CN105219028A - A kind of plug socket resin and preparation method thereof - Google Patents
A kind of plug socket resin and preparation method thereof Download PDFInfo
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- CN105219028A CN105219028A CN201510757938.2A CN201510757938A CN105219028A CN 105219028 A CN105219028 A CN 105219028A CN 201510757938 A CN201510757938 A CN 201510757938A CN 105219028 A CN105219028 A CN 105219028A
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Abstract
The present invention relates to a kind of plug socket resin, resin described in it is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 0-1.25 part.The present invention also provides the preparation method of this plug socket resin, comprises raw material mixing, grinding, de-bubble step.Plug socket resin of the present invention, can reduce plasma etching amount, and preparation method is simple, easy to operate in addition, is convenient to industrial production application.
Description
Technical field
The present invention relates to a kind of resin, be specifically related to a kind of plug socket resin and preparation method thereof.
Background technology
High-end HDI high density interconnect circuit card is electronic product main flow in recent years, and product not only will move towards frivolous, and transmission speed is also one of trend.High speed interconnect is one of target of jointly pursuing of all electronic equipment suppliers, wherein should guarantee to connect reliability accurately, guarantee high-speed transfer speed again, this demand also allows electronic material supplier constantly find the sheet material that can carry faster data on PCB, existing wiring board (the circuit version as Teflon material) has good dielectric characteristics with insulativity, is the good material ensureing signal fast transport.But these characteristics make to be difficult to process further or Metal plating on this type of wiring board.
Therefore, before carrying out electro-coppering to this type of wiring board, must first use plasma activation wiring board, plasma (Plasma) cleaning is not only applied in activation PCB surface, glue slag in cleaning hole when it can play a role simultaneously.Utilize the characteristic of plasma intermediate ion or free radical, can react fast with glue slag (hydrocarbon polymer) in hole and be formed and possess volatile hydrocarbon polymer, finally taken away by vacuum system. but relative plasma also easily reacts rapidly with the plug socket resin blocking circuit card aperture and interior erosion occurs, and forms the depression of 5-10um.
Summary of the invention
The object of the present invention is to provide a kind of plug socket resin that can reduce plasma etching amount, the present invention also provides the preparation method of this plug socket resin.
For solving the problem, the technical solution adopted in the present invention is as follows:
A kind of plug socket resin, resin described in it is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 0-1.25 part.
In the present invention, preferred scheme is described epoxy resin is bisphenol A type epoxy resin, and described inorganic powder is silicon-dioxide, and described solidifying agent is imidazole curing agent, and described antioxidant is 4-TBP class.
In the present invention, preferred scheme is the particle diameter of described silicon-dioxide is 1-10 μm.
In the present invention, preferred scheme is that described plug socket resin is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 1 part.
In the present invention, preferred scheme is that described plug socket resin is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 1.25 parts.
The present invention also provides the preparation method of this plug socket resin, comprises the steps: to have taken each component by formula ratio, mixes, and then through grinding, de-bubble, obtains product.
In the present invention, preferred scheme is that described grinding adopts three-roll grinder to grind, and milling time is 60-90min.
In the present invention, preferred scheme is that described de-bubble adopts centrifugal defoaming machine to carry out de-bubble.
Compared with prior art, tool of the present invention has the following advantages: plug socket resin of the present invention, can be good at resisting isoionic etching, in PCB production process, the etch quantity that plasma can be made to remove the medium ion pair plug socket resin of glue process significantly reduces, and makes the pcb board quality of production higher; In addition, the preparation method of plug socket resin of the present invention, simple, easy to operate, be convenient to industrial production application.
Below in conjunction with embodiment, the present invention is described in detail.
Embodiment
A kind of plug socket resin, resin described in it is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 0-1.25 part.
In the present invention, described epoxy resin is bisphenol A type epoxy resin; Described inorganic powder is silicon-dioxide, and wherein the particle diameter of silicon-dioxide can be the particle diameter of usual resin powder used; The particle diameter of preferred silicon-dioxide is 1-10 μm; Described solidifying agent is imidazole curing agent, as glyoxal ethyline and 2-ethyl-4-methyl narrow azoles; Described antioxidant is 4-TBP.
The present invention also provides the preparation method of this plug socket resin, comprises the steps: to have taken each component by formula ratio, mixes, and then through grinding, de-bubble, obtains product; Wherein, described grinding adopts three-roll grinder to grind, and milling time is 60-90min; De-bubble adopts centrifugal defoaming machine to carry out de-bubble.
The raw materials of plug socket resin of the present invention, all can by buying on the market.In embodiment 1-5, the epoxy resin adopted is bisphenol A type epoxy resin, and purchased from Jining Hua Kai resin company limited, model is HK-44; The inorganic powder adopted to be particle diameter the be silicon-dioxide of 1-10 μm; The imidazole curing agent adopted is glyoxal ethyline, purchased from Jiangsu Kangle New Materials Technology Co., Ltd.; The antioxidant adopted is 4-TBP, purchased from Shanghai Hai Qu Chemical Co., Ltd..
Embodiment 1-6
The plug socket resin of embodiment 1-6, its raw materials component refers to following table 1:
The plug socket resin formula table of table 1: embodiment 1-6
The plug socket resin of embodiment 1-6, obtains as follows: taken each component by formula ratio, mixed, and then through grinding, de-bubble, obtains product; Wherein, described grinding adopts three-roll grinder to grind, and milling time is 60-90min; De-bubble adopts centrifugal defoaming machine to carry out de-bubble, to obtain final product.
Experimental example
By the plug socket resin of embodiment 1-6, be applied on the pcb board of Teflon material respectively, obtain pcb board (plug socket resin of embodiment 1-6 and six groups of pcb board one_to_one corresponding of first group to the 6th group, as the pcb board of corresponding first group of the plug socket resin of embodiment 1, the pcb board of corresponding 4th group of the plug socket resin of embodiment 4); Carry out plasma except glue process to above-mentioned each group of pcb board, then take plasma away by vacuum system, concrete treatment step parameter sees the following form 2:
Table 2:PCB plate carries out plasma except glue treatment step, parameter list
Then the etch quantity of resin on each pcb board is tested respectively; Wherein, pcb board except glue process 3 hours, tested an etch quantity every 1 hour with plasma; Concrete data refer to following table 3:
Plug socket resin etch quantity on table 3:PCB plate
In addition, commercially available ordinary resin is adopted to be applied on the pcb board of Teflon material, the pcb board obtained is adopted and removes glue process with first group to the 6th group identical plasma, then take plasma away by vacuum system, then test the etch quantity of resin on each pcb board respectively; Wherein, pcb board except glue process 3 hours, tested an etch quantity every 1 hour with plasma; To be the etch quantity recorded for the 20.32%, 2nd hour be the etch quantity recorded for first hour that within the 35.76%, 3rd hour, to record etch quantity be 58.47%.
As can be seen from above-mentioned data, plug socket resin of the present invention can be good at resisting isoionic etching, make at plasma except in glue process, plug socket resin can not be subject to the excessive etching of plasma, can make that the quality of the pcb board of filling holes with resin is higher, performance is more stable.
Above-mentioned embodiment is only the preferred embodiment of the present invention; can not limit the scope of protection of the invention with this, change and the replacement of any unsubstantiality that those skilled in the art does on basis of the present invention all belong to the present invention's scope required for protection.
Claims (8)
1. a plug socket resin, is characterized in that described resin is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 0-1.25 part.
2. plug socket resin according to claim 1, is characterized in that: described epoxy resin is bisphenol A type epoxy resin, and described inorganic powder is silicon-dioxide, and described solidifying agent is imidazole curing agent, and described antioxidant is 4-TBP.
3. plug socket resin according to claim 1, is characterized in that: the particle diameter of described silicon-dioxide is 1-10 μm.
4. plug socket resin according to claim 1, is characterized in that described resin is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 1 part.
5. plug socket resin according to claim 1, is characterized in that described resin is made up of the following component according to parts by weight: epoxy resin 40-50 part, inorganic powder 35-50 part, solidifying agent 1-5 part, antioxidant 1.25 parts.
6. a preparation method for plug socket resin according to claim 1, is characterized in that comprising the steps: to have taken each component by formula ratio, mixes, and then through grinding, de-bubble, obtains product.
7. the preparation method of plug socket resin according to claim 6, is characterized in that: described grinding adopts three-roll grinder to grind, and milling time is 60-90min.
8. the preparation method of plug socket resin according to claim 6, is characterized in that: described de-bubble adopts centrifugal defoaming machine to carry out de-bubble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510757938.2A CN105219028A (en) | 2015-11-09 | 2015-11-09 | A kind of plug socket resin and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510757938.2A CN105219028A (en) | 2015-11-09 | 2015-11-09 | A kind of plug socket resin and preparation method thereof |
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| Publication Number | Publication Date |
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| CN105219028A true CN105219028A (en) | 2016-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510757938.2A Pending CN105219028A (en) | 2015-11-09 | 2015-11-09 | A kind of plug socket resin and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107043520A (en) * | 2017-01-19 | 2017-08-15 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
| CN113150494A (en) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | PCB micro-foaming hole plugging resin and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN102732096A (en) * | 2012-07-10 | 2012-10-17 | 依利安达电子（昆山）有限公司 | Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof |
| CN104371419A (en) * | 2014-11-20 | 2015-02-25 | 深圳市板明科技有限公司 | Nanometer calcium carbonate composite resin-based taphole printing ink and preparation method thereof |
-
2015
- 2015-11-09 CN CN201510757938.2A patent/CN105219028A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN102732096A (en) * | 2012-07-10 | 2012-10-17 | 依利安达电子（昆山）有限公司 | Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof |
| CN104371419A (en) * | 2014-11-20 | 2015-02-25 | 深圳市板明科技有限公司 | Nanometer calcium carbonate composite resin-based taphole printing ink and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107043520A (en) * | 2017-01-19 | 2017-08-15 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin of large aperture metal base printed circuit board consent and preparation method thereof |
| CN113150494A (en) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | PCB micro-foaming hole plugging resin and preparation method and application thereof |
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Application publication date: 20160106 |
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