JP2002198654A - Electric element built-in wiring board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate such a problem that when a small-size electric element is built in, an electric connection between the electric element and a circuit on the wiring board side cannot be easily and reliabily established. SOLUTION: The wiring board comprises an insulation substrate 1 made by laminating insulation layers 1a-1c each of which contains at least organic resin, a plurality of wiring circuit layers 2 formed on the surface of and/or inside the insulation substrate 1, and via hole conductors 3 made by filling via holes at least inside the insulation substrate 1 with a metal component. The electric element 5 having an inner interconnection 7 is build in inside a hollow part 4 formed in the wiring board to form an electric element built-in wiring board. In the electric element built-in wiring board, a connecting conductor section 8 is formed by filling a through hole extended through the electric element 5, or a through hole or space formed in the interface between the electric element 5 and a wall face of the insulation layer formed with the hollow part 4, with a metal component. The inner interconnection 7 of the electric element 5 and the via hole conductor 3 on the wiring board side and/or the wiring circuit layer 2 are electrically connected via the connecting conductor section 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board with a built-in electrical element in which an electronic component such as an LSI chip can be mounted on the surface and an electrical element such as a capacitor is built in an insulating substrate, and a method of manufacturing the same. is there.

[0002]

2. Description of the Related Art In recent years, with the demand for high performance and miniaturization of electronic equipment, there has been a demand for a wiring board corresponding to high density and high functionality of circuit components. Japanese Patent Application Laid-Open No. H11-220262 proposes a wiring board in which an electric element such as a semiconductor element is built in a substrate. Also, with the spread of communication equipment, high-speed operation is required, and in order to perform such high-speed operation, passive electronic components such as capacitors are incorporated in the insulating layer to minimize electric signal noise. Wiring board is also disclosed in
No. 1393.

Further, in these wiring boards, the connection between the built-in electric element and the circuit of the wiring board is performed by connecting electrodes formed on the surface of the electric element, electrodes and lands formed on the wiring board side. The connection is made with a conductive adhesive such as solder or the like.

[0004]

However, with the demand for further miniaturization of electronic equipment, miniaturization of wiring boards and miniaturization of electric elements such as capacitors have been attempted. For this reason, the connecting electrodes formed on the small-sized electric elements also become smaller, and it is also extremely difficult to form the connecting electrodes and the circuit of the wiring board with high accuracy. For example, when a connection electrode for directly connecting to a via hole conductor of a wiring board is formed on the upper and lower surfaces of a chip-shaped element, an electrode having a size of about 250 μm is generally required to connect to the via hole conductor, However, it is impossible to form such an electrode for an electronic component having a thickness of about 500 μm. Further, the connection electrode is usually formed by printing a conductive paste, but forming an electrode on a minute electric element is a very difficult operation.

Accordingly, the present invention provides a wiring board with a built-in electric element which can easily and surely make an electrical connection with a circuit on the wiring board side when a small electric element is built in, and a method of manufacturing the same. The purpose is to provide.

[0006]

The present inventor has studied the above problems, and as a result, has formed a through hole in an electric element and filled the through hole with a metal component. A connection conductor portion filled with a metal component is formed on an end surface of the hollow portion and the electric element in which the via hole conductor or the wiring circuit layer formed on the wiring board via the connection conductor portion is embedded. It has been found that by making a connection with such an electric element, good and reliable connection can be achieved even when the electric element itself has no external electrode.

That is, the wiring board with a built-in electric element of the present invention comprises:
An insulating substrate formed by laminating insulating layers containing at least an organic resin, a plurality of wiring circuit layers formed on the surface and / or inside the insulating substrate, and at least the inside of the insulating substrate filled with a metal component. An electric element built-in wiring board in which an electric element having an internal wiring is built in a cavity provided in a wiring board having a via hole conductor, and a through hole provided through the electric element, Alternatively, a connection conductor portion formed by filling a metal component into a through hole or a gap provided at an interface between an electric element and an insulating layer wall surface in which a cavity is formed is formed, and the electric conductor is formed through the connection conductor portion. The internal wiring of the element is electrically connected to a via-hole conductor and / or a wiring circuit layer on the wiring board side.

In such a wiring board, a multilayer capacitor element in which internal electrodes and dielectric layers are alternately laminated is most preferably used as the electric element. Even if there is no external electrode, even if there is no terminal electrode on the side end surface of the electric element, or even if there is no electrode for connection with these outside, it is necessary to make a reliable connection via the connection conductor part Can be.

Further, as a method for manufacturing such a wiring board with a built-in electric element, (a) a step of forming a cavity in an insulating sheet containing an uncured or semi-cured organic resin; and (b) a step of forming the cavity. (C) forming a through hole in the electric element, or forming a through hole in the interface between the electric element and the wall surface of the cavity, and forming a metal in the through hole. (D) forming a connection conductor portion by filling the components; and (d) an upper surface of an insulating sheet having a built-in electric element having a connection conductor portion in the cavity formed by the steps (a) and (b) and / or Or a step of laminating an insulating sheet containing an uncured or semi-cured organic resin on which a via-hole conductor and / or a wiring circuit layer is formed on the lower surface, and (e) the lamination produced by (d) by hot pressing. Stiff body And (c) curing the laminated body produced by (d) before hot pressing. .

Also in this case, it is desirable that the end surface of the electric element and / or the wall surface of the insulating sheet forming the cavity is formed of an inclined surface, and the gap is formed in a V-shape.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a wiring board with a built-in electric element according to the present invention will be described with reference to FIG. FIGS. 1A and 1B are a schematic cross-sectional view of an example of a wiring board with a built-in electric element, a schematic cross-sectional view of a built-in capacitor element, and a schematic plan view for explaining a built-in state of a capacitor element. is there.

In the present invention, an insulating substrate 1 is formed by laminating a plurality of insulating layers 1a to 1c on a wiring substrate, and a wiring circuit layer 2 is formed on the surface and inside thereof. Further, the wiring circuit layers 2 formed in different layers include the insulating layers 1a to 1c.
Are electrically connected by a via-hole conductor 3 formed by filling a metal component in a via-hole penetrating through. In addition, a cavity 4 is formed at a predetermined location in the insulating substrate 1, and a capacitor element 5 is built in the cavity 4 as an electric element.

In the wiring board shown in FIG.
As shown in FIG. 1A, the capacitor element 5 built therein has a so-called capacitor element 5 in which ceramic dielectric layers 6 mainly composed of BaTiO ₃ and internal electrodes 7 are alternately laminated. The internal electrode 7 has a positive electrode 7a and a negative electrode 7b alternately stacked. The positive electrode 7a is provided on one end face of the capacitor element 5, and the internal electrode 7 is provided with a negative electrode 7b. It is formed so as to be exposed on the other end face.

According to the present invention, in the wiring board of FIG. 1, a through hole is formed at the interface between the capacitor element 5 and the wall surface of the cavity 4 of the insulating layer 1c, and the through hole is filled with a metal component to form a connection conductor. A major feature is that the portion 8 is formed. The connection conductor 8 has at least one pair of connection conductors 8 a and 8 b formed at an end of the capacitor element 5. The connection conductor 8 a
Are electrically connected to the negative electrode 7b of the internal electrode 7 of the capacitor element 5, respectively.

The connection conductors 8 a and 8 b formed on the capacitor element 5 are electrically connected to the via-hole conductor 3 on the wiring board A or the wiring circuit layer 2.

In the wiring board shown in FIG.
Both a and 8b have through-holes formed at the interface between the capacitor element 5 and the wall surface of the hollow portion 4. However, if processing into the capacitor element 5 itself is possible, FIG. , (B) a schematic sectional view of the built-in capacitor element and (c) a plan view thereof, as shown in FIG.
It may be formed by forming a through hole near the end of itself and filling the through hole with a metal component.

In the configuration shown in FIG. 1, the connecting conductor 8 is
It is formed by forming a through-hole and filling the through-hole with a metal component. However, the connecting conductor is not limited to this. It is also possible to fill the gap at the interface with the metal component. A specific example thereof will be described based on FIG. 3 (a) schematic sectional view, (b) schematic sectional view of a built-in capacitor element, and (c) a schematic plan view for explaining a built-in state of the capacitor element.

In this electric element built-in wiring board, a via hole conductor 3 and a wiring circuit layer 2 are formed in an insulating substrate 1 as in FIG. Has a structure in which the terminal electrode is not formed on the end face, and the internal electrode 7 formed between the dielectric layers 6 is exposed from the end face. In addition, the end surface is obliquely polished, is inclined with respect to the upper and lower surfaces of the capacitor element 9, and has a trapezoidal cross section with a narrow upper surface.

Since the cavity 11 in which the capacitor element 9 is built has a rectangular cross section, when the capacitor element 9 whose end face is inclined as shown in FIG. 3 is built in, the insulating layer 1b of the cavity 11 is formed. Side wall and capacitor element 9
V such that the upper side is wider and the lower side is narrower
A character-shaped gap is formed. According to the present invention, the gap is filled with a metal component to form a V-shaped connection conductor 1.
2 are formed. In the connection conductor 12, since the internal electrode 7 is exposed at the end face of the capacitor element 9, the internal electrode 7 and the connection conductor 12 are electrically connected. It is electrically connected to the via-hole conductor 3 or the wiring circuit layer 2 in the wiring board.

In FIG. 3, the capacitor element 9 having a structure in which the end face is inclined is used. However, the end face of the capacitor element 9 is made vertical, and the wall surface of the cavity 11 in which the capacitor element 9 is built is formed by the inclined surface. This can also form a V-shaped gap having a wide upper side. The inclination angle of the end surface of the capacitor element 9 or the wall surface of the cavity 11 is 5 to 50.
°, especially about 5 to 30 ° is desirable.

As described above, the end surface of the capacitor element 9 and / or the wall surface of the cavity 11 are formed by the inclined surface,
By forming a V-shaped gap having a wide upper side between the end face of the capacitor element 9 and the end face of the hollow portion 11, the filling property of the metal component is increased, and the connection conductor portion 12 is easily formed. Electrical connection between the capacitor element 9 and the internal electrode 7 of the capacitor element 9 can also be improved.

In the above example, the terminal electrode was not formed on the end face of the capacitor element 9 and the internal electrode 7 was exposed on the end face. However, the terminal electrode formed by applying a conductor to the end face of the capacitor element 9 was used. May be used.

As shown in FIGS. 1 to 3, according to the present invention, a through hole is formed in an electric element, or a gap is formed between the insulating layer and a side wall forming a cavity. Filling the holes and gaps with a metal component enables electrical connection with the capacitor element. Further, in such a connection structure, it is not necessary to separately form an electrode or a land for connecting to a via-hole conductor of a wiring board or a wiring circuit layer on the upper and lower surfaces of the capacitor element, so that the structure of the built-in electric element is eliminated. Can be simplified.

Moreover, as will be apparent from the manufacturing method described later, such connection conductors can be formed in the process of manufacturing a general multilayer wiring board, so that they can be easily electrically connected to the wiring board without special steps. It is possible to do.

The material of the insulating substrate 1 in the wiring board with a built-in electric element of the present invention is not particularly limited as long as the above-described structure having the built-in electric element can be formed. In order to form a structure buried in the substrate, it is desirable to use an insulating material containing an organic resin that does not require a sintering step.

(Manufacturing method) In the case where the insulating substrate is made of an organic insulating material containing a thermosetting resin,
A method for manufacturing a wiring board will be described with reference to the process chart of FIG.

First, an insulating sheet 20 containing an uncured or semi-cured thermosetting resin is prepared.
A cavity 2 containing an electric element is provided in the insulating sheet 20.
1 is formed by punching or the like (a). The cavity 21 has a diameter of 10 μm with respect to the outer diameter of the built-in electric element.
Processing is made as large as about m to 70 μm, especially about 25 to 50 μm. If it is smaller than this range, the resin of the insulating sheet may peel off at the time of insertion and become resin dust, which may hinder electrical connection. On the other hand, if it is larger than this, a gap is left between the electric element and the cavity after the subsequent electric element is built in, and the electric element may fall off.

Next, in the hollow portion 21 of the insulating sheet 20,
A capacitor element 24 in which dielectric layers 22 and internal electrodes 23 are alternately stacked is built in (b). Capacitor element 24
A well-known component insertion machine can be used for the insertion. After the parts are inserted, a protective film such as polyethylene or PET is put on the surface and heated and pressed at a temperature of 50 to 160 ° C. and a pressure of 50 to 500 Pa for several minutes to form the insulating sheet 2.
The wall surface of the hollow portion 21 and the end surface of the capacitor element 24 are brought into close contact with each other. If there is a gap between the gap and the end face of the capacitor element, the conductive paste intrudes into this portion, and the conductive particles enter unintended portions, thereby lowering the insulation of the insulating substrate. Therefore, it is desirable that the gap between the end face and the capacitor element be smaller than the minimum diameter of the conductive particles to prevent the conductive particles from entering.

The capacitor element 24 and the cavity 21
A through hole 25 is formed at the interface with the wall surface of (c). A well-known method such as processing by irradiation with a carbon dioxide gas laser, a YAG laser, an excimer laser, plasma, or the like is used to form the through holes 25. The formation of the through-holes 25 may be carried out as it is after the protective film is brought into close contact with the front and back surfaces of the insulating sheet 20 and heated and pressed.
Further, the through-hole 20 is formed in the internal electrode 2 of the capacitor element 24.
As long as all three have been reached, it is also possible to stop halfway without forming a through-hole 25 that completely penetrates the element.

Thereafter, the through-hole 25 formed as described above is formed.
The inside is filled with a conductor paste containing a metal component such as Cu powder to form a connection conductor portion 26 (d).

When the connection conductor 26 is formed in the capacitor element 24 itself as shown in FIG. 2, the through-hole 25 is formed not only after being built in the cavity 21 but also before being built. Alternatively, a metal component can be filled.

On the other hand, via holes are formed in the insulating sheet 27 containing an uncured or semi-cured thermosetting resin by irradiation with a carbon dioxide gas laser, a YAG laser, an excimer laser, or the like, and filled with a conductive paste. To form a via-hole conductor 28, and further form an insulating sheet 27.
A wiring circuit layer 29 is formed on the surface of (e).

As described above, the via-hole conductor 28 and the wiring circuit layer 2 are provided on the upper and lower surfaces of the insulating sheet 20 in which the capacitor element 24 is built in the cavity 21.
The insulating sheet 27 on which 9 is formed is laminated. Thereafter, the thermosetting resin in the insulating sheet is completely cured by about 150.
By applying pressure and heating at a temperature of about 300 ° C., a wiring board having a built-in capacitor element can be manufactured (f).

The wiring circuit layer 29 formed on the surface of the insulating sheet 27 is formed, for example, by applying a metal foil such as a Cu foil or an Al foil to the surface of the insulating sheet 27 and then applying a resist, exposing, developing, etching, A method of forming a predetermined pattern by a resist removal process, or a method in which a conductor layer having a predetermined pattern is formed in the same manner as described above by pasting the metal foil on the surface of a resin film, There is a method of transferring to the surface.

The latter method uses the insulating sheet 27
Is not exposed to an etchant or the like, is not deteriorated by chemicals, and the production of the insulating sheet 27 and the formation of the wiring circuit layer 29 can be performed in parallel. In particular, by forming the wiring circuit layer 29 made of a metal foil on the surface of the transfer sheet and transferring it to the insulating sheet 27 under pressure, the pressure applied to the periphery of the via hole conductor 28 can be increased, In addition to increasing the contact force between the metal powders in the via hole conductor 28, the filling rate of the metal powder in the via hole conductor 28 can be increased and the resistance of the via hole conductor can be reduced.

In the insulating sheet 20 incorporating the capacitor element 24, via hole conductors 28 and wiring circuit layers 29 may be formed in portions other than the cavity 21 as in the case of the insulating sheet 27 as appropriate.

When the wiring board of FIG. 3 is manufactured, a capacitor element having an inclined end surface is provided in the hollow portion 21 of the insulating sheet 20 of FIG. 5 instead of FIG. 30 (b '), and its cavity 2
1 between the wall surface of the first capacitor element 1 and the end face of the capacitor element 30 so as to fill in a V-shaped connection conductor 31
Can be formed (d ′). Conversely, a hollow portion 32 having a sloped wall surface is formed in the insulating sheet 20, and a capacitor element 30 having a vertical end surface having an unsloped end surface is built therein, and the wall surface of the hollow portion 32 and the end surface of the capacitor element 30 are formed. The V-shaped connection conductor portion 31 can also be formed by filling a conductive paste therebetween.

(Insulating Material) In the method for manufacturing a wiring board of the present invention, the insulating material containing a thermosetting resin for forming an insulating sheet includes epoxy resin, triazine resin, polybutadiene resin, phenol resin, fluorine resin, and the like. Resin, diallyl phthalate resin, polyimide resin,
Thermosetting resin such as polyphenylene ether resin, or composite material of the thermosetting resin and inorganic filler powder such as silica and alumina, or thermosetting resin such as epoxy resin for woven or nonwoven fabric of glass fiber or aramid fiber A so-called prepreg impregnated with a resin can also be used.

(Conductor Paste) Also, via holes formed in an insulating sheet, conductor paste formed in a capacitor element, or a conductor paste filled in a gap between a capacitor element and a wall surface of a hollow portion may be a metal component.
Copper, silver, aluminum and gold, at least one or two or more, particularly copper powder, copper powder coated with silver powder, copper-containing powder such as copper-silver alloy powder, or Sn powder in this powder. Alternatively, a material to which a tin alloy powder such as Sn-Ag-Cu-Bi is added is used. Further, based on 100 parts by weight of the metal component, 1 to 6 parts by weight of a resin component and 1 to 4 parts by weight of a solvent are used. A paste can be prepared by adding the mixture in a ratio and kneading the mixture with a stirring deaerator or a three-roll mill.

The copper-containing powder to be used is most preferably an electrolytic copper powder having excellent conductivity and good dispersibility.
5 to 5 μm is desirable. This is because, if it is smaller than 0.5 μm, the surface is oxidized and the conductivity between the powders is reduced. If it is larger than 5 μm, the filling rate of the powder into the via-hole conductor is reduced and the resistance is increased.

The average particle diameter of the tin powder or tin alloy powder is preferably 1 to 15 μm. This is because if it is smaller than 1 μm, the surface is oxidized to increase the resistance, and if it is larger than 15 μm, the filling rate is reduced, and tin is localized to impair heat resistance.

As the resin component, bisphenol A, which reacts with an amine-based curing agent or acid anhydride, from the viewpoints of dispersibility, adhesion, heat resistance, storage stability, weather resistance, etc. of the copper-containing powder or tin-containing powder, or In addition to thermosetting resins such as bisphenol F, epoxy resin and triallyl isocyanurate resin, polymethacrylate and cellulose can also be used.

The solvent may be any solvent capable of dissolving the resin or a solvent, for example, isopropyl alcohol,
Terpineol, 2-octanol, butyl carbitol acetate and the like are used.

In particular, when the tin-containing powder is added to the copper-containing powder, the tin-containing powder is melted during the heat curing in the above-mentioned manufacturing process.
The via-hole conductor 28 formed on the substrate and the connection conductor 26 can be easily connected to each other.
By heating at a temperature of 0.5 ° C. for 0.5 to 5 hours, particularly about 1 to 3 hours, an intermetallic compound having excellent heat resistance consisting of Cu ₃ Sn or Cu ₆ Sn ₅ can be generated and strongly connected. it can.

[0045]

EXAMPLE 1 First, for example, a ceramic capacitor was manufactured as a built-in electric element as follows. As shown in FIG. 1B, an internal electrode pattern was screen-printed on the surface of a plurality of BaTiO ₃ -based ceramic dielectric sheets using a Ni metal paste. After that, the sheets were heated to 5
The layers are brought into close contact with each other at 5 ° C. under a pressure of 1500 Pa, and cut in a green state using a cutter.
It was fired at a temperature of 0 ° C. to produce a multilayer capacitor. In addition, it was confirmed that the internal electrode was exposed from the end face of the capacitor.

Further, Cu / Ni paste was applied to the end face of the capacitor element body where the internal electrode was exposed, and was baked at a temperature of 850 ° C. to form a terminal electrode on the end face of the capacitor. This capacitor has the same dimensions as those with dimensions of 1.6 mm × 1.6 mm × 0.3 mm, capacitance of 10 nF and self-inductance of 80 pH, and has a capacitance of 5 nF and self-inductance of 80 pH. Met.

Next, a wiring board incorporating the above multilayer capacitor was manufactured as follows. First, A-PPE
The resin and the powder in a varnish state are mixed with the resin so that the amorphous silica powder has a predetermined ratio, and a plurality of insulating sheets A having a thickness of 120 μm are formed by a doctor blade method.
Was prepared. Then, via holes (0.1 mm in diameter) were formed on these insulating sheets by a carbon dioxide laser, and the via holes were filled with a conductive paste containing Cu powder to form via-hole conductors.

Further, a hollow portion slightly larger than the outer diameter of the built-in capacitor was formed in the insulating sheet B for mounting a capacitor produced in the same manner as described above by trepanning with a carbon dioxide gas laser. The thickness of the insulating sheet is 5 times larger than the thickness of the multilayer capacitor.
The one having a thickness of 0 μm was used.

Next, after temporarily mounting the multilayer capacitor in the cavity, a resin sheet of polyethylene terephthalate (PET) was laminated on the front and back surfaces of the insulating sheet, and the pressure was increased to 100 Pa by a vacuum hot press and the temperature was raised at a rate of 7 times. ° C / mi
n. When the temperature reached 120 ° C., the temperature was maintained for 3 minutes to substantially eliminate the gap between the cavity of the multilayer capacitor and the insulating sheet.

Next, a through hole having a diameter of 0.1 mm was formed at the interface between both ends of the multilayer capacitor and the cavity of the insulating sheet by a carbon dioxide laser, and the same conductive paste was filled in the through hole. Thus, a connection conductor was formed.

On the other hand, polyethylene terephthalate (PE)
T) applying an adhesive to the surface of the transfer sheet made of resin,
A copper foil having a thickness of 12 μm and a surface roughness of 0.8 μm was bonded to one surface. Then, apply a dry film resist, expose,
After the development, the non-pattern portion was removed by etching using a spray type etching apparatus using a ferric chloride solution to form a wiring circuit layer made of copper foil.

On the surface of the insulating sheet B on which the via-hole conductor is formed, the wiring circuit layer side of the transfer sheet is
After pressure bonding at 0 ° C. and 200 Pa, the transfer sheet was peeled off, and the wiring circuit layer was transferred to the surface of the insulating sheet B.

Thereafter, the insulating sheets A and B are aligned and laminated, and the laminate is subjected to a pressure of 400 Pa.
The temperature was raised to 220 ° C., and heated at a maximum temperature of 220 ° C. for 1 hour to completely cure, thereby producing a wiring board incorporating a multilayer capacitor.

As a result of inspecting the continuity of the manufactured wiring board with the multilayer capacitor, no problem was found.
Further, there was no problem even after the PCT test (processing at 130 ° C., 85% humidity, 2.3 atm, 200 hours) on the wiring board incorporating the capacitor. In addition, a good connection state was confirmed as a multilayer capacitor regardless of the presence or absence of a terminal electrode on the end face.

Example 2 In manufacturing the multilayer capacitor of Example 1, the end face was formed as an inclined surface by changing the angle of the blade of the cutter, and the internal electrode was exposed at the end face as shown in FIG. 3B. Such a trapezoidal multilayer capacitor was manufactured.

Then, the above-mentioned multilayer capacitor was installed in the cavity of the insulating sheet B of Example 1, and the width of 0.3 mm formed between the wall surface of the cavity of the insulating sheet B and the end faces on both sides of the multilayer capacitor. The connection paste was formed by filling the gap with the conductor paste used in Example 1.

Then, in the same manner as in Example 1, the insulating sheet A and the insulating sheet B were aligned and laminated, and the laminated body was heated to 220 ° C. at a pressure of 400 Pa, and at a maximum temperature of 220 ° C. It was heated for 1 hour and completely cured to produce a wiring board with a built-in multilayer capacitor.

As a result of inspecting the continuity of the manufactured wiring board with the multilayer capacitor, no problem was found.
In addition, there was no problem even after the PCT test of the wiring board having the built-in capacitor as in Example 1.

[0059]

As described above, according to the present invention, an electric element such as a capacitor is built in an insulating substrate, and when the electric element is connected to a via-hole conductor or a wiring circuit layer on the wiring board side, an electric element is formed. By forming a through hole at a predetermined position and filling the inside with a metal component, or by forming a gap at the interface with the hollow portion of the insulating layer and filling the gap with the metal component, the surface of the electric element is particularly marked. Good connection with the wiring board can be achieved without forming a connection electrode.
As a result, it becomes possible to incorporate electric elements of all sizes and to perform reliable connection with via-hole conductors and wiring circuit layers of the wiring board.

[Brief description of the drawings]

FIG. 1A is a schematic cross-sectional view showing an example of a wiring board with a built-in electric element of the present invention, FIG. 1B is a schematic cross-sectional view of a built-in capacitor element, and FIG. It is a schematic plan view.

FIGS. 2A and 2B are schematic cross-sectional views showing another example of a wiring board with a built-in electric element of the present invention, FIG. 2B is a schematic cross-sectional view of a built-in capacitor element, and FIG. FIG.

FIGS. 3A and 3B show still another example of a wiring board with a built-in electric element according to the present invention. FIG. 3A is a schematic cross-sectional view of a built-in capacitor element, and FIG. FIG.

FIG. 4 is a process chart for explaining an example of a method for manufacturing the wiring board with a built-in electric element of FIG. 1 according to the present invention.

5 is a partial process chart for explaining an example of the method for manufacturing the wiring board with a built-in electric element in FIG.

[Explanation of symbols]

 A Wiring board 1 Insulating substrate 2 Wiring circuit layer 3 Via hole conductor 4 Cavity 5 Electric element 6 Dielectric layer 7 Internal electrode 8 Connection conductor

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/40 H05K 3/40 K F term (Reference) 5E317 AA24 AA27 BB01 BB11 CC17 CC25 CD25 CD32 CD34 GG11 5E336 AA07 AA08 BB03 BB15 BC02 BC12 BC15 BC26 CC43 CC53 EE08 GG11 5E346 AA01 AA12 AA15 AA38 AA43 AA60 BB01 BB16 CC02 CC08 CC31 DD02 DD32 EE02 EE06 EE09 EE13 FF01 FF18 FF45 GG15 GG28 H33 HH07

Claims (7)

[Claims] 1. An insulating substrate formed by laminating insulating layers containing at least an organic resin, a plurality of wiring circuit layers formed on the surface and / or inside of the insulating substrate, and a metal component at least inside the insulating substrate. Inside a cavity provided in a wiring board provided with a via hole conductor filled with, an electric element built-in wiring board containing an electric element having an internal wiring, wherein the electric element penetrates the electric element. A connection conductor portion formed by filling a metal component into a provided through hole or a through hole or a gap provided at an interface between an electric element and an insulating layer wall surface in which a cavity is formed; A wiring board with a built-in electric element, wherein an internal wiring of the electric element and a via-hole conductor and / or a wiring circuit layer on the wiring board side are electrically connected via a portion. 2. The wiring board with a built-in electric element according to claim 1, wherein said electric element comprises a multilayer capacitor element in which internal electrodes and dielectric layers are alternately stacked. 3. The electric element according to claim 1, wherein the end face of the electric element and / or the wall surface of the insulating layer forming the cavity is formed by an inclined surface, and the gap is formed in a V-shape. Wiring board with built-in electric element. 4. A step of forming a cavity in an insulating sheet containing an uncured or semi-cured organic resin; and (b) a step of incorporating an electric element having an internal wiring in the cavity. (C) forming a through hole in the electric element, or forming a through hole at the interface between the electric element and the cavity wall surface, and filling the through hole with a metal component to form a connection conductor;
(D) forming a via-hole conductor and / or a wiring circuit layer on the upper surface and / or lower surface of the insulating sheet having a built-in electric element having a connection conductor portion in the cavity formed by the steps (a) and (b); Laminating an insulating sheet containing an uncured or semi-cured organic resin,
(E) curing the laminate produced in (d) by hot pressing. A method for producing a wiring board with a built-in electric element, the method comprising: 5. A step of forming a cavity in an insulating sheet containing an uncured or semi-cured organic resin, and a step of incorporating an electric element having internal wiring in the cavity. (C) filling a gap between a wall surface of the hollow portion and the end surface with a metal component to form a connection conductor portion;
Uncured, via-hole conductors and / or wiring circuit layers are formed on the upper and / or lower surfaces of an insulating sheet having a built-in electric element having a connection conductor in the cavity formed by the steps (a) and (b). Alternatively, an electric element comprising: a step of laminating an insulating sheet containing a semi-cured organic resin; and (e) a step of curing the laminated body produced in (d) by hot pressing. Manufacturing method of built-in wiring board. 6. The method for manufacturing a wiring board with a built-in electric element according to claim 4, wherein the electric element comprises a multilayer capacitor element in which internal electrodes and dielectric layers are alternately laminated. 7. The electrical element according to claim 4, wherein an end surface of the electric element and / or a wall surface of the insulating sheet forming the cavity is formed of an inclined surface, and the gap is formed in a V-shape. Method for manufacturing a wiring board with a built-in electric element.