CN116249262A - Flexible area stepped plate thickness soft and hard combined plate product structure and manufacturing method thereof - Google Patents
Flexible area stepped plate thickness soft and hard combined plate product structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN116249262A CN116249262A CN202211705206.5A CN202211705206A CN116249262A CN 116249262 A CN116249262 A CN 116249262A CN 202211705206 A CN202211705206 A CN 202211705206A CN 116249262 A CN116249262 A CN 116249262A
- Authority
- CN
- China
- Prior art keywords
- board
- soft
- hard
- flexible
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a flexible area stepped plate thickness soft and hard combined plate product structure and a manufacturing method thereof, wherein the flexible area stepped plate thickness soft and hard combined plate product structure comprises a first hard plate, a first soft plate, a second soft plate, a third soft plate and a second hard plate; the first soft board is overlapped on the lower surface of the first hard board, and a third circuit layer and a fourth circuit layer which are arranged up and down are formed on the first soft board; the second soft board is overlapped on the lower surface of the first soft board, and the length of the second soft board is smaller than that of the first soft board; the flexible area is of a stepped thickness structure, and the same flexible area can meet the requirements of different layers and different thicknesses on the same soft and hard combined circuit board by adopting the laminated structure design and the fractional lamination mode of the divided areas, so that the same area has different Young modulus (the thinner Young modulus has lower Young modulus and better flexibility), the utilization rate of the internal space of the electronic product is greatly improved, and the special assembly design of the electronic product is met.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a flexible area ladder-shaped plate thickness soft and hard combined plate product structure and a manufacturing method thereof.
Background
Because the soft and hard combined circuit board is a combination of the FPC and the PCB, the production of the soft and hard combined circuit board should be provided with FPC production equipment and PCB production equipment at the same time. Firstly, drawing a circuit and an outline of a flexible printed circuit board by an electronic engineer according to requirements, then, issuing the circuit and the outline to a factory capable of producing the flexible printed circuit board, processing and planning related files by a CAM engineer, arranging FPC production lines to produce required FPC and PCB production lines to produce PCB, after the two flexible printed circuit boards and the hard printed circuit board come out, carrying out seamless lamination on the FPC and the PCB by a laminating machine according to planning requirements of the electronic engineer, and finally, preparing the flexible printed circuit board by a series of detail links.
The number of layers and thickness of the same flexible area of the current soft and hard combined circuit board are consistent. However, as electronic products gradually tend to be miniaturized and light in weight in the current market environment, the design and installation space in electronic equipment is more and more compact, and when a certain area on a soft and hard combined circuit board in the electronic product needs to meet different bending coefficient requirements or circuit boards with different thicknesses in a flexible area are limited by the assembly space, the soft and hard combined circuit board with consistent layer number and thickness in the soft board area cannot meet the product requirements. 2 FPC circuit boards with different layers or thicknesses are matched and assembled, so that the product cost is greatly increased and the internal space of the product is wasted. Meanwhile, electromagnetic interference is easy to generate between a plurality of circuit boards during assembly, and the signal quality of the electronic product is affected.
Therefore, it is necessary to study a scheme to solve the above-mentioned problems.
Disclosure of Invention
In view of the above, the present invention aims at overcoming the drawbacks of the prior art, and its primary objective is to provide a flexible-region stepped-plate-thickness rigid-flex board product structure and a manufacturing method thereof, which can effectively solve the problems of high cost and waste of internal space in the manufacturing of the conventional rigid-flex circuit board.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a flexible area ladder-shaped plate thickness soft and hard combined plate product structure comprises a first hard plate, a first soft plate, a second soft plate, a third soft plate and a second hard plate;
a first circuit pattern layer and a second circuit pattern layer which are arranged up and down are formed on the first hard board;
the first soft board is overlapped on the lower surface of the first hard board, and a third circuit layer and a fourth circuit layer which are arranged up and down are formed on the first soft board;
the second flexible board is overlapped on the lower surface of the first flexible board, the length of the second flexible board is smaller than that of the first flexible board, and a fifth circuit pattern layer is formed on the second flexible board;
the third flexible board is overlapped on the lower surface of the second flexible board, the length of the third flexible board is smaller than that of the second flexible board, and a sixth circuit pattern layer is formed on the third flexible board;
the second hard board is overlapped on the lower surface of the third soft board, the second hard board is positioned under the first hard board, and a seventh circuit layer and an eighth circuit layer which are arranged up and down are formed on the second hard board.
As a preferable scheme, one end of the first soft board, one end of the second soft board and one end of the third soft board are aligned, and the other end of the first soft board, the other end of the second soft board and the other end of the third soft board are arranged in a step mode.
As a preferable scheme, the first flexible board, the second flexible board and the third flexible board all adopt FPC substrates.
As a preferred solution, the first hard board and the second hard board are both FR4 substrates.
The manufacturing method of the flexible area stepped plate thickness soft and hard combined plate product structure comprises the following steps:
(1) The middle soft board structure adopts three FPC substrates, and a third circuit pattern layer, a fourth circuit pattern layer, a fifth circuit pattern layer and a sixth circuit pattern layer are manufactured on copper foils on two sides of each FPC substrate;
(2) Performing laser cutting windowing treatment on the step of the soft board in advance, and digging out a second soft board;
(3) Pressing the upper secondary outer FPC substrates together in a split pressing mode to form a 3-layer soft board semi-finished product plate;
(4) Plate thickness of the ladder is soft and hard to combine the circuit board structure: the upper secondary outer layer core and the lower secondary outer layer core respectively adopt an FR4 substrate, copper foils on two sides of the FR4 substrate are manufactured into a first circuit pattern layer, a second circuit pattern layer, a seventh circuit pattern layer and an eighth circuit pattern layer, and the upper outer layer core and the lower outer layer core are manufactured into 3-5 layers of outer layer circuits in the step area of the soft board;
(5) Adopting a split lamination mode, and laminating the first hard board, the second hard board, the third soft board and the semi-finished product plate of the previous 3 layers of soft boards on the outer layers of the upper part and the lower part together again to form an 8-layer soft and hard combined circuit board; and (3) after forming, the laser depth-control cover is opened to expose the low-order soft board area, so that an 8-layer soft and hard combined circuit board with the thickness of 2-3 layers of soft board areas and the thickness of a step is formed.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows:
the flexible area is of a stepped thickness structure, and the same flexible area can meet the requirements of different layers and different thicknesses on the same soft and hard combined circuit board by adopting the laminated structure design and the fractional lamination mode of the divided areas, so that the same area has different Young modulus (the thinner Young modulus has lower Young modulus and better flexibility), the utilization rate of the internal space of the electronic product is greatly improved, and the special assembly design of the electronic product is met.
In order to more clearly illustrate the structural features and efficacy of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic cross-sectional view of a preferred embodiment of the present invention.
The attached drawings are used for identifying and describing:
10. first hard plate 20 and first soft plate
30. Second flexible board 40, third flexible board
50. Second hard board
L1, a first circuit layer L2, a second circuit layer
L3, third line layer L4, fourth line layer
L5, fifth line layer L6, sixth line layer
L7, seventh wiring layer L8, eighth wiring layer.
Detailed Description
Referring to fig. 1, a specific structure of a flexible-region stepped-plate-thickness rigid-flex board product structure according to a preferred embodiment of the invention is shown, and the structure includes a first rigid board 10, a first flexible board 20, a second flexible board 30, a third flexible board 40 and a second rigid board 50.
The first hard board 10 has a first circuit layer L1 and a second circuit layer L2 disposed thereon. The first flexible board 20 is stacked on the lower surface of the first hard board 10, and a third circuit layer L3 and a fourth circuit layer L4 are formed on the first flexible board 20. The second flexible board 30 is stacked on the lower surface of the first flexible board 20, the length of the second flexible board 30 is smaller than that of the first flexible board 20, and a fifth circuit pattern layer L5 is formed on the second flexible board 30; the third flexible board 40 is stacked on the lower surface of the second flexible board 30, the length of the third flexible board 40 is smaller than that of the second flexible board 30, and a sixth circuit pattern layer L6 is formed on the third flexible board 40; the second hard board 50 is stacked on the lower surface of the third soft board 40, the second hard board 50 is located right under the first hard board 10, and a seventh circuit layer L7 and an eighth circuit layer L8 are formed on the second hard board 50.
One end of the first flexible board 20, one end of the second flexible board 30 and one end of the third flexible board 40 are aligned, and the other end of the first flexible board 20, the other end of the second flexible board 30 and the other end of the third flexible board 40 are arranged in a step. The first, second and third flexible boards 20, 30 and 40 are each FPC-based boards. The first hard plate 10 and the second hard plate 50 each employ an FR4 substrate.
The invention also discloses a manufacturing method of the flexible region stepped plate thickness soft and hard combined plate product structure, which comprises the following steps:
(1) The middle soft board structure adopts three FPC substrates, and a third circuit pattern layer L3, a fourth circuit pattern layer L4, a fifth circuit pattern layer L5 and a sixth circuit pattern layer L6 are manufactured on copper foils on two sides of each FPC substrate.
(2) The step of the flexible board is subjected to laser cutting windowing in advance, and the second flexible board 20 is dug.
(3) And pressing the upper secondary outer FPC substrates together in a split pressing mode to form a 3-layer soft board semi-finished product plate.
(4) Plate thickness of the ladder is soft and hard to combine the circuit board structure: the upper secondary outer layer core and the lower secondary outer layer core are respectively made of an FR4 substrate, copper foils on two sides of the FR4 substrate are made into a first circuit layer L1, a second circuit layer L2, a seventh circuit layer L7 and an eighth circuit layer L8, and the upper outer layer core and the lower outer layer core are made into 3-5 layers of outer layer circuits in the step area of the soft board.
(5) The upper outer layer first hard board 10, the lower outer layer first hard board 50, the third soft board 40 and the half-finished product plate of the previous 3 layers of soft boards are pressed together again in a split pressing mode to form an 8-layer soft and hard combined circuit board; and (3) after forming, the laser depth-control cover is opened to expose the low-order soft board area, so that an 8-layer soft and hard combined circuit board with the thickness of 2-3 layers of soft board areas and the thickness of a step is formed.
The design focus of the invention is that: the flexible area is of a stepped thickness structure, and the same flexible area can meet the requirements of different layers and different thicknesses on the same soft and hard combined circuit board by adopting the laminated structure design and the fractional lamination mode of the divided areas, so that the same area has different Young modulus (the thinner Young modulus has lower Young modulus and better flexibility), the utilization rate of the internal space of the electronic product is greatly improved, and the special assembly design of the electronic product is met.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention are still within the scope of the technical solutions of the present invention.
Claims (5)
1. A flexible area ladder form board thickness rigid-flex board product construction, its characterized in that: comprises a first hard plate, a first soft plate, a second soft plate, a third soft plate and a second hard plate;
a first circuit pattern layer and a second circuit pattern layer which are arranged up and down are formed on the first hard board;
the first soft board is overlapped on the lower surface of the first hard board, and a third circuit layer and a fourth circuit layer which are arranged up and down are formed on the first soft board;
the second flexible board is overlapped on the lower surface of the first flexible board, the length of the second flexible board is smaller than that of the first flexible board, and a fifth circuit pattern layer is formed on the second flexible board;
the third flexible board is overlapped on the lower surface of the second flexible board, the length of the third flexible board is smaller than that of the second flexible board, and a sixth circuit pattern layer is formed on the third flexible board;
the second hard board is overlapped on the lower surface of the third soft board, the second hard board is positioned under the first hard board, and a seventh circuit layer and an eighth circuit layer which are arranged up and down are formed on the second hard board.
2. The flexible-region stepped-plate-thickness rigid-flex board product structure according to claim 1, wherein: one end of the first soft board, one end of the second soft board and one end of the third soft board are aligned, and the other end of the first soft board, the other end of the second soft board and the other end of the third soft board are arranged in a step mode.
3. The flexible-region stepped-plate-thickness rigid-flex board product structure according to claim 1, wherein: the first flexible board, the second flexible board and the third flexible board are all FPC substrates.
4. The flexible-region stepped-plate-thickness rigid-flex board product structure according to claim 1, wherein: the first hard board and the second hard board are both FR4 substrates.
5. A method for manufacturing a product structure of a flexible-region stepped-plate-thickness rigid-flex board according to any one of claims 1-4, characterized in that: the method comprises the following steps:
(1) The middle soft board structure adopts three FPC substrates, and a third circuit pattern layer, a fourth circuit pattern layer, a fifth circuit pattern layer and a sixth circuit pattern layer are manufactured on copper foils on two sides of each FPC substrate;
(2) Performing laser cutting windowing treatment on the step of the soft board in advance, and digging out a second soft board;
(3) Pressing the upper secondary outer FPC substrates together in a split pressing mode to form a 3-layer soft board semi-finished product plate;
(4) Plate thickness of the ladder is soft and hard to combine the circuit board structure: the upper secondary outer layer core and the lower secondary outer layer core respectively adopt an FR4 substrate, copper foils on two sides of the FR4 substrate are manufactured into a first circuit pattern layer, a second circuit pattern layer, a seventh circuit pattern layer and an eighth circuit pattern layer, and the upper outer layer core and the lower outer layer core are manufactured into 3-5 layers of outer layer circuits in the step area of the soft board;
(5) Adopting a split lamination mode, and laminating the first hard board, the second hard board, the third soft board and the semi-finished product plate of the previous 3 layers of soft boards on the outer layers of the upper part and the lower part together again to form an 8-layer soft and hard combined circuit board; and (3) after forming, the laser depth-control cover is opened to expose the low-order soft board area, so that an 8-layer soft and hard combined circuit board with the thickness of 2-3 layers of soft board areas and the thickness of a step is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211705206.5A CN116249262A (en) | 2022-12-29 | 2022-12-29 | Flexible area stepped plate thickness soft and hard combined plate product structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211705206.5A CN116249262A (en) | 2022-12-29 | 2022-12-29 | Flexible area stepped plate thickness soft and hard combined plate product structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116249262A true CN116249262A (en) | 2023-06-09 |
Family
ID=86623366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211705206.5A Pending CN116249262A (en) | 2022-12-29 | 2022-12-29 | Flexible area stepped plate thickness soft and hard combined plate product structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116249262A (en) |
-
2022
- 2022-12-29 CN CN202211705206.5A patent/CN116249262A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI613941B (en) | A printed circuit board | |
| US7809220B2 (en) | Printed circuit board and manufacturing method thereof | |
| KR20110045991A (en) | Multi Layer Rigid Flexible Printed Circuit Board and Method for Manufacturing The Same | |
| CN101309556A (en) | Production method of circuit board having long and short golden finger | |
| CN102056414A (en) | Manufacturing method of printed circuit board | |
| CN110312380B (en) | Manufacturing and production method of multilayer insulated isolation circuit board with side metallized edges | |
| CN103313530A (en) | Manufacturing method of rigid-flex circuit board | |
| US20120080401A1 (en) | Method of fabricating multilayer printed circuit board | |
| CN103298274A (en) | Manufacturing method for capacitor-buried printed-circuit board and capacitor-buried printed-circuit board | |
| CN105323950A (en) | Flexible printed circuit board and manufacturing method thereof | |
| TW201410093A (en) | Rigid-flexible circuit substrate, rigid-flexible circuit board and method for manufacturing same | |
| CN219780476U (en) | Flexible area ladder-shaped plate thickness soft and hard combined plate product structure | |
| CN110381664B (en) | Manufacturing method of PCB with cavity and PCB | |
| CN116249262A (en) | Flexible area stepped plate thickness soft and hard combined plate product structure and manufacturing method thereof | |
| CN110572944A (en) | Method and device for manufacturing exposed area of rigid-flex printed circuit board | |
| CN113179596B (en) | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board | |
| CN104902698A (en) | A circuit board golden finger processing method and a circuit board having golden fingers | |
| KR100567095B1 (en) | method for manufacturing the rigid-flexible substrate having the micro via hole | |
| JP4926676B2 (en) | Manufacturing method of multilayer printed wiring board | |
| CN219269155U (en) | Stepped circuit board | |
| CN220368851U (en) | PCB board lamination structure | |
| CN220325890U (en) | Local thick copper pcb | |
| US11317506B2 (en) | Circuit board with high light reflectivity and method for manufacturing the same | |
| CN102404946A (en) | Low-density multilayer circuit board capable of integrating high-density multilayer board as well as manufacturing method thereof | |
| CN114945248B (en) | Processing technology of precise circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |