WO2009155808A1

WO2009155808A1 - Printed circuit board, its making method and relative equipment

Info

Publication number: WO2009155808A1
Application number: PCT/CN2009/071758
Authority: WO
Inventors: 杨瑞泉; 盛海强; 李洪彩; 樊建成; 刘洋
Original assignee: 华为技术有限公司
Priority date: 2008-06-24
Filing date: 2009-05-12
Publication date: 2009-12-30
Also published as: CN101616541A

Abstract

A multi-layer printed circuit board (PCB), which is formed by laminating a plurality of individual printed circuit boards together, is provided. The multi-layer PCB includes a surface copper layer on the first surface of the PCB, and a reference copper layer on another individual printed circuit board, wherein the surface copper layer is corresponding to the reference copper layer, and they are different layers.A hole (201) is formed in the multi-layer PCB, and the walls of the hole (201) are covered by sidewall metal (202). The sidewall metal (202) is electrically connected with the reference copper layer and isolated with the surface copper layer. The method for making the PCB and the equipment using the PCB are also provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present application claims priority to Chinese Patent Application No. 200810126818.2, entitled "Printed Circuit Board and Its Manufacturing Method, Related Equipment", filed on June 24, 2008 The entire contents of which are incorporated herein by reference. Technical field

The present invention relates to a printed circuit board, and in particular to a printed circuit board, a method of manufacturing the same, and a related device, wherein the related device is a device and a communication device for solving the return of the RF power amplifier. Background technique

With the increasing miniaturization and low cost requirements of Printed Circuit Board (PCB) products, the common board design of base station boards including power amplifiers has become an important development trend of the industry's product realization form; including power amplifiers and RF The common board printed circuit board design, such as digital, power supply and other circuits, is designed by multi-layer stacking. Designing the RF power amplifier on the multi-layer printed circuit board, it is necessary to consider the reasonable matching circuit of the RF power amplifier. Reference ground, and the rationality of the return path of the reference formation.

A solution for solving the reflow problem is a multi-layer mechanical blind hole lamination method, and a corresponding sectional view of the device for resolving the RF power amplifier reflow is shown in FIG. 1 , and the power amplifier tube 101 is opened through the printed circuit board. The window is embedded in the printed circuit board, and the PA Flange Block at the bottom of the power amplifier tube 101 is electrically connected to the agglomerate block 105. The agglomerate block 105 is made of a metal material, and the reference layer 103 corresponding to the matching node 102 of the power amplifier tube 101 is The second layer of the printed circuit board, in order to form a return path between the power amplifier tube flange and the reference ground layer 103, the blind hole 104 is drilled in the multilayer printed circuit board, and the sidewall of the blind hole is Metallization allows the reference formation to be electrically connected to the agglomerate through the metallized blind hole sidewalls, thereby enabling the reference formation 103 to be electrically connected to the power conduit flange to form a return path. In the process of implementing the present invention, the inventors have found that the above technical solutions have at least the following drawbacks: Since mechanical blind holes and plugging processes are required, at least two presses and two times are required for processing the printed circuit board. Drilling, two-hole metallization, and one-time plugging process result in complicated processing steps and high cost of printed circuit boards. Summary of the invention

The embodiments of the present invention provide a printed circuit board, a manufacturing method thereof, and related equipment. The technical solutions provided by the embodiments of the present invention are used to solve the reflow problem without requiring complicated printed circuit board processing steps.

The purpose of the embodiment of the present invention is achieved by the following technical solutions:

The embodiment of the invention provides a printed circuit board, which is composed of a plurality of single-layer printed circuit boards, the first surface of the printed circuit board is attached with a surface copper, and a reference single layer of the printed circuit board The printed circuit board is attached with a reference copper skin corresponding to the surface copper, the reference single-layer printed circuit board is different from the single-layer printed circuit board to which the surface copper is attached, and the printed circuit board includes Opening a window, a sidewall metal is attached to the sidewall of the window, the sidewall metal is electrically connected to the reference copper, and the sidewall metal is insulated from the surface copper.

The embodiment of the invention further provides a method for manufacturing a printed circuit board, comprising:

Laminating and pressing a single-layer printed circuit board;

Opening the window of the multilayer printed circuit board obtained by lamination and pressing;

Metallizing the side wall of the window obtained by opening the window;

Performing insulation treatment on one surface of the multilayer printed circuit board on the metallized sidewall, and the copper skin of the surface after the insulation treatment is metal insulated from the sidewall of the sidewall of the window. The sidewall metal is electrically connected to the copper skin of the reference formation corresponding to the surface.

Opening the window opening area on the prepreg corresponding to the single-layer printed circuit board on which the copper sheet is placed; laminating and pressing the single-layer printed circuit board and the prepreg which has taken out the window opening area; Controlling the squeezing process on the laminated printed circuit board by lamination, the squat area is the fenestration area on the prepreg;

Performing sidewall metallization on the printed circuit board obtained by the stenosis treatment;

Performing a fenestration process on the sidewall printed metallized multilayer circuit board, the fenestration being performed on the other surface of the multilayer printed circuit board, the fenestration processing area being in the window opening area of the prepreg The area of the pattern formed by the projection of the sidewall metal on the other surface is larger than the area of the contact surface of the window and the other surface.

Embodiments of the present invention also provide an apparatus for resolving the reflow of a radio frequency power amplifier, including the printed circuit board provided by the embodiment of the present invention.

The embodiment of the invention further provides a communication device, which comprises the device for solving the reflow of the RF power amplifier provided by the embodiment of the invention.

It can be seen from the above technical solutions provided by the embodiments of the present invention that, in the embodiment of the present invention, the printed circuit board can electrically connect the reference copper skin to the sidewall metal of the window, and can be passed through the sidewall metal when the power amplifier tube is inserted. Solving the problem of backflow between the power amplifier tube flange and the reference ground layer, thereby eliminating the need to drill blind holes in the printed circuit board, at least reducing the blind hole drilling process and the blind hole sidewall metallization process, therefore, When the printed circuit board provided by the embodiment solves the reflow problem, the complicated printed circuit board processing process is not required, and the printed circuit board has a simple processing process and good batch consistency, and can also reduce the cost. DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any inventive labor.

1 is a cross-sectional view showing an embodiment of a device for resolving a reflow of a radio frequency power amplifier in the prior art; FIG. 2 is a cross-sectional view showing a first embodiment of a printed circuit board according to an embodiment of the present invention; 3 is a cross-sectional view showing a first embodiment of an apparatus for resolving a reflow of a radio frequency power amplifier according to an embodiment of the present invention;

4 is a flow chart of a first embodiment of a method for manufacturing a printed circuit board according to an embodiment of the present invention; FIG. 5 is a schematic view showing a processing procedure of a printed circuit board for manufacturing a printed circuit board according to an embodiment of the present invention;

6 is a cross-sectional view showing a second embodiment of a printed circuit board according to an embodiment of the present invention;

7 is a cross-sectional view showing a second embodiment of an apparatus for resolving a reflow of a radio frequency power amplifier according to an embodiment of the present invention;

FIG. 8 is a flowchart of Embodiment 2 of a method for manufacturing a printed circuit board according to an embodiment of the present invention. detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The embodiment of the present invention provides a printed circuit board. A cross-sectional view of the first embodiment of the printed circuit board according to the embodiment of the present invention is shown in FIG. 2:

The printed circuit board is composed of a plurality of single-layer printed circuit boards, the first surface 201 of the printed circuit board is attached with a surface copper, and a reference single-layer printed circuit board 202 of the printed circuit board is attached with The reference copper skin corresponding to the surface copper is referred to as the reference ground layer; wherein, the reference single-layer printed circuit board 202 is different from the single-layer printed circuit board to which the surface copper is attached, in FIG. 2, the surface copper The skin-attached single-layer printed circuit board is a first-layer printed circuit board, and the reference single-layer printed circuit board is a second-layer printed circuit board, but the embodiment of the present invention is not limited to the reference single-layer printed circuit board. The circuit board can be printed for the second layer, and the reference single-layer printed circuit board can be selected according to the circuit design requirements, for example: can be the third layer, the fourth layer, the fifth layer or the sixth layer;

The printed circuit board includes a window 203, and a sidewall metal is attached to a sidewall of the window 203; In the embodiment of the present invention, the sidewall metal can be obtained by the sidewall metallization process. In the embodiment of the invention, the position of the window is related to the reference copper skin, and the sidewall metal after the sidewall of the window is required to be metallized can be Electrically connected to the reference copper skin;

The window 203 has a notch 204 at the first surface 201. The surface of the notch 204 is insulated. At the same time, the depth of the notch is smaller than the depth of the first surface 201 to the reference copper, so that the sidewall metal is electrically connected to the reference copper. The surface of the printed circuit board is an approximation of the window of the printed circuit board provided by the embodiment of the present invention. The interface between the printed circuit board and the surface of the printed circuit board is improved. "T" shape;

The embodiment of the present invention does not limit the shape and size of the window opening, the shape and the size of the notch, and only requires the projection of the sidewall metal on the first surface to form an area smaller than or equal to the contact surface of the notch and the first surface. The area does not affect the implementation of embodiments of the present invention; wherein, in this embodiment, the graphics may be within the contact surface. For example, the pattern formed by the projection of the sidewall metal on the first surface is circular, and the shape of the contact surface may be circular, square, or even irregular; in the embodiment of the present invention, the shape of the window It can also be the same shape as the notch.

Wherein, the notch can be realized by depth-controlled milling of the sidewall of the fenestration on the first surface, so that the copper of the reference formation can be electrically insulated from the sidewall metal while being insulated from the surface copper, and the printed circuit board is controlled deeply. The depth of the milling is less than the depth of the surface of the printed circuit board notch to the reference formation.

As can be seen from the above, the present embodiment using the printed circuit board can electrically connect the reference copper skin to the sidewall metal of the window. When inserting the power amplifier tube, the sidewall metal can be used to solve the problem between the power amplifier tube flange and the reference ground layer. The problem of reflow, so that no blind holes are required to be drilled on the printed circuit board, at least the drilling process of the blind holes and the sidewall metallization process of the blind holes can be reduced. Therefore, the printed circuit board provided by the embodiment is used to solve the reflow. In the case of a problem, a complicated printed circuit board processing process is not required, and the printed circuit board has a simple processing process and good batch consistency, and can also reduce costs.

The embodiment of the present invention further provides an apparatus for solving the reflow of the radio frequency power amplifier by using the first embodiment of the printed circuit board, wherein the radio frequency power amplifier can be a power amplifier tube or the like, and the apparatus for resolving the reflow of the radio frequency power amplifier provided by the embodiment of the present invention One includes a power amplifier tube 301, and a printed circuit board 302 And a sintered block 303, wherein the printed circuit board 302 is composed of a plurality of single-layer printed circuit boards, the first surface of the printed circuit board is attached with a surface copper, and a reference single-layer printed circuit of the printed circuit board The plate 3023 is attached with a reference copper skin corresponding to the surface copper, and the reference single-layer printed circuit board is different from the single-layer printed circuit board to which the surface copper is attached. The printed circuit board includes a window 3021, a side of the window 3021. a sidewall metal is attached to the wall, and the sidewall metal is electrically connected to the reference copper strip. The window 3021 has a notch 3022 on the first surface, and the surface of the notch 3022 is insulated, so that the sidewall metal is insulated from the surface copper through the gap; FIG. 3 is a cross-sectional view of the power amplifier tube 301. The power amplifier tube 301 is embedded in the printed circuit board through the window 303021 on the printed circuit board 302, and the input and output matching junction 3011 is located at the position of the notch 3022, so that the power amplifier is placed. The power amplifier tube flange of the tube 301 is electrically connected to the agglomerate 303;

The input and output matching junction 3011 of the power amplifier tube 301 is electrically connected to the surface of the first surface of the printed circuit board, wherein the sidewall of the window 3021 is attached with sidewall metal, and the window 3021 has a notch 3022 at the position of the first surface. The surface of the notch 3022 is insulated, so that the input and output matching junction and the surface copper skin are insulated from the sidewall metal; meanwhile, the depth of the notch 3022 is smaller than the depth of the first surface to the reference copper, so that the reference copper can pass through the sidewall The metal is electrically connected to the agglomerate 303;

Wherein, since the surface copper of the first surface is directly electrically connected to the input and output, the reference copper corresponding to the first surface is the reference copper corresponding to the input and output matching junction 3011; and at the same time, due to the sintered block and the bottom of the power amplifier tube The power amplifier tube flange is electrically connected, and the sidewall metal is also electrically connected to the agglomerate block, so that the reference copper skin can form a very short return path through the sidewall metal and the power amplifier tube flange.

As can be seen from the above, the device for solving the reflow of the radio frequency power amplifier provided by the embodiment of the present invention uses the printed circuit board provided by the embodiment of the present invention, so that the reference copper of the input and output matching junction can pass through the sidewall metal and the power amplifier of the window. The tube flange forms a very short return path, thereby improving the stability of the device for resolving the return of the RF power amplifier. At the same time, due to the presence of the gap, the non-ground short circuit of the side wall metal and the power amplifier tube input and output matching junction is avoided, Will affect the resolution of the RF power amplifier The normal operation of the device for reflow; since the printed circuit board provided by the embodiment of the present invention is used, the reference copper skin can be electrically connected to the sidewall metal of the window, and when the power amplifier tube is inserted, the power amplifier tube can be solved by the sidewall metal. The problem of backflow between the flange and the reference ground layer eliminates the need to drill blind holes in the printed circuit board, and at least reduces the drilling process of the blind holes and the sidewall metallization process of the blind holes. Therefore, the present embodiment is used. When the printed circuit board is provided to solve the reflow problem, the complicated printed circuit board processing process is not required, the printed circuit board has a simple processing process and good batch consistency, and the cost can also be reduced; and the sintered block and the printed circuit There is only one contact surface of the plate, which reduces the tolerance of the sintered surface.

The embodiment of the present invention further provides a method for manufacturing a printed circuit board according to the first embodiment of the printed circuit board. FIG. 4 is a flow chart of the first embodiment of the method for manufacturing the printed circuit board, including:

Step 401: laminating and pressing a single-layer printed circuit board;

Step 402: Opening a window of the multilayer printed circuit board obtained by laminating and pressing;

Step 403, metallizing the sidewall of the window obtained by opening the window;

Step 404: Insulating the metalized sidewall on one surface of the multilayer printed circuit board, and the copper surface of the insulated surface is insulated from the sidewall of the sidewall of the window, and the sidewall metal is The copper skin of the reference formation corresponding to the surface is electrically connected.

The embodiment of the present invention does not limit the specific processing manner of the insulation treatment. As long as the copper surface of the surface can be insulated from the sidewall of the sidewall of the window, the implementation of the embodiment of the present invention is not affected.

The embodiment of the present invention can adopt the controlled deep milling process as the insulation treatment, wherein, in the controlled deep milling, in order to electrically connect the sidewall metal to the copper layer of the reference ground corresponding to the surface, the depth of the controlled deep milling is smaller than the surface to the reference. The depth of the formation.

As can be seen from the above, the flow of the method for manufacturing a printed circuit board provided by the embodiment of the present invention requires only one window opening and one sidewall metallization, thereby eliminating the need for a blind hole drilling process and blind hole sidewall metallization. The board processing process reduces the processing cost.

A schematic diagram of a processing process of a printed circuit board corresponding to the method for fabricating a printed circuit board provided by the embodiment of the present invention is shown in FIG. 5, and includes: Step 501: Perform a lamination and pressing process on a plurality of single-layer printed circuit boards; thereby forming a plurality of single-layer printed circuit boards into a multi-layer printed circuit board;

Step 502: drilling and windowing the multilayer printed circuit board; the general printed circuit board has a through hole, so the through hole and the window opening can be completed in one process;

Step 503, metallization of the hole wall; metallization including the through hole and metallization of the window opening may also be completed in one process;

Step 504: performing depth-controlled milling on the edge of the window after metallization; the depth of the controlled depth milling is less than the depth of the surface corresponding to the deep-drawing milling to the reference ground printed circuit board;

For example, the reference medium thickness between the surface corresponding to the deep milling and the reference ground is 20 mil (mil is one thousandth of an inch, lmil = 0.0254 cm), and the depth of the depth of the deep milling is ±5 mil. 6~14) ±5mil, which can ensure that the sidewall metal and the power amplifier tube are not short-circuited; the width of the laterally-opened window can be controlled to (6~10) ±4mil.

As can be seen from the above, in the printed circuit board processing process, only one side wall metallization process and one hole drilling process are required, so that complicated printed circuit board processing steps are not required, and the processing cost is reduced.

A cross-sectional view of a second embodiment of a printed circuit board according to an embodiment of the present invention is shown in FIG. 6. The printed circuit board is composed of a plurality of single-layer printed circuit boards, and the first surface 601 of the printed circuit board is attached with Surface copper, a reference single-layer printed circuit board 602 of the printed circuit board is attached with a reference copper skin corresponding to the surface copper, and the reference copper layer is referred to as a reference ground layer; wherein, the reference single-layer printed circuit board 602 is different from the single-layer printed circuit board to which the surface copper is attached, that is, the single-layer printed circuit board with reference to the single-layer printed circuit board and the surface copper is not the same single-layer printed circuit board; in FIG. 6, The single-layer printed circuit board to which the surface copper is attached is the first printed circuit board, and the reference single-layer printed circuit board is the second printed circuit board, but the embodiment of the present invention does not limit the reference single-layer printed circuit. The board can only be printed on the second layer of the circuit board, and the reference single-layer printed circuit board can be selected according to the circuit design requirements, for example: can be the third layer, the fourth layer, the fifth layer or the sixth layer;

The printed circuit board includes a window 603, and a sidewall metal 604 is attached to a sidewall of the window 603; In the embodiment of the present invention, the sidewall metal can be obtained through the sidewall metallization process;

The 604 is electrically connected to the reference copper strip, and the sidewall metal does not cover the sidewall of the window between the first surface and the reference single-layer printed circuit board, that is, between the first surface and the reference single-board printed circuit board. The sidewall of the window is insulated, so that the sidewall metal 604 is insulated from the surface copper; wherein, the area of the pattern formed by the projection of the sidewall metal 604 on the first surface is larger than the area of the contact surface of the window and the first surface; In this embodiment, the contact surface can be within the coverage of the graphic. At this time, the interface for opening the window on the printed circuit board which is improved by the embodiment of the present invention is an approximate "convex" shape.

The embodiment of the present invention further provides an apparatus for resolving the reflow of the radio frequency power amplifier by using the second embodiment of the printed circuit board, wherein the radio frequency power amplifier can be a power amplifier tube or the like, and the apparatus for resolving the reflow of the radio frequency power amplifier provided by the embodiment of the present invention is provided. 2 includes a power amplifier tube 701, a printed circuit board 702, and a sintered block 703, wherein the printed circuit board 702 is composed of a plurality of single-layer printed circuit boards, and the first surface 7021 of the printed circuit board is attached with a surface copper skin. A reference single-layer printed circuit board 7022 of the printed circuit board is attached with a reference copper skin corresponding to the surface copper; wherein, the reference single-layer printed circuit board 7022 is different from the single-layer printed circuit board to which the surface copper is attached. The printed circuit board includes a window opening 7023, and a sidewall metal 7024 is attached to a sidewall of the window opening 7023. The sidewall metal in the embodiment of the present invention can be obtained by a sidewall metallization process; the sidewall metal 7024 and the reference copper The skin is electrically connected, and the sidewall metal does not cover the sidewall of the window between the first surface and the reference single-layer printed circuit board, that is, the first surface to the reference single-board printed circuit board Between the sidewall insulating window so that the side wall 7024 and the metal surface of the insulating copper; wherein, the RF power amplifier apparatus of the embodiment to solve the refluxing two cross-sectional view shown in Figure 7: The power amplifier tube 701 is embedded in the printed circuit board through the opening window 7023 of the printed circuit board 702, so that the power amplifier tube flange of the power amplifier tube 701 is electrically connected to the sintered block 703;

The input and output matching junction 7011 of the power amplifier tube 701 is electrically connected to the surface copper of the first surface of the printed circuit board, wherein the sidewall of the window 7023 is adhered with the sidewall metal, because the first surface to the reference single board printed circuit board The sidewall of the window is insulated to insulate the sidewall metal from the input-output matching junction and the surface copper, and the sidewall metal is electrically connected to the agglomerate 703, thereby allowing the reference copper to pass through the sidewall metal and the agglomerate and the power amplifier tube method. The blue plate forms a very short return path.

As can be seen from the above, the device for solving the reflow of the radio frequency power amplifier provided by the embodiment of the present invention uses the printed circuit board provided by the embodiment of the present invention, so that the reference copper of the input and output matching junction can pass through the sidewall metal and the power amplifier of the window. The tube flange forms a very short return path, thereby improving the stability of the device for resolving the return of the RF power amplifier. At the same time, due to the presence of the gap, the non-ground short circuit of the side wall metal and the power amplifier tube input and output matching junction is avoided, The normal operation of the device for resolving the reflow of the RF power amplifier is affected. Since the printed circuit board provided by the embodiment of the present invention is used, the reference copper skin can be electrically connected to the sidewall metal of the window, and when the power amplifier tube is inserted, The sidewall metal solves the problem of backflow between the power amplifier tube flange and the reference ground layer, so that it is not necessary to drill a blind hole on the printed circuit board, at least the blind hole drilling process and the sidewall metallization process of the blind hole can be reduced. Therefore, when the printed circuit board provided by the embodiment is used to solve the reflow problem, complicated printed wiring is not required. Plate machining step, the printed circuit board processing technology and simple batch consistency, but can also reduce costs.

The embodiment of the present invention further provides a method for manufacturing a printed circuit board corresponding to the second embodiment of the printed circuit board. FIG. 8 is a flow chart of the first embodiment of the method for manufacturing the printed circuit board, including:

Step 801: Pulling out a window opening area on a prepreg (PP: Prepreg) corresponding to a single-layer printed circuit board on which the copper sheet is placed;

Step 802: laminating a single-layer printed circuit board and a prepreg that has opened the window opening area;

Step 803, performing a deep enthalpy treatment on the multilayer printed circuit board obtained by lamination and pressing, and controlling the depth The area of the window is the window opening area on the prepreg;

Wherein, the depth of the triumphant central control squat of the invention may be the depth of a surface of the reference copper to multi-layer printed circuit board, the surface is not the surface of the surface copper surface of the multilayer printed circuit board; step 804, right Controlled sputum processing of the printed circuit board for sidewall metallization;

Step 805, performing windowing on the multilayer printed circuit board after metallization of the sidewall; opening the window on the other surface of the multilayer printed circuit board, and opening the window on the printed circuit board needs to be in the above The area of the window in which the prepreg is drawn, so that the area of the pattern formed by the projection of the side wall metal on the other surface is larger than the area of the contact surface of the window and the other surface;

It can be understood that the above description only describes the preferred printed circuit board provided by the embodiment of the present invention, that is, the case where the cross section of the window opening region is approximately "T" or approximately "convex". However, the printed circuit board provided by the embodiment of the present invention is not limited to the above manner, regardless of the shape of the cross section of the window opening area of the printed circuit board, as long as the sidewall metal can be electrically connected to the reference copper sheath. The surface copper insulation does not affect the implementation of the embodiments of the present invention; for example, the sidewalls may be selectively metallized, that is, the metallized sidewall regions are selected such that the sidewall metal covers only the reference copper The area to one surface of the multilayer printed circuit board, without covering the area of the reference copper skin to the other surface of the printed circuit board, can also meet the needs of embodiments of the present invention.

Further, the above-described printed circuit board manufacturing method provided by the embodiment of the present invention is only a preferred implementation manner provided by the embodiment of the present invention, and the printed circuit board provided by the embodiment of the present invention is not limited to being manufactured by the above manufacturing method. The embodiment of the invention does not limit the manufacturing method of the printed circuit board provided by the embodiment of the invention.

Further, the embodiment of the present invention further provides a communication device, which includes the device for resolving the reflow of the radio frequency power amplifier provided by the embodiment of the present invention. Communication device provided by embodiment of the present invention The specifics may be a base station, a relay station, or the like.

A person skilled in the art can understand that all or part of the steps of implementing the above embodiments can be completed by a program to instruct related hardware, and the program can be stored in a computer readable storage medium, and the program is executed. The following steps are included:

Laminating and pressing a single-layer printed circuit board;

Metallizing the side wall of the window obtained by opening the window;

And / or include the following steps:

Opening the window opening area on the prepreg corresponding to the single-layer printed circuit board on which the copper sheet is placed; laminating and pressing the single-layer printed circuit board and the prepreg which has opened the window opening area; The multi-layer printed circuit board performs a deep enthalpy processing, and the deep control area is a window opening area which is drawn on the prepreg;

The window processing is performed on the sidewall printed metallized multilayer printed circuit board, the window opening is performed on the other surface of the multilayer printed circuit board, and the windowed area is in the window opening area of the prepreg, side The area of the pattern formed by the projection of the wall metal on the other surface is greater than the area of the contact surface of the window and the other surface.

The above-mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like.

As can be seen from the above, it can be seen from the above that the present embodiment using the printed circuit board can electrically connect the reference copper skin to the side wall metal of the window. When the power amplifier tube is inserted, the power socket tube flange can be solved by the side wall metal. Referring to the problem of backflow between the ground layers, it is not necessary to drill blind holes on the printed circuit board, at least the drilling process of the blind holes and the side wall metallization process of the blind holes can be reduced, and therefore, the printing provided by the embodiment is used. When the board solves the reflow problem, it does not require complicated printed circuit board processing, and the printed circuit The process of the board is simple and the batch consistency is good, and the cost can also be reduced. Further, since the apparatus for solving the reflow of the radio frequency power amplifier provided by the embodiment of the present invention uses the printed circuit board provided by the embodiment of the present invention, The reference copper of the input and output matching junction forms a very short return path through the sidewall metal of the window and the power amplifier tube flange, thereby improving the stability of the device for solving the RF power amplifier reflow; and avoiding due to the presence of the gap The non-ground structure short circuit of the sidewall metal and the power amplifier tube input and output matching junction does not affect the normal operation of the device for resolving the RF power amplifier reflow. Therefore, when the printed circuit board provided by the embodiment is used to solve the reflow problem, no complicated The printed circuit board processing process, the printed circuit board processing process is simple and the batch consistency is good, and the cost can also be reduced. At the same time, since the printed circuit board provided by the embodiment of the present invention is used, the sintered block and the printed circuit board are used. There is only one contact surface of the plate, which reduces the tolerance of the sintered surface.

The printed circuit board, the manufacturing method and the related device provided by the embodiments of the present invention are described in detail above. The description of the above embodiments is only for helping to understand the method and the idea of the present invention. Meanwhile, it is for those skilled in the art. The present invention is not limited by the scope of the present invention.

Claims

Claim

A printed circuit board comprising a plurality of single-layer printed circuit boards, a surface of which is adhered to a first surface of the printed circuit board, and a reference single-layer printed circuit board of the printed circuit board Attaching a reference copper skin corresponding to the surface copper, the reference single-layer printed circuit board is different from the single-layer printed circuit board to which the surface copper is attached, wherein the printed circuit board comprises Opening a window, a sidewall metal is attached to the sidewall of the window, the sidewall metal is electrically connected to the reference copper, and the sidewall metal is insulated from the surface copper.

2. The printed circuit board according to claim 1, wherein the window further comprises a notch, the notch connecting the surface copper to the sidewall metal, and the surface of the notch is insulated.

3. The printed circuit board of claim 2, wherein the depth of the notch is less than a depth of the first surface to the reference copper.

The printed circuit board according to claim 2 or 3, wherein the area of the pattern formed by the projection of the side wall metal on the first surface is smaller than the area of the notch and the first surface The area of the contact surface, the pattern being within the contact surface.

The printed circuit board according to claim 1, wherein an area of a pattern formed by the projection of the sidewall metal on the first surface is larger than a contact surface of the window and the surface The area, the contact surface is within the graphic.

6. A method of manufacturing a printed circuit board, comprising:

Laminating and pressing a single-layer printed circuit board;

Metallizing the side wall of the window obtained by opening the window;

7. The method of manufacturing a printed circuit board according to claim 6, wherein said insulating layer The treatment is controlled by deep milling.

8. The method of manufacturing a printed circuit board according to claim 7, wherein the depth of the controlled depth milling is smaller than the depth of the surface to the reference formation.

9. A method of manufacturing a printed circuit board, comprising:

Opening the window opening area on the prepreg corresponding to the single-layer printed circuit board on which the copper sheet is placed; laminating and pressing the single-layer printed circuit board and the prepreg which has taken out the window opening area; Pressing the obtained multilayer printed circuit board to perform a deep squeezing process, wherein the deep control area is a window opening area on the prepreg;

10. The method of manufacturing a printed circuit board according to claim 9, wherein the depth of the depth control is a depth from the reference copper to the one surface.

A device for solving the reflow of a radio frequency power amplifier, comprising the printed circuit board according to any one of claims 1 to 5.

12. A communication device, comprising: solving the radio frequency according to claim 11