CN217816310U - LED lamp area of winding displacement preparation - Google Patents

LED lamp area of winding displacement preparation Download PDF

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Publication number
CN217816310U
CN217816310U CN202123113027.6U CN202123113027U CN217816310U CN 217816310 U CN217816310 U CN 217816310U CN 202123113027 U CN202123113027 U CN 202123113027U CN 217816310 U CN217816310 U CN 217816310U
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Prior art keywords
flat
parallel
layer
glue
led
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CN202123113027.6U
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Chinese (zh)
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王定锋
徐文红
徐磊
宋健
夏鹏
郑英杰
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Tongling Guozhan Electronic Co ltd
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Tongling Guozhan Electronic Co ltd
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Abstract

The utility model relates to a LED lamp area of winding displacement preparation, particularly, make into the winding displacement with at least 3 flat wires of film pasting that the area was glued, then the thin layer that has a plurality of pad windows open the area is glued on flat wire, resistance and LED welding are on the pad of window department, a plurality of resistance has formed parallel circuit and has connected, a plurality of LED have formed a set of parallelly connected or multiunit parallelly connected, the parallelly connected group of resistance that forms after the resistance is parallelly connected, the parallelly connected group of LED that forms after parallelly connected with LED, group and group have formed series connection again, make the LED lamp area of a winding displacement preparation, can cut separately the use in the position of arbitrary no LED and no resistance device.

Description

LED lamp area of winding displacement preparation
Technical Field
The utility model relates to a LED lamp area field, concretely relates to LED lamp area of making with winding displacement.
Background
In the prior art, the LED lamp strip is manufactured by welding the LED lamp and the resistor by using a flexible circuit board, the flexible circuit board is high in cost, and the cost of the manufactured lamp strip is also high.
In order to overcome above problem with high costs, the utility model discloses a low-cost winding displacement preparation lamp area, the long winding displacement of disjunctor that contains many lamp area winding displacements of preparation earlier welds LED and resistance preparation lamp area on the winding displacement, because the winding displacement is with low costs, can reduce the cost in lamp area by a wide margin. The Flat Cable is an FFC Flexible Flat Cable (FFC) which is made by adhering a plurality of Flat wires on a film in parallel arrangement. The method is generally used for connecting the PCB in the electronic product. The flat cable has a simple manufacturing process and is lower in cost than a Flexible Printed Circuit (FPC) board with a complex manufacturing process. The utility model discloses a on the winding displacement of three or three above wire preparation, the LED lamp area is made to a plurality of LEDs of welding and a plurality of resistance to the lamp area of making can be cut apart the back at the optional position of no LED and no resistance and use.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a LED lamp area of winding displacement preparation, particularly, film with the area glue, it has the film of taking of a plurality of pad windows to open, parallel 3 at least or 4 or 5 flat wire, put into simultaneously and cover the line machine and make into the winding displacement, perhaps paste parallel 3 at least or 4 or 5 flat wire with the film of taking the glue and make into the winding displacement, then the printing has the insulating printing ink of a plurality of pad windows on flat wire, resistance and LED welding are on opening the flat wire that has the pad window, a plurality of resistances have formed parallel circuit and have connected, a plurality of LEDs have formed parallel connection, the resistance that forms after the resistance is parallelly connected allies oneself with and allies oneself with group, the LED that forms after parallelly connected with LED allies oneself with and allies with the group has formed series connection, make the LED lamp area of a winding displacement preparation, can cut at the position of arbitrary no LED and resistance device and separately use. The utility model discloses a LED lamp area manufacture process need not etching and simple structure, and the cost of manufacture is low, efficient, easy to use, is a new technology of environmental protection, energy-conservation, material saving.
According to the utility model provides a LED lamp area of winding displacement preparation, include: the bottom layer is a film layer with glue; at least 3 flat wires are arranged in the middle; the upper layer is a film layer with glue or an ink layer; an LED and a resistor welded on the flat wire; the flat cable is characterized in that the flat cable is formed by arranging at least 3 flat wires in parallel or nearly in parallel and adhering the flat wires to a film layer with glue on the bottom layer, the upper layer is a film layer with glue, the film layer with glue is provided with a plurality of pad windows, and the film layer with glue is adhered to the flat wires; or the upper layer is an ink layer, the ink layer is provided with a plurality of bonding pad windows, the ink layer is combined on the flat conducting wire, the resistors and the LEDs are welded on the bonding pads at the bonding pad windows, the resistors are connected in parallel circuit, the LEDs are connected in parallel circuit, the resistors are connected in parallel to form a parallel group, the LEDs are connected in parallel to form a parallel group, the two parallel groups are connected in series, and the LED lamp strip manufactured by the flat cable can be used after being cut and separated at any position without the LEDs and without the resistors.
According to the utility model provides a LED lamp area of winding displacement preparation, include: a film layer with glue on the bottom layer; at least 4 flat wires are arranged in the middle; a film layer or an ink layer with glue on the upper layer; an LED and a resistor welded on the flat wire; the flat cable is characterized in that at least 4 flat wires are arranged in parallel or nearly in parallel and are adhered to a film layer with glue at the bottom layer to form the flat cable. The upper layer is a film layer with glue, a plurality of pad windows are formed in the film layer with the glue, and the film layer with the glue is stuck on the flat lead; or the upper layer is an ink layer, the ink layer is provided with a plurality of pad windows, the ink layer is combined on the flat conducting wire, the resistors and the LEDs are welded on the flat conducting wire provided with the pad windows, the resistors are connected in parallel, the LEDs are divided into two groups, each group is connected in parallel, the resistors connected in parallel are connected in parallel, the two groups of LEDs connected in parallel are connected in parallel with the LEDs, three groups are connected in parallel and connected in series, and the LED lamp strip manufactured by the flat cable can be used after being cut and separated at any position without the LEDs and without the resistors.
According to the utility model provides a LED lamp area of winding displacement preparation, include: the bottom layer is a film layer with glue; at least 5 flat wires are arranged in the middle; the upper layer is a film layer with glue or an ink layer; an LED and a resistor welded on the flat wire; the flat cable is characterized in that at least 5 flat wires are arranged in parallel or nearly arranged in parallel and are adhered to a film layer with adhesive on the bottom layer to form the flat cable. The upper layer is a film layer with glue, a plurality of pad windows are formed in the film layer with the glue, and the film layer with the glue is stuck on the flat lead; or the upper layer is an ink layer, the ink layer is provided with a plurality of pad windows, the ink layer is combined on the flat conducting wire, the resistors and the LEDs are welded on the flat conducting wire provided with the pad windows, the resistors are connected in parallel, the LEDs are divided into 3 groups, each group of LEDs is connected in parallel, the resistors are connected in parallel to form a parallel group, the 3 groups of LEDs formed after the resistors are connected in parallel with the LEDs, and the four groups are connected in series.
According to the utility model discloses a preferred embodiment, a LED lamp area of winding displacement preparation, a serial communication port, LED is the LED lamp pearl of chip package on the support.
According to the preferred embodiment of the utility model, a LED lamp area of winding displacement preparation, its characterized in that, LED is flip-chip LED chip or LED CSP device.
According to a preferred embodiment of the present invention, the LED strip is characterized in that the flat wire is formed by twisting a plurality of wires together, or formed by a single wire.
According to a preferred embodiment of the present invention, the LED lamp strip manufactured by the flat cable is characterized in that the flat wire is a copper wire or a copper-clad aluminum wire or a tin-clad copper wire or a copper-clad aluminum wire or a copper-clad steel wire.
According to the utility model discloses a preferred embodiment, a LED lamp area of winding displacement preparation, a characterized in that, lamp area back paste have the aluminium foil that the one deck improves lamp area thermal diffusivity.
According to the utility model discloses a preferred embodiment, a LED lamp area of winding displacement preparation, its characterized in that, the quantity of the resistance in lamp area is greater than the quantity of lamp pearl.
According to the utility model discloses a preferred embodiment, a LED lamp area of winding displacement preparation, its characterized in that, the quantity of the resistance in lamp area, the quantity that is less than or equal to the lamp pearl.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
Fig. 1 is a schematic of a full roll of rubberized pi (polyimide) film.
Fig. 2, fig. 3 and fig. 4 are schematic plan views of a film with adhesive being punched by a die on a roll-to-roll punching machine to form a window with a plurality of bonding pads.
Fig. 5 is a schematic diagram of a round copper wire being pressed into a flat wire on a wire calender to form a flat wire.
Fig. 6, 7 and 8 are schematic plan views of a flat cable circuit board with a three-layer structure manufactured by the film with adhesive, the film with a plurality of pad windows and the flat wires expressed in the 'fig. 1, 2 and 3' on a wire covering machine.
Fig. 9, 10 and 11 are schematic cross-sectional views of the flat cable wiring board manufactured in the three-layer structure by the wire covering machine shown in "fig. 6, 7 and 8".
Fig. 12, 13 and 14 are schematic cross-sectional views of the flat cable wiring board shown in "fig. 9, 10 and 11" to which a layer of heat-dissipating aluminum foil is attached.
Fig. 15, 16 and 17 are schematic plan views of the LED strip lamp manufactured on the flat cable wiring board shown in "fig. 12, 13 and 14".
Fig. 18, 19 and 20 are schematic cross-sectional views of the LED strip lamp manufactured on the flat cable wiring board shown in "fig. 15, 16 and 17".
Fig. 21, 22 and 23 are schematic plan views of a two-layer long flat cable manufactured by feeding a tape-coated film and flat wires together into a wire-coating machine on the wire-coating machine.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Detailed description of the preferred embodiment
1. Manufacturing a film with glue:
two rolls of pi (polyimide) film of 0.025mm were used to apply glue on a coater to prepare the film 1 with glue.
2. Manufacturing a film with a plurality of bonding pad windows:
one roll of the produced film with glue is punched with a die on a roll-to-roll punching machine to produce a film 2 with a plurality of pad windows 2.1.
3. Manufacturing a flat wire:
and pressing the round copper wire into a flat wire on a wire calender to prepare the flat wire 5.
4. Manufacturing a flat cable circuit board:
the method comprises the steps of enabling a film 1 with adhesive, a film 2 with a plurality of pad windows 2.1 and flat wires 5 to enter a wire covering machine together on the wire covering machine, enabling the film 1 with adhesive and the film 2 with the plurality of pad windows 2.1 to clamp the flat wires 5 in the middle, simultaneously enabling the flat wires to enter a rolling section of the wire covering machine for pressing, enabling the flat wires to be arranged in parallel and clamped in the middle after pressing at the temperature of 130 ℃ and under the pressure of 0.2mpa to form a three-layer structure which is firmly adhered to each other, enabling the flat wires 5 to expose out of the film 2 windows 2.1 to form pads to be manufactured into a circuit board 6 (shown in a figure 6, a figure 7, a figure 8, a figure 10 and a figure 11), then covering and adhering a layer of aluminum foil 12.1 (shown in a figure 12, a figure 13 and a figure 14) on the back face (the face without the pad of the wire board to be opened to manufacture a circuit board 7, and placing the circuit board 7 in an oven to be heated for 60 minutes at the temperature of 150 ℃ to enable the adhesive to be solidified.
5. Making OSP:
the flat cable circuit board 7 is arranged on an OSP production line, so that a layer of soldering flux for preventing copper oxidation is attached to the surface of the copper pad.
6. Manufacturing the lamp strip:
the resistor 15.1 and the LED15.2 are soldered to the flat cable 7 by SMT process to produce a flat cable LED strip (fig. 15, fig. 16, fig. 17, fig. 18, fig. 19, fig. 20).
Remarking:
1. the flat cable with 3 wires is designed by the manufacturing process, and the manufactured lamp strip meets the requirement of the lamp strip according to claim 1.
2. The flat cable with 4 wires is designed by the manufacturing process, and the manufactured lamp strip is the lamp strip meeting the requirement of claim 2.
3. The manufacturing process is used for designing the flat cable with 5 wires, and the manufactured lamp strip is the lamp strip meeting the requirement of claim 3.
Detailed description of the invention
1. Manufacturing the film with the adhesive:
the adhesive-coated film 1 was formed by coating a roll of 0.025mm pi (polyimide) film on a coater.
2. Manufacturing a flat wire:
and pressing the round copper wire into a flat wire on a wire calender to prepare the flat wire 5.
3. Manufacturing a long flat cable:
the adhesive film and the flat wires are fed into a wire covering machine on the wire covering machine, the adhesive film 1 and the flat wires 5 are fed into a rolling section of the wire covering machine for pressing at the same time, and after pressing at the temperature of 130 ℃ and under the pressure of 0.2mpa, the adhesive film and the flat wires are mutually and firmly adhered to form a two-layer structure (shown in figures 21, 22 and 23).
4. Manufacturing a flat cable circuit board:
printing solder resist ink on one side of a long flat wire 5 with a two-layer structure by using a roll-to-roll printing machine with an oven to prepare a flat wire circuit board 6 (shown in a figure 6, a figure 7, a figure 8, a figure 9, a figure 10 and a figure 11), drying the ink at 160 ℃ for 30 minutes, then covering and coating a layer of aluminum foil 12.1 (shown in a figure 12, a figure 13 and a figure 14) on the back side (the side without a windowing welding pad) of the circuit board to prepare the circuit board 7, and placing the circuit board in the oven to heat at 150 ℃ for 60 minutes to solidify the glue.
5. Making OSP:
the flat cable circuit board 7 is arranged on an OSP production line, so that a layer of soldering flux for preventing copper oxidation is attached to the surface of the copper pad.
6. Manufacturing the lamp strip:
the resistor 15.1 and the LED15.2 are soldered on the flat cable circuit board 7 by an SMT process to form a flat cable LED strip (fig. 15, fig. 16, fig. 17, fig. 18, fig. 19 and fig. 20).
Remarking:
1. the flat cable with 3 wires is designed by the manufacturing process, and the manufactured lamp strip meets the requirement of the lamp strip according to claim 1.
2. The flat cable with 4 wires is designed by the manufacturing process, and the manufactured lamp strip is the lamp strip meeting the requirement of claim 2.
4. The flat cable with 5 wires is designed by the manufacturing process, and the manufactured lamp strip meets the requirement of claim 3.
The present invention has been described in detail with reference to the accompanying drawings, which illustrate specific embodiments of a LED strip that can be mounted with a multi-directional turn. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims (10)

1. A LED lamp strip made of flat cables comprises:
the bottom layer is a film layer with glue;
at least 3 flat wires are arranged in the middle;
the upper layer is a film layer or an ink layer with glue;
an LED and a resistor welded on the flat wire;
the flat cable is characterized in that the flat cable is formed by arranging at least 3 flat wires in parallel or nearly in parallel and adhering the flat wires to a film layer with glue at the bottom layer; the upper layer is a film layer with glue, a plurality of pad windows are formed in the film layer with the glue, and the film layer with the glue is stuck on the flat lead; or the upper layer is an ink layer, the ink layer is provided with a plurality of bonding pad windows, the ink layer is combined on the flat conducting wire, the resistors and the LEDs are welded on the bonding pads at the bonding pad windows, the resistors are connected in parallel, the LEDs are connected in parallel, the resistors formed after the resistors are connected in parallel, the LEDs formed after the resistors are connected in parallel, the two parallel groups are connected in series, and the LED lamp strip manufactured by the flat cable can be used after being cut and separated at any positions without LEDs or resistance devices.
2. A LED lamp strip made of flat cables comprises:
a film layer with glue at the bottom layer;
at least 4 flat wires are arranged in the middle;
a film layer or an ink layer with glue on the upper layer;
an LED and a resistor welded on the flat wire;
the flat cable is characterized in that at least 4 flat wires are arranged in parallel or nearly in parallel and are adhered to a film layer with glue at the bottom layer to form the flat cable; the upper layer is a film layer with glue, a plurality of pad windows are formed in the film layer with the glue, and the film layer with the glue is stuck on the flat lead; or the upper layer is an ink layer, the ink layer is provided with a plurality of pad windows, the ink layer is combined on the flat conducting wire, the resistors and the LEDs are welded on the flat conducting wire provided with the pad windows, the resistors are connected in parallel, the LEDs are divided into two groups, each group is connected in parallel, the resistors connected in parallel are connected in parallel, the two groups of LEDs connected in parallel are connected in parallel with the LEDs, the three groups are connected in parallel and connected in series, and the LED lamp strip manufactured by the flat cable can be used after being cut and separated at any position without the LEDs and without the resistor devices.
3. A LED lamp strip made of flat cables comprises:
the bottom layer is a film layer with glue;
at least 5 flat wires are arranged in the middle;
the upper layer is a film layer or an ink layer with glue;
an LED and a resistor welded on the flat wire;
the flat cable is characterized in that at least 5 flat wires are arranged in parallel or nearly in parallel and are adhered to a film layer with glue at the bottom layer to form the flat cable; the upper layer is a film layer with glue, a plurality of pad windows are formed in the film layer with the glue, and the film layer with the glue is stuck on the flat lead; or the upper layer is an ink layer, the ink layer is provided with a plurality of pad windows, the ink layer is combined on the flat conducting wire, the resistors and the LEDs are welded on the flat conducting wire provided with the pad windows, the resistors are connected in parallel, the LEDs are divided into 3 groups, each group of LEDs are connected in parallel, the resistors connected in parallel are connected in parallel, the 3 groups of LEDs connected in parallel are connected in parallel with the LEDs, the four groups are connected in series, and the LED lamp strip manufactured by the flat cable can be used after being cut and separated at any position without the LEDs and resistance devices.
4. The LED strip made of flat cables as claimed in claim 1, 2 or 3, wherein the LEDs are LED beads packaged on a support.
5. The flat cable LED strip according to claim 1, 2 or 3, wherein the LEDs are flip-chip LED chips or LED CSP devices.
6. The flat cable LED strip according to claim 1, 2 or 3, wherein the flat conductive wire is a flat conductive wire formed by twisting a plurality of wires together, or a flat conductive wire formed by a single wire.
7. A LED strip made of flat wires according to claim 1, 2 or 3, wherein the flat wires are copper wires or copper-clad aluminum wires or tin-clad copper wires or copper-clad aluminum wires or copper-clad steel wires.
8. A LED strip with a flat cable according to claim 1, 2 or 3, wherein a layer of aluminum foil is adhered to the back of the strip to improve the heat dissipation of the strip.
9. A flat cable LED strip as claimed in claim 1, 2 or 3, wherein the number of resistors on the strip is greater than the number of beads.
10. A flat cable LED strip as claimed in claim 1, 2 or 3, wherein the number of resistors on the strip is less than or equal to the number of beads.
CN202123113027.6U 2021-12-08 2021-12-08 LED lamp area of winding displacement preparation Active CN217816310U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123113027.6U CN217816310U (en) 2021-12-08 2021-12-08 LED lamp area of winding displacement preparation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123113027.6U CN217816310U (en) 2021-12-08 2021-12-08 LED lamp area of winding displacement preparation

Publications (1)

Publication Number Publication Date
CN217816310U true CN217816310U (en) 2022-11-15

Family

ID=83958601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123113027.6U Active CN217816310U (en) 2021-12-08 2021-12-08 LED lamp area of winding displacement preparation

Country Status (1)

Country Link
CN (1) CN217816310U (en)

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