CN204291576U - A kind of integrated circuit board - Google Patents
A kind of integrated circuit board Download PDFInfo
- Publication number
- CN204291576U CN204291576U CN201420390773.0U CN201420390773U CN204291576U CN 204291576 U CN204291576 U CN 204291576U CN 201420390773 U CN201420390773 U CN 201420390773U CN 204291576 U CN204291576 U CN 204291576U
- Authority
- CN
- China
- Prior art keywords
- layer
- integrated circuit
- line layer
- circuit board
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims abstract description 213
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000011241 protective layer Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 22
- 239000005030 aluminium foil Substances 0.000 claims abstract description 19
- 238000010030 laminating Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 238000003466 welding Methods 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 13
- 229920000297 Rayon Polymers 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 9
- 229920006267 polyester film Polymers 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229920006289 polycarbonate film Polymers 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 42
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 239000004411 aluminium Substances 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000003825 pressing Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000000205 computational method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Integrated circuit board of the present utility model, comprise insulated base material layer, upper in insulated base material layer, lower surface sets gradually line layer and insulating protective layer respectively, line layer forms integrated circuit, on, the tie point of vertical conducting is provided with between the integrated circuit of the line layer of lower surface, the line layer of its upper and lower surface all uses aluminium foil to make, pad position is reserved in the position that integrated circuit need fill subsides electronics unit device of line layer, and pad position makes the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, the insulating protective layer place right in pad position forms the empty window of dew, there is provided and use two-sided aluminum line layer to realize safety, effectively signal transmission and heat conduction, dispel the heat and allow the integrated circuit board of longer service life of electronic devices and components, propose the conducting scheme of the two-layer integrated circuit layer at the surface mounted electronic devices and components of one side integrated circuit board of aluminum integrated circuit layer and the surface mounted electronic devices and components of the two-sided integrated circuit board of aluminum and the two-sided integrated circuit board of aluminum.
Description
Technical field
The utility model relates to a kind of LED circuit board, more particularly, particularly relates to a kind of integrated circuit board.
Background technology
Well-known, the best several metals of electric conductivity are respectively silver, copper, gold, aluminium.Their resistivity is respectively silver-colored 1.586Lp2 × 10
-8Ω .m, copper 1.678Lp2 × 10
-8Ω .m, golden 2.4Lp2 × 10
-8Ω .m, aluminium 2.6548Lp2 × 10
-8Ω .m.In electron trade, particularly in integrated circuit board industry, in the metal of above several electric conductivity the best, gold with high costs and silver are seldom used in integrated circuit board industry, although the little cost of aluminium density is low, but because aluminium is very easily oxidized, generate aluminium oxide, and aluminium oxide is non-conductive, run in the opposite direction with the effect of integrated circuit board, the chemical characteristic of aluminium is also very unstable in addition, and easily by acid or alkaline matter corrodes, therefore aluminium is not used in integrated circuit board industry.
In the heat conduction function of metal, the conductive coefficient W/ (m*K) of each metal is respectively silver 429, copper 401, gold 317, aluminium 237.Because the quality of aluminium is light, low price, the factors such as sharp processing is convenient, and become the preferred material of heat abstractor, in the application of LED, the heat abstractor of most LED lamp all adopts aluminum to do, as replaced the bulb lamp of incandescent lamp, replace T5, T8 fluorescent tube of fluorescent tube, replace the Ceiling light and flat lamp etc. of ceiling light.Its structure substantially all adopts reserved location on aluminium heat abstractor, processes screw hole, dress is posted the integrated circuit board of LED lamp bead, coats or paste adhesive-layer.First pre-determined bit is on aluminium heat abstractor, then screw fixed position is stamped, also have in industry and integrated circuit changed into PFC integrated circuit board, upper adhesive-layer is coated or pasted to the FPC integrated circuit board that dress posts LED lamp bead, directly be pasted onto on aluminium heat abstractor, because the thermal coefficient of expansion (10E-6/K) of aluminium is 23, and the thermal coefficient of expansion of copper is 17.5, and the main material of FPC integrated circuit board is copper, adopt the LED lamp of FPC integrated circuit board after thermal expansion shrinkage several times, FPC soft integration circuit is separated with aluminium heat abstractor, cause and cannot use.
In current LED industry, solve the heat dissipation problem of LED lamp, reduce costs reach family's usage level and make becoming more meticulous of LED lamp, lighting is with further improving product practical value and reduce product cost further, and raising use popularity rate etc. are old is successively the problem that in industry, pole need solve.
In order to solve the problem points of above several respects, adopt PFC integrated circuit board, to become more meticulous lighting to solve LED lamp, lighting problem, aluminum is adopted to make integrated circuit board, to solve, the coefficient of thermal expansion inconsistence problems of integrated circuit board and LED heat abstractor, reduce the use of copper simultaneously, reduce manufacturing cost.
As previously mentioned, because the chemical characteristic of aluminium is very unstable, and very easily produce nonconducting alumina layer, use aluminium to manufacture integrated circuit board as material, the problem that must solve is how at the surface mounted electronic devices and components of aluminium with allow the conducting between layers of integrated circuit board.
Utility model content
The technical problems to be solved in the utility model is the above-mentioned deficiency for prior art, two-sided use aluminum line layer ensure safety, effectively signal transmission and heat conduction, heat radiation with the prerequisite in the useful life of electronic devices and components under realize the technique effect that effectively reduces costs.The utility model proposes the conducting scheme in the surface mounted electronic devices and components solution of the two-sided integrated circuit board of aluminum integrated circuit layer and the two-layer integrated circuit layer of the two-sided integrated circuit board of aluminum.
The technical solution of the utility model is such: a kind of integrated circuit board, comprise insulated base material layer, upper in insulated base material layer, lower surface sets gradually line layer and insulating protective layer respectively, line layer forms integrated circuit, on, the tie point of vertical conducting is provided with between the integrated circuit of the line layer of lower surface, wherein: the line layer of upper and lower surface all uses aluminium foil to make, pad position is reserved in the position that integrated circuit need fill subsides electronics unit device of line layer, and pad position makes the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, the insulating protective layer place right in pad position forms the empty window of dew.
Above-mentioned a kind of integrated circuit board, the integrated circuit surface integral of line layer is provided with the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, and pad position is in the optional position of integrated circuit, and insulating protective layer is formed in outside laminating layer.
Above-mentioned a kind of integrated circuit board, tie point is arranged in pad.
Above-mentioned a kind of integrated circuit board, the insulated base material layer that tie point is corresponding is provided with the via of the line layer being communicated with upper and lower surface, the line layer of upper surface stretches downwards along via and contacts the line layer of lower surface, in the pit that areal stretch is formed, fill welding medium conducting when filling and pasting electronic component.
Above-mentioned a kind of integrated circuit board, line layer and the insulated base material layer of the upper surface that tie point is corresponding are provided with the via of the line layer being communicated with lower surface, fill welding medium conducting in via when filling and pasting electronic component.
Above-mentioned a kind of integrated circuit board, insulated base material layer is glass fabric or polyimide film or polycarbonate film or polyester film or ceramic material, it is two-sided with adhesive-layer formation, or the adhesive-layer of pure tacky film is formed, and the line layer of upper and lower surface is bonded as one by adhesive-layer.
Above-mentioned a kind of integrated circuit board, via is to the line layer below downward-extension penetrates, and the line layer of upper surface pulls down in the via of the line layer extending lower surface, and its bottom contacts with the sidewalls of the line layer of lower surface and connects.
Above-mentioned a kind of integrated circuit board, the line layer of upper surface along via stretch downwards contact lower surface line layer after adopt conductive solder technique to weld.
Above-mentioned a kind of integrated circuit board, upper surface line layer downwards stretching bottom forms the via riveting of the line layer of die and lower surface.
Above-mentioned a kind of integrated circuit board, the line layer of the upper surface relative with via is provided with the perforate less than the via aperture of insulating barrier, and edge, the hole via of perforate stretches downwards and contacts the line layer of lower surface.
Above-mentioned a kind of integrated circuit board, is provided with one deck conductive viscose layer or conducting solder layer along via wall, and conductive viscose layer or conducting solder layer are all covered with or part making in whole via inner ring.Realize via wall and effectively connect the upper wiring layer stretched along via downwards.By being communicated with the space that the upper wiring layer that stretches along via and line layer are formed after heating downwards, conducting sectional area can being increased and realize the better technique effect of conduction.Conducting solder layer is integrated by making it fused when the condition of heating 180 degree ~ 280 degree, realizes the technique effect of sealing conducting while making physical contact conducting.
Above-mentioned a kind of integrated circuit board, integrated circuit board gross thickness is less than 800 microns; Wherein adhesive layer thickness is 6 microns ~ 150 microns, and thickness of insulating layer is 10 microns ~ 400 microns, and upper strata integrated circuit layer thickness is 6 microns ~ 150 microns, 6 microns ~ 400 microns, lower floor's integrated circuit layer.
Above-mentioned a kind of integrated circuit board, conductive solder technique is tin cream welding or laser welding or ultrasonic bonding.
Adopt the utility model of technique scheme, be bonded as the line layer of the upper and lower surface of one respectively by adhesive layer by the insulating barrier of double-sided belt adhesive-layer and top and bottom thereof, wherein the line layer of upper and lower surface all adopts aluminium, the integrated circuit that aluminium is made needs fill and to paste on electronics unit device position copper facing or nickel plating or coated copper or coated nickel or its laminating layer combined, to realize on integrated circuit board two-sided use aluminium the problem simultaneously solved being how at the surface mounted electronic devices and components of aluminium with allow the technical problem of conducting between layers of integrated circuit board.The aluminium of its two-sided use can meet the carrier of power supply and Signal transmissions and heat conduction requirement, and make two-sided aluminium can effectively conducting, realize by adopting aluminium there is good heat-conducting effect and realize effective cost-effective technique effect while making the aluminium of two-sided use fully can meet instructions for use.Wherein, the insulating barrier of double-sided belt adhesive-layer offers via, stretches downwards and the line layer physical contact conducting of lower surface along via by making the line layer of upper surface.The upper and lower surface of effective conducting production method can enhance productivity, reduce energy resource consumption, strengthen electric conductivity.And then in the pit that areal stretch is formed, utilize the filling welding medium conducting when filling subsides electronic component to allow upper and lower line layer together with electronic component permanent weld, form permanent conducting body, and then produce the sound integrated circuit board of conduction property.Effectively extend the useful life of wiring board.The LED that the utility model is specially adapted to flexible circuit uses.The utility model adopts PFC integrated circuit board, to become more meticulous lighting to solve LED lamp, lighting problem, aluminum is adopted to make integrated circuit board, to solve, the coefficient of thermal expansion inconsistence problems of integrated circuit board and LED heat abstractor, reduce the use of copper simultaneously, reduce manufacturing cost.
The basic structure procedure of processing of the utility model integrated circuit board is: upper and lower surface laminating aluminium foil respectively process via on the insulating barrier of double-sided belt adhesive-layer after, to make after process circuit at two sides integrated circuit by method known in industry, make copper facing or nickel plating or coated copper or coated nickel or its pad be bonded in the position need welding electronics unit device.Then make insulating protective layer at the line layer outer surface except pad locations, insulating protective layer then forms the empty window of dew for welding electronics unit device in pad locations.The operation making copper facing or nickel plating or coated copper or coated nickel or its pad be bonded can make after line layer outer surface makes the operation of insulating protective layer.Its fabrication processing can be reduced to: insulating sticky glue-line processing via-----insulating sticky glue-line cladded aluminum foil at two-sides-----hot pressing-----traditional printing ink to manufacture integrated circuit figure----corrosion-----wireline inspection-----make copper facing or nickel plating or coated copper or coated nickel or its pad be bonded in the position need welding electronics unit device-----insulating protective layer processing-----mark process-----shaping.The surface of the integrated circuit of the line layer in above-mentioned steps also can whole installation copper facing or nickel plating or coated copper or coated nickel or its laminating layer combined, and pad is in the optional position of laminating layer.Aluminium copper facing or aluminium nickel plating or aluminium coated copper or manufacturing before operation can be arranged in printing ink to manufacture integrated graphics operation of the coated nickel of aluminium is adopted to make in above-mentioned steps; or make before insulating protective layer manufacturing procedure or after insulating protective layer manufacturing procedure; or make after mark manufacturing procedure, there is the effect that flexibility is strong.Above-mentioned copper facing, nickel plating process adopt the technique of chemical plating to make, and reduces the use of conventional plating process.
Concrete scheme of the present utility model is as follows:
(1) line layer in above-mentioned integrated circuit board is owing to being two-sided employing aluminium foil, and the circuit of the aluminium foil line layer of upper surface is pasted with the electronic devices and components dress meeting integrated circuit as electronic devices and components dress veneer by the pad of aluminium copper facing or aluminium nickel plating or aluminium coated copper or the coated nickel making of aluminium.When the circuit integral manufacturing aluminium copper facing of line layer or aluminium nickel plating or aluminium coated copper or the coated nickel of aluminium, pad can in the optional position of laminating layer.
(2) above-mentioned integrated circuit board adopts the integrated circuit layer that aluminium foil makes, and is to play transmission of electricity and Signal transmissions and heat conduction two functions simultaneously.
(3) above-mentioned integrated circuit board is not if needed heat conduction function, and its function is also complete and effective.
(4) in above-mentioned integrated circuit board, via is formed in the line layer of insulated base material layer and lower surface, the line layer of upper surface stretches downwards along via, its side wall surface forms contact conducting, and its bottom forms the via riveting of the line layer of die and lower surface after can slightly stretching out the lower surface of the line layer of lower surface.
(5) in above-mentioned integrated circuit board, the aperture of the perforate of the line layer of upper surface is less than the aperture of the via of insulated base material layer, when making base material, to play the effect of air guide and upper and lower two-layer physical contact conducting, computational methods: the radius that the perforate radius of the line layer of upper surface is less than insulating barrier via deducts the thickness of substrate layer, and (thickness of setting insulating barrier is A, the via radius of substrate layer is B, the perforate of the line layer of upper surface is C, then C < B-A) as long as the condition that the radius of the line layer perforate of upper surface can meet above " the C < B-A " that exemplify just can, its size just can be selected according to the adhesive property of selected insulated base material layer, without fixing requirement, if the perforate of the line layer of insulating layer perforating and upper surface is non-circular, condition is exemplified more than then perforate size can meet, make, the line layer of lower surface can contact conducting and just can.
(6) conduction method of its upper and lower two-layer line layer in above-mentioned integrated circuit board, can also orifice ring or inner hole wall be made one deck conductive viscose layer and allow the line layer extrusion outside wall surface of upper surface be bonded together by the line layer of conductive viscose and lower surface to form conducting body in via.Conductive viscose layer can whole insulating barrier via inner ring all be covered with, and also can be that part makes conductive viscose, only needs content with funtion to need just can.
(7), in above-mentioned integrated circuit board, the upper and lower two-layer line layer of the conducting that contacts can be formed by the method for welding and be permanently fixed conducting, can adopt laser welding or ultrasonic bonding.When arranging if conductive solder technique during tin cream conductive viscose layer is tin cream welding therebetween.
(8) above-mentioned integrated circuit board, described insulated base material layer is the two-sided glass fabric with adhesive-layer or polyimide film or polycarbonate film or the material such as polyester film or pottery.
(9) insulated base material layer described in above-mentioned integrated circuit board also can be the pure tacky film not with glass fabric or polyimide film or polycarbonate film or polyester film etc.
(10) adhesive layer on the insulating barrier two sides described in above-mentioned integrated circuit board or pure tacky film insulating barrier can be heat conduction, and also can be athermanous, its conductive coefficient can require accordingly according to circuit board and determine.
(11) upper surface line layer also can be perforate at via place, it is little that passing hole exterior open cell is led than upper strata integrated circuit in the aperture of perforate, soldering paste is filled in the pit that can be formed at it after it connects the line layer stretching contact lower surface downwards, play the line layer on the upper and lower surface of sealing and form contact point, becoming permanent conducting body.
(12) welding medium of filling in the pit that the line layer of upper surface is formed when via stretches the line layer contacting lower surface downwards can be pre-charged with or fill when filling and pasting electronic component, realizes the object of saving operation and disposable conducting and sealing formation permanent conduction.
(13) protective layer of the outer surface of the line layer on upper and lower surface can be diaphragm type, also can be dielectric ink, the materials such as paint and pure glue glued membrane.
(14) protective layer of the line layer outer surface on upper and lower surface, mentioned diaphragm, dielectric ink, paint, pure glued membrane etc., can be heat-conducting type, also can be non-heat-conducting type, and its conductive coefficient can set because of the requirement of integrated circuit board.
(15) protective layer of the line layer outer surface on upper and lower surface, mentioned diaphragm, its material can be polyimide film, also can be poly-carbonic acid film also can be polyester film etc.
(16) above-mentioned integrated circuit board, it is a group or more less that the circuit that the line layer of upper surface or the line layer of lower surface make causes.Often organize integrated circuit and comprise positive pole and negative pole respectively.
(17) its preferred gross thickness of above-mentioned integrated circuit board is less than 800 microns, and the flexible circuit board for less than 400 microns gross thickness is more superior.
(18) the adhesive layer thickness of above-mentioned double-sided wiring board can be 6 microns ~ 150 microns, is preferably 10 microns ~ 1 () () micron.
(19) thickness of insulating layer of above-mentioned integrated circuit board is 10 microns ~ 400 microns, is preferably 10 microns ~ 250 microns;
(20) thickness of the aluminium foil line layer above above-mentioned integrated circuit board and copper facing aluminium foil or nickel plating aluminium foil or coated copper aluminium foil or coated nickel aluminium foil is 6 microns ~ 150 microns, is preferably 10 microns ~ 75 microns.
(21) thickness of the aluminium foil line layer below above-mentioned integrated circuit board is 6 microns ~ 400 microns, is preferably 10 microns ~ 300 microns.
(22) the upper wiring layer perforate described in above-mentioned integrated circuit board is less than base material via, and after base material pressing, upper wiring layer can form conducting at line layer brought into physical contact.
(23) above-mentioned integrated circuit board can increase on the line layer of upper surface line layer or lower surface on the basis of two sandwich circuit boards formed line layer form two-layer more than wiring board; relative set insulating barrier between the line layer of corresponding increase and basic line layer, its protective layer is then formed in corresponding outer surface.
The utility model is compared with traditional integrated circuit board, the operation that manufacture method in common knowledge calculates traditional integrated circuit board and needs in the industry is by row 17 large basic operations, and heat-conducting type double sided board of the present utility model only needs eight basic operations, greatly save the production time.In addition, traditional double-sided wiring board, also must use electroplating technology, to environmental concerns, also dry film imaging must be used when making integrated circuit layer, cost intensive, and this double-sided wiring board, its operation is simplified, there is no electroplating technology, do not use dry film imaging, saved time and cost, reduce the destruction to environment.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the utility model is described in further detail, but do not form any restriction of the present utility model.
Cross-sectional view when Fig. 1 is the utility model specific embodiment 1 encapsulation state;
Fig. 2 is the cross-sectional view after the utility model specific embodiment 1 has encapsulated;
Cross-sectional view when Fig. 3 is the utility model specific embodiment 2 encapsulation state;
Fig. 4 is the cross-sectional view after the utility model specific embodiment 2 has encapsulated;
Fig. 5 be the utility model specific embodiment 2 further improvement project encapsulation state time cross-sectional view;
Cross-sectional view when Fig. 6 is the utility model specific embodiment 3 encapsulation state;
Cross-sectional view when Fig. 7 is the utility model specific embodiment 4 encapsulation state;
Fig. 8 is the cross-sectional view after the further improvement project of the utility model specific embodiment 3 has encapsulated;
Cross-sectional view when Fig. 9 is the utility model specific embodiment 4 encapsulation state;
Figure 10 is the cross-sectional view after the utility model specific embodiment 5 has encapsulated;
Figure 11 is the structural representation of the utility model specific embodiment 1-5 upper surface.
In figure: insulated base material layer 1, via 11, line layer 2, pad 21, pit 22, die 23, insulating protective layer 3, electronics unit device 4, welding medium 5.
Embodiment
Embodiment 1, as shown in Fig. 1 ~ 2, the two-sided integrated circuit board of one of the present utility model, comprise insulated base material layer 1, upper in insulated base material layer 1, lower surface sets gradually line layer 2 and insulating protective layer 3 respectively, each formation one group of integrated circuit on line layer 2, on, the tie point of vertical conducting is provided with between the integrated circuit of the line layer 2 of lower surface, the line layer 2 of upper and lower surface all uses aluminium foil to make, pad position is reserved in the position that integrated circuit need fill subsides electronics unit device of line layer 2, and pad position makes the laminating layer 21 of copper facing or nickel plating or coated copper or coated nickel or its combination, insulating protective layer 3 place right in pad position forms the empty window 31 of dew.Tie point is arranged on pad position central part.Line layer 2 and the insulated base material layer 1 of the upper surface that tie point is corresponding are provided with the via 11 of the line layer 2 being communicated with lower surface, fill welding medium 5 conducting in via 11 when filling and pasting electronic component.Insulated base material layer 1 is glass fabric or polyimide film or polycarbonate film or polyester film or ceramic material, and it is two-sided is formed with adhesive-layer, or the adhesive-layer of pure tacky film is formed, and the line layer 2 of upper and lower surface is bonded as one by adhesive-layer.
Embodiment 2, as shown in figs. 34, the insulated base material layer 1 that tie point is corresponding is provided with the via 11 of the line layer 2 being communicated with upper and lower surface, the line layer 2 of upper surface stretches downwards along via 11 and contacts the line layer 2 of lower surface, in the pit 22 that areal stretch is formed, fill welding medium conducting when filling and pasting electronic component.
In embodiment 1 or 2, the integral surface of the integrated circuit of line layer 2 is provided with the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, and pad position is in the optional position of integrated circuit, and insulating protective layer 3 is formed in outside laminating layer.
Embodiment 3, as shown in Figure 6, on the basis of embodiment 1 or 2, the line layer 3 of the upper surface relative with via 11 is provided with the perforate 31 less than the via aperture of insulating barrier, and edge, the hole via 11 of perforate stretches downwards and contacts the line layer of lower surface.
Embodiment 4, as shown in Figure 7, on the basis of embodiment 2, via 11 is to the line layer 3 below downward-extension penetrates, the line layer 2 of upper surface pulls down in the via 11 of the line layer 2 extending lower surface, and its bottom is connected with via 11 sidewall contact of the line layer 2 of lower surface.
Embodiment 5, as shown in Figure 9, Figure 10, on the basis of embodiment 4, the downward stretching bottom of upper surface line layer 2 forms via 11 riveting of the line layer 2 of die 23 and lower surface.
On the basis of embodiment 1 or 2 or 3, the line layer 2 of upper surface adopts the welding of conductive solder technique after the line layer 2 of via 11 stretching contact downwards lower surface.Conductive solder technique is laser welding or ultrasonic bonding.
As shown in Figure 5 and Figure 8, on the basis of embodiment 3 or 4, be provided with one deck conductive viscose layer 12 or conducting solder layer along via 11 wall, conductive viscose layer 12 or conducting solder layer are all covered with or part making in whole via inner ring.Conductive solder technique is tin cream welding.
The gross thickness of the integrated circuit board of above-described embodiment is less than 800 microns; Wherein adhesive layer thickness is 6 microns ~ 150 microns, and thickness of insulating layer is 10 microns ~ 400 microns, and upper strata integrated circuit layer thickness is 6 microns ~ 150 microns, 6 microns ~ 400 microns, lower floor's integrated circuit layer.
As shown in figure 11, above-described embodiment on the line layer 2 of upper surface, form the integrated circuit that a group comprises N, P pole, integrated circuit is reserved pad position and pad position makes copper facing or nickel plating or coated copper or coated nickel or its laminating layer 21 combined need fill the position of pasting electronics unit device.
The basis of two sandwich circuit boards of above-described embodiment can increase on the line layer of upper surface line layer or lower surface line layer form two-layer more than wiring board; relative set insulating barrier between the line layer of corresponding increase and basic line layer, its protective layer is then formed in corresponding outer surface.
The utility model is at concrete production stage:
(1) according to the design data of double-sided wiring board, insulating material 1 adopt digital control drilling machine get out location and via 11;
(2) same data are adopted to get out location hole on the aluminium foil 2 of top and bottom;
(3) will bore the insulating material 1 of via and bore the aluminium foil 2 of location hole, location is placed on pressing and forming on traditional pressing machine or fast press in order, its pressing condition is: pressure is 120KG/CM, temperature is 180 DEG C ± 10 DEG C, pressing time is 30 ~ 80 seconds, and pressing post cure condition is 165 DEG C ± 10 DEG C X60min
(4) according to the design data of double-sided wiring board, known method integration circuit in industry is adopted;
(5) according to the design data of double-sided wiring board and location hole at the laminating protective layer of outer surface of double-deck integrated circuit layer, form the empty window of dew at insulating protective layer 3 place that pad locations is right.Pressure is 120KG/CM, and temperature is 180 DEG C ± 10 DEG C, and pressing time is 30 ~ 80 seconds, and pressing post cure condition is 165 DEG C ± 10 DEG C X60min.
(6) copper facing or nickel plating or coated copper or coated nickel or its pad 21 be bonded is made;
(7) reference lamina of double-sided wiring board makes;
(8) double-sided wiring board is shaping, shipment.
Material selection:
(1) select gross thickness to be 75 microns, two-sided respectively with its thickness of 25 micron thickness adhesive layers be the polyimide film of 25 microns as insulating material, bore location hole and via, via diameter is 1000 microns;
(2) aluminium foil above selects thickness to be 35 microns, and bore the perforate at location hole and via place according to design data, the opening diameter at via place is 600 microns;
(3) aluminium foil below is selected thickness to be 150 microns and on pressing machine, is located pressing with the aluminium foil of bore via polyimide film and 35 microns, condition is: pressure is 120KG/CM temperature is 185 DEG C, time is 60 seconds, and pressing rear curing time is 165 DEG C of X60min;
(4) by clean for base material good for pressing rear employing rust-proof oil ink print two sides integrated circuit;
(5) integrated circuit corrosion;
(6) computer test of integrated circuit;
(7) the laminating polyimide type diaphragm of integrated circuit two sides appearance, condition is: pressure is 120KG/CM, and temperature is 180 DEG C, and the time is 60 seconds, and condition of cure is 165 DEG C of X60min;
(8) copper facing or nickel plating or coated copper or coated nickel or its pad 21 be bonded is made;
(9) character marking is made;
(10) integrated circuit sheet metal forming.
Can find out from above citing, traditional LED (integrated circuit board), manufacture method in common knowledge calculates in the industry by row, and its operation needed is 17 large basic operations, and this Novel heat-conducting type double sided board only needs eight basic operations, greatly save when producing and ask.In addition, traditional double-sided wiring board, also must use electroplating technology, to environmental concerns, also dry film imaging must be used when making integrated circuit layer, cost intensive, and this integrated circuit board, its operation is simplified, there is no electroplating technology, do not use dry film imaging, saved time and cost, reduce the destruction to environment.
In sum, the utility model, as specification and diagramatic content, makes actual sample and through repeatedly use test, from the effect of use test, provable the utility model can reach its desired object, and practical value is unquestionable.Above illustrated embodiment is only used for conveniently illustrating the utility model, not any pro forma restriction is done to the utility model, have in any art and usually know the knowledgeable, if do not depart from the utility model carry in the scope of technical characteristic, utilize the utility model disclose the Equivalent embodiments changing or modify in the done local of technology contents, and do not depart from technical characteristic content of the present utility model, all still belong in the scope of the utility model technical characteristic.
Claims (13)
1. an integrated circuit board, comprise insulated base material layer (1), upper in insulated base material layer (1), lower surface sets gradually line layer (2) and insulating protective layer (3) respectively, line layer (2) forms integrated circuit, on, the tie point of vertical conducting is provided with between the integrated circuit of the line layer (2) of lower surface, it is characterized in that: the line layer (2) of upper and lower surface all uses aluminium foil to make, pad position is reserved in the position that integrated circuit need fill subsides electronics unit device of line layer (2), and pad position makes the laminating layer (21) of copper facing or nickel plating or coated copper or coated nickel or its combination, insulating protective layer (3) place right in pad position forms the empty window (31) of dew.
2. a kind of integrated circuit board according to claim 1; it is characterized in that: the integral surface of the integrated circuit of line layer (2) is provided with the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination; pad position is in the optional position of integrated circuit, and insulating protective layer (3) is formed in outside laminating layer.
3. a kind of integrated circuit board according to claim 1, is characterized in that: tie point is arranged in pad position.
4. a kind of integrated circuit board according to claim 3, it is characterized in that: the insulated base material layer (1) that tie point is corresponding is provided with the via (11) of the line layer (2) being communicated with upper and lower surface, the line layer (2) of upper surface stretches downwards along via (11) and contacts the line layer (2) of lower surface, in the pit that areal stretch is formed, fill welding medium conducting when filling and pasting electronic component.
5. a kind of integrated circuit board according to claim 3, it is characterized in that: line layer (2) and the insulated base material layer (1) of the upper surface that tie point is corresponding are provided with the via (11) of the line layer (2) being communicated with lower surface, in via (11), fill welding medium conducting when filling and pasting electronic component.
6. a kind of integrated circuit board according to claim 1, it is characterized in that: insulated base material layer (1) is glass fabric or polyimide film or polycarbonate film or polyester film or ceramic material, it is two-sided is formed with adhesive-layer, or the adhesive-layer of pure tacky film is formed, the line layer (2) of upper and lower surface is bonded as one by adhesive-layer.
7. a kind of integrated circuit board according to claim 4, it is characterized in that: via (11) is to the line layer (2) below downward-extension penetrates, the line layer (2) of upper surface pulls down in the via (11) of the line layer (2) extending lower surface, and its bottom is connected with via (11) sidewall contact of the line layer (2) of lower surface.
8. a kind of integrated circuit board according to claim 4 or 7, is characterized in that: the line layer (2) that the line layer (2) of upper surface contacts lower surface along via (11) stretching downwards adopts conductive solder technique to weld afterwards.
9. a kind of integrated circuit board according to claim 7, is characterized in that: upper surface line layer (2) downwards stretching bottom forms via (11) riveting of the line layer (2) of die (23) and lower surface.
10. a kind of integrated circuit board according to claim 7 or 9, it is characterized in that: the line layer (2) of the upper surface relative with via (11) is provided with the perforate (24) less than the via aperture of insulating barrier, the edge, hole via (11) of described perforate stretches downwards and contacts the line layer of lower surface.
11. a kind of integrated circuit boards according to claim 4 or 7, it is characterized in that: be provided with one deck conductive viscose layer (12) or conducting solder layer along via (11) wall, conductive viscose layer (12) or conducting solder layer are all covered with or part making in whole via inner ring.
12. a kind of integrated circuit boards according to claim 2, is characterized in that: integrated circuit board gross thickness is less than 800 microns; Wherein adhesive layer thickness is 6 microns ~ 150 microns, and thickness of insulating layer is 10 microns ~ 400 microns, and upper strata integrated circuit layer thickness is 6 microns ~ 150 microns, 6 microns ~ 400 microns, lower floor's integrated circuit layer.
13. a kind of integrated circuit boards according to claim 8, is characterized in that: conductive solder technique is tin cream welding or laser welding or ultrasonic bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420390773.0U CN204291576U (en) | 2013-12-01 | 2014-07-09 | A kind of integrated circuit board |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320894893 | 2013-12-01 | ||
| CN201320894893X | 2013-12-01 | ||
| CN201420268322X | 2014-04-25 | ||
| CN201420268322 | 2014-04-25 | ||
| CN201420390773.0U CN204291576U (en) | 2013-12-01 | 2014-07-09 | A kind of integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204291576U true CN204291576U (en) | 2015-04-22 |
Family
ID=52874700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420390773.0U Expired - Fee Related CN204291576U (en) | 2013-12-01 | 2014-07-09 | A kind of integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204291576U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039079A (en) * | 2013-12-01 | 2014-09-10 | 吴祖 | Integrated circuit board |
-
2014
- 2014-07-09 CN CN201420390773.0U patent/CN204291576U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039079A (en) * | 2013-12-01 | 2014-09-10 | 吴祖 | Integrated circuit board |
| CN104039079B (en) * | 2013-12-01 | 2017-03-29 | 东莞市震泰电子科技有限公司 | Integrated circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104039079B (en) | Integrated circuit board | |
| TWI294757B (en) | Circuit board with a through hole wire, and forming method thereof | |
| CN103906344B (en) | Heat-conducting type double-sided PCB | |
| CN104349609A (en) | Printed circuit board and manufacturing method thereof | |
| CN205746247U (en) | A kind of double-sided PCB LED of electrically conductive ink conducting double-sided circuit | |
| WO2011060600A1 (en) | Double-faced circuit board with element and its interconnecting conduction method | |
| CN102858087A (en) | Blind-hole-conduction double-sided circuit board and processing method thereof | |
| CN213073220U (en) | Adopt flexible double-sided circuit board for LED lamp area of blind hole structure | |
| CN106804092A (en) | A kind of FPC and preparation method thereof | |
| CN102883524A (en) | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method | |
| CN102883519A (en) | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof | |
| CN203072249U (en) | Aluminum substrate used for mounting LED lamps | |
| CN103237410A (en) | Non-etched aluminum substrate and manufacturing method thereof | |
| CN204291576U (en) | A kind of integrated circuit board | |
| CN204836779U (en) | A printed circuit board structure for having than high heat dissipating demand product | |
| CN207354726U (en) | A kind of one-sided metallic base circuit board for being used to weld pin member | |
| CN101841976A (en) | Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity | |
| CN203896578U (en) | Heat conduction-type double-sided circuit board | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN204145882U (en) | One side integrated circuit board | |
| CN216291577U (en) | Multilayer circuit board | |
| CN2930196Y (en) | Soft and hard composite printed circuit board structure | |
| CN102510662A (en) | Novel LED sinkless copper plated lamp tape circuit board and manufacturing process thereof | |
| CN114007346A (en) | Multilayer circuit board manufacturing method and multilayer circuit board | |
| CN201306682Y (en) | Heat-dissipating LED module plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170516 Address after: Guangdong province Dongguan City Chashan town 523000 Zengbu village kylin City Patentee after: Dongguan Zhen Tai Electronic Technology Co., Ltd. Address before: 523000 Guangdong, Shijie, southwest town, Southwest Village, one of the four street, No. Patentee before: Wu Zu |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20200709 |