CN105237954A - Epoxy resin composition for plugging holes and blending method for epoxy resin composition - Google Patents
Epoxy resin composition for plugging holes and blending method for epoxy resin composition Download PDFInfo
- Publication number
- CN105237954A CN105237954A CN201510728454.5A CN201510728454A CN105237954A CN 105237954 A CN105237954 A CN 105237954A CN 201510728454 A CN201510728454 A CN 201510728454A CN 105237954 A CN105237954 A CN 105237954A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- additive
- composition
- solidifying agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of manufacturing of printed-circuit boards, particularly an epoxy resin composition for plugging holes and a blending method for the epoxy resin composition. The epoxy resin composition for plugging holes provided by the invention comprises epoxy resin. a curing agent, a curing accelerant, an additive and inorganic filler. In the composition provided by the invention, the epoxy resin has good flexibility; the curing agent can enhance the toughness of the epoxy resin; the curing accelerant enables more thorough development of effect of the curing agent and more quick effect of the curing agent; the additive enhances the binding force of the epoxy resin and the inorganic filler, so that chain segment movement is not easy to happen under the condition of high temperature and high reflection. The composition is not liable to flow, so that when a blind frid is produced and manufactured, the frid is plugged by the composition to avoid non-fullness and cavities of the frid. Moreover, the cured composition provided by the invention is high in heat resistance and great in toughness, and defects of layering, cracking and the like are not easy to happen, so that the product percent of pass of printed circuit boards is improved.
Description
Technical field
The present invention relates to printed circuit board manufacture technology field, particularly a kind of composition epoxy resin for consent and concocting method thereof.
Background technology
Along with the development of electronic information technology, electronic product, towards lightweight, microminiaturization, high speed future development, is had higher requirement to printed circuit board.
In order to adaptive technique development trend; Printed Circuit Board Design and producers are also in the making method of continuous more new designing concept and technique; wherein blind slot technique is that people are reducing Printed Circuit Board Design size; a kind of technological method that cooperation is assembled components and parts and invented; its bold design concept and the production of mass-producing really can play great impellent in the making field of printed circuit board, improves reliability and the manufacture craft ability of product effectively.
When printed circuit board, need to carry out consent with resin dedicated to blind slot, thus make printed circuit board monoblock smooth, but due to the restriction of each side, China's plug socket resin industry is still in the level relatively fallen behind in software and hardware, the product reliability produced is low, poor stability, cannot compete with external product completely; In addition; due to resin property and the restriction of filling in groove technique; resin properties parameter and jack process are difficult to mate completely; operability is low; the problem that plug groove is full, not empty is often there will be when manufacturing blind slot plate; and poor heat resistance after resin solidification, fragility are large, easily occur the defect such as layering, cracking, conforming product rate is low.
Summary of the invention
In order to overcome deficiency described above, the object of this invention is to provide that a kind of thermotolerance is strong, toughness is large, not easily there is layering, cracking defect, make the composition epoxy resin for consent that printed circuit board conforming product rate is high, especially also relate to the concocting method to the composition epoxy resin for consent.
The technical scheme that the present invention solves its technical problem is:
A kind of composition epoxy resin for consent, wherein, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 300 ~ 400 parts, 20 ~ 100 parts, solidifying agent, curing catalyst 20 ~ 80 parts, additive 40 ~ 100 parts, mineral filler 400 ~ 500 parts.
As a kind of embodiment of the present invention, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 80 parts, solidifying agent, curing catalyst 80 parts, additive 90 parts, mineral filler 400 parts.
As another kind of embodiment of the present invention, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 70 parts, solidifying agent, curing catalyst 60 parts, additive 100 parts, mineral filler 420 parts.
As another embodiment of the present invention, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 100 parts, solidifying agent, curing catalyst 20 parts, additive 80 parts, mineral filler 450 parts.
As a modification of the present invention, described epoxy resin is one or more in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, polyphenol type tetraglycidel ether epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin.
As a further improvement on the present invention, described solidifying agent is one or more in aliphatic polyamine, diacetone acrylamide, alicyclic polyamine, trolamine, DMP-30, mphenylenediamine, diamino diphenyl sulfone, diaminodiphenyl-methane, isophthalic two methanediamine, imidazoles, anhydrides, Dyhard RU 100, Tetra hydro Phthalic anhydride, tetrahydrophthalic anhydride, HHPA, methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride.
Further improve as of the present invention, described curing catalyst is imidazoles, glyoxal ethyline, 2-ethyl imidazol(e), 2-phenylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-phenylimidazole, 1-cyanoethyl-2-ethyl-4-phenylimidazole, 2, one or more in the two Dimethylurea of 4-toluene, alicyclic two ureas, 4,4-Methylene bis phenyl Dimethylureas, PDU.
Further improve as of the present invention, described additive is one or more in aerosil, soluble castor oil, polyolefin pulp, organic clay, hydrogenated castor oil, silane coupling agent, silicon modified organic polymer, organosilicon, modified siloxane, acrylate copolymer, modified polyurethane, modified fatty acid ester.
Further improve as of the present invention, described mineral filler is one or more in zinc oxide, magnesium oxide, aluminum oxide, bismuth oxide, beryllium oxide, magnesium hydroxide, aluminium hydroxide, silicon-dioxide, aluminum oxide, ferric oxide, bismuth oxide, boron nitride, silicon nitride, silicon carbide, diamond, silicon nitride, humite, barium metaborate, barium sulfate, barium titanate, wilkinite, calcium sulfate, calcium carbonate, clay, cristobalite, diatomite, rhombspar, kaolin, mica, talcum, wollastonite.
For a concocting method for the composition epoxy resin of consent, comprise the steps:
Step one: take the epoxy resin of corresponding weight part, solidifying agent, curing catalyst and additive in container;
Step 2: high-speed stirring in a reservoir, mixes 30 ~ 40 minutes;
Step 3: then stirring at low speed 12 hours in a reservoir;
Step 4: the mineral filler taking corresponding weight part, adds in container;
Step 5: high-speed stirring in a reservoir, mixes 30 ~ 40 minutes;
Step 6: use three-roll grinder repeatedly to grind;
Step 7: high-speed stirring, mixing 30-40 minute;
Step 8: vacuum defoamation 10-20 minute;
Step 9: set aside for use.
In the present invention, epoxy resin itself has snappiness well, solidifying agent can the toughness of reinforced epoxy, it is more thorough that curing catalyst makes the effect of solidifying agent play, also make solidifying agent effect quicker, additive makes epoxy resin and mineral filler bonding force strengthen, make it when high temperature high reverse--bias, not easily there is molecular chain movement, the present invention is not easily flowed, thus can when manufacturing blind slot plate, the present invention is made to clog blind slot, avoid blind slot not full, the appearance in cavity, and the present invention to solidify rear thermotolerance strong, toughness is large, not easily there is layering, the defects such as cracking, improve printed circuit board conforming product rate.
Accompanying drawing explanation
For ease of illustrating, the present invention is described in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is concocting method schema of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of composition epoxy resin for consent of the present invention, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 300 ~ 400 parts, 20 ~ 100 parts, solidifying agent, curing catalyst 20 ~ 80 parts, additive 40 ~ 100 parts, mineral filler 400 ~ 500 parts.
In the present invention, epoxy resin itself has snappiness well, solidifying agent can the toughness of reinforced epoxy, it is more thorough that curing catalyst makes the effect of solidifying agent play, also make solidifying agent effect quicker, additive makes epoxy resin and mineral filler bonding force strengthen, make it when high temperature high reverse--bias, not easily there is molecular chain movement, the present invention is not easily flowed, thus can when manufacturing blind slot plate, the present invention is made to clog blind slot, avoid blind slot not full, the appearance in cavity, and the present invention to solidify rear thermotolerance strong, toughness is large, not easily there is layering, the defects such as cracking, improve printed circuit board conforming product rate.
The invention provides a kind of embodiment one, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 80 parts, solidifying agent, curing catalyst 80 parts, additive 90 parts, mineral filler 400 parts.
Invention provides a kind of embodiment two, is: epoxy resin 350 parts, 70 parts, solidifying agent, curing catalyst 60 parts, additive 100 parts, mineral filler 420 parts with the formula of total amount 1000 weight part needed for ratio.
Invention provides a kind of embodiment three, is: epoxy resin 350 parts, 100 parts, solidifying agent, curing catalyst 20 parts, additive 80 parts, mineral filler 450 parts with the formula of total amount 1000 weight part needed for ratio.
The service condition of embodiment one, two, three is as following table:
The invention provides a kind of embodiment of epoxy resin, epoxy resin is one or more in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, polyphenol type tetraglycidel ether epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin.
The invention provides a kind of embodiment of solidifying agent, solidifying agent is one or more in aliphatic polyamine, diacetone acrylamide, alicyclic polyamine, trolamine, DMP-30, mphenylenediamine, diamino diphenyl sulfone, diaminodiphenyl-methane, isophthalic two methanediamine, imidazoles, anhydrides, Dyhard RU 100, Tetra hydro Phthalic anhydride, tetrahydrophthalic anhydride, HHPA, methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride.
The invention provides a kind of embodiment of curing catalyst, curing catalyst is imidazoles, glyoxal ethyline, 2-ethyl imidazol(e), 2-phenylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-phenylimidazole, 1-cyanoethyl-2-ethyl-4-phenylimidazole, 2, one or more in the two Dimethylurea of 4-toluene, alicyclic two ureas, 4,4-Methylene bis phenyl Dimethylureas, PDU.
The invention provides a kind of embodiment of additive, described additive is one or more in aerosil, soluble castor oil, polyolefin pulp, organic clay, hydrogenated castor oil, silane coupling agent, silicon modified organic polymer, organosilicon, modified siloxane, acrylate copolymer, modified polyurethane, modified fatty acid ester.
The invention provides a kind of embodiment of mineral filler, mineral filler is one or more in zinc oxide, magnesium oxide, aluminum oxide, bismuth oxide, beryllium oxide, magnesium hydroxide, aluminium hydroxide, silicon-dioxide, aluminum oxide, ferric oxide, bismuth oxide, boron nitride, silicon nitride, silicon carbide, diamond, silicon nitride, humite, barium metaborate, barium sulfate, barium titanate, wilkinite, calcium sulfate, calcium carbonate, clay, cristobalite, diatomite, rhombspar, kaolin, mica, talcum, wollastonite.
As shown in Figure 1, the present invention also provides a kind of concocting method of the composition epoxy resin for consent, comprises the steps:
Step one: take the epoxy resin of corresponding weight part, solidifying agent, curing catalyst and additive in container;
Step 2: high-speed stirring in a reservoir, mixes 30 ~ 40 minutes;
Step 3: then stirring at low speed 12 hours in a reservoir;
Step 4: the mineral filler taking corresponding weight part, adds in container;
Step 5: high-speed stirring in a reservoir, mixes 30 ~ 40 minutes;
Step 6: use three-roll grinder repeatedly to grind;
Step 7: high-speed stirring, mixing 30-40 minute;
Step 8: vacuum defoamation 10-20 minute;
Step 9: set aside for use.
In the present invention, in step 2, epoxy resin, solidifying agent, curing catalyst and additive are fully mixed, in step 3, makes it bonding force and fully demonstrate out, in step 5, six, make epoxy resin, solidifying agent, curing catalyst and additive dissolve in mineral filler, grind in step 6, make it fluidization, in step 8, make it bubble-free.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the composition epoxy resin for consent, it is characterized in that, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 300 ~ 400 parts, 20 ~ 100 parts, solidifying agent, curing catalyst 20 ~ 80 parts, additive 40 ~ 100 parts, mineral filler 400 ~ 500 parts.
2. a kind of composition epoxy resin for consent according to claim 1, it is characterized in that, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 80 parts, solidifying agent, curing catalyst 80 parts, additive 90 parts, mineral filler 400 parts.
3. a kind of composition epoxy resin for consent according to claim 1, it is characterized in that, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 70 parts, solidifying agent, curing catalyst 60 parts, additive 100 parts, mineral filler 420 parts.
4. a kind of composition epoxy resin for consent according to claim 1, it is characterized in that, with the formula of total amount 1000 weight part needed for ratio be: epoxy resin 350 parts, 100 parts, solidifying agent, curing catalyst 20 parts, additive 80 parts, mineral filler 450 parts.
5. a kind of composition epoxy resin for consent according to Claims 2 or 3 or 4, it is characterized in that, described epoxy resin is one or more in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, polyphenol type tetraglycidel ether epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin.
6. a kind of composition epoxy resin for consent according to claim 5, it is characterized in that, described solidifying agent is one or more in aliphatic polyamine, diacetone acrylamide, alicyclic polyamine, trolamine, DMP-30, mphenylenediamine, diamino diphenyl sulfone, diaminodiphenyl-methane, isophthalic two methanediamine, imidazoles, anhydrides, Dyhard RU 100, Tetra hydro Phthalic anhydride, tetrahydrophthalic anhydride, HHPA, methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride.
7. a kind of composition epoxy resin for consent according to claim 6, it is characterized in that, described curing catalyst is imidazoles, glyoxal ethyline, 2-ethyl imidazol(e), 2-phenylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-phenylimidazole, 1-cyanoethyl-2-ethyl-4-phenylimidazole, 2, one or more in the two Dimethylurea of 4-toluene, alicyclic two ureas, 4,4-Methylene bis phenyl Dimethylureas, PDU.
8. a kind of composition epoxy resin for consent according to claim 7, it is characterized in that, described additive is one or more in aerosil, soluble castor oil, polyolefin pulp, organic clay, hydrogenated castor oil, silane coupling agent, silicon modified organic polymer, organosilicon, modified siloxane, acrylate copolymer, modified polyurethane, modified fatty acid ester.
9. a kind of composition epoxy resin for consent according to claim 8, it is characterized in that, described mineral filler is one or more in zinc oxide, magnesium oxide, aluminum oxide, bismuth oxide, beryllium oxide, magnesium hydroxide, aluminium hydroxide, silicon-dioxide, aluminum oxide, ferric oxide, bismuth oxide, boron nitride, silicon nitride, silicon carbide, diamond, silicon nitride, humite, barium metaborate, barium sulfate, barium titanate, wilkinite, calcium sulfate, calcium carbonate, clay, cristobalite, diatomite, rhombspar, kaolin, mica, talcum, wollastonite.
10. for a concocting method for the composition epoxy resin of consent, it is characterized in that, comprise the steps:
Step one: take the epoxy resin of corresponding weight part, solidifying agent, curing catalyst and additive in container;
Step 2: high-speed stirring in a reservoir, mixes 30 ~ 40 minutes;
Step 3: then stirring at low speed 12 hours in a reservoir;
Step 4: the mineral filler taking corresponding weight part, adds in container;
Step 5: high-speed stirring in a reservoir, mixes 30 ~ 40 minutes;
Step 6: use three-roll grinder repeatedly to grind;
Step 7: high-speed stirring, mixing 30-40 minute;
Step 8: vacuum defoamation 10-20 minute;
Step 9: set aside for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510728454.5A CN105237954A (en) | 2015-10-29 | 2015-10-29 | Epoxy resin composition for plugging holes and blending method for epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510728454.5A CN105237954A (en) | 2015-10-29 | 2015-10-29 | Epoxy resin composition for plugging holes and blending method for epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105237954A true CN105237954A (en) | 2016-01-13 |
Family
ID=55035806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510728454.5A Pending CN105237954A (en) | 2015-10-29 | 2015-10-29 | Epoxy resin composition for plugging holes and blending method for epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105237954A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107043520A (en) * | 2017-01-19 | 2017-08-15 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN111393069A (en) * | 2020-03-25 | 2020-07-10 | 深圳绿景环保再生资源有限公司 | Preparation method of epoxy mortar of modified powder and graded sand and epoxy mortar |
| CN113150494A (en) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | PCB micro-foaming hole plugging resin and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN104497494A (en) * | 2014-06-10 | 2015-04-08 | 上海大学 | High stably dispersed nano-silica filled epoxy resin system, cured product and preparation method thereof |
| CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
-
2015
- 2015-10-29 CN CN201510728454.5A patent/CN105237954A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN104497494A (en) * | 2014-06-10 | 2015-04-08 | 上海大学 | High stably dispersed nano-silica filled epoxy resin system, cured product and preparation method thereof |
| CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107043520A (en) * | 2017-01-19 | 2017-08-15 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN111393069A (en) * | 2020-03-25 | 2020-07-10 | 深圳绿景环保再生资源有限公司 | Preparation method of epoxy mortar of modified powder and graded sand and epoxy mortar |
| CN111393069B (en) * | 2020-03-25 | 2021-09-21 | 深圳绿景环保再生资源有限公司 | Preparation method of epoxy mortar of modified powder and graded sand and epoxy mortar |
| CN113150494A (en) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | PCB micro-foaming hole plugging resin and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105237954A (en) | Epoxy resin composition for plugging holes and blending method for epoxy resin composition | |
| CN101128501B (en) | Epoxy resin, solidifiable resin composition containing epoxy resin and use thereof | |
| CN101585955B (en) | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil | |
| CN1125488C (en) | Liquid epoxy composite for packaging semiconductor and its application | |
| CN103709605B (en) | A kind of composition epoxy resin, preparation method and consent aluminium base | |
| CN101328301A (en) | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same | |
| CN105331187A (en) | Silicon-dioxide-type hole plugging ink and preparing method thereof | |
| CN101787132B (en) | Organic-silicon hybridization epoxy resin as well as preparation method and application thereof | |
| CN107043520A (en) | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof | |
| CN109265930A (en) | A kind of low-cost high-toughness self-lubricating epoxy resin and preparation method | |
| CN101948609A (en) | Black rubber and preparation method thereof | |
| CN104497494A (en) | High stably dispersed nano-silica filled epoxy resin system, cured product and preparation method thereof | |
| CN106189087A (en) | Low dielectric poss type epoxy resin composite material and preparation method thereof | |
| CN102311612A (en) | Resin composition and resin coated copper foil made of same | |
| CN105255385A (en) | Single-component and high-performance conductive silver adhesive and preparation method thereof | |
| JP2013133454A (en) | Curable composition and cured product of the same | |
| CN110291152B (en) | Thermosetting resin composition, cured product thereof, and printed wiring board | |
| CN106633631A (en) | Bottom filling rubber for high-density encapsulation and preparation method thereof | |
| CN101948672B (en) | High-defoaming epoxy resin packaging material and preparation method thereof | |
| CN106590494A (en) | Low-thermal expansion coefficient low-viscosity rapid-penetration bottom filling glue and preparation method thereof | |
| CN101508878B (en) | Bonder and method of preparing the same | |
| CN103664834B (en) | Epoxy monomer of a kind of thermal destruction and preparation method thereof and underfill material | |
| JP2018002923A (en) | Method for producing electric/electronic component, epoxy resin composition for injection molding, and electric/electronic component | |
| CN109517335B (en) | Epoxy resin composition for molding compound and preparation method thereof | |
| JP6598519B2 (en) | Manufacturing method of electronic / electrical component and electronic / electrical component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160113 |