CN219780476U - Flexible area ladder-shaped plate thickness soft and hard combined plate product structure - Google Patents
Flexible area ladder-shaped plate thickness soft and hard combined plate product structure Download PDFInfo
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- CN219780476U CN219780476U CN202223532269.3U CN202223532269U CN219780476U CN 219780476 U CN219780476 U CN 219780476U CN 202223532269 U CN202223532269 U CN 202223532269U CN 219780476 U CN219780476 U CN 219780476U
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- 239000000758 substrate Substances 0.000 claims description 10
- 238000010276 construction Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a flexible area stepped plate thickness soft and hard combined plate product structure, which comprises a first hard plate, a first soft plate, a second soft plate, a third soft plate and a second hard plate; the first soft board is overlapped on the lower surface of the first hard board, and a third circuit layer and a fourth circuit layer which are arranged up and down are formed on the first soft board; the second soft board is overlapped on the lower surface of the first soft board, and the length of the second soft board is smaller than that of the first soft board; the flexible area is of a stepped thickness structure, and the same flexible area can meet the requirements of different layers and different thicknesses on the same soft and hard combined circuit board by adopting the laminated structure design and the fractional lamination mode of the divided areas, so that the same area has different Young modulus (the thinner Young modulus has lower Young modulus and better flexibility), the utilization rate of the internal space of the electronic product is greatly improved, and the special assembly design of the electronic product is met.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a flexible area ladder-shaped plate thickness soft and hard combined plate product structure.
Background
Because the soft and hard combined circuit board is a combination of the FPC and the PCB, the production of the soft and hard combined circuit board should be provided with FPC production equipment and PCB production equipment at the same time. Firstly, drawing a circuit and an outline of a flexible printed circuit board by an electronic engineer according to requirements, then, issuing the circuit and the outline to a factory capable of producing the flexible printed circuit board, processing and planning related files by a CAM engineer, arranging FPC production lines to produce required FPC and PCB production lines to produce PCB, after the two flexible printed circuit boards and the hard printed circuit board come out, carrying out seamless lamination on the FPC and the PCB by a laminating machine according to planning requirements of the electronic engineer, and finally, preparing the flexible printed circuit board by a series of detail links.
The number of layers and thickness of the same flexible area of the current soft and hard combined circuit board are consistent. However, as electronic products gradually tend to be miniaturized and light in weight in the current market environment, the design and installation space in electronic equipment is more and more compact, and when a certain area on a soft and hard combined circuit board in the electronic product needs to meet different bending coefficient requirements or circuit boards with different thicknesses in a flexible area are limited by the assembly space, the soft and hard combined circuit board with consistent layer number and thickness in the soft board area cannot meet the product requirements. 2 FPC circuit boards with different layers or thicknesses are matched and assembled, so that the product cost is greatly increased and the internal space of the product is wasted. Meanwhile, electromagnetic interference is easy to generate between a plurality of circuit boards during assembly, and the signal quality of the electronic product is affected.
Therefore, it is necessary to study a scheme to solve the above-mentioned problems.
Disclosure of Invention
In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its main objective is to provide a flexible-region stepped-plate-thickness rigid-flex board product structure, which can effectively solve the problems of high cost and waste of internal space in the existing rigid-flex circuit board manufacturing.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a flexible area ladder-shaped plate thickness soft and hard combined plate product structure comprises a first hard plate, a first soft plate, a second soft plate, a third soft plate and a second hard plate;
a first circuit pattern layer and a second circuit pattern layer which are arranged up and down are formed on the first hard board;
the first soft board is overlapped on the lower surface of the first hard board, and a third circuit layer and a fourth circuit layer which are arranged up and down are formed on the first soft board;
the second flexible board is overlapped on the lower surface of the first flexible board, the length of the second flexible board is smaller than that of the first flexible board, and a fifth circuit pattern layer is formed on the second flexible board;
the third flexible board is overlapped on the lower surface of the second flexible board, the length of the third flexible board is smaller than that of the second flexible board, and a sixth circuit pattern layer is formed on the third flexible board;
the second hard board is overlapped on the lower surface of the third soft board, the second hard board is positioned under the first hard board, and a seventh circuit layer and an eighth circuit layer which are arranged up and down are formed on the second hard board.
As a preferable scheme, one end of the first soft board, one end of the second soft board and one end of the third soft board are aligned, and the other end of the first soft board, the other end of the second soft board and the other end of the third soft board are arranged in a step mode.
As a preferable scheme, the first flexible board, the second flexible board and the third flexible board all adopt FPC substrates.
As a preferred solution, the first hard board and the second hard board are both FR4 substrates.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows:
the flexible area is of a stepped thickness structure, and the same flexible area can meet the requirements of different layers and different thicknesses on the same soft and hard combined circuit board by adopting the laminated structure design and the fractional lamination mode of the divided areas, so that the same area has different Young modulus (the thinner Young modulus has lower Young modulus and better flexibility), the utilization rate of the internal space of the electronic product is greatly improved, and the special assembly design of the electronic product is met.
In order to more clearly illustrate the structural features and efficacy of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic cross-sectional view of a preferred embodiment of the present utility model.
The attached drawings are used for identifying and describing:
10. first hard plate 20 and first soft plate
30. Second flexible board 40, third flexible board
50. Second hard board
L1, a first circuit layer L2, a second circuit layer
L3, third line layer L4, fourth line layer
L5, fifth line layer L6, sixth line layer
L7, seventh wiring layer L8, eighth wiring layer.
Detailed Description
Referring to fig. 1, a specific structure of a flexible-region stepped-plate-thickness rigid-flex board product structure according to a preferred embodiment of the utility model is shown, and the structure includes a first rigid board 10, a first flexible board 20, a second flexible board 30, a third flexible board 40 and a second rigid board 50.
The first hard board 10 has a first circuit layer L1 and a second circuit layer L2 disposed thereon. The first flexible board 20 is stacked on the lower surface of the first hard board 10, and a third circuit layer L3 and a fourth circuit layer L4 are formed on the first flexible board 20. The second flexible board 30 is stacked on the lower surface of the first flexible board 20, the length of the second flexible board 30 is smaller than that of the first flexible board 20, and a fifth circuit pattern layer L5 is formed on the second flexible board 30; the third flexible board 40 is stacked on the lower surface of the second flexible board 30, the length of the third flexible board 40 is smaller than that of the second flexible board 30, and a sixth circuit pattern layer L6 is formed on the third flexible board 40; the second hard board 50 is stacked on the lower surface of the third soft board 40, the second hard board 50 is located right under the first hard board 10, and a seventh circuit layer L7 and an eighth circuit layer L8 are formed on the second hard board 50.
One end of the first flexible board 20, one end of the second flexible board 30 and one end of the third flexible board 40 are aligned, and the other end of the first flexible board 20, the other end of the second flexible board 30 and the other end of the third flexible board 40 are arranged in a step. The first, second and third flexible boards 20, 30 and 40 are each FPC-based boards. The first hard plate 10 and the second hard plate 50 each employ an FR4 substrate.
The utility model also discloses a manufacturing method of the flexible region stepped plate thickness soft and hard combined plate product structure, which comprises the following steps:
(1) The middle soft board structure adopts three FPC substrates, and a third circuit pattern layer L3, a fourth circuit pattern layer L4, a fifth circuit pattern layer L5 and a sixth circuit pattern layer L6 are manufactured on copper foils on two sides of each FPC substrate.
(2) The step of the flexible board is subjected to laser cutting windowing in advance, and the second flexible board 20 is dug.
(3) And pressing the upper secondary outer FPC substrates together in a split pressing mode to form a 3-layer soft board semi-finished product plate.
(4) Plate thickness of the ladder is soft and hard to combine the circuit board structure: the upper secondary outer layer core and the lower secondary outer layer core are respectively made of an FR4 substrate, copper foils on two sides of the FR4 substrate are made into a first circuit layer L1, a second circuit layer L2, a seventh circuit layer L7 and an eighth circuit layer L8, and the upper outer layer core and the lower outer layer core are made into 3-5 layers of outer layer circuits in the step area of the soft board.
(5) The upper outer layer first hard board 10, the lower outer layer first hard board 50, the third soft board 40 and the half-finished product plate of the previous 3 layers of soft boards are pressed together again in a split pressing mode to form an 8-layer soft and hard combined circuit board; and (3) after forming, the laser depth-control cover is opened to expose the low-order soft board area, so that an 8-layer soft and hard combined circuit board with the thickness of 2-3 layers of soft board areas and the thickness of a step is formed.
The design focus of the utility model is that: the flexible area is of a stepped thickness structure, and the same flexible area can meet the requirements of different layers and different thicknesses on the same soft and hard combined circuit board by adopting the laminated structure design and the fractional lamination mode of the divided areas, so that the same area has different Young modulus (the thinner Young modulus has lower Young modulus and better flexibility), the utilization rate of the internal space of the electronic product is greatly improved, and the special assembly design of the electronic product is met.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the technical scope of the present utility model, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present utility model are still within the scope of the technical solutions of the present utility model.
Claims (4)
1. A flexible area ladder form board thickness rigid-flex board product construction, its characterized in that: comprises a first hard plate, a first soft plate, a second soft plate, a third soft plate and a second hard plate;
a first circuit pattern layer and a second circuit pattern layer which are arranged up and down are formed on the first hard board;
the first soft board is overlapped on the lower surface of the first hard board, and a third circuit layer and a fourth circuit layer which are arranged up and down are formed on the first soft board;
the second flexible board is overlapped on the lower surface of the first flexible board, the length of the second flexible board is smaller than that of the first flexible board, and a fifth circuit pattern layer is formed on the second flexible board;
the third flexible board is overlapped on the lower surface of the second flexible board, the length of the third flexible board is smaller than that of the second flexible board, and a sixth circuit pattern layer is formed on the third flexible board;
the second hard board is overlapped on the lower surface of the third soft board, the second hard board is positioned under the first hard board, and a seventh circuit layer and an eighth circuit layer which are arranged up and down are formed on the second hard board.
2. The flexible-region stepped-plate-thickness rigid-flex board product structure according to claim 1, wherein: one end of the first soft board, one end of the second soft board and one end of the third soft board are aligned, and the other end of the first soft board, the other end of the second soft board and the other end of the third soft board are arranged in a step mode.
3. The flexible-region stepped-plate-thickness rigid-flex board product structure according to claim 1, wherein: the first flexible board, the second flexible board and the third flexible board are all FPC substrates.
4. The flexible-region stepped-plate-thickness rigid-flex board product structure according to claim 1, wherein: the first hard board and the second hard board are both FR4 substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223532269.3U CN219780476U (en) | 2022-12-29 | 2022-12-29 | Flexible area ladder-shaped plate thickness soft and hard combined plate product structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223532269.3U CN219780476U (en) | 2022-12-29 | 2022-12-29 | Flexible area ladder-shaped plate thickness soft and hard combined plate product structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780476U true CN219780476U (en) | 2023-09-29 |
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ID=88103139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223532269.3U Active CN219780476U (en) | 2022-12-29 | 2022-12-29 | Flexible area ladder-shaped plate thickness soft and hard combined plate product structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780476U (en) |
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2022
- 2022-12-29 CN CN202223532269.3U patent/CN219780476U/en active Active
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