CN107043520A - A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof - Google Patents
A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof Download PDFInfo
- Publication number
- CN107043520A CN107043520A CN201710043325.1A CN201710043325A CN107043520A CN 107043520 A CN107043520 A CN 107043520A CN 201710043325 A CN201710043325 A CN 201710043325A CN 107043520 A CN107043520 A CN 107043520A
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- China
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- epoxy resin
- large aperture
- circuit board
- printed circuit
- metal base
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof, including epoxy resin, curing agent, curing accelerator, toughener, additive, inorganic filler.The composition epoxy resin of metal base printed circuit board consent in large aperture provided by the present invention, all components are without volatile components such as solvent, low molecular compound, moisture, and solid content 100% can avoid occurring the defects such as not full, depression after consent；Viscosity is high, is not flowed after consent, it is very good that characterisitic parameter is matched with large aperture Metal Substrate consent panel products, can reduce process flow for filling holes, improves production efficiency；Abrasiveness is good, improves grinding efficiency；Thermal coefficient of expansion is low, heat-resist, solves resin and hole wall separation problem；Cost is low, about the 1/20 of imported product.
Description
Technical field
The present invention relates to the manufacture technology field of printed circuit board, a kind of large aperture metal base printed circuit board is specifically described
Composition epoxy resin of consent and preparation method thereof.
Background technology
With the development of electronic information technology, electronic product develops towards lightweight, miniaturization, high speed direction, to printing
Plate proposes higher requirement.
For adaptive technique development trend, printed board design and producers are also in constantly more new designing concept and technique
Preparation method.Jack process is also that people are reducing printed board design size, a kind of skill for coordinating assembling component and inventing
Art method.Its bold design concept and can the production of scale played great promotion in the making field of printed board really
Power, effectively raises the reliability and manufacture craft ability of product.
Due to the limitation of each side, China's plug socket resin industry is in terms of software and hardware still in relatively backward water
Put down, the product reliability produced is low, stability is poor, can not be competed completely with external product.And external product is although price is high
It is expensive, but performance is good, stability and reliability are high, and to ensure product quality, many enterprises also have to select imported product.
In addition, there is consent work because of characterisitic parameter and large aperture Metal Substrate consent panel products mismatch in traditional plug socket resin
Skill long flow path, efficiency are low, manufacture the problems such as cost is high, and are easily caused not full, empty consent, depression, resin and hole
The bad defects such as wall separation, greatly limit the development of large aperture Metal Substrate consent panel products.
The content of the invention
For above-mentioned background large pore metal base printed circuit board consent is full, empty, resin and hole wall easily divide
From, product qualification rate is low, and plug socket resin characterisitic parameter is mismatched with large aperture Metal Substrate jack panel, and process flow for filling holes is complicated,
Low production efficiency, manufactures the problems such as cost is high, and the present invention provides a kind of large aperture metal base printed circuit board consent
Composition epoxy resin and preparation method thereof.
The purpose of the present invention will be achieved through the following technical solutions：A kind of large aperture metal base printed circuit board consent
Composition epoxy resin, including epoxy resin, curing agent, curing accelerator, toughener, additive, inorganic filler.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent, its feature
It is：Include the epoxy resin of 90-110 mass parts, the curing agent of 0.5-100 mass parts, the solidification of 0.5-10 mass parts promotes
Agent, the toughener of 10-30 mass parts, the additive of 1-20 mass parts, the inorganic filler of 100-300 mass parts.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent, the ring
Oxygen tree fat is bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, aliphatic glycidyl ether epoxy
Resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, novolac epoxy resin, hydrogenated epoxy resin, biphenyl
Type epoxy resin, how the one or more in ring structure epoxy resin.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent is described solid
Agent is aliphatic polyamine, alicyclic polyamine, triethanolamine, imidazoles, anhydrides, modified amine, modified imidazole, polyethers
One or more in amine, amido amine, polyurethane, boron trifluoride, cyanate, polymercaptan.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent is described solid
Change accelerator is 2-ethyl-4-methylimidazole, 1- cyanoethyls -2-ethyl-4-methylimidazole, 2- ethyl -4- phenylimidazoles, modification
One or more in imidazoles, boron trifluoride, substituted urea, DMP-30.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent, the increasing
Tough dose is LNBR, rubber modified epoxy resin, polyurethane modified epoxy resin, dimer acid modified epoxy resin, phenol
Hydroxy polyethers sulfone, phenolic hydroxyl group polyphenylene oxide, PEI, core-shell particles, nano inorganic particle, one kind in block copolymer or
It is a variety of.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent is described to add
Plus agent is that aerosil, soluble castor oil, rilanit special, coupling agent, silicon modified organic polymer, acrylate are common
One or more in polymers, modified polyurethane, modified fatty acid ester.
It is preferred that, a kind of composition epoxy resin of described large aperture metal base printed circuit board consent, the nothing
Machine filler is active magnesium hydroxide, active aluminium hydroxide, activated alumina, nano silicon, nano-calcium carbonate, active kaolinite
Soil, active mica, the one or more of active talcum powder.
It is preferred that, a kind of preparation side of the composition epoxy resin of described large aperture metal base printed circuit board consent
Method, weighs epoxy resin, curing agent, curing accelerator and the additive of respective quality part in a container, high-speed stirred first
After mixing 30-40 minutes, then stirring at low speed 12 hours；Then the inorganic filler of respective quality part is weighed, the container is added to
In, then high-speed stirred is mixed 30-40 minutes, is ground using three-roll grinder, high-speed stirred mixing 30-40 minutes, most
Vacuum defoamation 120-180 minutes, set aside for use afterwards.
The beneficial effects of the invention are as follows：The asphalt mixtures modified by epoxy resin of metal base printed circuit board consent in large aperture provided by the present invention
Oil/fat composition, all components are without volatile components such as solvent, low molecular compound, moisture, and solid content 100% can be avoided
Occur the defects such as not full, depression after consent；Viscosity is high, is not flowed after consent, characterisitic parameter and large aperture Metal Substrate jack panel
Product matching is very good, can reduce process flow for filling holes, improves production efficiency；Abrasiveness is good, improves grinding efficiency；Thermal expansion system
Number is low, heat-resist, solves resin and hole wall separation problem；Cost is low, about the 1/20 of imported product.
Brief description of the drawings
Fig. 1 is a kind of preparation method of the composition epoxy resin of large aperture metal base printed circuit board consent of the invention
Flow chart.
Embodiment
To more fully understand the present invention, further specific elaboration, but not is made to the present invention below by following examples
Limitation of the invention is can be regarded as, some made for those skilled in the art according to foregoing invention content are nonessential
Improve with adjusting, be also considered as being within the scope of the present invention.
Embodiment 1
Weigh the bisphenol f type epoxy resin, the polyamine curing agent of 5 mass parts, the DMP-30 of 5 mass parts of 100 mass parts
Curing accelerator, block copolymer-toughened dose of 30 mass parts, the additives of 5 mass parts in a clean container, high-speed stirred
30-40 minutes, stirring at low speed 12 hours.Then the silica inorganic filler of 200 mass parts, 30-40 points of high-speed stirred are added
Clock, is repeatedly ground using three-roll grinder, then high-speed stirred 30-40 minutes, is put into vacuum degasing machine and is carried out 150 points of deaeration
Metal Substrate jack panel is made in clock, normal consent after taking-up.
Embodiment 2
The imidazoles solidification for weighing the novolac epoxy resin, the anhydride curing agent of 50 mass parts, 5 mass parts of 100 mass parts promotees
Enter agent, the core-shell particles of 30 mass parts, 5 mass parts additive in a clean container, high-speed stirred 30-40 minutes, low speed
Stirring 12 hours.Then the silica inorganic filler of 300 mass parts is added, high-speed stirred 30-40 minutes is ground using three rollers
Machine is repeatedly ground, then high-speed stirred 30-40 minutes, is put into vacuum degasing machine and is carried out deaeration 150 minutes, is normally filled in after taking-up
Hole, is made Metal Substrate jack panel.
Embodiment 3
Polyfunctional epoxy resin, the modified amine of 10 mass parts, the substituted urea of 3 mass parts for weighing 100 mass parts solidify and promoted
Enter agent, the nano inorganic particle of 30 mass parts, 5 mass parts additive in a clean container, high-speed stirred 30-40 minutes,
Stirring at low speed 12 hours.Then the active talcum powder inorganic filler of 230 mass parts is added, high-speed stirred 30-40 minutes uses three
Roller mill is repeatedly ground, then high-speed stirred 30-40 minutes, is put into vacuum degasing machine and is carried out deaeration 150 minutes, after taking-up
Normal consent, is made Metal Substrate jack panel.
Embodiment 4
It is as follows We conducted the contrast experiment of next step in order to which the present invention is better described：
Comparative example 1
Weigh 100 mass parts bisphenol f type epoxy resins, the amido diphenyl-methane curing agent of 10 mass parts two, the three of 5 mass parts
Phenyl phosphorus curing accelerator, 5 mass parts additive in a clean container, high-speed stirred 30-40 minutes, stirring at low speed 12 is small
When.Then the general silica inorganic filler of 50 mass parts is added, high-speed stirred 30-40 minutes is entered using three-roll grinder
Row repeatedly grinding, then high-speed stirred 30-40 minute, is put into vacuum degasing machine progress deaeration 120 minutes, normal consent after taking-up,
Metal Substrate jack panel is made.
Comparative example 2
Weigh 100 mass parts bisphenol f type epoxy resins, the amido diphenyl-methane curing agent of 10 mass parts two, the three of 5 mass parts
Phenyl phosphorus curing accelerator, 5 mass parts additive in a clean container, high-speed stirred 30-40 minutes, stirring at low speed 12 is small
When.Then the general silica inorganic filler of 200 mass parts is added, high-speed stirred 30-40 minutes is entered using three-roll grinder
Row repeatedly grinding, then high-speed stirred 30-40 minute, is put into vacuum degasing machine progress deaeration 120 minutes, normal consent after taking-up,
Metal Substrate jack panel is made.
Formula, performance and the Metal Substrate of the preparation consent of comparative example 1, comparative example 2, embodiment 1, embodiment 2 and embodiment 3
Plate performance comparison, it is as shown in the table：
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God is with principle, and any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (9)
1. a kind of composition epoxy resin of large aperture metal base printed circuit board consent, it is characterised in that：Including asphalt mixtures modified by epoxy resin
Fat, curing agent, curing accelerator, toughener, additive, inorganic filler.
2. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：Include the epoxy resin of 90-110 mass parts, the curing agent of 0.5-100 mass parts, the solidification of 0.5-10 mass parts
Accelerator, the toughener of 10-30 mass parts, the additive of 1-20 mass parts, the inorganic filler of 100-300 mass parts.
3. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：The epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, aliphatic
Tetraglycidel ether epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, novolac epoxy resin, hydrogen
Change epoxy resin, biphenyl type epoxy resin, how the one or more in ring structure epoxy resin.
4. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：The curing agent be aliphatic polyamine, alicyclic polyamine, triethanolamine, imidazoles, anhydrides, modified amine,
One or more in modified imidazole, polyetheramine, amido amine, polyurethane, boron trifluoride, cyanate, polymercaptan.
5. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：The curing accelerator be 2-ethyl-4-methylimidazole, 1- cyanoethyls -2-ethyl-4-methylimidazole, 2- ethyls -
One or more in 4- phenylimidazoles, modified imidazole, boron trifluoride, substituted urea, DMP-30.
6. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：The toughener is LNBR, rubber modified epoxy resin, polyurethane modified epoxy resin, dimeric dibasic acid
Modified epoxy, phenolic hydroxyl group polyether sulfone, phenolic hydroxyl group polyphenylene oxide, PEI, core-shell particles, nano inorganic particle, block
One or more in copolymer.
7. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：The additive be aerosil, soluble castor oil, rilanit special, coupling agent, modified organic silicon gather
One or more in compound, acrylate copolymer, modified polyurethane, modified fatty acid ester.
8. a kind of composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1, its
It is characterised by：The inorganic filler is active magnesium hydroxide, active aluminium hydroxide, activated alumina, nano silicon, nanometer
Calcium carbonate, alukalin, active mica, the one or more of active talcum powder.
9. a kind of system of the composition epoxy resin of large aperture metal base printed circuit board consent according to claim 1
Preparation Method, it is characterised in that：Epoxy resin, curing agent, curing accelerator and the additive of respective quality part are weighed first in one
In container, after high-speed stirred is mixed 30-40 minutes, then stirring at low speed 12 hours；Then the inorganic filler of respective quality part is weighed,
It is added in the container, then high-speed stirred is mixed 30-40 minutes, is ground using three-roll grinder, high-speed stirred is mixed
Close 30-40 minutes, last vacuum defoamation 120-180 minutes, set aside for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710043325.1A CN107043520A (en) | 2017-01-19 | 2017-01-19 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710043325.1A CN107043520A (en) | 2017-01-19 | 2017-01-19 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
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| Publication Number | Publication Date |
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| CN107043520A true CN107043520A (en) | 2017-08-15 |
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| CN201710043325.1A Pending CN107043520A (en) | 2017-01-19 | 2017-01-19 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108727780A (en) * | 2018-05-03 | 2018-11-02 | 广东生益科技股份有限公司 | The copper-clad plate of resin combination and its making |
| CN109021502A (en) * | 2018-07-06 | 2018-12-18 | 南雄市科鼎化工有限公司 | A kind of outer layer plug socket resin and preparation method thereof |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN111349414A (en) * | 2018-12-21 | 2020-06-30 | 上海得荣电子材料有限公司 | Low-stress insulating glue and preparation method thereof |
| CN113150494A (en) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | PCB micro-foaming hole plugging resin and preparation method and application thereof |
| CN113873767A (en) * | 2021-10-20 | 2021-12-31 | 南雄市科鼎化工有限公司 | Preparation method and application method of browned hole plugging resin for HDI circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| CN104497494A (en) * | 2014-06-10 | 2015-04-08 | 上海大学 | High stably dispersed nano-silica filled epoxy resin system, cured product and preparation method thereof |
| CN105219028A (en) * | 2015-11-09 | 2016-01-06 | 深圳市深逸通电子有限公司 | A kind of plug socket resin and preparation method thereof |
| CN105237954A (en) * | 2015-10-29 | 2016-01-13 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition for plugging holes and blending method for epoxy resin composition |
-
2017
- 2017-01-19 CN CN201710043325.1A patent/CN107043520A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| CN104497494A (en) * | 2014-06-10 | 2015-04-08 | 上海大学 | High stably dispersed nano-silica filled epoxy resin system, cured product and preparation method thereof |
| CN105237954A (en) * | 2015-10-29 | 2016-01-13 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition for plugging holes and blending method for epoxy resin composition |
| CN105219028A (en) * | 2015-11-09 | 2016-01-06 | 深圳市深逸通电子有限公司 | A kind of plug socket resin and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 陈毅龙等: "导热绝缘层的韧性及附着力影响因素分析", 《特种印制板》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108727780A (en) * | 2018-05-03 | 2018-11-02 | 广东生益科技股份有限公司 | The copper-clad plate of resin combination and its making |
| CN108727780B (en) * | 2018-05-03 | 2021-08-27 | 广东生益科技股份有限公司 | Resin composition and copper-clad plate manufactured by same |
| CN109021502A (en) * | 2018-07-06 | 2018-12-18 | 南雄市科鼎化工有限公司 | A kind of outer layer plug socket resin and preparation method thereof |
| CN109021502B (en) * | 2018-07-06 | 2020-07-31 | 南雄市科鼎化工有限公司 | Outer layer hole plugging resin and preparation method thereof |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN111349414A (en) * | 2018-12-21 | 2020-06-30 | 上海得荣电子材料有限公司 | Low-stress insulating glue and preparation method thereof |
| CN113150494A (en) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | PCB micro-foaming hole plugging resin and preparation method and application thereof |
| CN113873767A (en) * | 2021-10-20 | 2021-12-31 | 南雄市科鼎化工有限公司 | Preparation method and application method of browned hole plugging resin for HDI circuit board |
| CN113873767B (en) * | 2021-10-20 | 2022-07-12 | 南雄市科鼎化工有限公司 | Preparation method and application method of browned hole plugging resin for HDI circuit board |
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