CN104582240B - circuit board and circuit board manufacturing method - Google Patents
circuit board and circuit board manufacturing method Download PDFInfo
- Publication number
- CN104582240B CN104582240B CN201310510000.1A CN201310510000A CN104582240B CN 104582240 B CN104582240 B CN 104582240B CN 201310510000 A CN201310510000 A CN 201310510000A CN 104582240 B CN104582240 B CN 104582240B
- Authority
- CN
- China
- Prior art keywords
- layer
- substance
- circuit board
- insulating barrier
- metal simple
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of circuit board, it includes circuit substrate, the ink layer and electromagnetic armouring structure containing metal simple-substance set gradually.The circuit substrate includes the external conducting wire layer being in contact and the first insulating barrier.The external conducting wire layer is formed at the side of first insulating barrier.The external conducting wire layer includes ground path.Perforate is formed with first insulating barrier, to expose the ground path.The ink layer containing metal simple-substance is formed at the surface on surface and the ground path that from the perforate exposes of first insulating barrier away from the outer layer conductive layer.The ground path is conducted by the metal simple-substance in the ink layer containing metal simple-substance with the electromagnetic armouring structure.The present invention also provides a kind of circuit board manufacturing method.
Description
Technical field
The present invention relates to circuit board making technology, more particularly to a kind of circuit board and circuit board manufacturing method.
Background technology
Due to the lightening requirement of flexible PCB, when internal wiring is as the signal line transmitted to external signal, lead to
Conductive silver foil (EMI shielding film) is often needed to use to be covered in the outer layer of flexible PCB, to prevent external electromagnetic from doing
The signal loss disturbed interference and caused.
Conductive silver foil is usually four-layer structure, that is, is followed successively by diaphragm, metallic film, anisotropic conductive adhesive paste and mould release membrance.
, it is necessary to which mould release membrance is removed before being fitted, so that anisotropic conductive adhesive paste be combined with each other with flexible PCB.However,
Because the conductive effect of anisotropic conductive adhesive paste is poor compared with metal, it can become from anisotropic conductive adhesive paste to resistance during metallic film transition
Change, therefore, in signal return, the effect of passback also can be poor.In addition, the thickness of anisotropic conductive adhesive paste is thicker, with thicker
The thickness of the flexible PCB of anisotropic conductive adhesive paste is also thicker, it is difficult to meet lightening requirement.
The content of the invention
Therefore, it is necessary to a kind of circuit board and a kind of circuit board manufacturing method be provided, without using anisotropic conductive adhesive paste
The electromagnetic shielding action to signal line can be realized.
A kind of circuit board, it includes circuit substrate, the ink layer and electromagnetic armouring structure containing metal simple-substance set gradually.
The circuit substrate includes the external conducting wire layer being in contact and the first insulating barrier.The external conducting wire layer is formed at institute
State the side of the first insulating barrier.The external conducting wire layer includes ground path.Perforate is formed with first insulating barrier,
To expose the ground path.It is conductive away from the outer layer that the ink layer containing metal simple-substance is formed at first insulating barrier
The surface of layer and the surface of the ground path exposed from the perforate.The ground path passes through the ink containing metal simple-substance
Metal simple-substance in layer is conducted with the electromagnetic armouring structure.
A kind of circuit board manufacturing method, including step:Circuit substrate is provided, the circuit substrate includes the outer layer being in contact
Conductive circuit layer and the first insulating barrier, the external conducting wire layer include signal line and the ground connection around the signal line
Multiple perforates are formed with circuit, first insulating barrier, the ground path exposes from the perforate；In the described first insulation
The ink of metal ion is formed in the surface of layer and perforate；The metal ion in the ink of the metal ion is reduced, with
Form the ink layer containing metal simple-substance；And electromagnetic armouring structure is formed in the ink layer surface containing metal simple-substance, it is described
The material of electromagnetic armouring structure is copper, and the ground path passes through the metal simple-substance in the ink layer containing metal simple-substance and electricity
Magnet shielding structure is mutually conducted.
Circuit board and circuit board manufacturing method that the technical program is provided, are formed containing gold by the surface printed to insulating barrier
Belong to the ink of ion, and reduce the metal ion in the ink of metal ion, to form the ink layer containing metal simple-substance, then
Electromagnetic armouring structure is formed by way of electroless copper and electro-coppering.The electromagnetic armouring structure can be played to signal line
The effect of electromagnetic shielding, so as to prevent the electromagnetic interference of outer bound pair signal line generation.Compared to using in the prior art
Anisotropic conductive adhesive paste formation electro-magnetic screen layer, can effectively shorten the flow of circuit board making, reduce circuit board making cost,
And improve the yield of circuit board making.
Brief description of the drawings
Fig. 1 is the top view for the circuit substrate that the technical program embodiment is provided.
Fig. 2 is sectional view of Fig. 1 circuit substrate along II-II lines.
Fig. 3 is the sectional view after the ink that metal ion is formed on the first insulating barrier in fig. 2.
Fig. 4 be by the metallic in the ink of the metal ion in Fig. 3 be reduced to obtain after metal simple-substance containing gold
Belong to the sectional view of the ink layer of simple substance.
Fig. 5 is the sectional view after the formation chemical plating copper layer of the ink layer containing metal simple-substance in Fig. 4.
Fig. 6 is the sectional view formed on chemical plating copper layer in Figure 5 after copper electroplating layer.
Fig. 7 is the sectional view that the circuit board acquired after welding resisting layer is formed on copper electroplating layer in figure 6.
Fig. 8 is the top view in Fig. 7 circuit board.
Main element symbol description
| Circuit substrate | 110 |
| First insulating barrier | 111 |
| External conducting wire layer | 112 |
| Second insulating barrier | 113 |
| Inner layer conductive line layer | 114 |
| Basalis | 115 |
| Electromagnetic shielding forms area | 110a |
| General area | 110b |
| Perforate | 1111 |
| Signal line | 1121 |
| Ground path | 1122 |
| First line | 1141 |
| Second circuit | 1142 |
| The ink of metal ion | 120 |
| Ink layer containing metal simple-substance | 130 |
| Electromagnetic armouring structure | 140 |
| Chemical plating copper layer | 141 |
| Copper electroplating layer | 142 |
| Welding resisting layer | 150 |
| Circuit board | 100 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
Circuit board provided below in conjunction with drawings and Examples the technical program and preparation method thereof is made further
Describe in detail.
The circuit board manufacturing method that the technical program embodiment is provided comprises the following steps：
The first step, referring to Fig. 1 and 2, there is provided circuit substrate 110.
In the present embodiment, circuit substrate 110 is formed with the circuit board of conducting wire to make.Circuit substrate 110 include from
The first insulating barrier 111, the 112, second insulating barrier 113 of external conducting wire layer, the inner layer conductive line layer up to set gradually down
114 and basalis 115.There is circuit substrate 110 at least one electromagnetic shielding to form area 110a and except the electromagnetic shielding forms area
General area 110b outside 110a, the electromagnetic shielding, which forms area 110a, to be used to form electromagnetism electromagnetic armouring structure.For ease of understanding, this
In embodiment, illustrated so that there is circuit substrate 110 electromagnetic shielding to form area 110a as an example.In other embodiments,
It is described be electromagnetically shielded formed area 110a number can for two, three or more.
The electromagnetic shielding, which is formed in the first insulating barrier 111 in area 110a, is formed with multiple perforates 1111 so that part
External conducting wire layer 112 exposes from the multiple perforate 1111.
External conducting wire layer 112 is located at the side of the first insulating barrier 111, and the electromagnetic shielding is formed in area 110a
External conducting wire layer 112 includes signal line 1121 and ground path 1122.The ground path 1122 surrounds the signal
Circuit 1121, and the ground path 1122 exposes from the multiple perforate 1111.
Second insulating barrier 113 is located at 112 side away from first insulating barrier 111 of external conducting wire layer.
Inner layer conductive line layer 114 is located at one of second insulating barrier 113 away from external conducting wire layer 112
Side.That is, second insulating barrier 113 be located at the external conducting wire layer 112 with inner layer conductive line layer 114 it
Between.The inner layer conductive line layer 114 includes the circuit 1142 of first line 1141 and second.The first line 1141 is located at institute
State electromagnetic shielding to be formed in area 110a, and can be signal line or ground path.Second circuit 1142 is located at described
In the 110b of general area.In the present embodiment, first line 1141 is signal line, and passes through leading in second insulating barrier 113
Electric hole（It is not shown）It is electrical connected with the signal line 1121.
Basalis 115 is located at the inner layer conductive line layer 114 away from the side of the second insulating barrier 113, for carrying
First insulating barrier 111, external conducting wire the 112, second insulating barrier 113 of layer and inner layer conductive line layer 114.The substrate
115 basalis 115 of layer can be flexible resin layer, such as polyimides (Polyimide, PI), polyethylene terephthalate
(Polyethylene Terephthalate, PET) or PEN（Polythylene
Naphthalate, PEN）, or multilager base plate, including the multi-layer resinous layer being alternately arranged and multilayer conductive circuit layer.
I.e. the circuit substrate 110 can be more than two layers of FPC for conductive circuit layer.
In this step, the external conducting wire layer 112 and inner layer conductive line layer 114 can be used leads in the prior art
The preparation method of electric line makes to be formed.The perforate 1111 can be formed by the way of laser ablation.
During perforate 1111 is formed, the material of the original aperture segment in part is remained in perforate 1111, or is inhaled
The inwall of perforate 1111 is invested, glue residue is formed.After perforate 1111 is formed, it can further include to circuit substrate 110
Carry out removing glue Slag treatment.I.e. using plasma is handled circuit substrate 110 so that the glue residue in perforate 1111 is gone
Remove.
Second step, referring to Fig. 3, first insulating barrier formed by the method for printing in electromagnetic shielding in area 110a
The ink 120 of metal ion is formed in 111 surface and perforate 1111.The ink 120 of the metal ion can be containing
The ink of the metal ions such as palladium particle, silver particles, gold particle.In the present embodiment, the ink 120 of the metal ion is containing palladium
The ink of particle.
3rd step, referring to Fig. 4, the metal ion in reducing the ink 120 of the metal ion, will be described containing gold
The ink 120 of category ion becomes the ink layer 130 containing metal simple-substance.The thickness range of the ink layer 130 containing metal simple-substance
For 3 microns to 5 microns.In the present embodiment, the ink layer 130 containing metal simple-substance is the simple substance containing palladium that thickness is 4 microns
Ink layer.
4th step, refers to Fig. 5 and Fig. 6, and one layer of electromagnetic shielding is formed on the surface of ink layer 130 containing metal simple-substance
Structure 140.The electromagnetic armouring structure 140 by the metal simple-substance in the ink layer 130 containing metal simple-substance with it is described outer
Ground path 1122 in layer conductive circuit layer 112 is electrical connected.In the present embodiment, the material of the electromagnetic armouring structure 140
For copper, and the electromagnetic armouring structure 140 can be formed by following steps：
First, one layer of electroless copper is formed on the surface of ink layer 130 containing metal simple-substance in the way of electroless copper
Layer 141.
Then, one layer of copper electroplating layer 142 is formed on the surface of the chemical plating copper layer 141 by way of plating.It is described
Chemical plating copper layer 141 collectively forms the electromagnetic armouring structure 140 with copper electroplating layer 142.
4th step, refers to Fig. 7 and Fig. 8, forms welding resisting layer 150 on the surface of electromagnetic armouring structure 140, obtains circuit
Plate 100.
The welding resisting layer 150 can be formed by way of printing-ink.It is micro- that the thickness of the welding resisting layer 150 is less than 10
Rice.
Referring to Fig. 7, the technical program, which also provides a kind of use above method, makes the circuit board 100 to be formed, the electricity
Road plate 100 includes the circuit substrate 110, the ink layer 130 containing metal simple-substance, electromagnetic armouring structure 140 and anti-welding set gradually
Layer 150.
Circuit substrate 110 includes the first insulating barrier 111, the external conducting wire layer 112, second set gradually from top to bottom
Insulating barrier 113, inner layer conductive line layer 114 and basalis 115.Multiple perforates 1111 are formed with first insulating barrier 111 so that
Portion outer layer conductive circuit layer 112 is exposed from the multiple perforate 1111.External conducting wire layer 112 is located at the first insulating barrier
111 side, it includes signal line 1121 and ground path 1122.The ground path 1122 surrounds the signal line
1121, and the ground path 1122 exposes from the multiple perforate 1111.Second insulating barrier 113 is located at external conducting wire layer
112 sides away from first insulating barrier 111.
The ink layer 130 containing metal simple-substance is formed at first insulating barrier 111 away from the external conducting wire
The surface and the surface of the ground path 1122 exposed from the perforate 1111 of layer 112, and its thickness range is 3 microns to 5 micro-
Rice.The ground path 1122 is tied by the metal simple-substance in the ink layer 130 containing metal simple-substance with the electromagnetic shielding
Structure 140 is conducted.The material of the electromagnetic armouring structure 140 be copper, and the electromagnetic armouring structure 140 thickness be less than or
Equal to 15 microns.The thickness of the welding resisting layer 150 is more than 10 microns.The area of electromagnetic armouring structure 140 is more than signal line
The region of 1121 distributions, and be electrically connected to each other with ground path 1122, so as to play to the electromagnetic screen of signal line 1121
The effect of covering.
It is understood that can also be as needed, the first line 1141 of the inner layer conductive line layer 114 can also
For ground path, and first line 1141 passes through the ground connection of the conductive hole in the second insulating barrier 113 and external conducting wire layer 112
Circuit 1122 is electrical connected, in such cases, and signal line 1121 is located at electromagnetic armouring structure 140 and inner layer conductive line layer
Between 114.Electromagnetic armouring structure 140 and the area of first line 1141 are all higher than the region of the distribution of signal line 1121, and
It is electrically connected to each other with ground path 1122, so as to play to the electromagnetic shielding action of signal line 1121.
Circuit board and preparation method thereof that the technical program is provided, by the surface printed to insulating barrier formed containing metal from
The ink of son, and the metal ion in the ink of metal ion is reduced, to form the ink layer containing metal simple-substance, then pass through
Electroless copper and the mode of electro-coppering form electromagnetic armouring structure.The electromagnetic armouring structure can play electromagnetism to signal line
The effect of shielding, so as to prevent the electromagnetic interference of outer bound pair signal line generation.Compared in the prior art using different side
Property conducting resinl formation electro-magnetic screen layer, can effectively shorten the flow of circuit board making, reduce circuit board making cost, and
Improve the yield of circuit board making.In addition, the thickness range of the ink layer containing metal simple-substance is 3 microns to 5 microns, it is less than different
The thickness of side's property conducting resinl, can reduce the thickness of circuit board.
It will be understood by those skilled in the art that after the ink layer 130 containing metal simple-substance is formed, can also be in list containing metal
Perforate is formed in the ink layer 130 of matter, to expose ground path 1122, when then forming electromagnetic armouring structure, electromagnetic shielding knot
Perforate in ink layer 130 of the structure filling containing metal simple-substance, to cause electromagnetic armouring structure electrical directly with ground path 1122
It is connected.
It is understood that for the person of ordinary skill of the art, can be done with technique according to the invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (10)
1. a kind of circuit board, it includes circuit substrate, the ink layer and electromagnetic armouring structure containing metal simple-substance, institute set gradually
External conducting wire layer and the first insulating barrier that circuit substrate includes being in contact are stated, the external conducting wire layer is formed at described
The side of first insulating barrier, the external conducting wire layer includes being formed with perforate in ground path, first insulating barrier, with
Expose the ground path, the ink layer containing metal simple-substance is formed at first insulating barrier away from the outer layer conductive layer
Surface and the ground path exposed from the perforate surface, the ground path passes through the ink layer containing metal simple-substance
In metal simple-substance conducted with the electromagnetic armouring structure.
2. circuit board as claimed in claim 1, it is characterised in that the circuit substrate also includes the second insulating barrier and internal layer is led
Electric line layer, the external conducting wire layer is formed between second insulating barrier and the first insulating barrier.
3. circuit board as claimed in claim 1, it is characterised in that the ink film thickness scope containing metal simple-substance is 3 micro-
Rice is to 5 microns, and the thickness of the electromagnetic armouring structure is less than or equal to 15 microns.
4. circuit board as claimed in claim 1, it is characterised in that the circuit board also includes welding resisting layer, the welding resisting layer shape
It is less than 10 microns into the thickness in the surface of electromagnetic armouring structure, the welding resisting layer.
5. circuit board as claimed in claim 1, it is characterised in that the metal simple-substance is palladium.
6. a kind of circuit board manufacturing method, including step:
Circuit substrate is provided, the circuit substrate includes the external conducting wire layer being in contact and the first insulating barrier, the outer layer
Conductive circuit layer includes signal line and the ground path around the signal line, is formed with first insulating barrier multiple
Perforate, the ground path exposes from the perforate；
The ink of metal ion is formed in the surface of first insulating barrier and perforate；
The metal ion in the ink of the metal ion is reduced, to form the ink layer containing metal simple-substance；And
In the ink layer surface formation electromagnetic armouring structure containing metal simple-substance, the ground path passes through the list containing metal
Metal simple-substance in the ink layer of matter is mutually conducted with electromagnetic armouring structure.
7. circuit board manufacturing method as claimed in claim 6, it is characterised in that the forming method bag of the electromagnetic armouring structure
Include following steps：
By the method for electroless copper in the ink layer surface formation chemical plating copper layer containing metal simple-substance；And
Copper electroplating layer is formed on the surface of the chemical plating copper layer by electro-plating method, the chemical plating copper layer and copper electroplating layer are total to
With the composition electromagnetic armouring structure.
8. circuit board manufacturing method as claimed in claim 6, it is characterised in that the ink film thickness model containing metal simple-substance
Enclose for 3 microns to 5 microns, the thickness of the electromagnetic armouring structure is less than or equal to 15 microns.
9. circuit board manufacturing method as claimed in claim 6, it is characterised in that the circuit board also includes welding resisting layer, described
Welding resisting layer is formed at the surface of electromagnetic armouring structure, and the thickness of the welding resisting layer is less than 10 microns.
10. circuit board manufacturing method as claimed in claim 6, it is characterised in that the metal simple-substance is palladium.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310510000.1A CN104582240B (en) | 2013-10-25 | 2013-10-25 | circuit board and circuit board manufacturing method |
| TW102139509A TWI484875B (en) | 2013-10-25 | 2013-10-31 | Circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310510000.1A CN104582240B (en) | 2013-10-25 | 2013-10-25 | circuit board and circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104582240A CN104582240A (en) | 2015-04-29 |
| CN104582240B true CN104582240B (en) | 2017-08-25 |
Family
ID=53097144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310510000.1A Active CN104582240B (en) | 2013-10-25 | 2013-10-25 | circuit board and circuit board manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104582240B (en) |
| TW (1) | TWI484875B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934670B (en) * | 2015-07-02 | 2018-04-27 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN105657958B (en) * | 2015-12-29 | 2018-09-04 | 广东欧珀移动通信有限公司 | Mobile terminal, flexible PCB and its manufacturing method |
| CN107305848B (en) * | 2016-04-20 | 2019-08-20 | 碁鼎科技秦皇岛有限公司 | Package substrate, encapsulating structure and preparation method thereof |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN108767063A (en) * | 2018-05-31 | 2018-11-06 | 上海空间电源研究所 | Flexible plastic substrate thin film gallium arsenide solar cell welding module production method |
| CN110859022A (en) * | 2018-08-24 | 2020-03-03 | 三赢科技（深圳）有限公司 | Circuit board and electronic device using same |
| CN111565551B (en) * | 2019-02-13 | 2022-09-20 | 鹏鼎控股(深圳)股份有限公司 | Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure and circuit board |
| CN112020199B (en) * | 2019-05-29 | 2022-03-08 | 鹏鼎控股(深圳)股份有限公司 | Embedded circuit board and manufacturing method thereof |
| CN112449514B (en) * | 2019-08-31 | 2022-12-20 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN111913612A (en) * | 2020-09-15 | 2020-11-10 | 南京华睿川电子科技有限公司 | Capacitive touch screen and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201322836A (en) * | 2011-11-24 | 2013-06-01 | Tatsuta Densen Kk | Shield film, shielded printed wiring board, and method for manufacturing shield film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4914262B2 (en) * | 2006-03-29 | 2012-04-11 | タツタ電線株式会社 | Shield film and shield printed wiring board |
-
2013
- 2013-10-25 CN CN201310510000.1A patent/CN104582240B/en active Active
- 2013-10-31 TW TW102139509A patent/TWI484875B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201322836A (en) * | 2011-11-24 | 2013-06-01 | Tatsuta Densen Kk | Shield film, shielded printed wiring board, and method for manufacturing shield film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104582240A (en) | 2015-04-29 |
| TW201517710A (en) | 2015-05-01 |
| TWI484875B (en) | 2015-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104582240B (en) | circuit board and circuit board manufacturing method | |
| CN104349575B (en) | Flexible PCB and preparation method thereof | |
| JP5272090B2 (en) | Wiring board and manufacturing method thereof | |
| CN103458628B (en) | Multilayer circuit board and making method thereof | |
| CN104754855B (en) | Flexible PCB and preparation method thereof | |
| CN103687344B (en) | Circuit board manufacturing method | |
| CN108966478B (en) | Flexible circuit board and manufacturing method thereof | |
| KR101392164B1 (en) | Microelectronic device and method of manufacturing same | |
| CN104837301A (en) | Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board | |
| CN109769344B (en) | Circuit board and manufacturing method thereof | |
| JP2011159879A (en) | Flexible printed wiring board with shield, method for manufacturing the same, and electronic apparatus | |
| CN108882500A (en) | Flexible circuit board and preparation method thereof | |
| CN103871996A (en) | Package structure and manufacturing method thereof | |
| WO2012117872A1 (en) | Resin substrate with built-in electronic component | |
| CN103929895A (en) | Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element | |
| CN104254213A (en) | Multi-layer circuit board and manufacturing method thereof | |
| CN103052281A (en) | Embedded multilayer circuit board and manufacturing method thereof | |
| TW201038146A (en) | Conformal reference planes in substrates | |
| CN103781292B (en) | Circuit board and preparation method thereof | |
| TW201509264A (en) | Multilayer printed circuit board and method for manufacturing same | |
| CN106658959A (en) | Flexible circuit board and manufacturing method thereof | |
| KR20160124344A (en) | Flexible Printed Circuit and Method for Manufacturing The Same | |
| CN101241901A (en) | Buried chip encapsulation structure and its making method | |
| JP2012033529A (en) | Wiring board | |
| CN104284529B (en) | Rigid-flexible circuit board and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |