CN109593500A - A kind of high filling epoxy conductive silver glue of LED die bond and preparation method thereof - Google Patents
A kind of high filling epoxy conductive silver glue of LED die bond and preparation method thereof Download PDFInfo
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- CN109593500A CN109593500A CN201811346440.7A CN201811346440A CN109593500A CN 109593500 A CN109593500 A CN 109593500A CN 201811346440 A CN201811346440 A CN 201811346440A CN 109593500 A CN109593500 A CN 109593500A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Combustion & Propulsion (AREA)
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Abstract
A kind of high filling epoxy conductive silver glue of LED die bond, it is characterised in that be made of the raw material that following weight matches: 100 parts of epoxy resin, 20-100 parts of curing agent, 0.1-3 parts of promotor, 0.5-15 parts of coupling agent, 0-10 parts of fumed silica, 20-200 parts of diluent, 400-2800 parts of silver powder；The epoxy resin is made of 70-90 parts of bisphenol A epoxide resins and 10-30 parts of special epoxy resins；The special epoxy resin is one of glycidol ether, glycidyl amine and alicyclic based epoxy resin or in which a variety of combinations.The present invention also provides a kind of preparation methods of the high filling epoxy conductive silver glue of above-mentioned LED die bond.Conductive silver glue of the invention has suitable viscosity, higher thixotropy and good storage stability, has lower volume resistivity, higher thermal conductivity, excellent cementability, lower linear expansion coefficient after solidification.
Description
Technical field
The present invention relates to LED encapsulation materials, and in particular to a kind of high filling epoxy conductive silver glue and its system of LED die bond
Preparation Method.
Background technique
LED is a kind of semiconductor devices for directly converting electrical energy into luminous energy, has energy-saving and environmental protection, service life length, volume
The advantages such as small, light-weight, become the development trend of lighting area.And it is used for the tin-lead solder of element connection, not only toxic, pollution
Environment, and processing temperature is high, is unfavorable for Electronic Assemblies and develops to high integration, micromation direction.Conducting resinl becomes
Optimal solution.
By the research of decades, domestic conducting resinl has begun to take shape, but comparing with same kind of products at abroad still has
Larger gap.Especially in terms of the research of high-performance conductive silver paste, domestic technique is relatively weak, is primarily present that conductivity is low, leads
The problems such as heating rate is low, cementability is poor, poor heat resistance, poor stability, seriously limits the application range of conductive silver glue, substantially reduces
The service life of LED.
To solve the above problems, meeting the technical requirements of high-performance conductive silver paste, loading, the optimization silver powder of silver powder are improved
Contact network is a kind of feasible solution.However the increase of silver powder content, it will also reduce the cementability of conductive silver glue, resist
Impact, reliability and stability etc..Such as the content of silver powder is more than the variation tendency of viscosity and thixotropic index after certain value
It will change, increase with silver powder content, viscosity and thixotropy may reduce simultaneously, the characteristic with dilatant fluid, and lead
The requirement of the low glutinous high touching of electric elargol runs in the opposite direction.
Summary of the invention
Technical problem to be solved by the invention is to provide the high filling epoxy conductive silver glues and its system of a kind of LED die bond
Preparation Method, this conductive silver glue have suitable viscosity, higher thixotropy and good storage stability, have after solidification
Lower volume resistivity, higher thermal conductivity, excellent cementability, lower linear expansion coefficient.The technical solution of use is such as
Under:
A kind of high filling epoxy conductive silver glue of LED die bond, it is characterised in that be made of the raw material that following weight matches: epoxy
100 parts of resin, 20-100 parts of curing agent, 0.1-3 parts of promotor, 0.5-15 parts of coupling agent, 0-10 parts of fumed silica, dilution
20-200 parts of agent, 400-2800 parts of silver powder；
The epoxy resin is made of 70-90 parts of bisphenol A epoxide resins and 10-30 parts of special epoxy resins；The specific epoxy
Resin is one of glycidol ether, glycidyl amine and alicyclic based epoxy resin or in which a variety of combinations.
It is preferred that above-mentioned special epoxy resin be hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol-s epoxy resin,
Tetraphenolethane epoxy resin, tetramethyl biphenyl diphenol diglycidyl ether, 4,4'- diaminodiphenylmethane epoxy resin are (i.e.
) and one of triglycidyl group para-aminophenol (i.e. AFG-90) or in which a variety of combinations AG-80.
More preferable above-mentioned special epoxy resin is 4,4'- diaminodiphenylmethane epoxy resin.
It is preferred that the epoxide number of the bisphenol A epoxide resin is 0.4-0.58.
Above-mentioned curing agent can be anhydride, amine, phenolic curing agent.It is preferred that above-mentioned curing agent is methyl tetrahydro benzene two
Formic anhydride, methyl hexahydrophthalic acid anhydride, methylnadic anhydride, trimellitic anhydride, diethylenetriamines, triethylene four
Amine, tetren, dicyandiamide, diaminodiphenyl-methane, diaminodiphenylsulfone or linear phenolic resin.It is more preferably described
Linear phenolic resin is the bisphenol A type phenolic resin that molecular weight is 500-3000.It is preferred that the hardener dose is theoretical amount
60-200%, the further preferably 80-150% of theoretical amount.
Above-mentioned promotor can be tertiary amine and its salt, acetyl acetone salt, triphenylphosphine, acylate and its complexing
Object.It is preferred that above-mentioned promotor is 2-methylimidazole, 1 benzyl 2 methyl imidazole, 1- amino-ethyl -2-methylimidazole, 2- ethyl -
4-methylimidazole, 2,4,6-three (dimethylamino methyl) phenol (abbreviation DMP-30), acetylacetone cobalt (II), acetylacetone copper,
Triphenylphosphine or Boron Trifluoride Ethylamine.It is preferred that the dosage of above-mentioned promotor is the 0.5-2%wt of epoxy resin.
Above-mentioned coupling agent can be silane coupling agent, titanate esters system coupling agent, chromium complex coupling agent, aluminate coupling
Agent.It is preferred that above-mentioned coupling agent is silane coupling agent；Further preferred Silane coupling agent KH550, silane coupling agent KH560, silane
Coupling agent KH570, silane coupling agent KH580, silane coupling agent ND-42, silane coupling A -1120, silane coupling A -
1160.It is preferred that the dosage of above-mentioned coupling agent is the 2-10%wt of epoxy resin.
Fumed silica is that surface is rich in hydroxyl, specific surface area 70-400m2The nanoparticle of/g.It is preferred that above-mentioned gas
Aerosil is that specific surface area is 100-300m2The fumed silica of/g.It is preferred that the dosage of above-mentioned fumed silica is
The 2-8%wt of epoxy resin.
Above-mentioned diluent can be the combination of one of reactive diluent and non-activated thinner or both.On it is preferred that
State the combination that diluent is reactive diluent and non-activated thinner.Diluent uses non-activated thinner or inactive diluents
The combination of agent and reactive diluent, can be according to the silver powder content and viscosity and thixotropy of market demand adjustment conductive silver glue.
It is preferred that above-mentioned reactive diluent is alicyclic reactive diluent or aromatic active diluent.More preferable above-mentioned activity
Diluent is dimethyl for vinyl cyclohexene dioxide, 3,4- epoxy -6- methylcyclohexylmethyl -3,4- epoxy -6- methyl
Hexahydrobenzoid acid ester, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, vinyl cyclohexene dioxide, benzene second
One of olefinic oxide, phenyl glycidyl ether, 2-glycidyl aniline and 4- tert-butyl-phenyl glycidol ether or in which
A variety of combinations.
It is preferred that above-mentioned non-activated thinner is toluene, dimethylbenzene, ethyl acetate, dibatyl phithalate, diethylene glycol second
One of ether acetate and styrene or in which a variety of combinations.
It is preferred that the dosage of above-mentioned diluent is the 30-120%wt of epoxy resin.
Above-mentioned silver powder can be in spherical silver powder, flake silver powder, dendroid silver powder, nano-silver thread and electroplate particle
A kind of or in which a variety of combination.It is preferred that above-mentioned silver powder is micro-silver powder；The partial size of the micro-silver powder is 1-20um, vibration density
Degree is in 5g/cm3More than.The partial size of the more preferable micro-silver powder is 3-10um, and tap density is in 6g/cm3More than.Above-mentioned silver powder
Usually select particle size range narrow ditribution silver powder.
The present invention also provides a kind of preparation method of the high filling epoxy conductive silver glue of above-mentioned LED die bond, feature exists
In the following steps are included:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin, 20-100 parts of curing agent, 0.1-3 parts of promotor, being coupled
0.5-15 parts of agent, 0-10 parts of fumed silica, 20-200 parts of diluent, 400-2800 parts of silver powder；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, is stirred under the revolving speed of 600-1000r/min to uniformly mixed；
(3) silver powder is added in Centrifugal Vacuum agitator, stirring is equal to mixing under the revolving speed of 600-1500r/min
Even (mixing time is usually 5-30min) obtains the high filling epoxy conductive silver glue of LED die bond.
In above-mentioned steps (3), silver powder can be disposably added in Centrifugal Vacuum agitator, then be stirred.
Silver powder can also be added batch-wise in Centrifugal Vacuum agitator, stir certain time after a collection of silver powder of every addition, then add
Add next group silver powder and be stirred, such as silver powder is added in three batches, first accounts for the 70% of silver powder total amount, and second batch accounts for silver
The 20% of powder total amount, third batch account for the 10% of silver powder total amount.
After the high filling epoxy conductive silver glue of LED die bond is made, it can use a portion and make sample, in 120-150
Solidify 2 hours in DEG C baking oven, gained sample is tested for the property by the universal standard.
In high filling epoxy conductive silver glue of the invention, epoxy resin uses bisphenol A epoxide resin and special epoxy resin
Combination, make high filling epoxy conductive silver glue that not only there is low internal stress, but also heat resistance with higher and low line expansion system
Number；By optimizing raw material formula, the conductive silver glue of high silver powder loading can be provided, make conductive silver glue have high electric conductivity and
Thermal conductivity is able to satisfy the application of high performance lED.
High filling epoxy conductive silver glue of the invention has suitable viscosity, higher thixotropy and good storage steady
Qualitative, (25 DEG C, 0.5r/min) of viscosity are 60-300PaS, and thixotropic index (0.5r/5r) is 4-8, and room temperature sealed storage 48 is small
When its viscosity and thixotropic index variation less than 20%.Have after high filling epoxy conductive silver glue of the invention is cured lower
Volume resistivity, higher thermal conductivity, excellent cementability, lower linear expansion coefficient, electric conductivity and thermal conductivity are good, volume
Resistivity is 10-3-10-6Ω cm, thermal conductivity 5-30W/mK, for room temperature shear strength in 15-40MPa or more, the front Tg is swollen
Swollen coefficient is 25-60ppm.High filling epoxy conductive silver glue reliability also with higher of the invention, through high temperature and humidity, cold and hot
After the processing of the conditions such as impact, volume resistivity and shear strength variation are less than 20%.
Specific embodiment
Embodiment 1
In the present embodiment, the preparation method of the high filling epoxy conductive silver glue of LED die bond the following steps are included:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin (wherein 80 parts of bisphenol A epoxide resin, 4,4'- diamino
20 parts of diphenyl-methane epoxy resin), 80 parts of curing agent (being methyl hexahydrophthalic acid anhydride), 1 part of promotor (is 2- second
Base -4-methylimidazole), 5 parts of coupling agent (being silane coupling agent KH560), (its specific surface area is 2 parts of fumed silica
200m2/ g), 25 parts of diluent (being 4- tert-butyl-phenyl glycidol ether), 930 parts of silver powder (partial size of silver powder is 3-10um,
Tap density is in 5g/cm3More than)；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, stirs under the revolving speed of 1000r/min to uniformly mixed (mixing time is about 5 min)；
(3) silver powder is added in Centrifugal Vacuum agitator and (is disposably added to silver powder in the present embodiment centrifugal
In vacuum defoamation blender), stirring is obtained to uniformly mixed (mixing time is about 10min) under the revolving speed of 1300r/min
The high filling epoxy conductive silver glue of LED die bond.
After the high filling epoxy conductive silver glue of LED die bond is made, it can use a portion and make sample, dried in 120 DEG C
Solidify 2 hours in case, gained sample is tested for the property by the universal standard.
Embodiment 2
In the present embodiment, the preparation method of the high filling epoxy conductive silver glue of LED die bond the following steps are included:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin (wherein 80 parts of bisphenol A epoxide resin, 4,4'- diamino
20 parts of diphenyl-methane epoxy resin), 30 parts of curing agent (being diaminodiphenyl-methane), 1 part of promotor (is 2- ethyl-
4-methylimidazole), 5 parts of coupling agent (being Silane coupling agent KH550), (its specific surface area is 300m to 2 parts of fumed silica2/
G), 50 parts of diluent (wherein 10 parts of 4- tert-butyl-phenyl glycidol ether, 40 parts of diethylene glycol ether acetate), silver powder 830
(partial size of silver powder is 3-10um to part, and tap density is in 5g/cm3More than)；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, stirs under the revolving speed of 800r/min to uniformly mixed (mixing time is about 8 min)；
(3) silver powder is added in Centrifugal Vacuum agitator and (is disposably added to silver powder in the present embodiment centrifugal
In vacuum defoamation blender), stirring is obtained to uniformly mixed (mixing time is about 15min) under the revolving speed of 1000r/min
The high filling epoxy conductive silver glue of LED die bond.
After the high filling epoxy conductive silver glue of LED die bond is made, it can use a portion and make sample, dried in 150 DEG C
Solidify 2 hours in case, gained sample is tested for the property by the universal standard.
Embodiment 3
In the present embodiment, the preparation method of the high filling epoxy conductive silver glue of LED die bond the following steps are included:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin (wherein 88 parts of bisphenol A epoxide resin, tetramethyl biphenyl two
12 parts of phenol diglycidyl ether), 30 parts of curing agent (being diaminodiphenyl-methane), 0.5 part of promotor (is 2,4,6-
Three (dimethylamino methyl) phenol), 8 parts of coupling agent (being silane coupling agent KH560), 5 parts of (its specific surfaces of fumed silica
Product is 300m2/ g), 90 parts of diluent (being diethylene glycol ether acetate), (partial size of silver powder is 3- to 2730 parts of silver powder
10um, tap density is in 6g/cm3More than)；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, stirs under the revolving speed of 600r/min to uniformly mixed (mixing time is about 20min)；
(3) silver powder is added in Centrifugal Vacuum agitator, under the revolving speed of 1300r/min stirring to be uniformly mixed,
Obtain the high filling epoxy conductive silver glue of LED die bond.
In above-mentioned steps (3), silver powder is added batch-wise in Centrifugal Vacuum agitator and is stirred, specifically
Are as follows: first 1900 parts of silver powder are added in Centrifugal Vacuum agitator, stir 10min under the revolving speed of 1300r/min；Again
550 parts of silver powder are added in Centrifugal Vacuum agitator, stir 10min under the revolving speed of 1300r/min；It will finally remain
280 parts of remaining silver powder are added in Centrifugal Vacuum agitator, stir 15min under the revolving speed of 1300r/min.
After the high filling epoxy conductive silver glue of LED die bond is made, it can use a portion and make sample, dried in 120 DEG C
Solidify 2 hours in case, gained sample is tested for the property by the universal standard.
Embodiment 4
In the present embodiment, the preparation method of the high filling epoxy conductive silver glue of LED die bond the following steps are included:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin (wherein 85 parts of bisphenol A epoxide resin, four phenolic group ethane rings
15 parts of oxygen resin), 100 parts of curing agent (being linear phenolic resin), 1 part of promotor (being acetylacetone copper), 5 parts of coupling agent
(being Silane coupling agent KH550), (its specific surface area is 200m to 2 parts of fumed silica2/ g), 60 parts of diluent (it is 3,
4- epoxy -6- methylcyclohexylmethyl -3,4- epoxy -6- methyl cyclohexane carbamate), (partial size of silver powder is 1520 parts of silver powder
3-10um, tap density is in 5g/cm3More than)；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, stirs under the revolving speed of 1000r/min to uniformly mixed (mixing time is about 5 min)；
(3) silver powder is added in Centrifugal Vacuum agitator and (is disposably added to silver powder in the present embodiment centrifugal
In vacuum defoamation blender), stirring obtains LED to uniformly mixed (mixing time is about 8min) under the revolving speed of 600r/min
The high filling epoxy conductive silver glue of die bond.
After the high filling epoxy conductive silver glue of LED die bond is made, it can use a portion and make sample, dried in 120 DEG C
Solidify 2 hours in case, gained sample is tested for the property by the universal standard.
Embodiment 5
In the present embodiment, the preparation method of the high filling epoxy conductive silver glue of LED die bond the following steps are included:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin (wherein 70 parts of bisphenol A epoxide resin, bisphenol S asphalt mixtures modified by epoxy resin
30 parts of rouge), 40 parts of curing agent (being diaminodiphenylsulfone), 1.5 parts of promotor (being Boron Trifluoride Ethylamine), coupling agent 5
Part (being silane coupling agent KH580), (its specific surface area is 300m to 2 parts of fumed silica2/ g), 65 parts of diluent (are
Diethylene glycol ether acetate), (partial size of silver powder is 3-10um to 1340 parts of silver powder, and tap density is in 5g/cm3More than)；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, stirs under the revolving speed of 900r/min to uniformly mixed (mixing time is about 8 min)；
(3) silver powder is added in Centrifugal Vacuum agitator and (is disposably added to silver powder in the present embodiment centrifugal
In vacuum defoamation blender), stirring is obtained to uniformly mixed (mixing time is about 20min) under the revolving speed of 1200r/min
The high filling epoxy conductive silver glue of LED die bond.
After the high filling epoxy conductive silver glue of LED die bond is made, it can use a portion and make sample, dried in 120 DEG C
Solidify 2 hours in case, gained sample is tested for the property by the universal standard.
The filling epoxy conductive silver glue sample of height obtained by above-described embodiment 1-5 is tested for the property, test result such as table
1。
Table 1
High filling epoxy conductive silver glue of the invention has suitable viscosity, preferable thixotroping it can be seen from data in table 1
Property, excellent electric conductivity, thermal conductivity, higher adhesive strength, in terms of great power LED die bond with good application prospect.
Claims (10)
1. a kind of high filling epoxy conductive silver glue of LED die bond, it is characterised in that be made of the raw material that following weight matches: ring
It is 100 parts of oxygen resin, 20-100 parts of curing agent, 0.1-3 parts of promotor, 0.5-15 parts of coupling agent, 0-10 parts of fumed silica, dilute
Release 20-200 parts of agent, 400-2800 parts of silver powder；
The epoxy resin is made of 70-90 parts of bisphenol A epoxide resins and 10-30 parts of special epoxy resins；The specific epoxy
Resin is one of glycidol ether, glycidyl amine and alicyclic based epoxy resin or in which a variety of combinations.
2. the high filling epoxy conductive silver glue of LED die bond according to claim 1, it is characterized in that: the specific epoxy
Resin is hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol-s epoxy resin, tetraphenolethane epoxy resin, tetramethyl
In '-biphenyl diphenol diglycidyl ether, 4,4'- diaminodiphenylmethane epoxy resin and triglycidyl group para-aminophenol
A kind of or in which a variety of combination.
3. the high filling epoxy conductive silver glue of LED die bond according to claim 1, it is characterized in that: the curing agent is
Methyl tetrahydro phthalate anhydride, methyl hexahydrophthalic acid anhydride, methylnadic anhydride, trimellitic anhydride, diethylidene three
Amine, trien, tetren, dicyandiamide, diaminodiphenyl-methane, diaminodiphenylsulfone or novolac tree
Rouge.
4. the high filling epoxy conductive silver glue of LED die bond according to claim 1, it is characterized in that: the promotor is
2-methylimidazole, 1 benzyl 2 methyl imidazole, 1- amino-ethyl-2-methylimidazole, 2-ethyl-4-methylimidazole, 2,4,6-
Three (dimethylamino methyl) phenol, acetylacetone cobalt (II), acetylacetone copper, triphenylphosphine or Boron Trifluoride Ethylamine.
5. the high filling epoxy conductive silver glue of LED die bond according to claim 1, it is characterized in that: the coupling agent is
Silane coupling agent KH550, silane coupling agent KH560, silane coupling agent KH570, silane coupling agent KH580, silane coupling agent ND-
42, silane coupling A -1120 or silane coupling A -1160.
6. the high filling epoxy conductive silver glue of LED die bond according to claim 1, it is characterized in that: the diluent is
The combination of one of reactive diluent and non-activated thinner or both.
7. the high filling epoxy conductive silver glue of LED die bond according to claim 6, it is characterized in that: the activity dilution
Agent is dimethyl for vinyl cyclohexene dioxide, 3,4- epoxy -6- methylcyclohexylmethyl -3,4- epoxy -6- methyl cyclohexane
Carbamate, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, vinyl cyclohexene dioxide, styrene oxygen
One of compound, phenyl glycidyl ether, 2-glycidyl aniline and 4- tert-butyl-phenyl glycidol ether or in which a variety of
Combination.
8. the high filling epoxy conductive silver glue of LED die bond according to claim 6, it is characterized in that: described nonactive dilute
Releasing agent is one of toluene, dimethylbenzene, ethyl acetate, dibatyl phithalate, diethylene glycol ether acetate and styrene
Or in which a variety of combination.
9. the high filling epoxy conductive silver glue of LED die bond according to claim 1, it is characterized in that: the silver powder is micro-
Rice silver powder；The partial size of the micro-silver powder is 1-20um, and tap density is in 5g/cm3More than.
10. the preparation method of the high filling epoxy conductive silver glue of LED die bond described in claim 1, it is characterised in that including
Following steps:
(1) by weight, it is equipped with following raw material: 100 parts of epoxy resin, 20-100 parts of curing agent, 0.1-3 parts of promotor, being coupled
0.5-15 parts of agent, 0-10 parts of fumed silica, 20-200 parts of diluent, 400-2800 parts of silver powder；
(2) epoxy resin, curing agent, promotor, coupling agent, fumed silica and diluent Centrifugal Vacuum is added to take off
It steeps in blender, is stirred under the revolving speed of 600-1000r/min to uniformly mixed；
(3) silver powder is added in Centrifugal Vacuum agitator, stirring is equal to mixing under the revolving speed of 600-1500r/min
It is even, obtain the high filling epoxy conductive silver glue of LED die bond.
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| CN201811346440.7A CN109593500A (en) | 2018-11-13 | 2018-11-13 | A kind of high filling epoxy conductive silver glue of LED die bond and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110117474A (en) * | 2019-04-12 | 2019-08-13 | 江苏矽时代材料科技有限公司 | A kind of conduction high-thermal-conductivity epoxy resin composition and preparation method thereof |
| CN112778948A (en) * | 2020-12-23 | 2021-05-11 | 北京康美特科技股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
| CN113249072A (en) * | 2021-05-14 | 2021-08-13 | 安田信邦（厦门）电子科技有限公司 | Electronic packaging adhesive with good thermal stability and preparation method thereof |
| CN115216228A (en) * | 2022-07-28 | 2022-10-21 | 南方科技大学 | Method for improving heat conductivity of conductive silver adhesive, conductive silver adhesive and application thereof |
| CN115418187A (en) * | 2022-08-30 | 2022-12-02 | 海程新材料(芜湖)有限公司 | High-thermal-conductivity epoxy structural adhesive for bi-component power battery and preparation method thereof |
| CN115851193A (en) * | 2022-12-06 | 2023-03-28 | 深圳市绚图新材科技有限公司 | Die bonding conductive adhesive, preparation method thereof and die bonding processing method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110117474A (en) * | 2019-04-12 | 2019-08-13 | 江苏矽时代材料科技有限公司 | A kind of conduction high-thermal-conductivity epoxy resin composition and preparation method thereof |
| CN112778948A (en) * | 2020-12-23 | 2021-05-11 | 北京康美特科技股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
| CN112778948B (en) * | 2020-12-23 | 2022-06-24 | 北京康美特科技股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
| CN113249072A (en) * | 2021-05-14 | 2021-08-13 | 安田信邦（厦门）电子科技有限公司 | Electronic packaging adhesive with good thermal stability and preparation method thereof |
| CN115216228A (en) * | 2022-07-28 | 2022-10-21 | 南方科技大学 | Method for improving heat conductivity of conductive silver adhesive, conductive silver adhesive and application thereof |
| CN115418187A (en) * | 2022-08-30 | 2022-12-02 | 海程新材料(芜湖)有限公司 | High-thermal-conductivity epoxy structural adhesive for bi-component power battery and preparation method thereof |
| CN115851193A (en) * | 2022-12-06 | 2023-03-28 | 深圳市绚图新材科技有限公司 | Die bonding conductive adhesive, preparation method thereof and die bonding processing method |
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