CN113150494A - PCB micro-foaming hole plugging resin and preparation method and application thereof - Google Patents
PCB micro-foaming hole plugging resin and preparation method and application thereof Download PDFInfo
- Publication number
- CN113150494A CN113150494A CN202110315026.5A CN202110315026A CN113150494A CN 113150494 A CN113150494 A CN 113150494A CN 202110315026 A CN202110315026 A CN 202110315026A CN 113150494 A CN113150494 A CN 113150494A
- Authority
- CN
- China
- Prior art keywords
- resin
- foaming
- pcb
- micro
- hole plugging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 187
- 239000011347 resin Substances 0.000 title claims abstract description 187
- 238000005187 foaming Methods 0.000 title claims abstract description 147
- 238000002360 preparation method Methods 0.000 title claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 38
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 239000004088 foaming agent Substances 0.000 claims abstract description 26
- 239000011256 inorganic filler Substances 0.000 claims abstract description 21
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 21
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 14
- 238000011049 filling Methods 0.000 claims description 25
- 238000000227 grinding Methods 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 22
- 238000002156 mixing Methods 0.000 claims description 18
- -1 azo compound Chemical class 0.000 claims description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000002270 dispersing agent Substances 0.000 claims description 9
- 238000009736 wetting Methods 0.000 claims description 9
- 239000002518 antifoaming agent Substances 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- JRQJLSWAMYZFGP-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical compound OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JRQJLSWAMYZFGP-UHFFFAOYSA-N 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 3
- 239000004156 Azodicarbonamide Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims description 3
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000005350 fused silica glass Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 claims description 2
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 claims description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims description 2
- JDYUAATXMBQQJZ-UHFFFAOYSA-N 1,3-dibenzyl-2-methyl-1,2-dihydroimidazol-1-ium;chloride Chemical compound [Cl-].C1=C[NH+](CC=2C=CC=CC=2)C(C)N1CC1=CC=CC=C1 JDYUAATXMBQQJZ-UHFFFAOYSA-N 0.000 claims description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 2
- RHRJZZIOQCBTAW-UHFFFAOYSA-N 2-[4,5-bis(2-cyanoethoxymethylidene)-2-phenylimidazol-1-yl]propanenitrile Chemical compound C(#N)C(C)N1C(=NC(C1=COCCC#N)=COCCC#N)C1=CC=CC=C1 RHRJZZIOQCBTAW-UHFFFAOYSA-N 0.000 claims description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 2
- ZXTHWIZHGLNEPG-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC=C1 ZXTHWIZHGLNEPG-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 2
- QGDOHWWGCVCWLK-UHFFFAOYSA-N 3-benzyl-1-dodecyl-2-methyl-1,2-dihydroimidazol-1-ium;chloride Chemical compound [Cl-].CC1[NH+](CCCCCCCCCCCC)C=CN1CC1=CC=CC=C1 QGDOHWWGCVCWLK-UHFFFAOYSA-N 0.000 claims description 2
- CPXYLMJQRDHHCI-UHFFFAOYSA-N 4-(1,3-dioxan-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound O1CCCOC1C1CC2OC2CC1 CPXYLMJQRDHHCI-UHFFFAOYSA-N 0.000 claims description 2
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 claims description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 2
- NZSVGVCYSJJQBS-UHFFFAOYSA-N C.C1(=CC=CC=C1)C1(C(COCC2(C(O2)(C2=CC=CC=C2)C2=CC=CC=C2)C2=CC=CC=C2)(O1)C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C.C1(=CC=CC=C1)C1(C(COCC2(C(O2)(C2=CC=CC=C2)C2=CC=CC=C2)C2=CC=CC=C2)(O1)C1=CC=CC=C1)C1=CC=CC=C1 NZSVGVCYSJJQBS-UHFFFAOYSA-N 0.000 claims description 2
- WYPAPRNIILRHKG-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(CC1CO1)(C1=CC=CC=C1)C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(C(CC1CO1)(C1=CC=CC=C1)C1=CC=CC=C1)C1=CC=CC=C1 WYPAPRNIILRHKG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 2
- 125000005520 diaryliodonium group Chemical group 0.000 claims description 2
- 239000012954 diazonium Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- 239000001095 magnesium carbonate Substances 0.000 claims description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 2
- 210000004742 mc(tc) Anatomy 0.000 claims description 2
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 claims description 2
- 239000004843 novolac epoxy resin Substances 0.000 claims description 2
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 claims description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 claims 1
- 150000004008 N-nitroso compounds Chemical class 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 210000004027 cell Anatomy 0.000 claims 1
- FAMRKDQNMBBFBR-BQYQJAHWSA-N diethyl azodicarboxylate Substances CCOC(=O)\N=N\C(=O)OCC FAMRKDQNMBBFBR-BQYQJAHWSA-N 0.000 claims 1
- FAMRKDQNMBBFBR-UHFFFAOYSA-N ethyl n-ethoxycarbonyliminocarbamate Chemical compound CCOC(=O)N=NC(=O)OCC FAMRKDQNMBBFBR-UHFFFAOYSA-N 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000011863 silicon-based powder Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 25
- 230000009477 glass transition Effects 0.000 abstract description 7
- 230000000704 physical effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 37
- 230000008569 process Effects 0.000 description 33
- 239000010949 copper Substances 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 230000035882 stress Effects 0.000 description 14
- 239000000126 substance Substances 0.000 description 9
- 238000005553 drilling Methods 0.000 description 8
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000007781 pre-processing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004604 Blowing Agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HVIISEGQYMKIGI-UHFFFAOYSA-N 2-decyl-1-methylimidazole Chemical compound CCCCCCCCCCC1=NC=CN1C HVIISEGQYMKIGI-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical group O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910021487 silica fume Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/107—Nitroso compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
- C08J9/103—Azodicarbonamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The application relates to the technical field of PCBs (printed circuit boards), and provides a PCB micro-foaming hole plugging resin as well as a preparation method and application thereof, wherein the PCB micro-foaming hole plugging resin comprises the following components in percentage by weight, based on the total weight of the PCB micro-foaming hole plugging resin being 100%: 20 to 40 percent of epoxy resin; 2 to 10 percent of curing agent; 40 to 60 percent of inorganic filler; 0.1-10% of foaming agent; 0.1-5% of an auxiliary agent. The PCB micro-foaming hole plugging resin can form a micro-bubble structure, effectively reduces the volume shrinkage rate of the resin during curing and the shrinkage stress generated during curing, simultaneously ensures the original physical property CTE and glass transition temperature of the material, resists the shrinkage of the resin during use, reduces the curing stress and reduces the generation proportion of cracks; meanwhile, the dielectric constant, the dielectric loss and other properties are reduced, and the wide application in the field of high-frequency and high-speed PCBs is facilitated.
Description
Technical Field
The application belongs to the technical field of PCBs, and particularly relates to a PCB micro-foaming hole plugging resin and a preparation method and application thereof.
Background
At present, the construction and the commercialization layout of a 5G communication industry base station are carried out at an accelerated speed, and a huge development space is brought to terminal electronic consumption (smart phones, wearable devices and the like), big data processing and transmission communication devices (including servers, switches and the like), and automatic driving millimeter wave hardware (laser radars and the like) in the 5G commercial process. Meanwhile, the PCB used as the mother of the electronic product is synchronously and rapidly developed and upgraded, wherein the communication PCB is the most popular development direction of the PCB.
With the data transmission in large quantities, the communication frequency of communication devices and electronic products is getting higher and higher, and the trend of PCB towards high speed and high density, these trends bring challenges and opportunities to PCB materials and PCB manufacturing processes. In the aspect of high-speed materials, a base material resin system adopts PPO/PPE/PTFE and the like, so that the challenges are brought to the PCB machining and resin hole plugging process; meanwhile, the BGA VIP (VIA in pad) design becomes mainstream due to the trend of high density of the PCB, the VIP has high integration density, the BGA pitch design can be made smaller, and the BGA pitch design is reduced from 1.0mm to 0.80mm or even 0.65 mm; in order to ensure the small pitch design, in addition to the improvement of the fine degree and the alignment precision of a PCB circuit, the aperture of a mechanical through hole becomes smaller and smaller, the aperture is changed from 0.20mm to 0.15mm, the layer number design in the high-end communication PCB field is continuously increased, the aperture ratio of the through hole is further improved, and the maximum aperture ratio even reaches 40: 1; meanwhile, in order to ensure the integrity of high-speed signals of via holes, the back drilling technology is widely applied, redundant hole copper needs to be removed by adopting back drilling, and Stub is controlled; the technical trend of back drilling technology and hole structure with high thickness-diameter ratio brings challenges to the resin hole plugging process of through holes and back drilling holes, and at present, the main defects exist: filling resin filling fullness after hole plugging, resin crack defects, resin and copper bonding force and the like; due to the defects of the technology, the application of the hole plugging resin in the field of high-frequency and high-speed PCBs is influenced, and the preparation of the PCBs is limited.
Disclosure of Invention
The application aims to provide a PCB micro-foaming hole plugging resin, a preparation method and application thereof, and aims to solve the problem that resin cracks are easy to occur in a resin hole plugging process in the PCB manufacturing process in the prior art.
In order to achieve the purpose of the application, the technical scheme adopted by the application is as follows:
in a first aspect, the present application provides a PCB micro-foaming hole plugging resin, which comprises the following components in percentage by weight, based on 100% of the total weight of the PCB micro-foaming hole plugging resin:
in a second aspect, the present application provides a method for preparing a micro-foaming hole-plugging resin for a PCB, comprising the following steps:
providing each component according to the PCB micro-foaming hole plugging resin;
carrying out first mixing treatment on epoxy resin, a curing agent, an inorganic filler and an auxiliary agent to obtain a first mixture;
and carrying out second mixing treatment on the foaming agent and the first mixture, and carrying out grinding and defoaming treatment to obtain the PCB micro-foaming hole-plugging resin.
In a third aspect, the application provides an application of a PCB micro-foaming hole plugging resin or a PCB micro-foaming hole plugging resin prepared by a preparation method of the PCB micro-foaming hole plugging resin in a hole plugging preparation process of a PCB.
According to the PCB micro-foaming hole plugging resin provided by the first aspect of the application, the PCB micro-foaming hole plugging resin takes epoxy resin as a main raw material, and is cooperatively compounded with a foaming agent, a curing agent and an inorganic filler for use, the foaming agent and the epoxy resin are combined with each other, and the foaming agent has certain gas release and foaming functions when the material is cured, so that the PCB micro-foaming hole plugging resin can form a micro-bubble structure, the volume shrinkage rate of the resin during curing and the shrinkage stress generated during curing are effectively reduced, the original physical characteristic CTE and glass transition temperature of the material are ensured, the resin shrinkage is resisted during the use, the curing stress is reduced, and the crack generation proportion is reduced; meanwhile, due to the micro-foaming characteristic during curing, the internal structure of the PCB micro-foaming hole plugging resin is a smaller loose structure, the electrical property constants such as dielectric constant and dielectric loss can be lower, and meanwhile, when POFV technology is required, the PCB micro-foaming hole plugging resin has a micro-foaming micro-structure, so that the micro roughness of the surface of the resin is increased, the physical binding force between chemical copper and the resin during POFV is increased, the reliability of the POFV cap copper is increased, and the PCB micro-foaming hole plugging resin material is more favorable for wide application in the field of high-frequency high-speed PCBs.
The preparation method of the PCB micro-foaming hole plugging resin provided by the second aspect of the application is simple and convenient, the PCB micro-foaming hole plugging resin can be obtained only by simply mixing the components and carrying out conventional grinding and defoaming treatment, and the preparation method is simple to operate, does not need large-scale instruments and equipment, and can be widely applied.
The PCB microfoaming hole plugging resin provided by the third aspect of the application is applied to the hole plugging preparation process of the PCB, because the obtained PCB microfoaming hole plugging resin can form a microbubble structure, the shrinkage of the resin is resisted in the using process, the curing stress is reduced, the crack generation proportion is reduced, in the process of application in the hole plugging preparation process of the PCB, the volume of the PCB microfoaming hole plugging resin is not shrunk when the PCB microfoaming hole plugging resin is cured, the cracks and the pits can be well controlled to be generated, the stress release effect of the microfoaming structure can inhibit the crack expansion, the binding force between the surface of the resin and copper of a process product during chemical copper deposition is greatly improved, the dielectric loss of the resin is reduced, and the wide application in the field of high-frequency high-speed PCBs is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a diagram illustrating an application mechanism of a micro-foaming via-hole resin for a PCB in a via-hole preparation process of the PCB according to an embodiment of the present application. Wherein, in the figures, the respective reference numerals:
1-PCB substrate, 2-PCB micro-foaming hole-plugging resin and 3-PCB micro-foaming hole-plugging resin microstructure.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In this application, the term "and/or" describes an association relationship of associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a is present alone, A and B are present simultaneously, and B is present alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
In the present application, "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, "at least one (a), b, or c", or "at least one (a), b, and c", may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, and c may be single or plural, respectively.
It should be understood that, in various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, some or all of the steps may be executed in parallel or executed sequentially, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The weight of the related components mentioned in the description of the embodiments of the present application may not only refer to the specific content of each component, but also represent the proportional relationship of the weight among the components, and therefore, the content of the related components is scaled up or down within the scope disclosed in the description of the embodiments of the present application as long as it is scaled up or down according to the description of the embodiments of the present application. Specifically, the mass described in the specification of the embodiments of the present application may be a mass unit known in the chemical industry field such as μ g, mg, g, kg, etc.
The terms "first" and "second" are used for descriptive purposes only and are used for distinguishing purposes such as substances from one another, and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. For example, a first XX may also be referred to as a second XX, and similarly, a second XX may also be referred to as a first XX, without departing from the scope of embodiments of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The first aspect of the embodiments of the present application provides a PCB micro-foaming hole plugging resin, which comprises the following components in percentage by weight, based on 100% of the total weight of the PCB micro-foaming hole plugging resin:
according to the PCB micro-foaming hole plugging resin provided by the first aspect of the application, the PCB micro-foaming hole plugging resin takes epoxy resin as a main raw material, and is cooperatively compounded with a foaming agent, a curing agent and an inorganic filler for use, the foaming agent and the epoxy resin are combined with each other, and the foaming agent has certain gas release and foaming functions when the material is cured, so that the PCB micro-foaming hole plugging resin can form a micro-bubble structure, the volume shrinkage rate of the resin during curing and the shrinkage stress generated during curing are effectively reduced, the original physical characteristic CTE and glass transition temperature of the material are ensured, the resin shrinkage is resisted during the use, the curing stress is reduced, and the crack generation proportion is reduced; meanwhile, due to the micro-foaming characteristic during curing, the internal structure of the PCB micro-foaming hole plugging resin is a smaller loose structure, the electrical property constants such as dielectric constant and dielectric loss can be lower, and meanwhile, when POFV technology is required, the PCB micro-foaming hole plugging resin has a micro-foaming micro-structure, so that the micro roughness of the surface of the resin is increased, the physical binding force between chemical copper and the resin during POFV is increased, the reliability of the POFV cap copper is increased, and the PCB micro-foaming hole plugging resin material is more favorable for wide application in the field of high-frequency high-speed PCBs.
Specifically, the micro-foaming hole plugging resin comprises 20-40 wt% of epoxy resin, wherein the total weight of the micro-foaming hole plugging resin is 100%. Since the PCB micro-foaming hole-plugging resin is mainly applied to the process of manufacturing resin plug holes in PCB, the resin is required to be used as a main material. The weight percentage of the provided epoxy resin is 20 wt% -40 wt%, if the added epoxy resin is excessive, other components cannot well form a compounding effect, and PCB micro-foaming hole-plugging resin with a micro-foaming structure cannot be formed; if less epoxy resin is added, the properties of conventional via-filling resins cannot be achieved.
In a specific embodiment of the present invention, the weight percentage of the epoxy resin is 20 wt%, 22 wt%, 24 wt%, 26 wt%, 28 wt%, 30 wt%, 32 wt%, 34 wt%, 36 wt%, 38 wt%, 40 wt%, based on the total weight of the PCB micro-foaming via hole resin taken as 100 wt%.
In some embodiments, the epoxy resin is selected from the group consisting of dicyclopentadiene phenol type epoxy resin, biphenyl phenol type epoxy resin, bisphenol a type novolac epoxy resin, fused ring naphthalene type epoxy resin, 4 '-methylenebis (N, N' -diglycidylaniline), tetraphenylglycidylethane, triphenylglycidylether methane, triglycidyl isocyanurate, tetraglycidyldiaminodiphenylmethane, tetraglycidyl-1, 3-bisaminomethylcyclohexane, silicone modified epoxy resin, polyamide modified epoxy resin, benzoxazine modified epoxy, bisphenol a epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol a epoxy resin, 4, 5-epoxycyclohexane-1, 2-dimethyldiglycidyl ester, 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer, 1, 4-cyclohexanedimethanol bis (3, 4-epoxycyclohexanecarboxylic acid) ester, bis ((3, 4-epoxycyclohexyl) methyl) adipate, and at least one of triglycidyl p-aminophenol.
Specifically, the PCB micro-foaming hole filling resin comprises 0.1-10 wt% of foaming agent by taking the total weight of the PCB micro-foaming hole filling resin as 100%, the foaming agent is added, the material can release gas after being mixed, and a fine-hole compound is formed in the polymer composition, so that a micro-bubble structure is formed on the surface of the obtained PCB micro-foaming hole filling resin, the volume shrinkage rate of the resin during curing and the shrinkage stress generated during curing are effectively reduced, the original physical characteristics CTE and the glass transition temperature of the material are ensured, the shrinkage of the resin is resisted during the use, the curing stress is reduced, and the crack generation proportion is reduced; meanwhile, due to the micro-foaming characteristic during curing, the internal structure of the PCB micro-foaming hole plugging resin is a smaller loose structure, the electrical property constants such as dielectric constant and dielectric loss can be lower, and meanwhile, when POFV technology is required, the PCB micro-foaming hole plugging resin has a micro-foaming micro-structure, so that the micro roughness of the surface of the resin is increased, the physical binding force between chemical copper and the resin during POFV is increased, the reliability of the POFV cap copper is increased, and the PCB micro-foaming hole plugging resin material is more favorable for wide application in the field of high-frequency high-speed PCBs. If the amount of the foaming agent added is too large, the pores formed become too large, and the stability and filling property of the material are affected; if the addition amount of the foaming agent is too small, the PCB micro-foaming hole plugging resin material cannot form a micro-bubble structure, cannot resist the shrinkage of resin in the using process, reduces the curing stress and reduces the generation proportion of cracks.
In a specific embodiment of the present invention, the weight percentage of the blowing agent is 0.1 wt%, 0.5 wt%, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, 3.5 wt%, 4 wt%, 4.5 wt%, 5 wt%, 5.5 wt%, 6 wt%, 6.5 wt%, 7 wt%, 7.5 wt%, 8 wt%, 8.5 wt%, 9 wt%, 9.5 wt%, 10 wt%, based on the total weight of the PCB micro-foamed via hole resin taken as 100%.
In some embodiments, the blowing agent is selected from at least one of an N-ylidene compound, an azo compound. Wherein the N-methylene compound is at least one selected from N, N-dinitrosopentamethylenetetramine and N, N-dimethyl-N, N-diterephthalamide; the azo compound is at least one selected from azodicarbonamide, azodiisobutyronitrile, azodicarbonic isopropyl, azodicarbonic diethyl ester, diazoaminobenzene and azodicarbonic barium.
Specifically, the curing agent comprises 2-10 wt% of the total weight of the PCB micro-foaming hole plugging resin being 100%. And a curing agent is added, so that the PCB micro-foaming hole plugging resin can be cured in the microporous structure after being combined with the PCB by a hole plugging process and then cured. If the addition amount of the curing agent is too large, the addition of other components is influenced; if the amount of the curing agent added is too small, the curing effect is impaired.
In an embodiment of the present invention, the curing agent is present in an amount of 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, based on 100 wt% of the total weight of the PCB micro-foaming via hole resin.
In some embodiments, the curing agent is selected from at least one of an imidazole-based curing agent, an anhydride-based curing agent, and an amine-based curing agent.
In specific embodiments, the imidazole-based curing agent is selected from the group consisting of PN-23, PN-31, PN-40, PN-50, PN-H, 2-undecylimidazole, 2-heptadecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-methylimidazole isocyanurate, 2-phenylimidazole isocyanurate, 2, 4-diamino-6- (2-methylimidazole-1-ethyl) -S-triazine, 2, 4-diamino-6- (2-ethyl-4-methylimidazole-1-ethyl) -S-triazine, N-methyl-phenyl-N-methyl-2-imidazolium-ethyl-S-triazine, N-methyl-2-decylimidazole, N-methyl-1-methylimidazole-4-methyl-1-ethyl) -, 2, 4-diamino-6- (2-undecylimidazole-1-ethyl) -S-triazine, 2-phenyl-4, 5-dimethyloimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-4, 5-bis (cyanoethoxymethylene) imidazole, 1-dodecyl-2-methyl-3-benzylimidazole chloride, 1, 3-dibenzyl-2-methylimidazole chloride.
In a specific embodiment, the acid anhydride curing agent is at least one selected from phthalic anhydride, BTDA, DSDA, THPA, NA, MCTC.
In a specific embodiment, the amine-based curing agent is at least one selected from the group consisting of boron trifluoride-amine complex, aromatic diazonium salt, diaryliodonium salt, triarylsulfonium salt, and metallocene-based compound.
Specifically, the PCB micro-foaming hole plugging resin comprises 40-60 wt% of inorganic filler by taking the total weight of the PCB micro-foaming hole plugging resin as 100%, and the inorganic filler is added to mainly improve the filling property of the PCB micro-foaming hole plugging resin, so that the PCB micro-foaming hole plugging resin can have a good filling effect in the hole plugging process, and meanwhile, the stability and the wear resistance of the PCB micro-foaming hole plugging resin can be improved. If the addition amount of the inorganic filler is too much, the compounding of other components is influenced, and the property of the PCB micro-foaming hole plugging resin is influenced; if the amount of the inorganic filler added is too small, the stability and abrasion resistance of the material are affected.
In a specific embodiment of the present invention, the inorganic filler is present in an amount of 40 wt%, 42 wt%, 44 wt%, 46 wt%, 48 wt%, 50 wt%, 52 wt%, 54 wt%, 56 wt%, 58 wt%, 60 wt% based on 100 wt% of the total weight of the PCB micro-foaming via hole resin.
In some embodiments, the inorganic filler is selected from at least one of barium sulfate, talc, crystalline silica, fused silica, amorphous silica, nanosilica, magnesium carbonate, calcium carbonate, nanosilica, alumina, aluminum hydroxide, and silica fume.
Specifically, the micro-foaming hole plugging resin comprises 0.1-5 wt% of an auxiliary agent, wherein the auxiliary agent is at least one selected from a wetting dispersant and a defoaming agent, and the total weight of the micro-foaming hole plugging resin is 100%.
In some embodiments, the wetting and dispersing agent is selected from at least one of ByK-110, ByK-111, Hamming specialty chemical Disponer 904S, Luborun 2400SC, Luborun 20000.
In some embodiments, the defoamer is selected from BYK-A550, BYK-A515, BYK-A506, A506, Dow Corning H10, FS80, Digao Foamex1495, Foamex 842.
In an embodiment of the present invention, the weight percentage of the additive is 0.1 wt%, 0.5 wt%, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, 3.5 wt%, 4 wt%, 4.5 wt%, 5 wt% based on the total weight of the PCB micro-foaming via hole resin being 100%.
The second aspect of the embodiments of the present application provides a method for preparing a micro-foaming hole-plugging resin for a PCB, comprising the following steps:
s01, providing each component according to PCB micro-foaming hole plugging resin;
s02, carrying out first mixing treatment on epoxy resin, a curing agent, an inorganic filler and an auxiliary agent to obtain a first mixture;
and S03, carrying out second mixing treatment on the foaming agent and the first mixture, and carrying out grinding and defoaming treatment to obtain the PCB micro-foaming hole plugging resin.
The preparation method of the PCB micro-foaming hole plugging resin provided by the second aspect of the application is simple and convenient, the PCB micro-foaming hole plugging resin can be obtained only by simply mixing the components and carrying out conventional grinding and defoaming treatment, and the preparation method is simple to operate, does not need large-scale instruments and equipment, and can be widely applied.
In step S01, the components are provided according to the PCB micro-foaming pore-filling resin, and the components and the addition amount of the PCB micro-foaming pore-filling resin are discussed above, and are not repeated herein for brevity.
In step S02, a first mixing process is performed on the epoxy resin, the curing agent, the inorganic filler, and the auxiliary agent to obtain a first mixture. Wherein, the conventional mixing treatment method is adopted, and only the components are required to be uniformly mixed, so that the first mixture which is uniformly mixed can be ensured.
In step S03, a second mixing process is performed on the foaming agent and the first mixture, and grinding and defoaming processes are performed to obtain the PCB micro-foaming via-hole resin.
In some embodiments, after the second mixing treatment of the foaming agent and the first mixture, the obtained mixture is ground, wherein the grinding method comprises the following steps: and (3) carrying out high-speed grinding treatment on the mixture for 15-20 minutes at the temperature of 40-50 ℃. And in order to ensure that the fineness of the particle size of the material obtained by grinding is smaller, grinding is carried out for 3-4 times.
In some embodiments, the defoaming treatment is performed by: transferring the ground material to a vacuum stirring and defoaming machine for defoaming until the material is free from bubbles; and then carrying out centrifugal defoaming treatment to ensure that the obtained PCB micro-foaming hole-plugging resin has smaller fineness and no bubbles.
The third aspect of the application provides an application of the PCB micro-foaming hole plugging resin or the PCB micro-foaming hole plugging resin prepared by the preparation method of the PCB micro-foaming hole plugging resin in the hole plugging preparation process of the PCB.
The application of the PCB micro-foaming hole plugging resin in the hole plugging preparation process of the PCB provided by the third aspect of the application is shown in the attached drawing 1, the PCB micro-foaming hole plugging resin 2 is applied to the PCB substrate, the hole plugging material is formed in the PCB substrate 1, because the obtained PCB micro-foaming hole plugging resin 21 can form a micro-bubble structure, the shrinkage of the resin is resisted in the use process, the curing stress is reduced, the generation proportion of cracks is reduced, in the application process of the hole plugging preparation process of the PCB, the volume of the PCB micro-foaming hole plugging resin is not shrunk during curing, the cracks and the depressions can be well controlled, the stress release function of the micro-foaming structure can inhibit the crack expansion, the bonding force between the resin surface and copper during chemical copper deposition of a process product is greatly improved, the dielectric loss of the resin is reduced, and the wide application in the high-frequency high-speed PCB field is facilitated.
The preparation process of the plug hole comprises the following steps:
G01. preprocessing a PCB product to form PCB product micropores;
G02. filling the PCB micro-foaming hole plugging resin into the PCB product micropores by adopting a vacuum hole plugging process, performing hole plugging treatment, and then sequentially performing curing, baking and grinding treatment.
In step G01, the pre-treating the PCB product includes pre-baking and drilling the PCB product.
The pre-baking treatment of the PCB product mainly comprises removing water vapor in holes in the PCB product, and if the water vapor is remained in the holes, the hole plugging easily causes the problem of holes or hole explosion. The pre-baking temperature and time are further determined according to the characteristics of the PCB, and the baking temperature needs to be 5-10 ℃ higher than the glass transition temperature according to the glass transition temperature of the material.
In some embodiments, the pre-baking temperature of the epoxy resin PCB product is 130-; the pre-baking temperature of the high-speed PCB product is 170-200 ℃, and the pre-baking time is 2-6 hours.
Further, after the pre-baking treatment, drilling, namely drilling by adopting an aluminum sheet, and drilling holes needing resin hole plugging; to form PCB product micro vias.
And G02, filling the PCB micro-foaming hole plugging resin into the PCB product micropores by adopting a vacuum hole plugging process, performing hole plugging treatment, and then sequentially performing curing, baking and grinding treatment.
In some embodiments, the PCB product is placed in a vacuum hole plugging device, PCB micro-foaming hole plugging resin is filled in the micro-holes of the PCB product by adopting a vacuum hole plugging process, and the pressure of a scraper is controlled to be 4-10 kg/cm2And the scraper speed is 1-2 m/min.
In some embodiments, the via filling process is followed by a curing bake. The embodiment of the application adopts the step-type curing pre-baking parameters, the curing is gradually carried out according to the low temperature to the high temperature, the step-type curing temperature refers to the step-by-step temperature rise process, and the step-by-step temperature rise is not carried out by adopting the constant baking temperature; the setting is based on the curing temperature of the resin.
In a specific embodiment, the stepwise curing prebaking parameters are: the first stage is as follows: treating at 80-85 ℃ for 30min, and in the second stage: treating at 120-140 ℃ for 60min, and the third stage: treating at 150-155 ℃ for 30 min.
The stepped curing pre-baking treatment is adopted, and because the curing temperature of the PCB micro-foaming hole plugging resin is about 120 ℃, the PCB micro-foaming hole plugging resin is pre-cured by baking at a low temperature of 80-85 ℃ in a first stage before the curing temperature, and the difference of the internal and external temperatures of the PCB is balanced; then, curing at 120 ℃ in the second stage (the curing temperature point of the resin is near 120 ℃), and fully curing at 150 ℃ in the third stage, wherein the time is set according to the requirement of ensuring the curing degree of the resin; too low a temperature may result in insufficient curing of the resin, and too high a temperature may result in too large a stress for curing the resin, and may easily cause defects such as cracks.
In some embodiments, the curing bake is followed by a grinding process, the purpose of which is to remove resin from the vias and to clean the resin from the PCB surface.
In a specific embodiment, the grinding process comprises: the current of the upper brush wheel and the lower brush wheel of the grinding device is set to be 1.5-2.5A, and 8 groups of ceramic grinding brushes and 4 groups of non-woven cloth grinding brushes are matched for grinding.
In some embodiments, if the part of the product after grinding requires electroless copper plating, the electroless copper plating is performed according to a normal process in a PCB process.
The following description will be given with reference to specific examples.
Example 1
PCB micro-foaming hole plugging resin and preparation method and application thereof
PCB micro-foaming hole plugging resin
The PCB micro-foaming hole plugging resin comprises the following components in percentage by weight, based on 100 percent of the total weight of the PCB micro-foaming hole plugging resin:
wherein the epoxy resin is selected from dicyclopentadiene phenol type epoxy resin;
the curing agent is selected from 1-cyanoethyl-2-ethyl-4-methylimidazole;
the inorganic filler is selected from barium sulfate;
the foaming agent is selected from N, N-dinitrosopentamethylenetetramine;
the auxiliary agent is selected from a mixture of a wetting dispersant and a defoaming agent, the wetting dispersant is selected from German Bick BYK-110, and the defoaming agent is selected from BYK-A550.
Preparation method of PCB micro-foaming hole plugging resin
Providing each component according to the PCB micro-foaming pore-filling resin provided in the embodiment 1;
carrying out first mixing treatment on epoxy resin, a curing agent, an inorganic filler and an auxiliary agent to obtain a first mixture;
and carrying out second mixing treatment on the foaming agent and the first mixture, and carrying out grinding and defoaming treatment to obtain the PCB micro-foaming hole-plugging resin.
Application of PCB micro-foaming hole plugging resin
The PCB micro-foaming hole plugging resin is applied to a hole plugging preparation process of a PCB, and the hole plugging preparation process comprises the following steps:
preprocessing a PCB product to form PCB product micropores;
filling PCB micro-foaming hole plugging resin into PCB product micropores by using a vacuum hole plugging process, placing the PCB product in vacuum hole plugging equipment, filling the PCB micro-foaming hole plugging resin into the PCB product micropores by using the vacuum hole plugging process, and controlling the pressure of a scraper to be 4-10 kg/cm2Treating at a scraper speed of 1-2 m/min; and then sequentially carrying out curing and baking, adopting stepped curing and pre-baking, and having the parameters as follows: the first stage is as follows: 80 ℃ for 30min, and a second stage: 120 ℃ for 60min, and a third stage: treating at 150 deg.C for 30 min; then grinding treatment is carried out.
Example 2
PCB micro-foaming hole plugging resin and preparation method and application thereof
PCB micro-foaming hole plugging resin
The PCB micro-foaming hole plugging resin comprises the following components in percentage by weight, based on 100 percent of the total weight of the PCB micro-foaming hole plugging resin:
wherein the epoxy resin is selected from biphenyl phenol type epoxy resin;
the curing agent is selected from phthalic anhydride;
the inorganic filler is selected from talcum powder;
the foaming agent is selected from azodicarbonamide;
the auxiliary agent is selected from a mixture of a wetting dispersant and a defoaming agent, the wetting dispersant is selected from German Bick BYK-110, and the defoaming agent is selected from BYK-A515.
Preparation method of PCB micro-foaming hole plugging resin
Providing each component according to the PCB micro-foaming pore-filling resin provided in example 2;
carrying out first mixing treatment on epoxy resin, a curing agent, an inorganic filler and an auxiliary agent to obtain a first mixture;
and carrying out second mixing treatment on the foaming agent and the first mixture, and carrying out grinding and defoaming treatment to obtain the PCB micro-foaming hole-plugging resin.
Application of PCB micro-foaming hole plugging resin
The PCB micro-foaming hole plugging resin is applied to a hole plugging preparation process of a PCB, and the hole plugging preparation process comprises the following steps:
preprocessing a PCB product to form PCB product micropores;
filling PCB micro-foaming hole plugging resin into PCB product micropores by using a vacuum hole plugging process, placing the PCB product in vacuum hole plugging equipment, filling the PCB micro-foaming hole plugging resin into the PCB product micropores by using the vacuum hole plugging process, and controlling the pressure of a scraper to be 4-10 kg/cm2Treating at a scraper speed of 1-2 m/min; and then sequentially carrying out curing and baking, adopting stepped curing and pre-baking, and having the parameters as follows: the first stage is as follows: 80 ℃ for 30min, and a second stage: 120 ℃ for 60min, and a third stage: treating at 150 deg.C for 30 min; then grinding treatment is carried out.
Example 3
PCB micro-foaming hole plugging resin and preparation method and application thereof
PCB micro-foaming hole plugging resin
The PCB micro-foaming hole plugging resin comprises the following components in percentage by weight, based on 100 percent of the total weight of the PCB micro-foaming hole plugging resin:
wherein the epoxy resin is selected from polyamide modified epoxy resin;
the curing agent is selected from boron trifluoride-amine complex;
the inorganic filler is selected from fused silica;
the foaming agent is selected from barium azodicarboxylate;
the auxiliary agent is selected from a mixture of a wetting dispersant and a defoaming agent, the wetting dispersant is selected from German Bick BYK-110, and the defoaming agent is selected from BYK-A506.
Preparation method of PCB micro-foaming hole plugging resin
Providing each component according to the PCB micro-foaming pore-filling resin provided in the embodiment 3;
carrying out first mixing treatment on epoxy resin, a curing agent, an inorganic filler and an auxiliary agent to obtain a first mixture;
and carrying out second mixing treatment on the foaming agent and the first mixture, and carrying out grinding and defoaming treatment to obtain the PCB micro-foaming hole-plugging resin.
Application of PCB micro-foaming hole plugging resin
The PCB micro-foaming hole plugging resin is applied to a hole plugging preparation process of a PCB, and the hole plugging preparation process comprises the following steps:
preprocessing a PCB product to form PCB product micropores;
filling PCB micro-foaming hole plugging resin into PCB product micropores by using a vacuum hole plugging process, placing the PCB product in vacuum hole plugging equipment, filling the PCB micro-foaming hole plugging resin into the PCB product micropores by using the vacuum hole plugging process, and controlling the pressure of a scraper to be 4-10 kg/cm2Treating at a scraper speed of 1-2 m/min; and then sequentially carrying out curing and baking, adopting stepped curing and pre-baking, and having the parameters as follows: the first stage is as follows: 80 ℃ for 30min, and a second stage: 120 ℃ for 60min, and a third stage: treating at 150 deg.C for 30min(ii) a Then grinding treatment is carried out.
And (3) carrying out performance test on the products obtained in the embodiments 1 to 3, and observing the crack proportion and the thermal stress of the PCB after the hole plugging resin is plugged in the PCB, and the crack and the interface bonding force performance of the products after reflow soldering test.
The performance test results are shown in the following table 1, and it can be seen from the table 1 that the products obtained in the examples 1 to 3 have no cracks, the proportion of the cracks is 0%, and the thermal stress test shows that the products obtained in the examples 1 to 3 have no cracks and the cap copper layer has no separation; through reflow testing, it can be seen that the product resin obtained in examples 1-3 has no cracks and the cap copper layer has no separation.
TABLE 1
Therefore, according to the PCB micro-foaming hole plugging resin provided by the application, the PCB micro-foaming hole plugging resin takes epoxy resin as a main raw material, and is cooperatively compounded with a foaming agent, a curing agent and an inorganic filler for use, the foaming agent and the epoxy resin are combined with each other, and the foaming agent has certain gas release and foaming functions when the material is cured, so that the PCB micro-foaming hole plugging resin can form a micro-bubble structure, the volume shrinkage rate of the resin during curing and the shrinkage stress generated during curing are effectively reduced, the original physical characteristic CTE and the glass transition temperature of the material are ensured, the resin shrinkage is resisted during the use, the curing stress is reduced, and the crack generation proportion is reduced; meanwhile, due to the micro-foaming characteristic during curing, the internal structure of the PCB micro-foaming hole plugging resin is a smaller loose structure, the electrical property constants such as dielectric constant and dielectric loss can be lower, and meanwhile, when POFV technology is required, the PCB micro-foaming hole plugging resin has a micro-foaming micro-structure, so that the micro roughness of the surface of the resin is increased, the physical binding force between chemical copper and the resin during POFV is increased, the reliability of the POFV cap copper is increased, and the PCB micro-foaming hole plugging resin material is more favorable for wide application in the field of high-frequency high-speed PCBs.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The PCB micro-foaming hole plugging resin is characterized by comprising the following components in percentage by weight based on 100% of the total weight of the PCB micro-foaming hole plugging resin:
2. the PCB micro-foaming via hole resin of claim 1, wherein the foaming agent is selected from at least one of N-Subx compounds and azo compounds.
3. The PCB micro-foaming nozzle resin of claim 2, wherein the N-nitroso compound is at least one selected from the group consisting of N, N-dinitrosopentamethylenetetramine, N-dimethyl-N, N-diterephthalamide; and/or the presence of a gas in the gas,
the azo compound is selected from at least one of azodicarbonamide, azodiisobutyronitrile, isopropyl azodicarboxylate, diethyl azodicarboxylate, diazoaminobenzene and barium azodicarboxylate.
4. The PCB micro-foaming via hole resin of claim 1, wherein the epoxy resin is selected from dicyclopentadiene phenol type epoxy resin, biphenyl phenol type epoxy resin, bisphenol A type novolac epoxy resin, condensed ring naphthalene type epoxy resin, 4 '-methylenebis (N, N' -diglycidylaniline), tetraphenylglycidylethane, triphenylglycidylether methane, triglycidyl isocyanurate, tetraglycidyldiaminodiphenylmethane, tetraglycidyl-1, 3-bisaminomethylcyclohexane, silicone modified epoxy resin, polyamide modified epoxy resin, benzoxazine modified epoxy, bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, 4, 5-epoxycyclohexane-1, 2-dimethyldiglycidyl ester, 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer, 1, 4-cyclohexanedimethanol bis (3, 4-epoxycyclohexanecarboxylate) ester, bis ((3, 4-epoxycyclohexyl) methyl) adipate, and at least one of triglycidyl-p-aminophenol.
5. The PCB micro-foaming pore-filling resin according to any one of claims 1 to 4, wherein the curing agent is at least one selected from imidazole curing agents, anhydride curing agents and amine curing agents.
6. The PCB microfoaming cell hole resin of claim 5, wherein said imidazole based curing agent is selected from PN-23, PN-31, PN-40, PN-50, PN-H, 2-undecylimidazole, 2-heptadecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-methylimidazole triisocyanate, 2-phenylimidazole triisocyanate, 2, 4-diamino-6- (2-methylimidazole-1-ethyl) -S-triazine, 2, 4-diamino-6- (2-ethyl-4-methylimidazole-1-ethyl) -at least one of S-triazine, 2, 4-diamino-6- (2-undecylimidazole-1-ethyl) -S-triazine, 2-phenyl-4, 5-dimethyloimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-4, 5-bis (cyanoethoxymethylene) imidazole, 1-dodecyl-2-methyl-3-benzylimidazole chloride, 1, 3-dibenzyl-2-methylimidazole chloride; and/or the presence of a gas in the gas,
the acid anhydride curing agent is at least one selected from phthalic anhydride, BTDA, DSDA, THPA, NA and MCTC; and/or the presence of a gas in the gas,
the amine curing agent is at least one selected from boron trifluoride-amine complex, aromatic diazonium salt, diaryl iodonium salt, triaryl sulfonium salt and metallocene compound.
7. The PCB micro-foaming hole plugging resin according to any one of claims 1 to 4, wherein said inorganic filler is at least one selected from the group consisting of barium sulfate, talc, crystalline silica, fused silica, amorphous silica, silicon dioxide, nano silica, magnesium carbonate, calcium carbonate, nano calcium carbonate, aluminum oxide, aluminum hydroxide and fine silicon powder.
8. The PCB micro-foaming pore-filling resin of any one of claims 1 to 4, wherein the auxiliary agent is at least one selected from a wetting dispersant and a defoaming agent.
9. A preparation method of PCB micro-foaming hole plugging resin is characterized by comprising the following steps:
providing components of the PCB micro-foaming pore-filling resin according to any one of claims 1 to 8;
carrying out first mixing treatment on epoxy resin, a curing agent, an inorganic filler and an auxiliary agent to obtain a first mixture;
and carrying out second mixing treatment on the foaming agent and the first mixture, and carrying out grinding and defoaming treatment to obtain the PCB micro-foaming hole-plugging resin.
10. Use of the PCB micro-foaming hole-plugging resin of any one of claims 1 to 8 or the PCB micro-foaming hole-plugging resin prepared by the preparation method of the PCB micro-foaming hole-plugging resin of claim 9 in a hole-plugging preparation process of a PCB.
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