CN109302801A - A kind of production method of Metal Substrate jack panel - Google Patents
A kind of production method of Metal Substrate jack panel Download PDFInfo
- Publication number
- CN109302801A CN109302801A CN201811386561.4A CN201811386561A CN109302801A CN 109302801 A CN109302801 A CN 109302801A CN 201811386561 A CN201811386561 A CN 201811386561A CN 109302801 A CN109302801 A CN 109302801A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- drilling
- production method
- aluminium flake
- jack panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Abstract
The invention discloses a kind of production methods of Metal Substrate jack panel, it drills on metallic substrates according to product design, to the metal substrate processing after drilling, remove the greasy dirt impurity of drill hole inner wall, aluminium flake net is mounted on screen printer, after the drilling on the mesh and metal substrate of aluminium flake net aligns, the relative position of aluminium flake net and metal substrate is fixed with pilot pin, plug socket resin be poured on aluminium flake net on one side on, with scraper for screen printing machine by plug socket resin scraped on one side to the another side of aluminium flake net from aluminium flake net, so that plug socket resin is substantially filled in drilling, the metal substrate for completing consent process is put into press, vacuum pressing-combining solidification, sizing material around removal drilling.The method does not need pasting protective film not only; it ensure that production efficiency; and avoid the investment of vacuum taphole machine equipment; the problems such as resin is lost, consent is not full, empty during also solving large aperture consent and standing; and it is suitable for small lot multi-item production; consent speed is fast, improves production efficiency.
Description
Technical field
The present invention relates to printed wiring board manufacturing technology fields, and in particular to a kind of production method of Metal Substrate jack panel.
Background technique
With the development of electronic information technology, electronic product develops towards lightweight, micromation, densification direction, to print
More stringent requirements are proposed for making sheet.For adaptive technique development trend, the designer and producer of printed board are also constantly more
New designing concept and manufacturing process.Filling holes with resin technique is also that people are reducing printed board design size, cooperation assembly member
Device and a kind of technical method invented, have played huge effect in the production field of printed board, have effectively reduced product ruler
It is very little, and improve the reliability of product.
In recent years, Metal Substrate jack panel is rapidly developed, consent technology be more and more applied to high-power illumination,
The application of the fields such as automotive electronics, safety monitoring, especially automotive electronics proposes higher want to product quality and reliability
It asks.Since the aperture of Metal Substrate jack panel is big (1.5mm or more), using conventional PCB plug socket resin and screen printer method for plugging
Production, it may appear that resin is lost, consent is not full, empty etc. bad.To solve the case where above-mentioned resin is lost, common practices is
Layer protecting film is sticked on one side in Metal Substrate jack panel, plays the role of supporting resin, resin is prevented to be lost.Although this can
It solves the problems, such as that resin is lost, but undoubtedly increases production cost, reduce production efficiency.Also, jack panel pad pasting can be made
Can not be vented in pore-forming, there is consent dead angle at edge, will appear the problems such as cavity very serious is bad after consent.However, using
Vacuum taphole machine carrys out consent, although also can solve, cavity is bad, and there are equipment cost height, Material Cost is high, and (wherein one side is needed
Pasting protective film), the problems such as production efficiency is low (40-50 seconds/block), and the number of the remodeling time is long, and it is raw to be not appropriate for small lot multi items
It produces.
Summary of the invention
Bad, the present invention such as the resin occurred when in order to solve the problems, such as consent is lost, consent is not full, is easy to appear cavity
A kind of production method of Metal Substrate jack panel is provided, not only production cost is low, high production efficiency, and qualification rate is high, and is suitable for
Small lot multi-item production can make of common screen printer.
The purpose of the present invention will be realized by following technical method: a kind of production method of Metal Substrate jack panel, according to production
Product design drills on metallic substrates, handles the metal substrate after drilling, the greasy dirt impurity of drill hole inner wall is removed, by aluminium flake net
It is mounted on screen printer, after the drilling on the mesh and metal substrate of aluminium flake net aligns, fixes aluminium flake net and gold with pilot pin
Belong to the relative position of substrate, plug socket resin be poured on aluminium flake net on one side on, with scraper for screen printing machine by plug socket resin from aluminium flake net
It is scraped on one side to the another side of aluminium flake net, so that plug socket resin is substantially filled in drilling, the metal substrate for completing consent process is put
Enter into press, solidifies by vacuum pressing-combining, the sizing material overflowed around removal drilling.
Preferably, a kind of production method of Metal Substrate jack panel, the metal substrate after the drilling successively pass through
Oil removing, microetch, roughening, cleaning treatment remove the greasy dirt impurity of drill hole inner wall.
Preferably, the production method of a kind of Metal Substrate jack panel installs two blocks of wood on the platform of the screen printer
Plate, the both ends of metal substrate are respectively placed on two pieces of planks, and plank does not cover drilling, to guarantee pair of drilling with mesh
Position.
Preferably, the production method of a kind of Metal Substrate jack panel, the metal substrate bottom are lined with plank etc.
High batten, batten is between plank, and batten pad is in metal substrate without drill hole, and metal substrate becomes when to prevent consent
Shape causes consent not full.
Preferably, the production method of a kind of Metal Substrate jack panel, the plug socket resin are dilute by epoxy resin, activity
Agent, latent curing agent, curing accelerator, additive, inorganic micron filler and inorganic nano-filler is released to mix.
Preferably, the production method of a kind of Metal Substrate jack panel, is calculated, the plug socket resin is by 90 with mass parts
~120 parts of epoxy resin, 5~10 portions of reactive diluents, 1~30 part of latent curing agent, 1~10 part of curing accelerator, 0~20
Part additive, 200~400 parts of inorganic micron fillers and 10~50 parts of inorganic nano-fillers mix.
Preferably, the production method of a kind of Metal Substrate jack panel, the epoxy resin include liquid epoxies,
Multifunctional solid epoxy and multifunctional liquid epoxies, are calculated with mass parts, and epoxy resin is by 40~50 parts of Breakup of Liquid Ring
Oxygen resin, 30~40 parts of multifunctional solid epoxies and 20~30 parts of multifunctional liquid epoxies compositions.
Preferably, the production method of a kind of Metal Substrate jack panel, the plug socket resin in the drilling is by checking
Two sides outwardly protrudes, and the reverse side of metal substrate is laid flat onto thousand layer frames, and a backing plate, backing plate are placed in thousand layer frames
On put isolation film after place metal substrate, metal substrate is put into together with one piece of backing plate into press.
Preferably, a kind of production method of Metal Substrate jack panel, the metal substrate are put into press, vacuum
Pressing solidification, pressing time are 40~60min, and pressing-in temp is 150~170 DEG C, and pressing pressure is 100~200PSI.
Preferably, the production method of a kind of Metal Substrate jack panel, after the press vacuum pressing-combining, by metal
Substrate is split out, and the sizing material overflowed around 180 mesh and the removal drilling of 300 mesh abrasive bands is respectively adopted.
Compared with prior art, the present invention is with following the utility model has the advantages that the present invention, which passes through screen printer, completes drilling and net
After the contraposition in hole, plug socket resin is substantially filled in drilling with scraper for screen printing machine, is formed by curing jack panel by vacuum pressing-combining.
This production method does not need pasting protective film not only, ensure that production efficiency, and avoids the investment of vacuum taphole machine equipment, also
The problems such as resin is lost, consent is not full, empty during solving large aperture consent and standing, and it is more to be suitable for small lot
Kind production, consent speed is fast (10-20 seconds/block), substantially increases production efficiency.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the production method of Metal Substrate jack panel in the present invention；
Fig. 2 is a kind of consent schematic diagram of the production method of Metal Substrate jack panel in the present invention.
Specific embodiment
For a better understanding of the invention, further specific elaboration is made to the present invention below by following embodiment, but not
It can be regarded as limitation of the invention, it is some nonessential according to made by foregoing invention content for those skilled in the art
It improves and adjusts, be also considered as and be within the scope of the present invention.
Embodiment 1
As shown in Figure 1, a kind of production method of Metal Substrate jack panel, is divided into following steps:
(1) prepared by plug socket resin
It being calculated with mass parts, plug socket resin is by 40-50 parts of liquid epoxies, 30-40 parts of multifunctional solid epoxies,
20-30 parts of multifunctional liquid epoxies, 5-10 portions of reactive diluents, 1-30 parts of latent curing agents, 1-10 parts of solidifications promote
Agent, 0-20 parts of additives, 200-400 parts of inorganic micron fillers, 10-50 parts of inorganic nano-fillers mix.Its is specific as follows:
40-50 parts of A liquid epoxies, be bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol S type epoxy tree
One of rouge, bisphenol-A/F mixed type epoxy resin, liquid alicyclic epoxy resin are a variety of.
Multifunctional solid epoxy 30-40 parts of B, be phenol novolac epoxy resins, Study On O-cresol Epoxy Resin, BPA
Novolac epoxy resin, DCPD phenol novolac epoxy resins, XYLOK novolac epoxy resin, biphenyl type epoxy resin, naphthalene type asphalt mixtures modified by epoxy resin
One of rouge etc. is a variety of.
Multifunctional liquid epoxies 20-30 parts of C, be liquid phenol novolac epoxy resin, cycloaliphatc glycidyl ester type
Polyfunctional epoxy resin, aromatic amine glycidyl ester type polyfunctional epoxy resin, one in glycerol amine type polyfunctional epoxy resin
Kind is a variety of.
5-10 parts of D reactive diluent, be monofunctional reactive diluent, difunctional reactive diluents, multifunctional activity dilution
One of agent is a variety of.
1-30 parts of E latent curing agent, be one of dicyandiamide, acid anhydrides, modified imidazole, modified dicyandiamine, thiocarbamide or
It is a variety of.
1-10 parts of F curing accelerator, be one of imidazoles, imdazole derivatives, DMP-30 promotor, modified imidazole or more
Kind.
0-20 parts of G additive, be deaeration agent, defoaming agent, dispersing agent, anti-settling agent, thixotropic agent, rheological agent, coupling agent, antioxygen
One of agent, toughener are a variety of.
200-400 parts of H inorganic micron filler is aluminium oxide, zinc oxide, silica, titanium dioxide, calcium carbonate, talcum
One of powder, magnesia, aluminium hydroxide, magnesium hydroxide are a variety of.
10-50 parts of I inorganic nano-filler, be nano aluminium oxide, nano silica, nanometer calcium carbonate, nanometer hydroxide
One of aluminium, nano-sized magnesium hydroxide, nano-titanium dioxide, nano zine oxide, nano ferrite are a variety of.
Plug socket resin of the invention has the following characteristics that
(I) high viscosity and high thixotropic: metal substrate is not necessarily to pasting protective film, consent and resin all will not be from during standing
Back is lost, and guarantees that resin is full in hole.
(II) consent speed is fast: general 10~20s/ block, production efficiency improve 1 times or more than vacuum taphole.
(III) high reliability: it can be tested by reliabilities such as thermal stress, high temperature and humidity, cooling thermal impact, high temperature storages.
(2) metal substrate drills
Metal substrate is split into corresponding size by product design by metal substrate sawing sheet, and in the metal substrate of required size
On drill according to product design, complete drilling operation.
(3) metal substrate is handled
The processing such as oil removing, microetch, roughening, cleaning is carried out to the metal substrate after drilling, it is ensured that drill hole inner wall is miscellaneous without greasy dirt
Matter.
(4) metal substrate aligns
By the aluminium flake net of product design production consent, and aluminium flake net is mounted on screen printer, it is left in silk-screen machine platform
Two pieces of planks are fixed on right both sides, and plank thickness is 3~5mm, and the distance between plank is slightly smaller than length (such as Fig. 2 of metal substrate
It is shown), the both ends of metal substrate are respectively placed on plank, and plank does not cover drilling.Manual adjustment metal substrate and screen printer
Position of platform is directed at the drilling on metal substrate with the mesh of aluminium flake net, then passes through the fixed metal substrate of pilot pin and aluminium flake
The relative position of net.And in the bottom of metal substrate without drill hole, upper 2~3 wood contour with plank of pad on vertical direction
Item prevents metal substrate deformation when consent from causing the not full problem of consent for the support in metal substrate middle position.In addition,
Chock item can use always than using conventional air guide backing plate to be more convenient to operate, and no replacement is required；And air guide backing plate uses one
Resin can be inserted in section time metapore, timing is needed to replace.
(5) metal substrate consent
Upper on one side (as shown in Figure 2) that the plug socket resin of allotment is poured into aluminium flake net, with scraper for screen printing machine by plug socket resin
From being tiled on one side to the another side of aluminium flake net for aluminium flake net, so that plug socket resin is substantially filled in drilling, consent is completed.It connects
, check whether the two sides of plug socket resin in drilling on metal substrate has protrusion, then metal substrate reverse side is laid flat to thousand layers
On frame, the metal substrate after consent is placed again after padding 1 backing plate and 1 release film in thousand layer frames.
(6) pressing solidification
Metal substrate after consent is put into a press together with one piece of backing plate, vacuum pressing-combining solidification, pressing time be 40~
60min, pressing-in temp are 150~170 DEG C, and pressing pressure is 100~200PSI.
(7) it post-processes
Completion to be laminated, splits out metal substrate, is cut using 180 mesh and 300 mesh the abrasive bands plug socket resin that side is overflowed that will drill
Completely, Metal Substrate consent board finished product is finally obtained.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of production method of Metal Substrate jack panel, it is characterised in that: drill on metallic substrates according to product design, to brill
Metal substrate processing behind hole, removes the greasy dirt impurity of drill hole inner wall, aluminium flake net is mounted on screen printer, when the net of aluminium flake net
After drilling contraposition on hole and metal substrate, the relative position of aluminium flake net and metal substrate is fixed with pilot pin, plug socket resin falls
Aluminium flake net on one side on, with scraper for screen printing machine by plug socket resin scraped on one side to the another side of aluminium flake net from aluminium flake net so that
Plug socket resin is substantially filled in drilling, and the metal substrate for completing consent process is put into press, is solidified by vacuum pressing-combining,
The sizing material overflowed around removal drilling.
2. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: the gold after the drilling
Belong to substrate and successively pass through oil removing, microetch, roughening, cleaning treatment, removes the greasy dirt impurity of drill hole inner wall.
3. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: the screen printer is put down
Two pieces of planks are installed, the both ends of metal substrate are respectively placed on two pieces of planks, and plank does not cover drilling, to guarantee to bore on platform
The contraposition in hole and mesh.
4. a kind of production method of Metal Substrate jack panel according to claim 3, it is characterised in that: the metal substrate bottom
Portion is lined with the batten contour with plank, batten between plank, batten pad in metal substrate without drill hole, so as to anti-detent plug
Metal substrate deformation causes consent not full when hole.
5. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: the plug socket resin by
Epoxy resin, reactive diluent, latent curing agent, curing accelerator, additive, inorganic micron filler and inorganic nano-filler
It mixes.
6. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: it is calculated with mass parts,
The plug socket resin is by 90~120 parts of epoxy resin, 5~10 portions of reactive diluents, 1~30 part of latent curing agent, 1~10 part
Curing accelerator, 0~20 part of additive, 200~400 parts of inorganic micron fillers and the mixing of 10~50 parts of inorganic nano-fillers and
At.
7. a kind of production method of Metal Substrate jack panel according to claim 5, it is characterised in that: the epoxy resin packet
Include liquid epoxies, multifunctional solid epoxy and multifunctional liquid epoxies, calculated with mass parts, epoxy resin by
40~50 parts of liquid epoxies, 30~40 parts of multifunctional solid epoxies and 20~30 parts of multifunctional liquid epoxies groups
At.
8. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: the plug in the drilling
Hole resin lays flat the reverse side of metal substrate onto thousand layer frames, and put in thousand layer frames by checking that two sides outwardly protrudes
A backing plate is set, places metal substrate after isolation film is put on backing plate, metal substrate is put into together with one piece of backing plate into press.
9. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: the metal substrate is put
Enter into press, vacuum pressing-combining solidification, pressing time is 40~60min, and pressing-in temp is 150~170 DEG C, and pressing pressure is
100~200PSI.
10. a kind of production method of Metal Substrate jack panel according to claim 1, it is characterised in that: the press vacuum
After pressing, metal substrate is split out, the sizing material overflowed around 180 mesh and the removal drilling of 300 mesh abrasive bands is respectively adopted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811386561.4A CN109302801A (en) | 2018-11-20 | 2018-11-20 | A kind of production method of Metal Substrate jack panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811386561.4A CN109302801A (en) | 2018-11-20 | 2018-11-20 | A kind of production method of Metal Substrate jack panel |
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| Publication Number | Publication Date |
|---|---|
| CN109302801A true CN109302801A (en) | 2019-02-01 |
Family
ID=65143489
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|---|---|---|---|
| CN201811386561.4A Pending CN109302801A (en) | 2018-11-20 | 2018-11-20 | A kind of production method of Metal Substrate jack panel |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112616261A (en) * | 2021-02-04 | 2021-04-06 | 四川英创力电子科技股份有限公司 | Method for processing simple aluminum sheet mesh plug hole of circuit board |
| CN113784523A (en) * | 2021-09-07 | 2021-12-10 | 珠海杰赛科技有限公司 | Method for manufacturing reusable resin plug hole base plate |
| CN113950191A (en) * | 2020-07-17 | 2022-01-18 | 深南电路股份有限公司 | Circuit board and hole plugging method thereof |
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Application publication date: 20190201 |