CN113573475A - Rigid-flex board and manufacturing method thereof - Google Patents
Rigid-flex board and manufacturing method thereof Download PDFInfo
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- CN113573475A CN113573475A CN202110850888.8A CN202110850888A CN113573475A CN 113573475 A CN113573475 A CN 113573475A CN 202110850888 A CN202110850888 A CN 202110850888A CN 113573475 A CN113573475 A CN 113573475A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Microelectronics & Electronic Packaging (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a rigid-flex board and a manufacturing method thereof. The soft and hard combination board comprises a soft board, a first bonding sheet and a first hard board which are sequentially laminated and pressed; the soft board comprises a soft area and a soft and hard combination area; the soft area comprises an original soft area and an extended soft area; the soft and hard combining area comprises a first combining area and a second combining area, the first combining area is connected to two sides of the flexible area in the width direction, and the second combining area is positioned on two sides of the flexible area in the length direction, is separated from the flexible area and is connected with the first combining area on the same side; the expansion soft area and the first bonding sheet are separated through the isolation layer, and the isolation layer can be separated from the expansion soft area when the expansion soft area is bent; the first hard sheet and the first adhesive sheet each have a windowed area that is consistent with both the location and size of the original flexible zone. The invention adds the extended flexible area on the basis of the conventional original flexible area, enlarges the whole width of the flexible area and increases the unidirectional bending radius of the flexible area.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a rigid-flex Board and a manufacturing method thereof.
Background
The rigid-flex Board is formed by combining a Flexible Circuit Board and a rigid Circuit Board through processes such as pressing and the like, and the Circuit Board simultaneously has the characteristics of a Flexible Printed Circuit (FPC) and a Printed Circuit Board (PCB); the soft and hard combined plate has a certain rigid area and a certain flexible area, and the flexible area can be bent, so that the soft and hard combined plate has great advantages in the aspects of saving the internal space of a product, reducing the volume of a finished product, improving the performance of the product and the like.
However, the structure of the existing rigid-flex board is shown in fig. 1, and the manufacturing method thereof is generally: the method comprises the steps of firstly routing off the part, corresponding to the soft area 11 of the soft board 1, of the hard board, windowing the bonding sheet, then pressing the soft board 1, the bonding sheet and the hard board, and then manufacturing an outer-layer circuit on a semi-finished product obtained through pressing.
Limited by the installation space of the product, and based on the structure shown in fig. 1, the width of the soft region 11 that can be designed by engineering personnel is small, so that the bending radius of the soft region 11 is insufficient, and the soft plate 1 is often torn at the position of a soft and hard interface line in the assembling and using process, thereby causing product scrapping.
Disclosure of Invention
The invention aims to provide a soft-hard combined board and a manufacturing method thereof, which solve the problem of product scrapping caused by insufficient bending radius of a soft area in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a soft-hard combined board comprises a soft board, a first bonding sheet and a first hard board which are sequentially laminated and pressed;
the soft board comprises a soft area and a soft and hard combination area which is bonded with the first hard board;
the flexible region comprises an original flexible region and an extended flexible region, and the extended flexible region is connected to at least one side of the original flexible region along the width direction;
the soft and hard combining area comprises a first combining area and a second combining area, the first combining area is connected to two sides of the soft area along the width direction, and the second combining area is positioned on two sides of the extended soft area along the length direction, is separated from the extended soft area and is connected with the first combining area on the same side;
the expansion soft area and the first bonding sheet are separated through an isolation layer, and the isolation layer can be separated from the expansion soft area when the soft area is bent towards a direction away from the first hard board;
the first hard board and the first bonding sheet both have a windowed area, and the position and size of the windowed area are consistent with those of the original soft area.
Optionally, the isolation layer is a single-sided adhesive tape, and an adhesive surface of the single-sided adhesive tape is attached to the first bonding sheet.
Optionally, the isolation layer is double-sided tape, the great viscose surface of double-sided tape's viscosity with the laminating of first bonding sheet, the less viscose surface of double-sided tape's viscosity is in when the softness district is the non-bending state with the laminating of extension softness district, when the softness district is the bending state with extension softness district separation.
Optionally, the adhesive tape further comprises a second hard board and a second adhesive sheet; the second bonding sheets and the second hard boards are alternately laminated on one side of the first hard board, which is far away from the soft board; the positions and the sizes of the windowing areas of the second hard board and the second bonding sheet and the original soft area are consistent.
A manufacturing method of a rigid-flex board comprises the following steps:
providing at least the flexible board, the first bonding sheet, the first rigid board, and the release layer;
sequentially laminating and pressing the plates to enable the first hard plate, the first bonding sheet and the soft plate to be sequentially laminated, and the isolation layer is laminated between the first bonding sheet and the soft area;
removing waste material areas of the flexible board, which are positioned on two sides of the original flexible area along the length direction;
uncovering appointed areas of the first hard board and the first bonding sheet and removing an exposed part of the isolation layer after uncovering, wherein the position of the appointed area is consistent with the preset manufacturing position of the original flexible area, and the size of the appointed area is consistent with the preset manufacturing size of the original flexible area;
and carrying out depth control milling along a preset boundary line between the extension flexible area and the second combination area, so that the extension flexible area and the second combination areas on two sides are separated.
Optionally, the isolation layer stacked between the first bonding sheet and the flexible region includes: the first isolation subarea is consistent with the position of the original soft zone, and the second isolation subarea is consistent with the position of the expanded soft zone;
along the length direction, the first isolation subarea is larger than the single side of the original soft area by a first value, and the second isolation subarea is smaller than the single side of the extended soft area by a second value; the first value is greater than the second value;
the isolation layer is smaller than the flexible region by a second value in a width direction.
Optionally, the isolation layer is a single-sided adhesive tape;
the in-order lamination pressfitting includes:
adhering the adhesive surface of the single-sided adhesive tape to the surface of the first adhesive sheet in advance;
removing the invalid area of the single-sided adhesive tape, and reserving the effective area of the single-sided adhesive tape, wherein the position of the effective area is consistent with that of the soft area;
and sequentially laminating and pressing the first hard board, the first bonding sheet bonded with the single-sided adhesive tape and the soft board.
Optionally, the isolation layer is a double-sided adhesive tape;
the in-order lamination pressfitting includes:
adhering the adhesive surface with higher viscosity of the double-sided adhesive tape to the surface of the first adhesive sheet facing the soft board in advance; or, an adhesive surface of the double-sided adhesive tape with a low viscosity is bonded to the surface of the flexible board facing the first adhesive sheet in advance;
removing the invalid area of the double-sided tape, and reserving the effective area of the double-sided tape, wherein the position of the effective area is consistent with that of the soft area;
and sequentially laminating and pressing the first hard board, the first bonding sheet and the soft board.
Optionally, the method further includes: providing a second hard board and a second bonding sheet, and alternately laminating the second bonding sheet and the second hard board on the side of the first hard board, which faces away from the soft board;
and opening the cover of the appointed areas of the second hard board and the second bonding sheet at the same time of opening the cover of the appointed areas of the first hard board and the first bonding sheet.
Optionally, the width of the extended flexible region is smaller than the width of the original flexible region, and the length of the extended flexible region is equal to the length of the original flexible region.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, the small part of the combined area connected with the original soft area is divided from the original soft and hard combined area, and then the small part of the combined area is separated from other soft and hard combined areas on two sides in the length direction, so that the small part of the combined area is converted into the extended soft area which can be bent together with the original soft area, namely, the extended soft area is added on the basis of the conventional original soft area, the whole width of the soft area is enlarged, the unidirectional bending radius of the soft area is increased, and the risk of tearing the product is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a side view of a conventional rigid-flex board.
Fig. 2 is a side view of a first rigid-flex board according to an embodiment of the present invention.
Fig. 3 is a comparative top view of a flexible board provided by an embodiment of the present invention before and after processing.
Fig. 4 is a side view of a second rigid-flex board according to an embodiment of the present invention.
Fig. 5 is a side view of a third rigid-flex board according to an embodiment of the invention.
Fig. 6 is a flowchart of a method for manufacturing a rigid-flex circuit board according to an embodiment of the present invention.
Fig. 7 is a schematic view of a manufacturing process of the rigid-flex board according to an embodiment of the present invention.
Fig. 8 is a schematic width diagram of an isolation region of an isolation layer according to an embodiment of the invention.
Fig. 9 is a schematic length diagram of an isolation region of an isolation layer according to an embodiment of the invention.
Fig. 10 is a flowchart of a lamination pressing method when the isolation layer is a single-sided tape according to an embodiment of the present invention.
Fig. 11 is a flowchart of a lamination pressing method when the isolation layer is a double-sided tape according to an embodiment of the present invention.
Illustration of the drawings:
the flexible printed circuit board comprises a flexible printed circuit board 1, a first rigid printed circuit board 2, a first bonding sheet 3, a second rigid printed circuit board 4, a second bonding sheet 5, an isolation layer 6, a flexible area 11, a flexible-rigid combination area 12, a waste area 13, a preset edge line 14, an original flexible area 111, an extended flexible area 112, a first combination area 121, a second combination area 122, a first isolation subarea 61 and a second isolation subarea 62.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the problem that the product is easy to tear in the bending use process due to the limitation of the width design value of the flexible region 11 of the conventional rigid-flexible printed circuit board, the embodiment of the invention provides the rigid-flexible printed circuit board, which can expand the flexible region 11 by using the rigid-flexible printed circuit board 12 and increase the bendable width of the flexible region 11, thereby increasing the bending radius of the product and reducing the probability of the product tearing at the rigid-flexible boundary line position.
Referring to fig. 2 and fig. 3, a rigid-flex board according to an embodiment of the present invention includes: the soft board 1, the first bonding sheet 3 and the first hard board 2 are sequentially laminated and pressed.
The soft board 1 comprises an exposed soft area 11 and a soft and hard combination area 12 for bonding with the first hard board 2. The flexible section 11 includes an original flexible section 111 and an extended flexible section 112, and the extended flexible section 112 is connected to one side of the original flexible section 111 in the width direction. The soft and hard bonding areas 12 include a first bonding area 121 and a second bonding area 122, the first bonding area 121 is connected to two sides of the flexible area 11 along the width direction, and the second bonding area 122 is located on two sides of the flexible extension area 112 along the length direction, is separated from the flexible extension area 112, and is connected to the first bonding area 121 on the same side.
The extended flexible region 112 is separated from the first adhesive sheet 3 by the isolation layer 6, and the isolation layer 6 can be separated from the extended flexible region 112 when the flexible region 11 is bent in a direction away from the first rigid board.
The first hard sheet 2 and the first adhesive sheet 3 each have a windowed area that coincides with the original flexible region 111 in both position and size.
It should be noted that the width direction and the length direction of the present embodiment are located in the same plane perpendicular to the lamination direction, and the width direction and the length direction are perpendicular to each other. Wherein, the width direction refers to: in the structure shown in fig. 1, the soft region 11 is used as a boundary, and the soft-hard combining region 12 on one side points to the soft-hard combining region 12 on the other side; therefore, the width of the soft region 11 in the width direction determines the bending radius.
It can be understood that the rigid-flexible printed circuit board according to the embodiment of the present invention can be bent in two directions, and when the flexible region 11 is bent in a direction away from the first rigid board 2, the bendable width of the flexible region 11 is the sum of the widths of the original flexible region 111 and the extended flexible region 112; when the flexible region 11 is bent in a direction toward the first hard board 2, the bendable width of the flexible region 11 is the width of the original flexible region 111.
Compared with the conventional rigid-flexible printed circuit board shown in fig. 1, the flexible area 11 provided by the rigid-flexible printed circuit board according to the embodiment of the present invention is provided with the extended flexible area 112 on the basis of the conventional original flexible area 111, so as to expand the overall width of the flexible area 11, and meanwhile, since one side of the flexible area 11 is not shielded by the rigid board and the other side is shielded by a part of the rigid board, the unidirectional bending radius of the flexible area 11 in the bending direction is increased for the bending direction of the flexible area 11 in the direction away from the first rigid board 2, thereby reducing the risk of tearing of the product.
In addition, the embodiment of the present invention adopts a relatively novel soft region extension manner, which specifically includes: a small part of the bonding area connected to the original flexible area 111 is divided from the original flexible area 12, and then the small part of the bonding area is separated from the other flexible areas 12 (i.e., the second bonding areas 122) on both sides in the length direction, and simultaneously the small part of the bonding area is separated from the first bonding sheet 3 at the bottom through the isolation layer 6, so that the small part of the bonding area is converted into an extended flexible area 112 which can be bent together with the original flexible area 111.
Based on the novel soft region expansion manner, compared with the conventional rigid-flex circuit shown in fig. 1, when the rigid-flex circuit of the embodiment of the invention is manufactured, only an isolation layer 6 matched with the expansion soft region 112 needs to be added to other components outside the flexible circuit 1, and the position, the size and the like of the uncapped region of the rigid circuit do not need to be adjusted. Therefore, under the same manufacturing conditions, the embodiment of the invention can simply and effectively increase the bending radius of the flexible region 11 without increasing other costs.
Referring to fig. 4, another rigid-flex board according to an embodiment of the present invention is different from the structure shown in fig. 2 in that: an extended flexible region 112 is connected to each of both sides of the original flexible region 111 in the width direction. The other structures are the same as those in fig. 2, and are not described again here.
At this time, the overall width of the flexible region 11 is the sum of the widths of the original flexible region 111 and the two extended flexible regions 112, thereby further increasing the unidirectional bending width of the flexible region 11.
Referring to fig. 5, another rigid-flex board according to an embodiment of the present invention is different from the structure shown in fig. 2 in that: further comprises a second hard board 4 and a second bonding sheet 5; the second bonding sheets 5 and the second hard boards 4 are alternately laminated on one side of the first hard board 2, which is far away from the soft board 1; the positions and sizes of the windowed areas of the second hard sheet 4 and the second adhesive sheet 5 are consistent with those of the original flexible area 111.
Compared with the structure shown in fig. 2, the rigid-flex board has the advantages that the number of rigid boards is increased, and the rigid-flex board can be selected according to actual design requirements in practical application.
Referring to fig. 6 and 7, in order to manufacture the rigid-flex board, an embodiment of the present invention further provides a method for manufacturing a rigid-flex board, including:
The flexible printed circuit board 1 to be manufactured includes a flexible region 11 and a rigid-flexible bonding region 12 connected to each other, the flexible region 11 includes an original flexible region 111 and an extended flexible region 112, and the extended flexible region 112 is connected to at least one side of the original flexible region 111 along a width direction.
In this step, design information of each part of the flexible printed circuit board 1, including a preset manufacturing position, a preset manufacturing size, and the like, needs to be determined.
And 102, sequentially laminating and pressing the plates to enable the first hard plate 2, the first bonding sheet 3 and the soft plate 1 to be sequentially laminated, and the isolation layer 6 to be laminated between the first bonding sheet 3 and the soft area 11 of the soft plate 1.
And 103, removing the waste material areas 13 of the flexible printed circuit board 1 on two sides of the original flexible area 111 along the length direction.
And 104, uncovering the designated areas of the first hard board 2 and the first bonding sheet 3 and removing the exposed parts of the isolation layer 6 after uncovering, wherein the position of the designated areas is consistent with the preset manufacturing position of the original flexible area 111, and the size of the designated areas is consistent with the preset manufacturing size of the original flexible area 111.
After the expanded flexible region 112 is separated from the second bonding region 122 of the soft and hard bonding region 12, the expanded flexible region 112 is only connected to the first bonding region 121 and the original flexible region 111 of the soft and hard bonding region 12 at two sides of the width direction, and the expanded flexible region 112 is not bonded to the first hard board 2 at the bottom layer because the inner layer of the expanded flexible region 112 is isolated from the first bonding sheet by the isolation layer 6, so that the expanded flexible region 112 can get rid of the pinning of the soft and hard bonding region 12 at the same layer and the first hard board 2 at the bottom layer and can be bent simultaneously with the original flexible region 111.
Since the depth of the depth control milling of the soft region 11 is small, it is preferable to use a laser depth control method in order to improve the depth control accuracy.
It should be noted that the execution sequence of each operation step in the manufacturing method according to the embodiment of the present invention is not limited to the above sequence, and the execution sequence of some steps can be flexibly adjusted according to the situation in practical application.
Further, as shown in fig. 8 and 9, in the lamination process, the whole isolation area of the isolation layer 6 stacked between the first adhesive sheet 3 and the flexible region 11 may be divided into: a first isolated partition 61 that is coincident with the original soft region 111 location, and a second isolated partition 62 that is coincident with the extended soft region 112 location.
Along the length direction, the first isolation partition 61 is larger than the single side of the original soft area 111 by a first value, and the second isolation partition 62 is smaller than the single side of the extended soft area 112 by a second value; the first value is greater than the second value; the entire isolation layer 6 is smaller than the entire soft region 11 by a single side by a second value in the width direction.
This is because, the two unilateral sides along the length direction in the extended flexible area 112 are the waste areas 13, which will be milled later, so as to facilitate the subsequent uncovering of the first hard board 2, the second isolation subarea 62 of the isolation layer 6 can be properly enlarged along the length direction, and the difficulty in uncovering caused by the adhesion of the hard board part in the uncovering area to the flexible board 1 is avoided being increased. Meanwhile, in order to prevent the isolation layer 6 from entering the surface of the first hard board 2 to affect the pattern lines thereof, the entire isolation layer 6 is slightly smaller than the entire flexible region 11 in the width direction.
Illustratively, the entire isolation region of the isolation layer 6 in the width direction is 0.2mm smaller than the single edge of the entire flexible region 11, the first isolation partition 61 of the isolation layer 6 in the length direction is 2mm larger than the single edge of the original flexible region 111, and the second isolation partition 62 of the isolation layer 6 in the length direction is 0.2mm smaller than the single edge of the extended flexible region 112.
It should be noted that in the flexible printed circuit board 1 structure shown in fig. 2 and 3, only one side of the original flexible region 111 is provided with the extended flexible region 112, the width of the extended flexible region 112 is smaller than that of the original flexible region 111, and the length of the extended flexible region 112 is equal to that of the original flexible region 111. Based on this, the isolation structure of the isolation layer 6 is as shown in fig. 8 and 9, and the isolation region as a whole exhibits a convex structure. In fact, the present invention does not limit the specific shape and size of the extended flexible region 112 and the original flexible region 111, and can be flexibly designed according to the actual requirement, and at the same time, the isolation region of the isolation layer 6 can be adaptively adjusted.
In one possible embodiment, the isolation layer 6 is a single-sided tape, as shown in fig. 10, and the method of laminating the layers in sequence in step 102 is as follows:
In this step, a single-sided tape having a size equal to that of the first adhesive sheet 3 may be obtained by cutting, and the single-sided tape is attached to the surface of the first adhesive sheet 3, and the first adhesive sheet 3 is used as a carrier, which not only facilitates the graphic fabrication of the single-sided tape, but also facilitates the subsequent lamination and lamination operation.
Specifically, the single-sided adhesive tape can be cut off along the boundary line between the effective area and the ineffective area by laser cutting, and then the ineffective area of the single-sided adhesive tape is torn off.
And 203, sequentially laminating and pressing the first hard board 2, the first bonding sheet 3 bonded with the single-sided adhesive tape and the soft board 1.
In another possible embodiment, the isolation layer 6 is a double-sided tape, as shown in fig. 11, and the method of laminating the boards in sequence in step 102 is as follows:
And step 302, removing the invalid area of the single-sided tape, and keeping the effective area of the single-sided tape, wherein the position of the effective area is consistent with that of the soft area 11.
Of course, in other embodiments, other carriers may be used to carry the isolation layer 6 and process the isolation layer 6 to form a pattern matching with the soft region 11, and when stacking the boards, the isolation layer 6 is transferred between the first bonding sheet 3 and the soft region 11 of the soft board 1, and then pressed.
In addition, the manufacturing method may further include: providing a second hard board 4 and a second bonding sheet 5, and alternately laminating the second bonding sheet 5 and the second hard board 4 on the side of the first hard board 2 away from the soft board 1; the second hard sheet 4 and the designated areas of the second adhesive sheet 5 are uncapped while the designated areas of the first hard sheet 2 are uncapped. Thus, the number of the hard plates can be designed according to actual requirements.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A soft and hard combined board is characterized by comprising a soft board, a first bonding sheet and a first hard board which are sequentially laminated and pressed;
the soft board comprises a soft area and a soft and hard combination area which is bonded with the first hard board;
the flexible region comprises an original flexible region and an extended flexible region, and the extended flexible region is connected to at least one side of the original flexible region along the width direction;
the soft and hard combining area comprises a first combining area and a second combining area, the first combining area is connected to two sides of the soft area along the width direction, and the second combining area is positioned on two sides of the extended soft area along the length direction, is separated from the extended soft area and is connected with the first combining area on the same side;
the expansion soft area and the first bonding sheet are separated through an isolation layer, and the isolation layer can be separated from the expansion soft area when the soft area is bent towards a direction away from the first hard board;
the first hard board and the first bonding sheet both have a windowed area, and the position and size of the windowed area are consistent with those of the original soft area.
2. The rigid-flex board as recited in claim 1, wherein the isolation layer is a single-sided tape, and an adhesive surface of the single-sided tape is attached to the first adhesive sheet.
3. The rigid-flexible printed circuit board as claimed in claim 1, wherein the isolation layer is a double-sided tape, the adhesive surface of the double-sided tape with a relatively high viscosity is attached to the first adhesive sheet, and the adhesive surface of the double-sided tape with a relatively low viscosity is attached to the extended flexible region when the flexible region is in the non-bending state and is separated from the extended flexible region when the flexible region is in the bending state.
4. The rigid-flex board of claim 1, further comprising a second rigid board and a second adhesive sheet; the second bonding sheets and the second hard boards are alternately laminated on one side of the first hard board, which is far away from the soft board; the positions and the sizes of the windowing areas of the second hard board and the second bonding sheet and the original soft area are consistent.
5. A manufacturing method of a rigid-flex board is characterized by comprising the following steps:
providing at least the flexible board, the first bonding sheet, the first rigid board, and the release layer;
sequentially laminating and pressing the plates to enable the first hard plate, the first bonding sheet and the soft plate to be sequentially laminated, and the isolation layer is laminated between the first bonding sheet and the soft area;
removing waste material areas of the flexible board, which are positioned on two sides of the original flexible area along the length direction;
uncovering appointed areas of the first hard board and the first bonding sheet and removing an exposed part of the isolation layer after uncovering, wherein the position of the appointed area is consistent with the preset manufacturing position of the original flexible area, and the size of the appointed area is consistent with the preset manufacturing size of the original flexible area;
and carrying out depth control milling along a preset boundary line between the extension flexible area and the second combination area, so that the extension flexible area and the second combination areas on two sides are separated.
6. The method for manufacturing the rigid-flex board as claimed in claim 5, wherein the isolation layer stacked between the first bonding sheet and the flexible region comprises: the first isolation subarea is consistent with the position of the original soft zone, and the second isolation subarea is consistent with the position of the expanded soft zone;
along the length direction, the first isolation subarea is larger than the single side of the original soft area by a first value, and the second isolation subarea is smaller than the single side of the extended soft area by a second value; the first value is greater than the second value;
the isolation layer is smaller than the flexible region by a second value in a width direction.
7. The manufacturing method of the rigid-flex board as claimed in claim 5, wherein the isolation layer is a single-sided tape;
the in-order lamination pressfitting includes:
adhering the adhesive surface of the single-sided adhesive tape to the surface of the first adhesive sheet in advance;
removing the invalid area of the single-sided adhesive tape, and reserving the effective area of the single-sided adhesive tape, wherein the position of the effective area is consistent with that of the soft area;
and sequentially laminating and pressing the first hard board, the first bonding sheet bonded with the single-sided adhesive tape and the soft board.
8. The manufacturing method of the rigid-flex board as claimed in claim 5, wherein the isolation layer is a double-sided tape;
the in-order lamination pressfitting includes:
adhering the adhesive surface with higher viscosity of the double-sided adhesive tape to the surface of the first adhesive sheet facing the soft board in advance; or, an adhesive surface of the double-sided adhesive tape with a low viscosity is bonded to the surface of the flexible board facing the first adhesive sheet in advance;
removing the invalid area of the double-sided tape, and reserving the effective area of the double-sided tape, wherein the position of the effective area is consistent with that of the soft area;
and sequentially laminating and pressing the first hard board, the first bonding sheet and the soft board.
9. The method for manufacturing a rigid-flex board according to claim 5, further comprising: providing a second hard board and a second bonding sheet, and alternately laminating the second bonding sheet and the second hard board on the side of the first hard board, which faces away from the soft board;
and opening the cover of the appointed areas of the second hard board and the second bonding sheet at the same time of opening the cover of the appointed areas of the first hard board and the first bonding sheet.
10. The method for manufacturing the rigid-flex board as claimed in claim 5, wherein the width of the extended flexible region is smaller than the width of the original flexible region, and the length of the extended flexible region is equal to the length of the original flexible region.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110850888.8A CN113573475B (en) | 2021-07-27 | 2021-07-27 | Rigid-flex board and manufacturing method thereof |
| PCT/CN2021/138232 WO2023005111A1 (en) | 2021-07-27 | 2021-12-15 | Rigid-flex board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110850888.8A CN113573475B (en) | 2021-07-27 | 2021-07-27 | Rigid-flex board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113573475A true CN113573475A (en) | 2021-10-29 |
| CN113573475B CN113573475B (en) | 2022-11-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110850888.8A Active CN113573475B (en) | 2021-07-27 | 2021-07-27 | Rigid-flex board and manufacturing method thereof |
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| CN (1) | CN113573475B (en) |
| WO (1) | WO2023005111A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023005111A1 (en) * | 2021-07-27 | 2023-02-02 | 生益电子股份有限公司 | Rigid-flex board and manufacturing method therefor |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116546727A (en) * | 2023-05-04 | 2023-08-04 | 江西景旺精密电路有限公司 | Semi-rigid-flex product depth-control milling process capable of improving bending capability and depth-control precision |
| CN117686386A (en) * | 2023-12-07 | 2024-03-12 | 郴州功田电子陶瓷技术有限公司 | Method for testing fluidity of bonding sheet |
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| WO2023005111A1 (en) | 2023-02-02 |
| CN113573475B (en) | 2022-11-22 |
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