CN112040634A - Manufacturing process of embedded copper block circuit board - Google Patents
Manufacturing process of embedded copper block circuit board Download PDFInfo
- Publication number
- CN112040634A CN112040634A CN202010897331.5A CN202010897331A CN112040634A CN 112040634 A CN112040634 A CN 112040634A CN 202010897331 A CN202010897331 A CN 202010897331A CN 112040634 A CN112040634 A CN 112040634A
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- Prior art keywords
- board
- copper
- blind groove
- protective film
- copper block
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing process of an embedded copper block circuit board, which comprises the following steps: after cutting the core board, the copper foil and the PP, sticking a protective film on the position of a blind groove corresponding to the copper block on one PP; then, sequentially overlapping the core board and the copper foil through PP (polypropylene) and pressing the core board and the copper foil into a sub-board, wherein one surface of the PP, which is pasted with the protective film, is contacted with the core board; firstly, manufacturing an inner layer circuit on the daughter board, then, inwards deeply cutting and uncovering the position, corresponding to the protective film, on the daughter board to form a blind groove, wherein the bottom of the blind groove is the surface of the inner layer central core plate; placing a copper block in the blind groove, laminating the daughter board and the single-sided copper-clad board, and pressing to form a production board, wherein the dielectric layer on the single-sided copper-clad board is in contact with the daughter board, and windowing is performed on the single-sided copper-clad board at a position corresponding to the blind groove before lamination; and then sequentially carrying out post-processes on the production board to obtain the embedded copper block circuit board. According to the invention, the protective film is pasted on the PP, so that the problems of insufficient glue filling, cavities, cracks, layering and the like in the pressing process are solved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing process of an embedded copper block circuit board.
Background
With the continuous miniaturization of electronic products, the volume of a Printed Circuit Board (PCB) is required to be continuously reduced, and the circuit design is more and more intensive; the power density of the components is improved, and the heat dissipation capacity of the PCB is overlarge, so that the problems of short service life of the components, aging, even failure of the components and the like are caused; an explosion event of a certain known mobile phone battery is a typical example, so that designers and manufacturers are more vigilant in terms of heat dissipation; this event again demonstrates the desirability of improving thermal management of electronic products.
With the rapid development of the fields of new-generation information technology, energy-saving and new-energy automobiles, electric equipment and the like, the problem of heat dissipation is urgently solved; at present, there are many ways to solve the heat dissipation problem of the PCB, such as dense heat dissipation hole design, thick copper foil circuit, metal-based (core) plate structure, embedded copper block design, copper-based boss design, high heat conduction material, etc., and directly embedding the metal copper block in the PCB is one of the effective ways to solve the heat dissipation problem.
The design of the copper block embedding plate mainly comprises two types of copper block embedding penetrating type and copper block semi-embedding type: the thickness of the embedded copper block is smaller than the total thickness of the plate, one surface of the copper block is flush with the bottom layer or the top layer, and the other surface of the copper block is flush with one surface of the inner layer; to this copper billet semi-buried type, during the pressfitting, need to ensure that the roughness control of copper billet and board is within 0.075mm, therefore how to guarantee the roughness between copper billet and the board is the difficult point of preparation, because the roughness is not enough, can have certain difference in height between copper billet and the board, leads to the not enough, the cavity of junction underfill of copper billet and board easily, crackle, layering scheduling problem.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a manufacturing process of an embedded copper block circuit board, which is characterized in that a protective film is adhered on PP (polypropylene) adjacent to an inner core plate, so that the bottom of a blind groove is the surface of the core plate, the flatness between a copper block and a plate can be controlled within +/-0.075 mm, and the problems of insufficient glue filling, cavities, cracks, layering and the like caused by height difference during pressing are solved.
In order to solve the technical problem, the invention provides a manufacturing process of an embedded copper block circuit board, wherein a blind groove for accommodating a copper block is arranged on one surface of the embedded copper block circuit board, and the manufacturing process comprises the following steps:
s1, cutting a core plate, a copper foil and a PP according to the size of a spliced plate, and pasting a protective film on one PP at a position corresponding to the blind groove;
s2, sequentially overlapping the core board and the copper foil through PP according to requirements, and pressing into a sub-board, wherein one surface of the PP, which is adhered with the protective film, is contacted with the core board;
s3, firstly, manufacturing an inner layer circuit on the daughter board, then, inwards performing depth control cutting at the position, corresponding to the protective film, on the daughter board, and uncovering to form the blind groove, wherein the protective film is removed when the cover is uncovered, and the bottom of the blind groove is the surface of the inner layer central core board;
s4, placing a copper block in the blind groove, then laminating the daughter board and the single-sided copper-clad board in sequence according to requirements, pressing the laminated board into a production board, contacting the medium layer on the single-sided copper-clad board with the daughter board, windowing the single-sided copper-clad board at a position corresponding to the blind groove before pressing, and exposing the copper block after pressing;
s5, sequentially carrying out outer layer circuit manufacturing, solder mask manufacturing, surface treatment and molding on the production board to obtain the embedded copper block circuit board;
further, in step S2, before lamination, inner layer circuits are fabricated on the core board.
Further, in step S2, before pressing, rivet holes are drilled in corresponding positions of the core plate and the PP, respectively.
Further, in step S3, when the surface of the core board at the bottom of the blind groove is a copper surface, the blind groove is formed by performing laser cutting to control depth inwards at a position corresponding to the protective film on the daughter board and uncovering.
Further, in step S3, when the surface of the core board at the bottom of the blind groove is a copper-free surface, the blind groove is formed by performing depth-controlled cutting inwards at a position corresponding to the protective film on the daughter board in a depth-controlled milling manner and uncovering.
Further, in step S4, the size of the copper block is 75 to 100 μm smaller than the size of the blind via on one side.
Further, the following steps are included between steps S3 and S4:
and S31, laminating the copper foil and the PP together in a rapid laminating mode to form the single-sided copper-clad plate.
Further, in step S31, the parameters of the rapid press fit are: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 1-2 min.
Further, in step S4, the size of the window is 0.05 to 0.1mm larger than the size of the copper-embedded block.
Further, in step S1, the size of the protective film is 0.1 to 0.2mm smaller than the size of the blind groove.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the protective film is adhered to the PP adjacent to the inner core plate, so that the PP is not adhered to the core plate due to the protective film when the core plate and the PP are pressed together, on one hand, the core plate can be conveniently uncovered after later cutting, and on the other hand, the waste material and the protective film can be removed together when the core plate is uncovered, so that the surface of the core plate is used as the bottom of the blind groove, and the surface of the core plate is not provided with the adhered PP medium layer, so that the flatness of the core plate can be ensured, the flatness between the copper block and the plate can be controlled within +/-0.075 mm, and the problems of insufficient glue filling, cavities, cracks, layering and the like caused by height difference during pressing are solved; in addition, the size difference between the blind groove and the copper block is strictly controlled, so that sufficient glue filling during pressing can be ensured, the pressing quality is improved, and the too large or too small size difference between the blind groove and the copper block easily causes the copper block to be too loose or too tight after being placed in the blind groove, so that the glue filling quality and the bonding force during pressing are influenced.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The embodiment provides a manufacturing process of an embedded copper block circuit board, wherein a blind groove for accommodating a copper block is formed in one surface of the embedded copper block circuit board, and the specific process is as follows:
(1) cutting: a core plate, PP and copper foil are cut according to the size of a jointed board of 467mm multiplied by 620mm, the thickness of the core plate is 2mm (the thickness is the thickness without the outer layer copper foil), and the thickness of the outer layer copper foil is 0.5 oz.
(2) And pasting a protective film: and (3) pasting a protective film on one piece of PP at a position corresponding to the blind groove to be manufactured, wherein the size of the protective film is 0.1-0.2mm smaller than that of the blind groove, so that the protective film is prevented from being ablated when the cover is opened by later-stage forming cutting in a laser cutting mode, and further, the flatness of the bottom of the blind groove and the operation of opening the cover are prevented from being influenced.
(3) And inner layer circuit manufacturing (negative film process): transferring inner layer pattern, coating photosensitive film with vertical coating machine, controlling film thickness of the photosensitive film to 8 μm, and completing inner layer circuit exposure on the core board with 5-6 exposure rulers (21 exposure rulers) by using full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(4) And OPE punching: and punching a rivet hole for pressing at a corresponding position of the core plate PP.
(5) And one-time pressing: the manufacturing method comprises the steps of sequentially superposing a copper foil, PP, a core plate, PP and the copper foil to form a laminated plate, riveting the laminated plate through a rivet hole by using a rivet, and pressing the laminated plate into a sub-plate, wherein one surface of the PP, which is pasted with a protective film, is contacted with the core plate.
(6) And inner layer circuit manufacturing (negative film process): transferring inner layer pattern, coating photosensitive film with vertical coating machine, controlling film thickness of the photosensitive film to 8 μm, and completing inner layer circuit exposure on the daughter board with 5-6 exposure rulers (21 exposure rulers) by using full-automatic exposure machine; etching the inner layer, etching the exposed and developed daughter board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(7) And cutting: and the position of the daughter board corresponding to the protective film is positioned at the outer side of the protective film, the outer side of the daughter board is subjected to inward depth control cutting, the blind groove used for containing the copper block is formed after the cover is removed, the protective film is removed together when the cover is removed to remove waste materials, and the bottom of the blind groove is the surface of the inner-layer core board.
In the above, when the surface of the core board at the bottom of the blind groove is a copper surface, that is, the inner layer circuit manufactured on the core board includes the copper surface corresponding to the blind groove, the blind groove is formed by inwards depth-controlled cutting and uncovering at the position corresponding to the protective film on the daughter board in a laser cutting manner, so that the copper surface at the bottom of the blind groove is prevented from being damaged due to processing errors in a depth-controlled milling manner, and the manufacturing quality is improved; when the surface of the core plate at the bottom of the blind groove is copper-free, namely the inner layer circuit manufactured on the core plate does not have a copper surface corresponding to the blind groove, the blind groove is formed after the inner layer circuit is inwards deeply cut at the position corresponding to the protective film on the daughter board in a depth control milling mode and the cover is uncovered, the protective film is prevented from being ablated due to processing errors in a laser cutting mode, and the cover is conveniently uncovered and the flatness of the bottom of the blind groove is improved.
(8) And secondary pressing: laminating the copper foil and the PP together in a quick laminating mode to form a single-sided copper-clad plate, wherein the parameters of the quick laminating are as follows: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 1-2 min.
(9) And windowing: and windowing at the position, corresponding to the blind groove, on the single-sided copper-clad plate, wherein the single side of the window is 0.05-0.1mm larger than the buried copper block, so that the copper block can conveniently pass through the window upwards.
(10) And brown oxidation: through a chemical reaction mode, a brown oxide layer is generated on the surfaces of the copper layers of the daughter board and the copper block, so that the roughness of the copper surface is increased, and the bonding force with PP during pressing is enhanced.
(11) And pressing for three times: placing a copper block in a blind groove on a daughter board, then laminating the single-sided copper-clad board, the daughter board and the single-sided copper-clad board in sequence and pressing the laminated products into a production board, wherein a PP medium layer on the single-sided copper-clad board is contacted with the daughter board, a window on the single-sided copper-clad board is vertically corresponding to the blind groove, the copper block is exposed from the window after pressing, and the top surface of the copper block after pressing is flush with the board surface of the production board or slightly lower than the board surface of the production board; the size of the copper block is 75-100 μm smaller than that of the blind groove on one side, so that the copper block can be conveniently placed in the blind groove, and the glue filling quality during pressure sealing can be ensured.
(12) And outer layer drilling: and drilling holes on the production plate by using a mechanical drilling mode according to the drilling data.
(13) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.
(14) And electroplating the whole plate: according to the mechanism of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the hole copper is ensured to meet the product requirement, and electroplating parameters are set according to the thickness of the finished hole copper.
(15) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(16) Solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the production plate and silk-printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process.
(17) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(18) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(19) And forming: according to the prior art and according to the design requirement, the shape is gong, and the tolerance of the shape is +/-0.05 mm; and manufacturing the embedded copper block circuit board.
(20) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the embedded copper block circuit board is inspected, and if a defect exists, the embedded copper block circuit board is repaired in time, so that excellent quality control is guaranteed to be provided for the customer.
(21) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the embedded copper block circuit board meet the requirements of customers or not.
(22) And packaging: and hermetically packaging the embedded copper block circuit boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing process of an embedded copper block circuit board is provided, wherein a blind groove used for accommodating a copper block is arranged on one surface of the embedded copper block circuit board, and the manufacturing process is characterized by comprising the following steps:
s1, cutting a core plate, a copper foil and a PP according to the size of a spliced plate, and pasting a protective film on one PP at a position corresponding to the blind groove;
s2, sequentially overlapping the core board and the copper foil through PP according to requirements, and pressing into a sub-board, wherein one surface of the PP, which is adhered with the protective film, is contacted with the core board;
s3, firstly, manufacturing an inner layer circuit on the daughter board, then, inwards performing depth control cutting at the position, corresponding to the protective film, on the daughter board, and uncovering to form the blind groove, wherein the protective film is removed when the cover is uncovered, and the bottom of the blind groove is the surface of the inner layer central core board;
s4, placing a copper block in the blind groove, then laminating the daughter board and the single-sided copper-clad board in sequence according to requirements, pressing the laminated board into a production board, contacting the medium layer on the single-sided copper-clad board with the daughter board, windowing the single-sided copper-clad board at a position corresponding to the blind groove before pressing, and exposing the copper block after pressing;
and S5, sequentially carrying out outer layer circuit manufacturing, solder mask manufacturing, surface treatment and molding on the production board to obtain the embedded copper block circuit board.
2. The process of claim 1, wherein in step S2, the inner layer circuit is formed on the core board before the pressing.
3. The process of claim 2, wherein in step S2, rivet holes are drilled in the corresponding positions of the core board and the PP before pressing.
4. The process of claim 1, wherein in step S3, when the surface of the core board at the bottom of the blind groove is a copper surface, the blind groove is formed by laser cutting at a position corresponding to the protective film on the daughter board and then removing the cover.
5. The process of claim 1, wherein in step S3, when the surface of the core board at the bottom of the blind groove is a copper-free surface, the blind groove is formed by performing depth-controlled cutting inward at a position corresponding to the protective film on the daughter board by a depth-controlled milling method and uncovering.
6. The process of claim 1, wherein in step S4, the size of the copper block is 75-100 μm smaller than the size of the blind via on one side.
7. The process of claim 1, further comprising the following steps between steps S3 and S4:
and S31, laminating the copper foil and the PP together in a rapid laminating mode to form the single-sided copper-clad plate.
8. The process of claim 7, wherein in step S31, the parameters of the rapid press fit are: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 1-2 min.
9. The process of claim 1, wherein in step S4, the one side of the window is 0.05-0.1mm larger than the buried copper block.
10. The process of claim 1, wherein in step S1, the size of the protection film is 0.1-0.2mm smaller than the size of the blind via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010897331.5A CN112040634A (en) | 2020-08-31 | 2020-08-31 | Manufacturing process of embedded copper block circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010897331.5A CN112040634A (en) | 2020-08-31 | 2020-08-31 | Manufacturing process of embedded copper block circuit board |
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| CN112040634A true CN112040634A (en) | 2020-12-04 |
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| CN202010897331.5A Pending CN112040634A (en) | 2020-08-31 | 2020-08-31 | Manufacturing process of embedded copper block circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194635A (en) * | 2021-03-15 | 2021-07-30 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| CN113677108A (en) * | 2021-08-16 | 2021-11-19 | 上海美维电子有限公司 | Manufacturing method of embedded copper block |
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| JPH08236886A (en) * | 1995-02-23 | 1996-09-13 | Fuji Electric Co Ltd | Metal base copper-clad laminate |
| CN206923133U (en) * | 2017-06-06 | 2018-01-23 | 鹤山市众一电路有限公司 | New PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113194635A (en) * | 2021-03-15 | 2021-07-30 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| CN113194635B (en) * | 2021-03-15 | 2023-05-26 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| CN113677108A (en) * | 2021-08-16 | 2021-11-19 | 上海美维电子有限公司 | Manufacturing method of embedded copper block |
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Application publication date: 20201204 |