CN105623581A - Low viscosity low thermal dilatation coefficient bottom filling rubber and preparing method thereof - Google Patents
Low viscosity low thermal dilatation coefficient bottom filling rubber and preparing method thereof Download PDFInfo
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- CN105623581A CN105623581A CN201610013488.0A CN201610013488A CN105623581A CN 105623581 A CN105623581 A CN 105623581A CN 201610013488 A CN201610013488 A CN 201610013488A CN 105623581 A CN105623581 A CN 105623581A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to bottom filling rubber, containing a filler, epoxy resin, curing agent and auxiliaries, wherein the filler has a core-shell structure, an inner core adopts SiO2 spherical particles and the shell is a cladding layer formed by a polymer containing amino or epoxy group functional groups. The cladding layer formed by the polymer containing amino or epoxy group functional groups is arranged at the surface of the SiO2 spherical particles, the bottom filling rubber has low viscosity, low thermal dilatation coefficient and long in working life.
Description
Technical field
The present invention relates to a kind of underfill, particularly relate to the underfill of a kind of low viscosity, low thermal coefficient of expansion; The preparation method that the invention still further relates to a kind of underfill, belongs to adhesive field.
Background technology
Underfill is a kind of liquid phase adhesive, is generally the high epoxy resin-base composite material filling silicon dioxide. Underfill is the critical material in flip-chip packaging techniques, in order to disperse on soldered ball due between chip and polymeric substrates thermal coefficient of expansion do not mate the internal stress of generation, to protect soldered ball, thus improving reliability and the service life of packaging.
Underfill should possess the mechanical performance of the thermal coefficient of expansion matched with soldered ball, relatively low viscosity, long shelf life, good cementability and excellence. And these performances and the size of filler, distribution of sizes, pattern, loading, especially its surface chemical property is closely related.
Additionally, along with electronic product develops towards high integration, portable direction, in flip chip technology (fct), the arrangement of soldered ball is more and more intensive, volume is more and more less so that the silica dioxide granule of the some tens of pm size used in tradition underfill this high density, thin space flip-chip Process of Applying Glue in easily cause the problems such as blocking, hole and some glue is uneven.
Therefore, the silica dioxide granule of the some tens of pm size that the silica dioxide granule replacement of reduced size is traditional has become a kind of inevitably development trend as the filler of underfill. But, owing to can bring the poor compatibility of high specific surface area and itself and epoxy resin substrate when silicon oxide size reduces, the viscosity often leading to underfill increases severely, and working life shortens. Therefore, viscosity problem has become key issue and the matter of utmost importance that current small size silicon dioxide is applied in underfill.
Summary of the invention
One of the object of the invention is to provide a kind of underfill, and it has low viscosity, low thermal coefficient of expansion, and working life is long.
The preparation method that the two of the object of the invention are to provide a kind of underfill, it is simple to operate, be easily achieved, this preparation method the underfill prepared has low viscosity, low thermal coefficient of expansion, and working life is long.
Underfill of the present invention, comprises filler, epoxy resin, firming agent and auxiliary agent, and described filler has nucleocapsid structure, and wherein, kernel is spherical, and shell is the clad being made up of the polymer containing amino or epoxy functionality.
Preferably, described kernel is monodisperse silica sphere particle shape granule.
Preferably, the particle diameter of described spherical is 50��5000nm, it is preferred to 50��4000nm, more preferably 100��3000nm, is further preferably 500��1500nm.
The particle diameter of described spherical can be 60nm, 100nm, 200nm, 500nm, 800nm, 1000nm, 1200nm, 1250nm, 1500nm, 1800nm, 2000nm, 2300nm, 2500nm, 2800nm, 3000nm, 3300nm, 3500nm, 3700nm, 4000nm, 4200nm, 4500nm or 4800nm.
Preferably, described polymer is one or more in polymethyl methacrylate, poly (glycidyl methacrylate), polymine, polyimides, polyurethane.
Preferably, the thickness of described clad is 10��50nm, it is preferred to 15��45nm, more preferably 15��40nm, is further preferably 15��25nm.
The thickness of described clad can be 12nm, 15nm, 18nm, 20nm, 22nm, 25nm, 27nm, 30nm, 32nm, 35nm, 37nm, 40nm, 42nm, 45nm or 48nm.
Preferably, underfill of the present invention, comprise the component of following percentage by weight:
Such as, filler can be 12%, 15%, 17%, 20%, 22%, 25%, 28%, 30%, 32%, 35%, 37%, 40%, 45%, 48%, 50%, 53%, 55%, 59%, 62%, 65% or 68%;
Epoxy resin can be 22%, 25%, 28%, 30%, 32%, 35%, 37%, 40%, 45%, 48%, 50%, 53%, 55% or 59%;
Firming agent can be 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23% or 24%;
Auxiliary agent can be 5.2%, 5.5%, 5.8%, 6%, 6.3%, 6.5%, 6.8%, 7%, 7.2%, 7.5%, 7.7%, 8%, 8.3%, 8.5%, 8.8%, 9%, 9.2%, 9.5%, 9.6%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18% or 19%.
Preferably, described epoxy resin is one or more in the epoxy resin of bisphenol A type epoxy resin, bisphenol f type epoxy resin, cycloaliphatic epoxy resin, Ppolynuclear aromatic epoxy resin, phenol aldehyde type epoxy resin, biphenyl structural. The described combination infinite combination for bisphenol A type epoxy resin Yu bisphenol f type epoxy resin of typical case, the combination of bisphenol A type epoxy resin and cycloaliphatic epoxy resin, the combination of bisphenol f type epoxy resin and phenol aldehyde type epoxy resin, the combination of bisphenol A type epoxy resin, bisphenol f type epoxy resin and cycloaliphatic epoxy resin, the combination etc. of Ppolynuclear aromatic epoxy resin, phenol aldehyde type epoxy resin and biphenyl structural.
Preferably, described firming agent is one or more in alicyclic acid anhydride type curing agent, amine curing agent, phenolic firming agent, thio-alcohol firming agent. The described combination infinite combination for alicyclic acid anhydride type curing agent Yu amine curing agent of typical case, the combination of amine curing agent and phenolic firming agent, the combination of alicyclic acid anhydride type curing agent and thio-alcohol firming agent, the combination etc. of the combination of alicyclic acid anhydride type curing agent, amine curing agent and phenolic firming agent, alicyclic acid anhydride type curing agent, phenolic firming agent and thio-alcohol firming agent.
Preferably, described auxiliary agent comprises one or more in accelerator, diluent, toughener, defoamer;
Preferably, described accelerator is the kind or two or more in metal carboxylate accelerator, imidazoles, imdazole derivatives, tertiary amine salt complex, boron trifluoride complex, microcapsule subsidence feed;
Preferably, described diluent is single epoxide diluent and/or multi-epoxy diluent;
Preferably, described toughener is one or more in thiorubber., thermoplastic elastomer (TPE), liquid silastic, hydroxyl terminated butyl nitrile (HTBN) rubber, carboxyl end of the liquid acrylonitrile-butadiene rubber;
Preferably, described defoamer is polysiloxane-based defoamer and/or acryl-based antifoaming agent.
Above-mentioned accelerator, diluent, toughener, defoamer concrete material be auxiliary agent commonly used in the art, this is not limited by the present invention.
The preparation method of underfill of the present invention, comprises the steps:
(1) described filler is mixed by proportioning with epoxy resin, prepare the first mixture;
(2) described firming agent is added to the first mixture by proportioning with auxiliary agent, mixing, vacuum defoamation, prepare underfill.
Filler of the present invention can be ultrasonic prepared by being dispersed in polymer solution by spherical.
Compared with prior art, it is an advantage of the current invention that: the filler of underfill of the present invention has nucleocapsid structure, be wherein the clad being made up of polymer for shell. The clad being made up of polymer can replace or the oh group on coated silica surface, with reduce the high surface of silicon dioxide can and reactivity, thus improving silicon dioxide dispersibility in the epoxy, and then reduce the viscosity of underfill.
Additionally, polymer in clad is by the chemical reaction between the riveted effect between epoxy resin macromole and the functional group in polymerized segment and epoxy molecule or firming agent molecule, the interfacial interaction of silica dioxide granule and epoxy resin can be improved, thus reducing the viscosity of underfill, thermal coefficient of expansion further, and there is the effect extending underfill working life.
After tested, when silica surface coated polymer and after being applied to underfill, the viscosity of underfill is the highest reduces about 89%, and thermal coefficient of expansion can the highest reduction about 12%.
Accompanying drawing explanation
Fig. 1 is the structural representation that the embodiment of the present invention 1 has the filler of nucleocapsid structure;
Fig. 2 is the structural representation of the embodiment of the present invention 1 filler kernel;
Fig. 3 is the structural representation of the embodiment of the present invention 1 filler shell.
Detailed description of the invention
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
Embodiment 1
The present embodiment underfill comprises the component of following weight: filler 40g, epoxy resin 25g, firming agent 21.5g and auxiliary agent 13.5g, and wherein auxiliary agent includes accelerator 1.2g, dispersant 0.2g, defoamer 0.1g and diluent 12g.
The preparation method of the underfill of the present embodiment comprises the steps:
(1) weigh filler 40g and bisphenol A type epoxy resin 25g, both mix homogeneously, prepare the first mixture;
(2) in the first mixture, methyl hexahydrophthalic anhydride firming agent 21.5g, accelerator 2-phenyl-4-methylimidazole 1.2g, dispersant 0.2g, defoamer 0.1g, diluent 12g are added respectively, mix homogeneously, vacuum defoamation, prepare underfill.
As it is shown in figure 1, filler has nucleocapsid structure used by the present embodiment; Wherein, kernel is particle diameter as shown in Figure 2 is the spherical of 500nm, and shell is the clad being made up of polymethyl methacrylate as shown in Figure 3.
Embodiment 2
The present embodiment underfill comprises the component of following weight: filler 30g, epoxy resin 50g, firming agent 13.3g and auxiliary agent 6.7g, and wherein auxiliary agent includes dispersant 0.2g, defoamer 0.1g, diluent 5g and toughener 1.4g.
The preparation method of the underfill of the present embodiment comprises the steps:
(1) weigh filler 30g and bisphenol f type epoxy resin 50g, both mix homogeneously, prepare the first mixture;
(2) in the first mixture, diamine curing agent 13.3g, dispersant 0.2g, defoamer 0.1g, diluent 5g, toughener 1.4g are added respectively, mix homogeneously, vacuum defoamation, prepare underfill.
Used by the present embodiment, filler has nucleocapsid structure, and wherein, kernel is particle diameter is the spherical of 50nm, and shell is the clad being made up of polymine.
Embodiment 3
The present embodiment underfill comprises the component of following weight: filler 30g, epoxy resin 47g, firming agent 10.0g and auxiliary agent 13g, and wherein auxiliary agent includes dispersant 4g, defoamer 1g, diluent 5g and toughener 3g.
The preparation method of the underfill of the present embodiment comprises the steps:
(1) weigh filler 30g, bisphenol A type epoxy resin 25g and phenol aldehyde type epoxy resin 22g, three's mix homogeneously, prepare the first mixture;
(2) in the first mixture, add chloro-4, the 4-MDA 10.0g of firming agent 3,3-bis-, dispersant 4g, defoamer 1g, diluent 5g, toughener 3g, mix homogeneously, vacuum defoamation respectively, prepare underfill.
Used by the present embodiment, filler has nucleocapsid structure, and wherein, kernel is particle diameter is the spherical of 50nm, and shell is the clad being made up of polymine.
Embodiment 4
The present embodiment underfill comprises the component of following weight: filler 20g, epoxy resin 40g, firming agent 25g and auxiliary agent 15g, and wherein auxiliary agent includes accelerator 2-ethyl-4-methylimidazole 0.5g, dispersant 0.4g, defoamer 0.1g, diluent 5g and toughener 9g.
The preparation method of the underfill of the present embodiment comprises the steps:
(1) weigh filler 20g and weigh orthoresol type phenol aldehyde type epoxy resin 40.0g, both mix homogeneously, prepare the first mixture;
(2) in the first mixture, firming agent 4 is added respectively, 4 '-DADPS 25g, accelerator 2-ethyl-4-methylimidazole 0.5g, dispersant 0.4g, defoamer 0.1g, diluent 5g and toughener 9g, mix homogeneously, vacuum defoamation, prepare underfill.
Used by the present embodiment, filler has nucleocapsid structure, and wherein, kernel is particle diameter is the spherical of 1000nm, and shell is the clad being made up of polyimides.
Embodiment 5
The present embodiment underfill comprises the component of following weight: filler 30g, epoxy resin 40g, firming agent 10.65g and auxiliary agent 19.35g, and wherein auxiliary agent includes dispersant 0.2g, defoamer 0.15g, diluent 10g and toughener 9g.
The preparation method of the underfill of the present embodiment comprises the steps:
(1) weigh filler 30g, bisphenol A type epoxy resin 20g and bisphenol f type epoxy resin 20g, three's mix homogeneously, prepare the first mixture;
(2) in the first mixture, add diamine curing agent 10.65g, dispersant 0.2g, defoamer 0.15g, diluent 10g, toughener 9g, mix homogeneously, vacuum defoamation respectively, prepare underfill.
Used by the present embodiment, filler has nucleocapsid structure, and wherein, kernel is particle diameter is the spherical of 100nm, and shell is the clad being made up of poly (glycidyl methacrylate).
Embodiment 6
The present embodiment underfill comprises the component of following weight: filler 40g, epoxy resin 40g, firming agent 10.7g and auxiliary agent 9.3g, and wherein auxiliary agent includes accelerator 2-phenyl-4-methylimidazole 0.1g, dispersant 0.1g, defoamer 0.1g, diluent 5g and toughener 4g.
The preparation method of the underfill of the present embodiment comprises the steps:
(1) weigh filler 40g, bisphenol f type epoxy resin 25g and cycloaliphatic epoxy resin 15.0g, three's mix homogeneously, prepare the first mixture;
(2) in the first mixture, m-diaminobenzene. firming agent 10.7g, accelerator 2-phenyl-4-methylimidazole 0.1g, dispersant 0.1g, defoamer 0.1g, diluent 5g, toughener 4g are added respectively, mix homogeneously, vacuum defoamation, prepare underfill.
Used by the present embodiment, filler has nucleocapsid structure, and wherein, kernel is particle diameter is the spherical of 3000nm, and shell is the clad being made up of polyurethane.
Comparative example 1
The formula difference from Example 1 of the present embodiment underfill is in that: filler is particle diameter is the spherical of 500nm, and its surface does not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 1.
Comparative example 2
The formula difference from Example 2 of the present embodiment underfill is in that: filler is particle diameter is the spherical of 50nm, and its surface does not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 2.
Comparative example 3
The formula difference from Example 3 of the present embodiment underfill is in that: filler is particle diameter is the spherical of 50nm, and its surface does not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 3.
Comparative example 4
The formula difference from Example 4 of the present embodiment underfill is in that: filler is particle diameter is the spherical of 1000nm, and its surface does not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 4.
Comparative example 5
The formula difference from Example 5 of the present embodiment underfill is in that: filler is particle diameter is the spherical of 100nm, and its surface does not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 5.
Comparative example 6
The formula difference from Example 6 of the present embodiment underfill is in that: filler is particle diameter is the spherical of 3000nm, and its surface does not carry out polymer overmold.
Other components of the present embodiment underfill and preparation method thereof are such as embodiment 6.
The performance of underfill prepared by each embodiment is tested, and test result is in Table 1.
The performance of each embodiment underfill of table 1.
Above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the thought of the present invention, all will change in specific embodiments and applications, and this specification content should not be construed as limitation of the present invention.
Claims (10)
1. a underfill, comprise filler, epoxy resin, firming agent and auxiliary agent, it is characterised in that: described filler has nucleocapsid structure, wherein, kernel is spherical, and shell is the clad being made up of the polymer containing amino or epoxy functionality.
2. underfill as claimed in claim 1, it is characterised in that: described kernel is monodisperse silica sphere particle shape granule.
3. underfill as claimed in claim 1 or 2, it is characterised in that: the particle diameter of described spherical is 50��5000nm, it is preferred to 50��4000nm, more preferably 100��3000nm, is further preferably 500��1500nm.
4. underfill as claimed in claim 1, it is characterised in that: described polymer is one or more in polymethyl methacrylate, poly (glycidyl methacrylate), polymine, polyimides, polyurethane.
5. underfill as claimed in claim 1, it is characterised in that: the thickness of described clad is 10��50nm, it is preferred to 15��45nm, more preferably 15��40nm, is further preferably 15��25nm.
6. underfill as claimed in claim 1, it is characterised in that comprise the component of following percentage by weight:
7. underfill as claimed in claim 6, it is characterised in that: described epoxy resin is one or more in the epoxy resin of bisphenol A type epoxy resin, bisphenol f type epoxy resin, cycloaliphatic epoxy resin, Ppolynuclear aromatic epoxy resin, phenol aldehyde type epoxy resin, biphenyl structural.
8. underfill as claimed in claim 6, it is characterised in that: described firming agent is one or more in alicyclic acid anhydride type curing agent, amine curing agent, phenolic firming agent, thio-alcohol firming agent.
9. underfill as claimed in claim 6, it is characterised in that: described auxiliary agent comprises one or more in accelerator, diluent, toughener, defoamer;
Preferably, described accelerator is the kind or two or more in metal carboxylate accelerator, imidazoles, imdazole derivatives, tertiary amine salt complex, boron trifluoride complex, microcapsule subsidence feed;
Preferably, described diluent is single epoxide diluent and/or multi-epoxy diluent;
Preferably, described toughener is one or more in thiorubber., thermoplastic elastomer (TPE), liquid silastic, hydroxyl terminated butyl nitrile (HTBN) rubber, carboxyl end of the liquid acrylonitrile-butadiene rubber;
Preferably, described defoamer is polysiloxane-based defoamer and/or acryl-based antifoaming agent.
10. the preparation method of underfill as described in any one of claim 1��9, it is characterised in that comprise the steps:
(1) described filler is mixed by proportioning with epoxy resin, prepare the first mixture;
(2) described firming agent is added to the first mixture by proportioning with auxiliary agent, mixing, vacuum defoamation, prepare underfill.
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| CN106590494A (en) * | 2016-12-01 | 2017-04-26 | 烟台信友新材料股份有限公司 | Low-thermal expansion coefficient low-viscosity rapid-penetration bottom filling glue and preparation method thereof |
| CN106589464A (en) * | 2016-11-28 | 2017-04-26 | 深圳先进技术研究院 | Preparation method for vinyl polymer coated nano-silica microsphere and modified epoxy resin |
| CN109456620A (en) * | 2018-11-19 | 2019-03-12 | 江苏联瑞新材料股份有限公司 | A kind of low viscosity filler composition and preparation method thereof |
| CN110997855A (en) * | 2017-08-08 | 2020-04-10 | 索尼公司 | Adhesive, electronic device, and optical device |
| CN110982436A (en) * | 2019-12-19 | 2020-04-10 | 安徽微威环保科技有限公司 | Acrylic sealant and preparation method thereof |
| CN112457808A (en) * | 2020-11-20 | 2021-03-09 | 湖北三选科技有限公司 | Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method |
| CN113800816A (en) * | 2020-06-12 | 2021-12-17 | 深圳先进电子材料国际创新研究院 | Epoxy plastic packaging material and preparation method and application thereof |
| CN117363238A (en) * | 2023-12-06 | 2024-01-09 | 涿州市柯林电子产品有限公司 | Heat-dissipation cold gel for new energy storage battery with circulation heat dissipation |
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