CN104754885B - The manufacture method of circuit board - Google Patents
The manufacture method of circuit board Download PDFInfo
- Publication number
- CN104754885B CN104754885B CN201510137262.7A CN201510137262A CN104754885B CN 104754885 B CN104754885 B CN 104754885B CN 201510137262 A CN201510137262 A CN 201510137262A CN 104754885 B CN104754885 B CN 104754885B
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- Prior art keywords
- hole
- circuit board
- plated
- resin
- aperture
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention discloses a kind of manufacture method of circuit board, comprises the following steps：Cover plate is provided, in the circuit board surface for opening up the second through hole, making cover plate be covered in after plating corresponding with the plated through-hole on circuit board on cover plate, and the second through hole position relative with the plated through-hole of circuit board；There is provided and the good resin material of copper face wellability, resin is sufficiently stirred under vacuum；The resin after stirring is set to be coated on lid surface, the single stroke of scraper of screen printer makes the second through hole of cover plate fill up resin, and resin is filled in plated through-hole through the second through hole, and oil return knife scrapes back the resin for residing in lid surface；The copper electroplating layer that need to retain is covered with graphic plating tin layers, the figure that need to retain is protected, makes at least one end aperture of plated through-hole that copper ring is exposed, is etched using alkaline etching liquid, removes the copper ring protected without tin layers, and etch desired depth.The present invention can remove the aperture copper ring of plated through-hole, realize the via insulating properties of circuit board, can effectively substitute back drill technology.
Description
Technical field
The present invention relates to circuit board production techniques field, a kind of circuit board system of achievable via insulation is more particularly related to
Make method.
Background technology
Printed circuit board (pcb board) is the supplier of electronic component electrical connection.Pcb board plated through-hole technology is printing
One of key of circuit board production techniques, plated through-hole refers to use chemistry anti-on the hole wall between the top layer and bottom of pcb board
One layer of thin copper should be plated on the inwall in hole so that the top layer of pcb board is connected with each other with bottom.Part affixed metal structural member
Radio communication product, for ensure product insulating reliability, earliest way be on hardware fluting processing component.
It refer to shown in Fig. 1, the electronic device includes pcb board 100 and coupled hardware 200, in hardware
The position that the surface being connected on 200 with pcb board 100 corresponds to plated through-hole 300 opens up groove 400, so that hardware 200
It is isolated between plated through-hole 300, so as to realize the insulating properties of product.But, above-mentioned realizes what plated through-hole insulated
Technology is because of hardware form of diverse, and difficulty of processing and cost are higher, realize that large-scale application is beset with resistance.
With the development of PCB process technologies, consider for cost savings and simplified manufacturing process flow, terminal called equipment
Manufacturer realizes that PCB vias design alternative metals structural member grooving techniques without diskization using back drill technology one after another, by increasing gold
Category structural member ensures product insulating properties with the distance of hole copper (plated through-hole).Shown in Figure 2, the electronic device includes
Pcb board 100 and connected hardware 200, wherein, copper facing shape in through hole 500, through hole 500 is opened up on pcb board 100
Pore-forming copper 600, then back drill removal partial hole copper 600 is carried out, then make the end face and metal knot of the removal hole copper of pcb board 100
Component 200 is connected, so as to increase the distance of hardware 200 and hole copper 600, and then realizes the insulating properties of product.But,
Back drill technology has many restrictions, and large-scale application has problems.Firstth, back drill process matching turmeric is surface-treated, and is needed
Hypertoxic industrial chemicals is used, medicine management and control and liquid waste processing are more difficult；Secondth, back drill product processing Aligning degree control will
Ask high, Row control is complicated, yield rate is relatively low；3rd, increase the drilling of knife footpath, be unfavorable for highly dense wiring, limitation product design and
Application.Therefore, the via insulation technology of exploitation replacement back drill technology is significant.
The A of Chinese patent literature CN 102869205 disclose a kind of " pcb board plated through-hole forming method ", and this method passes through
To carrying out filling erosion resistant 800 (referring to Fig. 3) in the plated through-hole 300 of the substrate 700 of pcb board, place is then etched again
Reason, the hole copper in plated through-hole 300 is protected without being etched by erosion resistant 800, the pad of the end of plated through-hole 300 then by
Etching is removed.The technical problem that this method is solved is to improve radio frequency products signal quality, so that pcb board can be used for communication and army
Thing etc. has the field of high-frequency microwave signal demand.But, there is quality hidden danger in practice in this method, for example, 1. right
When plated through-hole carries out filling out erosion resistant, consent depression is easily formed, it is possible to making partial hole copper also exposed, during etching not only
The pad of plated through-hole end is eliminated, part hole wall copper can be also etched away, cause etch depth exceeded；2. consent mistake is being carried out
, there is long-term erosion hole wall copper in easy residue gas bubble, the easy Tibetan medicine water when orifice bubble is close to hole wall copper in Cheng Zhong, erosion resistant
Cause failure risk；If 3. there is resin cull after ceramic nog plate, easily there is the residual copper in aperture after etching, cause printed board via exhausted
Edge fails, to ensure zero-fault during production, circuit board etching after completing, it is necessary to carry out AOI detections (i.e. hole
The residual copper detection of mouth), but because circuit board would generally be placed a period of time, the copper of plate face easily aoxidizes obfuscation, reduction copper and base material
The contrast in face, causes defect to fail to report problem, therefore AOI workshops typically configure a pickling deoxidation line, remove the oxygen on copper removal surface
Change layer to strengthen the contrast of copper and base material, still, circuit board can make tree because containing CaCO3 compositions, pickling inside plug socket resin
Copper in exposed hole, interference detection process after fat comes off, cause detection process vacation point many, influence detection and repairing efficiency.Therefore, really
It is necessary to be improved prior art, to solve above-mentioned technical problem, eliminates the quality hidden danger existed.In addition, the technique
Technology can also substitute back drill Technology application to via insulation technology field.
The content of the invention
It is an object of the present invention to：A kind of manufacture method of circuit board is provided, it can realize the via of circuit board
Landless.
It is another object of the present invention to：A kind of manufacture method of circuit board is provided, it can realize the mistake of circuit board
Insulated between hole and the hardware for connecting circuit board.
Another object of the present invention is：A kind of manufacture method of circuit board is provided, it is existing that it can prevent consent depression
The generation of elephant, eliminates quality hidden danger.
The present invention further an object is that：A kind of manufacture method of circuit board is provided, it can prevent hole wall adsorbed gas
The phenomenon for steeping easy Tibetan medicine water is produced, it is to avoid hole wall copper failure risk.
A further object of the present invention is：A kind of manufacture method of circuit board is provided, its can in favor of realize AOI detect
The residual copper in aperture.
For up to this purpose, the present invention uses following technical scheme：
A kind of manufacture method of circuit board, comprises the following steps：
Step S10：Cover plate is provided, in corresponding with the electroplated plated through-hole being formed on circuit board on the cover plate
The second through hole is opened up, the aperture of second through hole is more than the aperture of the plated through-hole, the cover plate is covered in after plating
Circuit board surface, and second through hole position relative with the plated through-hole of the circuit board；
Step S20：There is provided and the good resin material of copper face wellability, the resin is sufficiently stirred under vacuum；
Step S30：The resin after stirring is set to be coated on the lid surface, the single stroke of scraper of screen printer makes the lid
Second through hole of plate fills up resin, and the resin is filled in the plated through-hole through second through hole, the oil return knife of screen printer
The resin for residing in the lid surface is scraped back；
Step S40：The circuit board is toasted, makes the hardening of resin in the plated through-hole；
Step S50：The copper electroplating layer that need to retain is covered with graphic plating tin layers, the figure that need to retain is protected, makes the gold
Copper ring is exposed at least one end aperture in categoryization hole, is etched using alkaline etching liquid, removes the copper ring protected without tin layers, and
Etch desired depth；
Wherein, the step S10 and step S20 is without sequencing.
This method opens up the second through hole on the cover board by using cover plate is set on circuit boards, and second through hole with
Plated through-hole is corresponding, and resin is directly coated on cover plate, and resin enters in plated through-hole through the second through hole, can play choosing
The effect of selecting property filling holes with resin；By the way that the aperture design of the second through hole to be more than to the aperture of plated through-hole, lead to beneficial to improving second
Hole and the aligning accuracy of plated through-hole, then the second through hole is filled up by resin by the single stroke of scraper, filling holes with resin can be avoided
Depression；By selecting the resin good with copper face wellability, and it is sufficiently stirred under vacuum, on the one hand reduces metal
The hole wall for changing hole adsorbs the risk of bubble, on the other hand further improves the quality of filling holes with resin, the present invention is by overcoming consent recessed
Sunken shortcoming, further avoid because resin depression easily caused by lack tin plating, and cause asking for having no copper in the holes after alkali etching
Topic；By the way that tin layers against corrosion are covered in into circuit board surface, alkali etching is then carried out again, eliminates the copper ring of no tin layers protection,
And desired depth is etched, the insulating properties of via is realized, new via insulation technology is turned into available for back drill technology is substituted.
As a kind of preferred scheme, in the step S20, Pre-Evaluation is carried out to the resin material of offer, chosen and copper
Face contact angle is θ resin, wherein, θ≤90 °, the contact angle refers to the tangent line of its outline when resin is placed in circuit board surface
Direction and the angle of copper face formation.This programme can select the less resin of contact angle by carrying out Pre-Evaluation to resin material,
The smaller immersional wetting for showing resin and copper face of contact angle is stronger, and immersional wetting is more strong, and bubble is more difficult to be adsorbed in hole wall, from
And when avoiding orifice bubble close to hole wall copper easy Tibetan medicine water and cause hole wall copper fail risk, while also helping resin plug
Enter plated through-hole.
As a kind of preferred scheme, in the step S20, the resin is stirred under vacuum, makes the viscosity of resin
Reduce at least 200Pas.It is preferred that, mechanical agitation 30min is carried out to the resin using preceding.This programme to resin by entering
Row is stirred under vacuum in advance, can reduce the viscosity of resin, and makes bubble in the presence of buoyancy inside fugitive liquids by stirring,
Bubble is adsorbed in the risk of hole wall when further reducing filling holes with resin.
As a kind of preferred scheme, the step S10 comprises the following steps：
S101：The circuit board is placed on backing plate, opens up relative with the plated through-hole of the circuit board on the backing plate
The first through hole answered, the aperture of the first through hole is more than the aperture of the plated through-hole；By the way that circuit board is positioned over into backing plate
On, and first through hole is opened up corresponding to plated through-hole on backing plate, and in filling holes with resin, the resin meeting in one side plated through-hole
Because being dropped down onto under Action of Gravity Field in first through hole, resin is set fully to be flowed in plated through-hole and full of plated through-hole, improve consent
Quality, on the other hand, unnecessary resin enters first through hole memory storage, will not pollute table top.The aperture of first through hole is preferred
The aperture more than plated through-hole, i.e., the aperture of plated through-hole be less than first through hole aperture, the tree in plated through-hole can be made
Fat more smoothly falls.
S102：The cover plate is placed in on the top of the circuit board, the cover plate metal opened up with the circuit board
Change the second corresponding through hole of hole, the aperture of second through hole is more than the aperture of the plated through-hole, by lifting the lid
Plate makes the surface for being covered in the circuit board of its selectivity；
By opening up the second through hole corresponding to plated through-hole on the cover board, cover plate is covered in the surface of circuit board, resin
Uniformly it is coated on cover plate, is then fallen under the local resin for having the second through hole in plated through-hole, without the second through hole
Local resin do not fall, scraped back by oil return knife, serve the effect of selective consent, protect the complete of circuitous pattern
Property.
S103：The backing plate and/or the cover plate are adjusted, so that the first through hole, second through hole and the electricity
The central axis of the plated through-hole of road plate is adjusted to allowed band, realize the first through hole, second through hole with it is described
The plated through-hole of circuit board is with respect to position.
As a kind of preferred scheme, the aperture of the first through hole is more than the aperture of the plated through-hole, and described first leads to
The scope that the aperture in hole is more than the plated through-hole aperture is 0.250mm~0.500mm；And/or,
The aperture of second through hole is more than the aperture of the plated through-hole, and the aperture of second through hole is more than the gold
The scope in the aperture in categoryization hole is 0.150mm~0.250mm.
The deflection for considering circuit board itself is 0.050mm~0.100mm, and the aperture of the second through hole on cover plate is relative
0.150mm~0.250mm is increased in the aperture of plated through-hole, the contraposition capability control between plated through-hole and the second through hole can be made
In 0.076mm, filling holes with resin quality is improved.
As a kind of preferred scheme, in the step S30, the scraper speed is 15mm/s~30mm/s, described to scrape
Knife pressure is more than 5kg/cm2, and the scraper angle is 8 °~20 °.By by scraper speed, scraper to the pressure of resin, and
Scraper angle control effectively, and can further improve filling holes with resin quality.
As a kind of preferred scheme, in the step S40, the circuit board is toasted using incremental temperature.
Because temperature rise bubble becomes big, the resin viscosity that its buoyancy also becomes big and uncured diminishes, and bubble is more easy to emerge, therefore adopts
With segmentation baking, temperature is raised to high temperature by low temperature, is to ensure that bubble does not emerge to form depression at high temperature in hole.
As a kind of preferred scheme, in the step S40, nog plate step is carried out to the surface of the circuit board after baking,
The nog plate step replaces nog plate at least twice using abrasive band and non-woven fabrics, abrasive belt grinding section and the section speed adjustment of non-woven fabrics nog plate
It is extremely identical.Relative to traditional ceramic nog plate, easily there is resin cull in ceramic nog plate, easily form the residual copper in aperture after the etching, if
The contact surface of hardware and circuit board is present to be connect in raised or burr, the projection or burr insertion welding resistance with residual copper
Touch, then can cause the problem of insulating properties fails, and this programme carries out nog plate at least twice using abrasive band and non-woven fabrics combination,
The problem of resin cull can be overcome, so that the problem of avoiding the residual copper in aperture.
As a kind of preferred scheme, in the step S50, when being etched to circuit board, with the circuit board and institute
It is etching surface to state the consent surface that cover plate is in contact.The resin and the wellability of copper face selected due to this programme is good, selection plug
Hole face can avoid hole wall from revealing copper and be etched, cause the defect that etch depth is exceeded as etching face.
As a kind of preferred scheme, in addition to：Step S60, in carrying out AOI detections to the circuit board after etching, specifically
Including：
Step S601：Circuit board is dried in after pickling oxide layer, drying rate is 3.0m/min~3.5m/
min；
Step S602：Brown processing is carried out to the circuit board after drying, then carries out volcanic ash nog plate, AOI spies are then carried out
Survey.
Need to carry out AOI detections to circuit board after the etching, AOI spies are carried out in the short time if compared after the etching
Survey, then because copper is not oxidized, AOI detection operations can be smoothed out.If circuit board was placed after a period of time to be carried out again
AOI is detected, then AOI detections can not be smoothed out because of copper problem of oxidation and are aoxidized, it is necessary to further be removed by pickling process
Layer, when carrying out pickling, due to the resin filled in plated through-hole easily with acid reaction and be washed off so that in plated through-hole
Hole copper exposes, and causes and detects false point, interference detection result, and this programme to the circuit board after pickling by first drying, then
Brown processing is carried out again, the copper color on circuit board is produced change, is then carried out volcanic ash nog plate, make circuit board surface copper face
Color changes (copper color in surface can brighten after usual nog plate) again, and the color of the hole copper in plated through-hole will not then become again
Change, make surface copper and base material produce aberration with this, then carry out AOI detections then can smoothly to detect whether there is the residual copper in aperture.
Beneficial effects of the present invention：The manufacture method for the circuit board that the present invention is provided, can remove the aperture of plated through-hole
Copper ring, and with etch depth, realize the via insulating properties of circuit board, back drill technology can be effectively substituted, in implementation process
Consent depression, the phenomenon of the hole wall absorption easy Tibetan medicine water of bubble can be prevented to produce, hole wall copper failure risk is reduced, eliminate product
Matter hidden danger；The present invention also provides a kind of new AOI detection methods, the residual copper in the aperture of plated through-hole can be carried out effectively detection and
Repair.
Brief description of the drawings
The present invention is described in further detail below according to drawings and examples.
Fig. 1 is a kind of pcb board of prior art and the assembling structure schematic diagram of hardware；
Fig. 2 is another pcb board of prior art and the assembling structure schematic diagram of hardware；
Fig. 3 is a kind of structural representation of pcb board of prior art；
Fig. 4 be embodiments of the invention described in method of manufacturing circuit board in step S10 schematic diagram；
Fig. 5 is step S20 resins in the method for manufacturing circuit board described in the embodiment of the present invention and copper face soakage principle figure；
Fig. 6 be embodiments of the invention described in method of manufacturing circuit board in step S50 graphic platings schematic diagram；
Fig. 7 takes off the schematic diagram of dry film for step S50 in the method for manufacturing circuit board described in embodiments of the invention；
Fig. 8 be embodiments of the invention described in method of manufacturing circuit board in step S50 alkali etchings schematic diagram；
Fig. 9 takes off the schematic diagram of tin for step S50 in the method for manufacturing circuit board described in embodiments of the invention.
In figure：
100th, pcb board；200th, hardware；300th, plated through-hole；400th, groove；500th, through hole 600, hole copper；700、
Substrate；800th, erosion resistant；
1st, cover plate；11st, the second through hole；2nd, circuit board；21st, plated through-hole；22nd, copper ring；23rd, copper face；3rd, backing plate；31st,
One through hole；4th, dry film；5th, resin；6th, tin layers.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiments of the invention provide a kind of manufacture method of circuit board, comprise the following steps：
Step S10：Cover plate is provided, in corresponding with the electroplated plated through-hole being formed on circuit board on the cover plate
The second through hole is opened up, the aperture of second through hole is more than the aperture of the plated through-hole, the cover plate is covered in after plating
Circuit board surface, and second through hole position relative with the plated through-hole of the circuit board；
Step S20：There is provided and the good resin material of copper face wellability, the resin is sufficiently stirred under vacuum；
Step S30：The resin after stirring is set to be coated on the lid surface, the single stroke of scraper of screen printer makes the lid
Second through hole of plate fills up resin, and the resin is filled in the plated through-hole through second through hole, the oil return knife of screen printer
The resin for residing in the lid surface is scraped back.
Step S40：The circuit board is toasted, makes the hardening of resin in the plated through-hole；
Step S50：The copper electroplating layer that need to be retained with graphic plating tin layers covering against corrosion, is protected the figure that need to retain, made
Copper orifice ring is exposed at least one end aperture of the plated through-hole, is etched using alkaline etching liquid, removes without tin layers against corrosion
The copper ring of protection, and etch desired depth；
Step S60, in after etching to the circuit board carry out AOI detections.
Wherein, step S10 specifically includes following steps (shown in Figure 4)：
S101：Circuit board 2 is placed on backing plate 3, corresponding with the plated through-hole 21 of circuit board 2 is opened up on backing plate 3
One through hole 31, the aperture of first through hole 31 is more than the aperture of plated through-hole 21；In the present embodiment, the thickness of slab of circuit board 2≤
2.500mm, 40 μm~60 μm of face copper thickness, aperture≤3.500mm of plated through-hole, the aperture of first through hole 31 is relative to metal
Change the big 0.350mm in aperture in hole 21.
S102：Cover plate 1 is placed on the top of circuit board 2, cover plate 1 and opens up corresponding with the plated through-hole 21 of circuit board 2
The second through hole 11, the aperture of the second through hole 11 is more than the aperture of plated through-hole 21, makes covering for its selectivity by lifting cover plate 1
It is placed on the surface of circuit board 2；In the present embodiment, cover plate 1 is fixed on screen frame, for supporting cover plate 1, cover plate 1 uses aluminium
Plate, has the advantages that light weight, can do slabbing, and on the one hand thinner thickness can play filling holes with resin positioning action, i.e., only for
The position of the plated through-hole of circuit board 2 carries out selective resin consent, and on the other hand, laminar aluminium flake can also make resin fast
Speed is fallen into plated through-hole, can improve consent efficiency.The aperture of second through hole 11 of the present embodiment is more than plated through-hole 21
Aperture 0.200mm.
S103：Backing plate 3 and/or cover plate 1 are adjusted, so that first through hole 31, the plated through-hole of the second through hole 11 and circuit board
21 central axis is adjusted to allowed band, realizes the phase of plated through-hole 21 of first through hole 31, the second through hole 11 and circuit board
Contraposition.In the present embodiment, backing plate 3 is placed on table top first, then circuit board is placed by the contraposition part of screen printer
In on backing plate 3, making the central axis of first through hole 31 be overlapped with the central axis of plated through-hole 21, error is in the model for providing to allow
In enclosing；Then cover plate 1 is placed in the top of circuit board 2, by making cover plate 1 decline and be covered in the upper surface of circuit board 2, is passed through
Contraposition part fine setting cover plate 1 position of screen printer, makes the central axis of the second through hole 11 and the central axis weight of plated through-hole 21
Close, error is in the range of regulation allows.Then backing plate 3, circuit board 2 and cover plate 1 are compressed by the pressing component of screen printer,
Wait for filling holes with resin.First through hole 31, the plated through-hole of the second through hole 11 and circuit board can be improved through the above way
21 aligning accuracies.
Step S20 specifically includes following steps：
S201：Pre-Evaluation is carried out to the resin material of offer, the resin for θ with copper face contact angle is chosen, wherein, θ≤
90 °, contact angle refers to the tangential direction of its outline and the angle of copper face formation when resin is placed in circuit board surface.Contact angle θ can
Directly to be measured by crystalline phase microscope, it can also be calculated by formula.It is shown in Figure 5, resin 5 is positioned over circuit
On the copper face 23 of plate 2, resin 5 is entered in plated through-hole, top extreme higher position and the copper face 23 of the resin 5 of indwelling on copper face 23
The distance between be a, the angle on copper face 23 between the tangent line and copper face 23 of the bottom margin of the resin 5 of indwelling is contact angle θ,
The bottom Breadth Maximum of the resin 5 of indwelling on copper face 23 is b, can calculate and connect by formula θ=tan-1 (4ab)/(b2-4a2)
Feeler, the resin and copper face contact angle θ of the present embodiment are 25 °.The smaller explanation resins 5 of contact angle θ are in more flat on copper face 23, i.e.,
More into the resin in plated through-hole, the resin residued on copper face is few, shows that the immersional wetting of the resin and copper face is good, can
Beneficial to consent work.
S202：The resin is stirred under vacuum, making the viscosity of resin reduces at least 200Pas.In the present embodiment
In, mechanical vacuum stirring 30min is carried out to the resin using preceding, making the viscosity of resin reduces 250Pas.
In step S30, by the control of filling holes with resin process conditions and parameter, filling holes with resin quality is further ensured that.Tool
Body is included in terms of flatness of scraping glue and plate face pressure uniformity, scraper pressure, frictioning feeding speed, scraper angle.For scraping
The control of glue flatness and plate face pressure uniformity, can adjust table top height and walk, to improve its flatness；By scraper speed
Control is in 15mm/s~30mm/s, and scraper pressure control is in more than 5kg/cm2, preferably 8kg/cm 2, scraper angle control
Between 8 °~20 °, in addition, only carrying out single stroke during scraper consent, i.e. a knife fills up resin, it is to avoid scraper sweeping action is easy
The defect of bubble is produced, by above-mentioned design, filling holes with resin quality is may further ensure that.
Step S40 specifically includes following steps：
Step S401：Circuit board is positioned in baking oven, drying-plate process is divided into three phases, first stage drying-plate temperature is
55 °~65 °, the drying-plate time is 25min~35min；Second stage drying-plate temperature be 75 °~85 °, the drying-plate time be 25min~
35min；Phase III drying-plate temperature is 115 °~125 °, and the drying-plate time is 55min~65min.By stage by stage and temperature is passed
The roasting mode of increasing can aid in the quick-hardening of resin, and the high-temperature baking when resin is uncured can also be avoided easily to make bubble
The problem of emerging and form depression.
Step S402：Nog plate step is carried out to the surface of the circuit board after baking, the nog plate step uses abrasive band and nothing
Spin cloth alternating nog plate at least twice, abrasive belt grinding section and non-woven fabrics nog plate section speed are adjusted to identical.In the present embodiment, abrasive band mill
Plate section and non-woven fabrics nog plate section speed are controlled in 1.5m/min~2.5m/min.
Step S50 specifically includes following steps：Referring first to as shown in fig. 6, be covered in the surface of circuit board 2 with dry film 4, its
In, dry film 4 is covered in the first end of plated through-hole 21, and the second end does not cover dry film 4；Graphic plating is carried out to circuit board, made not
The region for being covered with dry film 4 plates tin layers 6, wherein, the copper ring 22 at the end of plated through-hole 21 second is covered with tin layers 6, referring then to Fig. 7
Shown, dry film 4 is taken off in progress, and the layers of copper for removing needs is exposed, wherein, the copper ring 22 of the first end of plated through-hole 21 is not because plating tin
Layer 6 and it is exposed；Referring next to shown in Fig. 8, carry out alkali etching to circuit board 2, it is specific using film compensation 0.030mm~
0.064mm, etching speed 2.0m/min~3.0m/min, because tin layers 6 are covered in the copper ring 22 at the second end of plated through-hole 21
Outside, in alkali etching, copper ring 22 is not etched, and the copper ring 22 of the first end of plated through-hole 21 is due to not covered with tin
Layer 6, is etched in alkali etching, and hole wall copper is also partially etched, and etch depth is controlled more than 20 μm, realizes gold
The insulating properties of the first end in categoryization hole 21；Turn finally to shown in Fig. 9, take off tin to obtain corresponding product.Certainly, art technology
Personnel are easier it is contemplated that can also etch away the copper ring at the two ends of plated through-hole, and control the etching of hole wall copper
Depth, so as to realize the two ends insulating properties of plated through-hole.
Step S60 specifically includes following steps：
Step S601：Circuit board is dried in after pickling oxide layer, drying rate is 3.0m/min~3.5m/
min；
Step S602：Brown processing is carried out to the circuit board after drying, then carries out volcanic ash nog plate, AOI spies are then carried out
Survey.
The technical principle of the present invention is described above in association with specific embodiment, these descriptions are intended merely to explain the present invention's
Principle, it is impossible to be construed to limiting the scope of the invention in any way.Based on explaining herein, those skilled in the art
Would not require any inventive effort can associate other embodiments of the present invention, and these modes fall within this hair
Within bright protection domain.
Claims (10)
1. a kind of manufacture method of circuit board, it is characterised in that comprise the following steps：
Step S10：Cover plate is provided, on the cover plate with the electroplated plated through-hole being formed on circuit board is corresponding opens up
Second through hole, the aperture of second through hole is more than the aperture of the plated through-hole, the electricity for making the cover plate be covered in after plating
Road plate surface, and second through hole position relative with the plated through-hole of the circuit board；
Step S20：There is provided and the good resin material of copper face wellability, the resin is sufficiently stirred under vacuum；
Step S30：The resin after stirring is set to be coated on the lid surface, the single stroke of scraper of screen printer makes the cover plate
Second through hole fills up resin, and the resin is filled in the plated through-hole through second through hole, and the oil return knife of screen printer will be stayed
The resin for being stored in the lid surface is scraped back；
Step S40：The circuit board is toasted, makes the hardening of resin in the plated through-hole；
Step S50：The copper electroplating layer that need to retain is covered with graphic plating tin layers, the figure that need to retain is protected, makes the metallization
Copper ring is exposed at least one end aperture in hole, is etched using alkaline etching liquid, removes the copper ring protected without tin layers, and etch
Desired depth；
Wherein, the step S10 and step S20 is without sequencing.
2. the manufacture method of circuit board according to claim 1, it is characterised in that in the step S20, to offer
Resin material carries out Pre-Evaluation, chooses the resin for θ with copper face contact angle, wherein, θ≤90 °；
The contact angle refers to the tangential direction of its outline and the angle of copper face formation when resin is placed in circuit board surface.
3. the manufacture method of circuit board according to claim 2, it is characterised in that in the step S20, to the tree
Fat is stirred under vacuum, and is made the viscosity of resin and is reduced at least 200Pas.
4. the manufacture method of circuit board according to claim 1, it is characterised in that the step S10 comprises the following steps：
S101：The circuit board is placed on backing plate, opens up corresponding with the plated through-hole of the circuit board on the backing plate
First through hole, the aperture of the first through hole is more than the aperture of the plated through-hole；
S102：The cover plate is placed in on the top of the circuit board, the cover plate plated through-hole opened up with the circuit board
The second corresponding through hole, the aperture of second through hole is more than the aperture of the plated through-hole, is made by lifting the cover plate
The surface for being covered in the circuit board of its selectivity；
S103：The backing plate and/or the cover plate are adjusted, so that the first through hole, second through hole and the circuit board
The central axis of plated through-hole adjust to allowed band, realize the first through hole, second through hole and the circuit
The plated through-hole of plate is with respect to position.
5. the manufacture method of circuit board according to claim 4, it is characterised in that the aperture of the first through hole is more than institute
State the aperture of plated through-hole, the aperture of the first through hole be more than the scope in the plated through-hole aperture for 0.250mm~
0.500mm；And/or,
The aperture of second through hole is more than the aperture of the plated through-hole, and the aperture of second through hole is more than the metallization
The scope in the aperture in hole is 0.150mm~0.250mm.
6. the manufacture method of circuit board according to claim 5, it is characterised in that in the step S30, the scraper
Speed is 15mm/s~30mm/s, and the scraper pressure is more than 5kg/cm2, and the scraper angle is 8 °~20 °.
7. the manufacture method of circuit board according to claim 1, it is characterised in that in the step S40, to the electricity
Road plate is toasted using incremental temperature.
8. the manufacture method of circuit board according to claim 1, it is characterised in that in the step S40, after baking
Circuit board surface carry out nog plate step, the nog plate step using abrasive band and non-woven fabrics alternating nog plate at least twice, abrasive band
Nog plate section and non-woven fabrics nog plate section speed are adjusted to identical.
9. the manufacture method of circuit board according to claim 1, it is characterised in that in the step S50, to circuit board
When being etched, etching surface is in the consent surface being in contact with the cover plate using the circuit board.
10. the manufacture method of the circuit board according to any one of claim 1 to 9, it is characterised in that also include：Step
S60, in carrying out AOI detections to the circuit board after etching, is specifically included：
Step S601：Circuit board is dried in after pickling oxide layer, drying rate is 3.0m/min~3.5m/min；
Step S602：Brown processing is carried out to the circuit board after drying, then carries out volcanic ash nog plate, AOI detections are then carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510137262.7A CN104754885B (en) | 2014-05-06 | 2015-03-26 | The manufacture method of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2014101989942 | 2014-05-06 | ||
| CN201410198994.2A CN103945651A (en) | 2014-05-06 | 2014-05-06 | Circuit board manufacturing method |
| CN201510137262.7A CN104754885B (en) | 2014-05-06 | 2015-03-26 | The manufacture method of circuit board |
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| CN104754885A CN104754885A (en) | 2015-07-01 |
| CN104754885B true CN104754885B (en) | 2017-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410198994.2A Pending CN103945651A (en) | 2014-05-06 | 2014-05-06 | Circuit board manufacturing method |
| CN201510137262.7A Active CN104754885B (en) | 2014-05-06 | 2015-03-26 | The manufacture method of circuit board |
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| CN201410198994.2A Pending CN103945651A (en) | 2014-05-06 | 2014-05-06 | Circuit board manufacturing method |
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| CN105451470B (en) * | 2014-08-29 | 2018-06-26 | 深南电路有限公司 | A kind of processing method of circuit board |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104883822B (en) * | 2015-06-12 | 2017-12-26 | 西安大为印制电路板厂 | It is a kind of to produce that high density is two-sided and the method for multilayer printed circuit board |
| CN105282982A (en) * | 2015-11-24 | 2016-01-27 | 悦虎电路(苏州)有限公司 | Photosensitive preparation method of holes |
| CN105682350A (en) * | 2016-04-05 | 2016-06-15 | 苏州市惠利源科技有限公司 | Half-annular ring circuit board |
| CN107548239A (en) * | 2017-08-07 | 2018-01-05 | 江门崇达电路技术有限公司 | A kind of method for lifting positive outer layer AOI overhaul efficiencies |
| CN109874229B (en) * | 2017-12-04 | 2021-04-09 | 北大方正集团有限公司 | Manufacturing method of PCB stepped hole and PCB |
| CN108449887B (en) * | 2018-04-10 | 2019-12-20 | 生益电子股份有限公司 | Manufacturing method for plating thick copper on local hole wall and PCB |
| CN109275268A (en) * | 2018-11-14 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of PCB back drill production method being less than 0.15mm for medium thickness |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN109413860A (en) * | 2018-11-21 | 2019-03-01 | 广东世运电路科技股份有限公司 | The method that a kind of pair of board metal hole is etched |
| CN109600924A (en) * | 2018-12-17 | 2019-04-09 | 智恩电子(大亚湾)有限公司 | A kind of HDI plate filling holes with resin method |
| CN111800943A (en) * | 2019-04-09 | 2020-10-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN110611997A (en) * | 2019-09-18 | 2019-12-24 | 江苏博敏电子有限公司 | Processing method of copper-plated hole of printed circuit board |
| CN111295052B (en) * | 2020-03-25 | 2021-06-01 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN112518432B (en) * | 2020-10-13 | 2022-05-10 | 欣强电子（清远）有限公司 | Method for improving surface flatness of electroplated platinum and polishing equipment used by same |
| CN112770505B (en) * | 2020-11-27 | 2022-08-05 | 惠州市特创电子科技股份有限公司 | Circuit board and preparation method thereof |
| CN112543551B (en) * | 2020-11-27 | 2022-04-15 | 信丰迅捷兴电路科技有限公司 | Processing technology for COB Mini/Micro LED printed circuit board delta E color difference management and control |
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| CN102056403A (en) * | 2009-10-26 | 2011-05-11 | 株式会社电装 | Printed wiring board |
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| CN104754885A (en) | 2015-07-01 |
| CN103945651A (en) | 2014-07-23 |
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