CN204361126U - A kind of SMD LED package substrate - Google Patents
A kind of SMD LED package substrate Download PDFInfo
- Publication number
- CN204361126U CN204361126U CN201420862730.8U CN201420862730U CN204361126U CN 204361126 U CN204361126 U CN 204361126U CN 201420862730 U CN201420862730 U CN 201420862730U CN 204361126 U CN204361126 U CN 204361126U
- Authority
- CN
- China
- Prior art keywords
- encapsulation
- substrate
- epoxy resin
- datum hole
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to LED chip base plate for packaging manufacturing technology field, relate to a kind of SMD LED package substrate specifically, it comprises substrate, described substrate is provided with encapsulation datum hole array, epoxy resin is plugged with at encapsulation datum hole, and on substrate copper facing face, described epoxy resin be filled in encapsulation datum hole in, equal with the face of substrate.The utility model base plate for packaging adopts epoxy resin consent technology, utilizes the hot curing fillibility of epoxy resin, is filled and led up by encapsulation datum hole, and downstream encapsulation will full for the encapsulation of whole SET face, and light-emitting area reaches 100%, and above like this problem all will be resolved.Client does not need the whole SET pressing mold of mould, greatly improves packaging efficiency.Owing in encapsulation process, can there is not the problem of excessive glue after consent, can less by product design when product design in early stage, circuit is thinner, improves the size of product after encapsulation.
Description
Technical field
The utility model relates to LED chip base plate for packaging manufacturing technology field, relates to a kind of SMD LED package substrate specifically.
Background technology
SMD LED package substrate is for developing the LED industry of small, the deficiency that traditional design mode exists hinders the development of LED industry at last, as shown in Figure 1, and traditional base plate for packaging, the encapsulation datum hole 1 that this base plate for packaging has array to discharge, this encapsulation datum hole 1 brings following defect:
1. through hole and orifice ring account for 1/3 of whole Unit area, and this area is because can not encapsulate near Kong Huiyi glue, and this area just causing LED wafer to waste 1/3 can not produce light source.
2. encapsulation is several SET solid glue of pressing mold together, because porose, specially must open one set of die and push down the excessive glue in limit, hole, and pressing mold efficiency cannot promote.
Utility model content
For the deficiency in above-mentioned technology, the utility model provides a kind of SMD LED package substrate,
For solving the problems of the technologies described above, the utility model is realized by following scheme:
A kind of SMD LED package substrate, comprises substrate, described substrate is provided with encapsulation datum hole array, is plugged with epoxy resin at encapsulation datum hole, and on substrate copper facing face, described epoxy resin is filled in encapsulation datum hole, equal with the face of substrate.
Further, the thickness in described copper facing face is between 0.1-0.5mm.
The beneficial effects of the utility model are: the utility model base plate for packaging adopts epoxy resin consent technology, utilize the hot curing fillibility of epoxy resin, filled and led up by encapsulation datum hole, downstream encapsulation will full for the encapsulation of whole SET face, light-emitting area reaches 100%, and above like this problem all will be resolved.Client does not need the whole SET pressing mold of mould, greatly improves packaging efficiency.Owing in encapsulation process, can there is not the problem of excessive glue after consent, can less by product design when product design in early stage, circuit is thinner, improves the size of product after encapsulation, makes unit plane.
Accompanying drawing explanation
Fig. 1 is traditional encapsulation datum hole.
Fig. 2 is at copper coating schematic diagram after the utility model consent.
Fig. 3 is the utility model consent trailing flank schematic diagram.
Mark in accompanying drawing: encapsulation datum hole 1; Substrate 2; Copper facing face 21; Epoxy resin 22.
Embodiment
Below in conjunction with accompanying drawing, the utility model is elaborated.
Please refer to accompanying drawing 2,3, a kind of SMD LED package substrate of the present utility model, comprise substrate 2, described substrate 2 is provided with encapsulation datum hole 1 array, epoxy resin 22 is plugged with at encapsulation datum hole 1, and copper facing face 21 on a substrate 2, described epoxy resin 22 is filled in encapsulation datum hole 1, equal with the face of substrate 2, the thickness in described copper facing face 21 is between 0.1-0.5mm.
Utilize the hot curing fillibility of epoxy resin 22, filled and led up by encapsulation datum hole 1, downstream encapsulation will full for the encapsulation of whole SET face, light-emitting area reaches 100%, the problem that such traditional structure produces all will be resolved, and not need the whole SET pressing mold of mould, greatly improve packaging efficiency.
Below the technique of the utility model encapsulating structure:
Through boring and copper facing operation, after encapsulation datum hole 1 metallizes, plate is cleaned up by chemical mode, then utilizes screen printing technique, whole for the epoxy resin mixed up by proportioning plate printing is filled in hole, fill and lead up encapsulation datum hole 1, and hyperthermia drying solidification.Because in press resin can remain in limit, hole and edges of boards, after hyperthermia drying solidification, residual resin can be stone, need the epoxy resin 22 adopting grinding technique unnecessary protrusion to be remained in limit, hole and plate face to grind off for this reason, then by chemical cleaning mode, obtain clean copper face and plate face, be beneficial to the graphic making of rear operation.
Owing in encapsulation process, can there is not the problem of excessive glue after consent, can less by product design when product design in early stage, circuit is thinner, improves the size of product after encapsulation, makes unit plane.Dynamic then up to ten thousand of the hole of resin consent, and it is full to ensure there is a hole, does not allow to occur small opening phenomenon.This ten thousand/ defect will cause the probability scrapped, inevitable requirement, in technique, rigorous thinking and specification is carried out in production operation.
Owing to needing the full weight of retaining ring epoxy resins 22, fastness, hardness is strong after hardening for the resin of employing.In order to ensure the quality of product, the surfacing of maintenance consent is the key of this technology:
1) adjust angle and the dynamics of silk screen printing, the speed of scraper reduces the rear outstanding problem of resin spilling solidification.
2) for resin ledge after solidification, utilize Plate grinder equipment, carry out time nog plate to sheet material, for the first time, powerful nog plate, thoroughly grinds off ledge, and second time nog plate, become more meticulous nog plate, polished by resin in hole to consistent with surperficial copper face height.
3) consent material selection, what fill in the quality of material to product in hole to get up decisive role, if use plugging green oil, simple to operate in printing process and nog plate process, smooth surface, but because the hardness of green oil is inadequate, be that in easy causing hole, green oil drops in follow-up operation in process, cause whole blackboard newspaper to give up.Epoxide resin material consent is adopted to be that I takes charge of after repeatedly certification, to think ready-made scheme.
The foregoing is only preferred implementation of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (2)
1. a SMD LED package substrate, comprise substrate (2), described substrate (2) is provided with encapsulation datum hole (1) array, it is characterized in that: be plugged with epoxy resin (22) in encapsulation datum hole (1), and in the upper copper facing face (21) of substrate (2), described epoxy resin (22) is filled in encapsulation datum hole (1), equal with the face of substrate (2).
2. a kind of SMD LED package substrate according to claim 1, is characterized in that: the thickness of described copper facing face (21) is between 0.1-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420862730.8U CN204361126U (en) | 2014-12-31 | 2014-12-31 | A kind of SMD LED package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420862730.8U CN204361126U (en) | 2014-12-31 | 2014-12-31 | A kind of SMD LED package substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204361126U true CN204361126U (en) | 2015-05-27 |
Family
ID=53262579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420862730.8U Expired - Fee Related CN204361126U (en) | 2014-12-31 | 2014-12-31 | A kind of SMD LED package substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204361126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543493A (en) * | 2021-07-12 | 2021-10-22 | 上海嘉捷通电路科技股份有限公司 | Preparation method of Z-direction interconnection printed circuit board |
-
2014
- 2014-12-31 CN CN201420862730.8U patent/CN204361126U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543493A (en) * | 2021-07-12 | 2021-10-22 | 上海嘉捷通电路科技股份有限公司 | Preparation method of Z-direction interconnection printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 Termination date: 20171231 |