CN210781501U

CN210781501U - Rigid-flex board with expansion-shrinkage prevention structure

Info

Publication number: CN210781501U
Application number: CN201921307531.XU
Authority: CN
Inventors: 倪兵; 张海峰
Original assignee: Shenzhen Path Technology Co ltd
Current assignee: Shenzhen Path Technology Co ltd
Priority date: 2019-08-13
Filing date: 2019-08-13
Publication date: 2020-06-16
Anticipated expiration: 2029-08-13

Abstract

The utility model discloses a rigid-flexible board with prevent structure that contracts that rises, including at least one deck hose layer and with an at least hard board layer of an at least hose layer laminating, hose layer, hard board layer all include circuit district and non-circuit district, circuit district forms the circuit, in the non-circuit district of hose layer forms the first fretwork metal level that has a plurality of first fretwork regions, in the non-circuit district of hard board layer forms the second fretwork metal level that has a plurality of second fretwork regions, first fretwork metal level with second fretwork metal level position corresponds, the center in first fretwork region and the central dislocation set in second fretwork region. The utility model provides a soft or hard combined plate with prevent structure that contracts that expands, the lamination harmomegathus changes for a short time.

Description

Rigid-flex board with expansion-shrinkage prevention structure

Technical Field

The utility model relates to a rigid-flex board technical field, specifically speaking relates to a rigid-flex board with prevent expanding and contracting structure.

Background

The rigid-flex board has been widely used in consumer electronics, communications, industrial control, etc. products because of its advantages of flexibility, light weight, etc., and has become an important branch of circuit board development.

The flexible board and the hard board need to be pressed in the manufacturing process of the rigid-flexible board, the expansion and shrinkage change of the multilayer (more than 4 layers) rigid-flexible board and the DHI board is large before and after pressing, the problems of interlayer alignment deviation and the like occur, and the yield and the efficiency of subsequent drilling are influenced. FIG. 1 is a diagram illustrating the statistics of the variation of expansion and contraction before and after each step in the manufacturing process of rigid-flex printed circuit boards in the prior art. Wherein the maximum variation of expansion and contraction before and after pressure transmission (i.e. pressing) is 0.0819% -0.0130% ~ 0.0689%.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a rigid-flex board with prevent structure that contracts that rises, the change that contracts that expands after the lamination is little.

The utility model discloses a soft or hard combination board with prevent structure that contracts that rises adopts technical scheme is:

the flexible-rigid combined board with the expansion-contraction prevention structure comprises at least one flexible board layer and at least one rigid board layer attached to the at least one flexible board layer, wherein the flexible board layer and the rigid board layer respectively comprise a circuit area and a non-circuit area, the circuit area forms a circuit, a first hollow metal layer with a plurality of first hollow areas is formed in the non-circuit area of the flexible board layer, a second hollow metal layer with a plurality of second hollow areas is formed in the non-circuit area of the rigid board layer, the first hollow metal layer corresponds to the second hollow metal layer in position, and the center of the first hollow area and the center of the second hollow area are arranged in a staggered mode.

Preferably, when the flexible printed circuit board layer has two or more layers, the non-circuit area corresponding to each layer of flexible printed circuit board layer is formed with a first hollowed-out metal layer having a plurality of first hollowed-out areas, and the centers of the first hollowed-out areas of two adjacent first hollowed-out metal layers are arranged in a staggered manner.

As a preferred scheme, each layer of the first hollowed metal layer comprises a plurality of first wires in a first direction and a plurality of second wires in a second direction, and the first wires and the second wires intersect to form a plurality of first hollowed areas; each layer of the second hollowed metal layer comprises a plurality of third wires in the first direction and a plurality of fourth wires in the second direction, and the third wires and the fourth wires intersect to form a plurality of second hollowed areas.

As a preferred scheme, in each layer of the first hollow metal layer, a plurality of first wires are parallel to each other and are arranged at equal intervals, and a plurality of second wires are parallel to each other and are arranged at equal intervals; in each second hollow metal layer, a plurality of third wires are parallel to each other and are arranged at equal intervals, and a plurality of fourth wires are parallel to each other and are arranged at equal intervals; the line widths of the first routing lines, the second routing lines, the third routing lines and the fourth routing lines are equal, and the distance between two adjacent first routing lines, the distance between two adjacent second routing lines, the distance between two adjacent third routing lines and the distance between two adjacent fourth routing lines are equal.

Preferably, the ratio of the line width of the first wire to the distance between two adjacent first wires is 1: 4.

As a preferred scheme, the line widths of the first wire, the second wire, the third wire and the fourth wire are all 0.1 mm.

As a preferred scheme, the plurality of first hollow-out areas and the plurality of second hollow-out areas are in a diamond shape; in each layer of the first hollow metal layer, the intersection point of the first routing and the second routing is positioned at the center of a first hollow area adjacent to the first hollow metal layer or the center of a second hollow area adjacent to the second hollow metal layer; in each layer of second hollow metal layer, the intersection point of the third wire and the fourth wire is positioned at the center of a second hollow area of an adjacent second hollow metal layer or the center of a first hollow area of an adjacent first hollow metal layer.

Preferably, the first hollow metal layer and the second hollow metal layer are both copper layers.

Preferably, the angle between the first direction and the second direction is 45 °.

As a preferred scheme, when the rigid-flexible printed circuit board is a six-layer board, the non-circuit area of the rigid-flexible printed circuit board comprises a base layer, first hollowed metal layers arranged on two opposite surfaces of the base layer, covering film layers covering the surfaces of the two first hollowed metal layers, adhesive sheet layers adhered to the surfaces of the two covering film layers, two second hollowed metal layers adhered to the two adhesive sheet layers, adhesive sheet layers adhered to the surfaces of the two second hollowed metal layers, and two second hollowed metal layers adhered to the two adhesive sheet layers; the base layer, the first hollowed-out metal layers arranged on two opposite sides of the base layer, the covering film layers covering the surfaces of the two first hollowed-out metal layers form a flexible board layer, the two second hollowed-out metal layers attached to the two bonding sheet layers, the bonding sheet layers attached to the surfaces of the two second hollowed-out metal layers, and the two second hollowed-out metal layers attached to the two bonding sheet layers form a hard board layer.

The utility model discloses a soft or hard combination board with prevent structure that contracts that rises's beneficial effect is: the method comprises the steps that a first hollowed-out metal layer with a plurality of first hollowed-out areas is formed in a non-line area of a soft board layer, a second hollowed-out metal layer with a plurality of second hollowed-out areas is formed in a non-line area of a hard board layer, the center of each first hollowed-out area and the center of each second hollowed-out area are arranged in a staggered mode, the problem of interlayer alignment deviation when a plurality of layers of soft and hard composite boards and a DHI board are laminated is solved, and the expansion and contraction change after lamination is small.

Drawings

FIG. 1 is a statistic of the variation of expansion and contraction before and after each step in the manufacturing process of rigid-flex boards in the prior art.

Fig. 2 is a schematic view of the rigid-flex board with the anti-collapsing structure of the present invention.

Fig. 3 is a schematic diagram of the first hollowed-out metal layer of the rigid-flex board with the anti-collapsing structure of the present invention.

Fig. 4 is a front view of the half-section of the rigid-flex board with the anti-expansion structure of the present invention.

Fig. 5 is a statistic of the expansion and contraction variation values before and after each step in the manufacturing process of the rigid-flex board with the anti-expansion and contraction structure of the present invention.

Detailed Description

The invention will be further elucidated and described with reference to the following embodiments and drawings in which:

referring to fig. 2 and 4, a rigid-flex board with an anti-collapsing structure includes at least one flexible board layer 100 and at least one hard board layer 200 attached to the at least one flexible board layer 100. The flexible board layer 100 and the hard board layer 200 each include a circuit area 300 and a non-circuit area 400, and the circuit area 300 forms a circuit.

Referring to fig. 3 and 4, a first hollow metal layer 10 having a plurality of first hollow areas 11 is formed in the non-circuit area 51 of the flexible board layer 100, a second hollow metal layer 20 having a plurality of second hollow areas is formed in the non-circuit area 51 of the hard board layer 200, the first hollow metal layer 10 corresponds to the second hollow metal layer 20, and the center of the first hollow area 11 and the center of the second hollow area are disposed in a staggered manner, so that significant slippage between layers can be avoided during compression, and the amount of expansion and contraction is effectively reduced.

When the flexible board layer 100 has two or more layers, the non-circuit area 51 corresponding to each layer of flexible board layer 100 is formed with the first hollow metal layer 10 having the plurality of first hollow areas 11, and the centers of the first hollow areas 11 of two adjacent first hollow metal layers 10 are disposed in a staggered manner, so as to further reduce the expansion and contraction amount.

Each layer of the first hollow metal layer 10 includes a plurality of first traces 12 in a first direction and a plurality of second traces 13 in a second direction, and the first traces 12 and the second traces 13 intersect to form a plurality of first hollow areas 11. Each second hollow metal layer 20 includes a plurality of third traces in the first direction and a plurality of fourth traces in the second direction, and the third traces and the fourth traces intersect to form a plurality of second hollow areas.

In each layer of the first hollow metal layer 10, the plurality of first traces 12 are parallel to each other and are arranged at equal intervals, and the plurality of second traces 13 are parallel to each other and are arranged at equal intervals. In each layer of the second hollow metal layer 20, a plurality of third traces are parallel to each other and are arranged at equal intervals, and a plurality of fourth traces are parallel to each other and are arranged at equal intervals.

The line widths of the first traces 12, the second traces 13, the third traces and the fourth traces are equal, and the distance between two adjacent first traces 12, the distance between two adjacent second traces 13, the distance between two adjacent third traces and the distance between two adjacent fourth traces are equal.

The first hollow areas 11 and the second hollow areas are rhombuses with equal areas. In each layer of the first hollow metal layers 10, the intersection point of the first trace 12 and the second trace 13 is located at the center of the first hollow area 11 of the adjacent first hollow metal layer 10 or the center of the second hollow area 11 of the adjacent second hollow metal layer 20. In each layer of the second hollow metal layer 20, the intersection point of the third trace and the fourth trace is located at the center of the second hollow area of the adjacent second hollow metal layer 20 or the center of the first hollow area 11 of the adjacent first hollow metal layer 10.

Specifically, the included angle between the first direction and the second direction is 45 °. The ratio of the line width of the first trace 12 to the distance between two adjacent first traces 12 is 1: 4. The line widths of the first wire 12, the second wire 13, the third wire and the fourth wire are all 0.1 mm.

When the rigid-flex board is a six-layer board, the non-circuit area 51 of the rigid-flex board includes a base layer 30, first hollow metal layers 10 disposed on two opposite sides of the base layer 30, covering film layers 40 covering the surfaces of the two first hollow metal layers 10, adhesive sheet layers 60 adhered to the surfaces of the two covering film layers 40, two second hollow metal layers 20 adhered to the two adhesive sheet layers 60, adhesive sheet layers 60 adhered to the surfaces of the two second hollow metal layers 20, and two second hollow metal layers 20 adhered to the two adhesive sheet layers 60. Specifically, the base layer 30 is a PI layer, the first hollow metal layer 10 and the second hollow metal layer 20 are copper layers, the cover film layer 40 is a CVL layer, and the adhesive sheet layer 60 is a PP layer.

The base layer 30, the first hollow metal layers 10 disposed on two opposite sides of the base layer 30, and the cover film layers covering the surfaces of the two first hollow metal layers 10 form the flexible board layer 100, the two second hollow metal layers 20 attached to the two adhesive sheet layers 60, the adhesive sheet layer 60 attached to the surfaces of the two second hollow metal layers 20, and the two second hollow metal layers 20 attached to the two adhesive sheet layers 60 form the hard board layer 200.

Referring to fig. 5, the variation of expansion and contraction before and after each step in the manufacturing process of the rigid-flex board of the present invention is calculated, wherein the variation of expansion and contraction before and after pressure transmission (i.e. pressing) is 0.0319% -0.0230% ═ 0.0089%, and the effect is obvious.

The utility model discloses a soft or hard combination board with prevent structure that contracts that rises, form the first fretwork metal level 10 that has a plurality of first fretwork regions 11 in the non-circuit district 51 of soft board layer 100, form the second fretwork metal level 20 that has a plurality of second fretwork regions in the non-circuit district 51 of hard board layer 200, through the center that makes first fretwork region 11 and the central dislocation set of second fretwork region, the problem of counterpoint skew between when having solved multilayer soft or hard composite board and DHI board compression, the harmomegathus change is little after the lamination.

It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A rigid-flexible board with expansion-shrinkage prevention structure comprises at least one flexible board layer and at least one hard board layer attached to the at least one flexible board layer, wherein the flexible board layer and the hard board layer respectively comprise a circuit area and a non-circuit area, the circuit area forms a circuit, and the rigid-flexible board is characterized in that,

and forming a first hollow metal layer with a plurality of first hollow areas in the non-circuit area of the flexible board layer, forming a second hollow metal layer with a plurality of second hollow areas in the non-circuit area of the hard board layer, wherein the first hollow metal layer corresponds to the second hollow metal layer in position, and the center of the first hollow area and the center of the second hollow area are arranged in a staggered manner.

2. The rigid-flex board with an anti-collapsing structure according to claim 1, wherein when the flexible board layer has two or more layers, the non-circuit area corresponding to each layer of flexible board layer has a first hollowed-out metal layer with a plurality of first hollowed-out areas, and the centers of the first hollowed-out areas of two adjacent first hollowed-out metal layers are arranged in a staggered manner.

3. The rigid-flex board with an anti-collapsing structure according to claim 2, wherein each layer of the first hollowed-out metal layer includes a plurality of first traces in a first direction and a plurality of second traces in a second direction, and the first traces and the second traces intersect to form a plurality of first hollowed-out areas;

each layer of the second hollowed metal layer comprises a plurality of third wires in the first direction and a plurality of fourth wires in the second direction, and the third wires and the fourth wires intersect to form a plurality of second hollowed areas.

4. The rigid-flex board with an anti-shrinkage structure according to claim 3, wherein in each first hollowed-out metal layer, a plurality of first traces are parallel to each other and are arranged at equal intervals, and a plurality of second traces are parallel to each other and are arranged at equal intervals; in each second hollow metal layer, a plurality of third wires are parallel to each other and are arranged at equal intervals, and a plurality of fourth wires are parallel to each other and are arranged at equal intervals;

the line widths of the first routing lines, the second routing lines, the third routing lines and the fourth routing lines are equal, and the distance between two adjacent first routing lines, the distance between two adjacent second routing lines, the distance between two adjacent third routing lines and the distance between two adjacent fourth routing lines are equal.

5. The rigid-flex board with the anti-shrinkage structure according to claim 4, wherein the ratio of the line width of the first traces to the distance between two adjacent first traces is 1: 4.

6. The rigid-flex board with the anti-shrinkage structure according to claim 4, wherein the line widths of the first trace, the second trace, the third trace and the fourth trace are all 0.1 mm.

7. The rigid-flex board with the anti-collapsing structure as claimed in any one of claims 1 to 6, wherein the first hollowed-out areas and the second hollowed-out areas are diamond-shaped;

in each layer of the first hollow metal layer, the intersection point of the first routing and the second routing is positioned at the center of a first hollow area adjacent to the first hollow metal layer or the center of a second hollow area adjacent to the second hollow metal layer;

in each layer of second hollow metal layer, the intersection point of the third wire and the fourth wire is positioned at the center of a second hollow area of an adjacent second hollow metal layer or the center of a first hollow area of an adjacent first hollow metal layer.

8. The rigid-flex board with the anti-shrinkage structure according to any one of claims 1 to 6, wherein the first hollowed-out metal layer and the second hollowed-out metal layer are both copper layers.

9. The rigid-flex board with an anti-collapse structure according to any one of claims 3 to 6, wherein the angle between the first direction and the second direction is 45 °.

10. The rigid-flex board with the shrinkage-resistant structure as claimed in any one of claims 1 to 6, wherein when the rigid-flex board is a six-layer board, the non-circuit area of the rigid-flex board comprises a base layer, first hollow metal layers disposed on two opposite sides of the base layer, cover film layers covering the surfaces of the two first hollow metal layers, bonding sheet layers adhered to the surfaces of the two cover film layers, two second hollow metal layers adhered to the two bonding sheet layers, bonding sheet layers adhered to the surfaces of the two second hollow metal layers, and two second hollow metal layers adhered to the two bonding sheet layers;

the base layer, the first hollowed-out metal layers arranged on two opposite sides of the base layer, the covering film layers covering the surfaces of the two first hollowed-out metal layers form a flexible board layer, the two second hollowed-out metal layers attached to the two bonding sheet layers, the bonding sheet layers attached to the surfaces of the two second hollowed-out metal layers, and the two second hollowed-out metal layers attached to the two bonding sheet layers form a hard board layer.