CN113950191B - Circuit board and hole plugging method thereof - Google Patents
Circuit board and hole plugging method thereof Download PDFInfo
- Publication number
- CN113950191B CN113950191B CN202010694732.0A CN202010694732A CN113950191B CN 113950191 B CN113950191 B CN 113950191B CN 202010694732 A CN202010694732 A CN 202010694732A CN 113950191 B CN113950191 B CN 113950191B
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- circuit board
- baking
- hole
- plugged
- plugging
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- 238000000034 method Methods 0.000 title claims abstract description 56
- 239000000945 filler Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 28
- 238000007650 screen-printing Methods 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000008602 contraction Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000011347 resin Substances 0.000 description 38
- 229920005989 resin Polymers 0.000 description 38
- 239000007789 gas Substances 0.000 description 22
- -1 polytetrafluoroethylene Polymers 0.000 description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007602 hot air drying Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a circuit board and a hole plugging method of the circuit board, wherein the hole plugging method comprises the following steps: obtaining a circuit board to be processed; the circuit board is provided with a hole to be plugged; performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged; and (3) carrying out hole plugging treatment on the circuit board which is not cooled by baking so as to bond the inner wall of the circuit board to be plugged with the stuffing. The invention provides a circuit board and a hole plugging method of the circuit board, wherein the hole plugging method of the circuit board is to obtain a circuit board to be processed, wherein the circuit board to be plugged is arranged in the circuit board to be processed; performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged; the circuit board which is not cooled after baking is subjected to hole plugging treatment, so that gas is prevented from being hidden in a hole to be plugged due to expansion caused by heat and contraction caused by cold, a filler can fill the hole to be plugged, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the stuffing can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the productivity are saved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board and a hole plugging method of the circuit board.
Background
As printed wiring boards continue to develop in a higher density and more functionality, the reliability requirements for the wiring boards are increasing. The demand of the circuit board using the resin hole plugging technology is greatly improved, but the resin hole plugging technology is insufficient in hole plugging processing capability of a back drill of a special material, and because air is contained in the back drill of the circuit board in the hole plugging process, hole breaking and sinking phenomena occur in the resin of the hole plugging in the post-curing process, so that the reject ratio of the circuit board is increased, the processing efficiency is low, and serious waste is caused for cost and productivity.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board and a manufacturing method of the circuit board, and solves the problem that holes are easy to break at solder mask plug holes of the circuit board in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: the method for plugging the circuit board comprises the following steps: obtaining a circuit board to be processed; the circuit board is provided with a hole to be plugged; performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged; and (3) carrying out hole plugging treatment on the circuit board which is not cooled by baking so as to bond the inner wall of the circuit board to be plugged with the stuffing.
The step of plugging the baked uncooled circuit board to bond the inner wall of the circuit board to be plugged with the stuffing specifically comprises the following steps: and carrying out vacuum silk screen printing hole plugging treatment on the circuit board which is not baked so as to remove the gas in the holes to be plugged.
The step of performing vacuum silk screen printing hole plugging treatment on the circuit board which is not baked to remove the gas in the hole to be plugged specifically comprises the following steps: carrying out constant-temperature cooling treatment on the baked circuit board; and (5) cooling the circuit board to 80-100 ℃ at constant temperature, and performing vacuum silk screen printing hole plugging treatment on the circuit board to be plugged.
And the step of bonding the inner wall to be plugged and the filler comprises the following steps: and (3) performing a second baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the stuffing.
The step of performing a second baking treatment on the circuit board subjected to the plugging treatment to cure the filler specifically includes: horizontally placing the circuit board subjected to the hole plugging treatment and performing secondary baking treatment; the concave surface of the filler in the plug hole of the circuit board faces downwards, and the convex surface of the filler faces upwards, so that the filler protruding out of the surface of the circuit board flows into the plug hole in a vertical manner in the curing process.
The step of horizontally placing the circuit board after the hole plugging treatment and performing the second baking treatment specifically comprises the following steps: and carrying out sectional curing and baking on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high, wherein the number of sections subjected to sectional curing ranges from 3 sections to 5 sections, the baking temperature ranges from 80 ℃ to 150 ℃, and the total time length of all sectional baking ranges from 140 minutes.
When the number of the sections for sectional curing is 5, the step of carrying out sectional curing and baking on the circuit board after the hole plugging treatment according to the baking temperature from low to high comprises the following steps: carrying out first-stage baking on the circuit board subjected to the hole plugging treatment at the temperature of 80 ℃, wherein the first-stage baking time is 35 minutes; carrying out second-stage baking on the circuit board subjected to the first-stage baking at the temperature of 90 ℃, wherein the second-stage baking time is 35 minutes; carrying out third-stage baking on the circuit board subjected to the second-stage baking at the temperature of 110 ℃, wherein the third-stage baking time is 28 minutes; carrying out a fourth-stage baking on the circuit board subjected to the third-stage baking at the temperature of 140 ℃, wherein the fourth-stage baking time is 7 minutes; and (3) carrying out a fifth-stage baking on the circuit board subjected to the fourth-stage baking at the temperature of 150 ℃, wherein the fifth-stage baking time is 35 minutes.
The step of obtaining the circuit board to be processed specifically comprises the following steps: obtaining a substrate; wherein, the base plate is provided with a hole to be plugged; and cleaning the substrate to obtain the circuit board to be processed.
The first baking treatment is performed on the circuit board so that the foreign matters in the to-be-plugged holes are discharged, and the method specifically comprises the following steps: and (3) carrying out primary baking treatment on the circuit board at the temperature of 170 ℃, wherein the primary baking treatment time is 60-90 minutes, so as to remove gas and water in holes to be plugged on the circuit board.
In order to solve the technical problems, a second technical scheme adopted by the invention is as follows: a circuit board is provided, and a hole to be plugged of the circuit board is plugged by the hole plugging method of the circuit board.
The beneficial effects of the invention are as follows: different from the situation of the prior art, the circuit board and the hole plugging method of the circuit board are provided, and the hole plugging method of the circuit board is realized by obtaining the circuit board to be processed, which is provided with the hole to be plugged; performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged; the circuit board which is not cooled after baking is subjected to hole plugging treatment, so that gas is prevented from being hidden in a hole to be plugged due to expansion caused by heat and contraction caused by cold, a filler can fill the hole to be plugged, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the stuffing can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the productivity are saved.
Drawings
Fig. 1 is a schematic flow chart of a first embodiment of a circuit board plugging method provided by the invention;
fig. 2 is a schematic flow chart of a second embodiment of a circuit board plugging method according to the present invention;
fig. 3 is a schematic structural diagram of a circuit board corresponding to the step of the circuit board plugging method provided in fig. 2;
fig. 4 is a schematic structural diagram of an embodiment of a circuit board provided by the present invention.
Detailed Description
The following describes the embodiments of the present application in detail with reference to the drawings.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application.
The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. Further, "a plurality" herein means two or more than two.
The terms "first," "second," "third," and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a flowchart illustrating a circuit board plugging method according to a first embodiment of the present invention. In this embodiment, the method for plugging a hole of a circuit board specifically includes the following steps.
S11: obtaining a circuit board to be processed; the circuit board is provided with a hole to be plugged.
Specifically, a substrate is obtained; wherein, the base plate is provided with a hole to be plugged; and cleaning the substrate to obtain the circuit board to be processed.
S12: and performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged.
Specifically, the circuit board is subjected to a first baking treatment at 170 ℃ for 60-90 minutes to remove gas and water in holes to be plugged on the circuit board.
S13: and (3) carrying out hole plugging treatment on the circuit board which is not cooled by baking so as to bond the inner wall of the circuit board to be plugged with the stuffing.
Specifically, vacuum screen printing hole plugging treatment is carried out on the circuit board which is not cooled by baking so as to remove the gas in the holes to be plugged. Carrying out constant-temperature cooling treatment on the baked circuit board; and (5) cooling the circuit board to 80-100 ℃ at constant temperature, and performing vacuum silk screen printing hole plugging treatment on the circuit board to be plugged. And then, performing a second baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the stuffing. In an alternative embodiment, the circuit board after the hole plugging treatment is horizontally placed and subjected to a second baking treatment; the concave surface of the filler in the hole to be plugged of the circuit board faces downwards, and the convex surface of the filler faces upwards, so that the filler protruding out of the surface of the circuit board flows into the hole to be plugged in a vertical mode in the solidifying process. And carrying out sectional curing and baking on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high, wherein the number of sections subjected to sectional curing ranges from 3 sections to 5 sections, the baking temperature ranges from 80 ℃ to 150 ℃, and the total time length of all sectional baking ranges from 140 minutes.
In a specific embodiment, when the number of segments for sectional curing is 5, the step of performing sectional curing and baking on the circuit board after the hole plugging treatment according to the baking temperature from low to high includes: carrying out first-stage baking on the circuit board subjected to the hole plugging treatment at the temperature of 80 ℃, wherein the first-stage baking time is 35 minutes; continuously performing second-stage baking on the circuit board subjected to the first-stage baking at the temperature of 90 ℃, wherein the second-stage baking time is 35 minutes; continuously baking the circuit board subjected to the second stage at the temperature of 110 ℃ for a third stage, wherein the third stage baking time is 28 minutes; continuously baking the circuit board subjected to the third stage at 140 ℃ for a fourth stage, wherein the fourth stage baking time is 7 minutes; and continuously baking the circuit board subjected to the fourth stage at the temperature of 150 ℃ for a fifth stage, wherein the baking time of the fifth stage is 35 minutes.
According to the hole plugging method of the circuit board, the circuit board to be processed, which is provided with the hole to be plugged, is obtained; performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged; the circuit board which is not cooled after baking is subjected to hole plugging treatment, so that gas is prevented from being hidden in a hole to be plugged due to expansion caused by heat and contraction caused by cold, a filler can fill the hole to be plugged, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the stuffing can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the productivity are saved.
Referring to fig. 2 and 3, fig. 2 is a flowchart illustrating a circuit board plugging method according to a second embodiment of the present invention; fig. 3 is a schematic structural diagram of a circuit board corresponding to the step of the circuit board plugging method provided in fig. 2. In this embodiment, the method for plugging a hole of a circuit board specifically includes the following steps.
S21: obtaining a substrate; wherein, the substrate is provided with a hole to be plugged.
Specifically, a substrate 301 is obtained, the substrate 301 including a core board and a metal plate provided on a surface of the core board. The core plate is made of insulating dielectric materials. The upper and lower surfaces of the core plate may be supported by a metal plate, or may be supported by one of the surfaces of the core plate. The substrate 301 may also be a copper-clad plate. In particular, in an alternative embodiment, the material of the substrate 301 is polytetrafluoroethylene material. The polytetrafluoroethylene substrate 301 is provided with a hole to be plugged 302, and the hole to be plugged 302 is a through hole. Wherein the inner wall of the hole 302 to be plugged may also be plated with copper (not shown).
S22: and cleaning the substrate to obtain the circuit board to be processed.
Specifically, the metal plate on the surface of the substrate 301 is polished by a polisher to remove oxides, oil traces and impurities on the metal plate surface of the substrate 301, and the roughened metal plate can enhance the adhesion between the subsequent solder resist ink and the surface of the substrate 301, and clean the impurities in the hole 302 to be plugged to obtain the circuit board to be treated. In another alternative embodiment, the metal plate roughened on the surface of the substrate 301 is brushed with a nylon brush by spraying a dilute sulfuric acid solution with a mass concentration of 1% ± 0.5% into a polisher. In an alternative embodiment, the surface of the substrate 301 is cleaned with dilute sulfuric acid having a mass concentration of 1% ± 0.5% to remove oil stains and impurities, etc. from the surface of the substrate 301. In an alternative embodiment, the surface of the substrate 301 may be cleaned by blowing, ultrasonic vibration, or the like, to remove dirt attached to the surface of the substrate 301.
S23: and performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged.
Specifically, the cleaned circuit board to be treated is dried by hot air, wherein the temperature of the hot air drying is 170 ℃, the hot air drying is carried out for 60 to 90 minutes, when the hot air drying is carried out for 90 minutes, the drying plate effect is better, residual moisture on the circuit board to be treated can be removed by carrying out primary drying treatment on the circuit board, and meanwhile, the water vapor and other gases in the hole to be plugged 302 on the circuit board to be treated are reduced as much as possible by the principle of thermal expansion and cold contraction. In an alternative embodiment, the substrate 301 is a polytetrafluoroethylene plate, and the activity of the substrate in the holes 302 to be plugged on the polytetrafluoroethylene plate is greatly improved under the high temperature condition, which is beneficial for the subsequent combination with the filled resin 303. In an alternative embodiment, the circuit board to be treated is dried after cleaning is finished, so as to prevent moisture on the circuit board from affecting the bonding strength between the resin 303 of the plug hole and the inner wall of the plug hole 302, and simultaneously avoid affecting the wetting effect of the solder resist ink on the circuit board when the solder resist ink is coated on the circuit board in the following process.
S24: the baked uncooled circuit board is subjected to vacuum screen printing hole plugging treatment to remove the gas in the holes to be plugged 302.
Specifically, the circuit board subjected to the hot air baking treatment at 170 ℃ is placed in an incubator at 90 ℃, the temperature of the circuit board is cooled to 90 ℃, the circuit board at 90 ℃ is taken out, the circuit board is horizontally placed on a vacuum screen printing hole plugging machine, and vacuum screen printing hole plugging operation is directly carried out on the circuit board, so that resin 303 is filled into the hole to be plugged 302 from the upper end face of the circuit board to be plugged 302. In the vacuum screen printing hole plugging process, the circuit board and the hole to be plugged 302 on the circuit board are in a vacuum state, and the gas hidden in the hole to be plugged 302 is not increased, so that the resin 303 can be more densely filled into the hole to be plugged 302 and is tightly attached to the inner wall of the hole to be plugged 302. Under the condition of 90 ℃, the moisture in the to-be-plugged hole 302 on the circuit board can be evaporated into water vapor, so that the moisture in the to-be-plugged hole 302 can be removed, meanwhile, due to the fact that the gas expands with heat and contracts with cold, the gas in the to-be-plugged hole 302 on the circuit board is relatively reduced, the resin 303 can be filled into the to-be-plugged hole 302 more, and the phenomenon that the resin 303 has more bubbles due to the gas in the to-be-plugged hole 302 in the filling process is avoided. Meanwhile, the resin 303 is filled into the to-be-plugged holes 302 of the circuit board at the temperature of 90 ℃, so that the resin 303 and the circuit board can be firmly bonded at the high temperature, and the bonding strength of the resin 303 and the inner wall of the to-be-plugged holes 302 is improved. In an alternative embodiment, the substrate 301 is made of polytetrafluoroethylene, and the circuit board is subjected to vacuum screen printing hole plugging at 90 ℃, so that the polytetrafluoroethylene board has relatively high substrate activity, and polytetrafluoroethylene on the inner wall of the hole to be plugged 302 can be relatively well combined with the filled resin 303, so that the bonding force between polytetrafluoroethylene on the inner wall of the hole to be plugged 302 and the resin 303 is enhanced. The resin 303 is filled in the hole to be plugged 302 at high temperature, volatile matters of the solvent in the resin 303 in the hole to be plugged can be effectively volatilized, the phenomena that the resin 303 in the hole to be plugged contains bubbles and bursts holes due to post-curing are reduced, meanwhile, the edge of the inner wall of the hole to be plugged 302 can be rapidly cured in the hole plugging process, the pre-curing effect of the resin 303 is achieved, the swelling and shrinkage of the circuit board and gas release in the later period are reduced, and the stability and reliability of the complete curing of the resin 303 in the later period are greatly improved.
S25: and (3) performing a second baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the stuffing.
Specifically, the circuit board subjected to the plugging treatment with the resin 303 is placed horizontally, the upper end face during the vacuum screen printing plugging treatment is taken as the bottom face of the second baking treatment, and the lower end face during the vacuum screen printing plugging treatment is taken as the top face of the second baking treatment. In another alternative embodiment, the circuit board with the plugging process is placed horizontally, wherein the concave surface at the location of the plugging of the resin 303 on the circuit board is used as the bottom surface for the second baking process, and the convex surface at the location of the plugging of the resin 303 on the circuit board is used as the top surface. In the vacuum screen printing hole plugging process, the circuit board is horizontally placed, the resin 303 is filled in the hole to be plugged 302 vertically arranged on the circuit board, the resin 303 can be subjected to a sagging phenomenon under the action of gravity, so that the resin 303 at the hole to be plugged 302 is recessed, and the resin 303 at the hole to be plugged 302 is protruded.
After the circuit board subjected to the plugging treatment of the resin 303 is horizontally placed, the circuit board subjected to the plugging treatment of the resin 303 is heated and cured. Specifically, the circuit board subjected to the hole plugging treatment is subjected to sectional curing baking according to the baking temperature from high to low. In an alternative embodiment, 3-stage curing baking is performed on the circuit board after the hole plugging treatment according to the baking temperature from low to high, the baking temperature ranges from 80 ℃ to 150 ℃, and the total baking time is 140 minutes. In another alternative embodiment, 4-stage curing baking is carried out on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high, the baking temperature ranges from 80 ℃ to 150 ℃, and the total baking time is 140 minutes. In another alternative embodiment, the circuit board subjected to the hole plugging treatment is subjected to 5-stage curing baking according to the baking temperature from low to high, the baking temperature ranges from 80 ℃ to 150 ℃, and the total baking time is 140 minutes. In a specific embodiment, 5-stage curing baking is carried out on the circuit board subjected to the hole plugging treatment, and the circuit board subjected to the hole plugging treatment is baked for 35 minutes at the temperature of 80 ℃ to finish the first-stage baking; baking the circuit board subjected to the first-stage baking treatment at 90 ℃ for 35 minutes to finish the second-stage baking; baking the circuit board subjected to the second-stage baking treatment at the temperature of 110 ℃ for 28 minutes to finish the third-stage baking; baking the circuit board subjected to the third-stage baking treatment at the temperature of 140 ℃ for 7 minutes to finish the fourth-stage baking; and baking the circuit board subjected to the fourth-stage baking treatment at the temperature of 150 ℃ for 35 minutes, and obtaining the finished circuit board 30 cured by the resin 303 after finishing the fifth-stage baking.
According to the hole plugging method of the circuit board, the circuit board to be processed, which is provided with the hole to be plugged, is obtained; performing primary baking treatment on the circuit board to discharge the gas in the holes to be plugged; the circuit board which is not cooled after baking is subjected to hole plugging treatment, so that gas is prevented from being hidden in holes to be plugged due to expansion caused by heat and contraction caused by cold, hole plugging resin can fill the holes to be plugged, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall to be plugged and the plugging resin is enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the productivity are saved. And through regard concave surface that the circuit board filled resin as the bottom surface in the secondary solidification process, the bulge face is as the top surface, makes the resin in waiting the jack can flow back to waiting in the jack through self gravity in the heating solidification process, makes the resin surface of circuit board resin jack department and the surface parallel and level of circuit board, solves the phenomenon that the circuit board filled resin droops.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a circuit board provided by the present invention. In this embodiment, a circuit board 40 includes a substrate 401, a to-be-plugged hole 402 is disposed on the substrate 401, and the to-be-plugged hole 402 on the circuit board 40 is plugged by the circuit board plugging method provided in any of the above embodiments. The circuit board 40 performs hole plugging treatment on the baked uncooled hole to be plugged 402, so that gas is prevented from being hidden in the hole to be plugged 402 due to expansion caused by heat and contraction caused by cold, the hole to be plugged 402 can be filled with hole plugging resin 403, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall of the to-be-plugged hole 402 and the plugging resin 403 can be enhanced, so that the reject ratio of the circuit board 40 is reduced, and the cost and the productivity are saved.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (8)
1. A method for plugging a circuit board, the method comprising:
obtaining a circuit board to be processed; the circuit board is provided with a hole to be plugged;
performing primary baking treatment on the circuit board to discharge the gas in the hole to be plugged;
carrying out hole plugging treatment on the circuit board which is not cooled by baking so as to bond the inner wall to be plugged with a stuffing;
the plugging treatment for the circuit board which is not cooled after baking comprises the following steps:
carrying out constant-temperature cooling treatment on the baked circuit board;
and cooling the circuit board to 80-100 ℃ at constant temperature, and performing vacuum silk screen printing hole plugging treatment on the circuit board to be plugged.
2. The method of plugging a circuit board according to claim 1, wherein the step of plugging the circuit board, which is not cooled by baking, so that the inner wall to be plugged is bonded to the filler further comprises:
and performing a second baking treatment on the circuit board subjected to the plugging treatment so as to cure the stuffing.
3. The method of plugging a circuit board according to claim 2, wherein the step of performing a second baking process on the circuit board subjected to the plugging process to cure the filler comprises:
horizontally placing the circuit board subjected to the hole plugging treatment and performing secondary baking treatment; and the concave surface of the filler in the plug hole of the circuit board faces downwards, and the convex surface of the filler faces upwards, so that the filler protruding out of the surface of the circuit board flows into the plug hole in a vertical manner in the curing process.
4. The method for plugging a circuit board according to claim 3, wherein the step of horizontally placing the circuit board after the plugging process and performing the second baking process comprises:
and carrying out sectional curing and baking on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high, wherein the number of sections for sectional curing is 3-5, the baking temperature is 80-150 ℃, and the total time length of all sectional baking is 140 minutes.
5. The method for plugging a circuit board according to claim 4, wherein when the number of the sections for the sectional curing is 5, the step of performing sectional curing baking on the circuit board after the plugging treatment according to the baking temperature from low to high comprises:
carrying out first-stage baking on the circuit board subjected to the hole plugging treatment at the temperature of 80 ℃, wherein the first-stage baking time is 35 minutes;
carrying out second-stage baking on the circuit board subjected to the first-stage baking at the temperature of 90 ℃, wherein the second-stage baking time is 35 minutes;
carrying out third-stage baking on the circuit board subjected to the second-stage baking at the temperature of 110 ℃, wherein the third-stage baking time is 28 minutes;
carrying out a fourth-stage baking on the circuit board subjected to the third-stage baking at the temperature of 140 ℃, wherein the fourth-stage baking time is 7 minutes;
and (3) carrying out a fifth-stage baking on the circuit board subjected to the fourth-stage baking at the temperature of 150 ℃, wherein the fifth-stage baking time is 35 minutes.
6. The method for plugging a circuit board according to claim 1, wherein the step of obtaining the circuit board to be processed specifically comprises:
obtaining a substrate; wherein, the base plate is provided with a hole to be plugged;
and cleaning the substrate to obtain the circuit board to be processed.
7. The method for plugging a circuit board according to claim 1, wherein the step of performing a first baking process on the circuit board to remove the foreign matter in the hole to be plugged specifically comprises:
and carrying out primary baking treatment on the circuit board at the temperature of 170 ℃, wherein the primary baking treatment time is 60-90 minutes so as to remove gas and water in the holes to be plugged on the circuit board.
8. A wiring board, characterized in that the hole to be plugged of the wiring board is plugged by the hole plugging method of the wiring board according to any one of claims 1 to 7.
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