CN111565551B - Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure and circuit board - Google Patents
Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure and circuit board Download PDFInfo
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- CN111565551B CN111565551B CN201910690529.3A CN201910690529A CN111565551B CN 111565551 B CN111565551 B CN 111565551B CN 201910690529 A CN201910690529 A CN 201910690529A CN 111565551 B CN111565551 B CN 111565551B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
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Abstract
A circuit board comprises an outer layer conductive circuit layer and a protective layer, wherein a plurality of openings are formed in the protective layer, and part of the outer layer conductive circuit layer is exposed out of the openings; the circuit board further comprises an electromagnetic shielding structure, the electromagnetic shielding structure comprises an insulating layer, a metal shielding layer formed on the insulating layer and a conductive bonding layer formed on the metal shielding layer and back to the insulating layer, the conductive bonding layer of the electromagnetic shielding structure is bonded on the protective layer, part of the conductive bonding layer, the metal shielding layer and the insulating layer are attached to the inner wall of the opening, the conductive bonding layer is electrically connected with the outer conductive circuit layer, and the electromagnetic shielding structure forms a recess in a position corresponding to the opening. The invention also provides a manufacturing method of the other electromagnetic shielding structure and the electromagnetic shielding structure. The electromagnetic shielding structure, the manufacturing method thereof and the circuit board provided by the invention have the advantages of small risk of board explosion, short manufacturing process and low energy consumption.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding structure and a manufacturing method thereof.
Background
With the rapid development of modern electronic industry, wireless communication and digitization technology, various electronic and electrical devices have been mainly focused on military and special industrial fields from the beginning, and have gradually evolved into being widely applied to various fields closely related to people's daily life, such as broadcast television, communication and navigation, electric power facilities, scientific research, medical high-frequency devices and various household appliances, however, these devices and products can generate electromagnetic radiation to different degrees.
At present, an electromagnetic shielding structure made of high-conductivity and high-permeability materials is mostly adopted to shield electromagnetic radiation, and the attenuation value of the electromagnetic shielding is 50-70 decibels. However, with the coming of the 5G era, the electromagnetic shielding attenuation value of 50-70 dB can not meet the requirement. In the prior art, the thickness of the electromagnetic shielding structure is increased to improve the attenuation value of the electromagnetic shielding, but the risk of board explosion of the electromagnetic shielding structure is increased. In addition, the substrate needs to be baked before the electromagnetic shielding structure is pressed on the circuit substrate, so that the manufacturing process of the flexible circuit board is increased and the energy consumption is increased.
Disclosure of Invention
In view of this, the present invention provides an electromagnetic shielding structure with less risk of plate explosion, short manufacturing process and low energy consumption.
It is also necessary to provide a method for manufacturing an electromagnetic shielding structure with low risk of plate explosion, short manufacturing process and low energy consumption.
It is also necessary to provide a circuit board with low risk of board explosion, short manufacturing process and low energy consumption.
A method for manufacturing an electromagnetic shielding structure comprises the following steps: providing a bearing substrate, wherein the bearing substrate comprises an insulating layer and a release film, the insulating layer is formed on the release film, and a protective coating is further formed on the exposed surface of the release film; forming a chemical plating layer on the surface of the insulating layer far away from the release film by adopting a chemical plating mode, wherein the chemical plating layer is provided with a plurality of holes with irregular positions, sizes and shapes, and the chemical plating solution used by the chemical plating comprises a pore regulator, a nickel compound, sodium hypophosphite, a complexing agent, a pH value buffering agent and a KI stabilizing agent; the pore regulator is manganese sulfate, manganese chloride or manganese nitrate, the concentration of the pore regulator is 10-20g/L, the concentration of the nickel compound is 10-35g/L, the concentration of sodium hypophosphite is 15-45g/L, the concentration of the complexing agent is 10-35g/L, the concentration of the pH value buffering agent is 0-20g/L, the concentration of the KI stabilizer is 0-2mg/L, the pH value of the chemical plating solution is 3-4, the temperature of the chemical plating solution is 50-90 ℃, and the chemical plating time is 2-15 minutes; forming a plating metal layer on the chemical plating layer by electroplating to obtain a metal shielding layer; baking; and forming a conductive adhesion layer on the surface of the metal shielding layer far away from the insulating layer.
Further, the porosity of the metal shielding layer is 35% -65%.
An electromagnetic shielding structure is prepared by the manufacturing method of the electromagnetic shielding structure; the electromagnetic shielding structure comprises an insulating layer, a metal shielding layer formed on the insulating layer and a conductive adhesion layer formed on the metal shielding layer and opposite to the insulating layer, wherein the metal shielding layer comprises a chemical plating layer formed on the insulating layer and a plating metal layer formed on the chemical plating layer, and a plurality of holes with irregular positions, sizes and shapes are formed on the chemical plating layer; the conductive adhesion layer is formed on the plating metal layer.
A circuit board comprises an outer layer conducting circuit layer and a protective layer, wherein a plurality of openings are formed in the protective layer, and part of the outer layer conducting circuit layer is exposed out of the openings; the circuit board further comprises the electromagnetic shielding structure, a conductive bonding layer of the electromagnetic shielding structure is attached to the protective layer, part of the conductive bonding layer, the metal shielding layer and the insulating layer are attached to the inner wall of the opening, the conductive bonding layer is electrically connected with the outer conductive circuit layer, and a recess is formed in the position, corresponding to the opening, of the electromagnetic shielding structure.
A method for manufacturing an electromagnetic shielding structure comprises the following steps: providing a bearing substrate, wherein the bearing substrate comprises an insulating layer and a release film, the insulating layer is formed on the release film, and a protective coating is further formed on the exposed surface of the release film; carrying out surface treatment on the insulating layer; forming a chemical plating metal layer on the insulating layer by a chemical plating method to obtain a metal shielding layer, and forming a plurality of chemical plating layers with vertical lattices on the surface of the insulating layer to obtain the metal shielding layer, wherein the vertical lattices are provided with a plurality of holes with irregular positions, sizes and shapes; the chemical plating solution used by the chemical plating comprises a pore regulator, a nickel compound, sodium hypophosphite, a complexing agent, a pH value buffering agent and a KI stabilizer; the pore regulator is saccharin sodium/bissulfonylimide, the concentration of the pore regulator is 0.5-2g/L, the concentration of the nickel compound is 10-35g/L, the concentration of the sodium hypophosphite is 15-45g/L, the concentration of the complexing agent is 10-35g/L, the concentration of the pH value buffering agent is 0-20g/L, the concentration of the KI stabilizer is 0-2mg/L, the pH value of the electroless plating solution is 6.0-8.0, the temperature of the electroless plating solution is 40-60 ℃, and the time of the electroless plating is 2-15 minutes; baking; and forming a conductive adhesion layer on the surface of the metal shielding layer far away from the insulating layer.
Further, the porosity of the metal shielding layer is 80% -98%.
An electromagnetic shielding structure is prepared by the manufacturing method of the electromagnetic shielding structure; the electromagnetic shielding structure comprises an insulating layer, a metal shielding layer formed on the insulating layer and a conductive adhesion layer formed on the metal shielding layer and opposite to the insulating layer, wherein the metal shielding layer comprises a chemical plating layer, the chemical plating layer is provided with a plurality of vertical lattices, and the vertical lattices are provided with a plurality of holes with irregular positions, sizes and shapes.
A circuit board comprises an outer layer conducting circuit layer and a protective layer, wherein a plurality of openings are formed in the protective layer, and part of the outer layer conducting circuit layer is exposed out of the openings; the circuit board further comprises the electromagnetic shielding structure, a conductive bonding layer of the electromagnetic shielding structure is attached to the protective layer, part of the conductive bonding layer, the metal shielding layer and the insulating layer are attached to the inner wall of the opening, the conductive bonding layer is electrically connected with the outer conductive circuit layer, and a recess is formed in the position, corresponding to the opening, of the electromagnetic shielding structure.
According to the electromagnetic shielding structure, the circuit board and the manufacturing method of the electromagnetic shielding structure, holes with irregular sizes and arrangement are formed on the metal shielding layer by adopting chemical plating or vertical lattice plating, so that the risk of board explosion can be reduced, the manufacturing process can be shortened, and the energy consumption can be reduced.
Drawings
Fig. 1 is a cross-sectional view of a carrier substrate according to a first embodiment of the invention.
FIG. 2 is a cross-sectional view of the carrier substrate shown in FIG. 1 after a metal layer is formed on the insulating layer.
Fig. 3 is an enlarged view (picture) of the metal shielding layer shown in fig. 2.
Fig. 4 is a cross-sectional view of a conductive adhesion layer formed on the metal shielding layer shown in fig. 2 to obtain an electromagnetic shielding structure.
Fig. 5 is a sectional view of the release film shown in fig. 4 removed.
Fig. 6 is a cross-sectional view of the electromagnetic shielding structure shown in fig. 5 after removing the release film, which is pressed on a circuit substrate to obtain a circuit board.
Fig. 7 is a sectional view of a circuit board according to a second embodiment of the present invention.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be made on the electromagnetic shielding structure, the manufacturing method thereof, and the specific implementation, structure, features and effects of the circuit board provided by the present invention with reference to fig. 1-7 and the preferred implementation.
Referring to fig. 1-5, the present invention provides a method for manufacturing an electromagnetic shielding structure 20, comprising the following steps:
in a first step, referring to fig. 1, a carrier substrate 10 is provided. The carrier substrate 10 includes a release film 11 and an insulating layer 12 formed on the release film 11.
A protective coating (not shown) is further formed on the exposed surface of the release film 11 to prevent the release film 11 from being corroded in the subsequent electroless plating solution, so as to prevent the electroless plating solution from being consumed and polluted.
Wherein the release film 11 is selected from a Polyethylene (PE) release film, a polyethylene terephthalate (PET) release film, an oriented polypropylene (OPP) release film, a Polycarbonate (PC) release film, a Polystyrene (PS) release film, a polymethylmethacrylate (pmma) release film
The release film may be any one of (polymethyl methacrylate, PMMA), biaxial Polypropylene (BOPP), polymethylpentane (Poly-4-methyl-1-pentane, TPX), polyvinyl chloride (PVC), Polytetrafluoroethylene (PTFE), monosilicon, or polyester, or a combination of at least two thereof. Typical but non-limiting examples of such combinations are: the combination of PE release film and PET release film, the combination of OPP release film and PC release film, the combination of PS release film and PMMA release film, the combination of BOPP release film and TPX release film, the combination of PVC release film and PTFE release film, the combination of monosilicon release film and polyester release film or the combination of PE release film, PET release film and PC release film, etc. The release film 11 is preferably a PET release film.
The insulating layer 12 is an insulating film selected from any one or a combination of at least two of insulating ink, a thermoplastic polyurethane film, a thermoplastic polyimide film, a polyester imide film, a fluorocarbon vinyl film, an imide fiber paper and a polybutylene terephthalate film. Typical but non-limiting examples of such combinations are: a combination of a thermoplastic polyurethane film and a thermoplastic polyimide film, a combination of a polyester imide film and a fluorocarbon ethylene film, a combination of an imide fiber paper and a polybutylene to titanic acid film, a combination of a thermoplastic polyimide film and a polyester imide film, a combination of a thermoplastic polyurethane film and a fluorocarbon ethylene film or a polyester film, a combination of a thermoplastic polyimide film and a polyester imide film, and the like.
In the present embodiment, the insulating layer 12 is insulating ink. Wherein the insulating ink is composed of black paste/filler, flexible resin, thermosetting resin, hardener and the like.
Wherein the thickness of the insulating layer 12 is 5-10 μm.
In a second step, referring to fig. 2-3, a metal shielding layer 13 is formed on the surface of the insulating layer 12 away from the release film 11 by an electroless plating method.
Wherein, a plurality of holes are formed on the metal shielding layer 13. Since the holes are formed in the electroless plating process, the positions, sizes and shapes of the holes on the metal shield layer 13 are irregular. The term "irregularity" herein specifically means: the positions of the holes are randomly distributed and are not limited to a certain position; the shapes of the holes are various and are not limited to a certain shape, and the shapes of the adjacent holes can be the same or different; the size of the holes is not limited to a certain size, and the sizes of the adjacent holes may be the same or different. Wherein the pore diameter of the pores is less than 30 microns.
Specifically, in the first electroless plating method, the step of forming the metal shielding layer 13 by the electroless plating method includes: first, a chemical plating layer (not shown) is formed on the surface of the insulating layer 12 away from the release film 11 by chemical plating. Secondly, forming an electroplating metal layer on the chemical plating layer by electroplating; and baking to obtain a metal shielding layer 13. Next, a plating metal layer (not shown) is formed on the electroless plating layer by electroplating to obtain the metal shielding layer 13. The plated metal layer is to increase the thickness of the metal shielding layer 13. In this embodiment, the thickness of the plated metal layer is 1.5 μm. And baking the bearing substrate 10 with the metal shielding layer 13.
In the first chemical plating method, the chemical plating solution used in the chemical plating is a chemical plating solution commonly used in the industry, but the chemical plating solution further includes a pore regulator, so that a plurality of holes with irregular positions, sizes and shapes are formed on the chemical plating layer. The pore regulator is used for regulating the porosity of the pores. The pore regulator is at least one of manganese sulfate, manganese chloride, manganese nitrate and other additives which can be co-deposited with nickel and can form porous structures such as pores and holes.
In the first electroless plating method, the electroless plating layer is a nickel plating layer having a thickness of 0.5 μm. Wherein, the chemical plating solution also comprises nickel compounds (nickel sulfate/nickel chloride, etc.), sodium hypophosphite, a complexing agent, a pH value buffering agent and a KI stabilizer. The concentration of the nickel compound is 10-35g/L, the concentration of the sodium hypophosphite is 15-45g/L, the concentration of the complexing agent is 10-35g/L, the concentration of the pH value buffering agent is 0-20g/L, the concentration of the pore regulator is 10-20g/L, and the concentration of the KI stabilizer is 0-2 mg/L. The pH value of the chemical plating solution is 3.0-4.0, the temperature of the chemical plating solution is 50-90 ℃, and the chemical plating time is 2-15 minutes. In this embodiment, the complexing agent is citric acid and the pH buffer is sodium acetate.
In the first electroless plating method, the porosity of the metal shielding layer 13 obtained by the electroless plating method is 35% to 65%.
Specifically, in the second electroless plating method, the step of forming the metal shielding layer 13 by electroless plating includes: first, the insulating layer 12 is subjected to a surface treatment and a chemical plating treatment to form a chemical plating layer (not shown) having a plurality of vertical lattices (not shown) on the surface of the insulating layer, wherein the vertical lattices are formed with a plurality of holes with irregular positions, sizes and shapes. Next, the metal shielding layer 13 with the vertical lattice and the holes is baked.
In the second electroless plating method, the electroless plating solution used in the electroless plating is an electroless plating solution commonly used in the industry, but the electroless plating solution further includes a pore regulator, and the pore regulator is sodium saccharin (BSI)/bis (b-phenylene sulfylimide, BBI).
In a second embodiment, the material of the vertical lattice is nickel. In this embodiment, the metal layer is copper, but is not limited to copper. The electroless plating solution used in the method comprises a nickel compound (nickel sulfate/nickel chloride, etc.), sodium hypophosphite, a complexing agent, a pH value buffering agent and a KI stabilizer. Wherein the concentration of the nickel compound is 10-35g/L, the concentration of the sodium hypophosphite is 15-45g/L, the concentration of the complexing agent is 10-35g/L, the concentration of the pH value buffering agent is 0-20g/L, the concentration of the pore regulator is 0.5-2.0g/L, and the concentration of the KI stabilizer is 0-2 mg/L. The pH value of the chemical plating solution is 6.0-8.0, the temperature of the chemical plating solution is 40-60 ℃, and the chemical plating time is 2-15 minutes. In this embodiment, the complexing agent is citric acid and the pH buffering agent is sodium acetate.
In the second chemical plating method, the metal shielding layer 13 with vertical crystals enables the circuit board to have better bending performance, temperature resistance and electromagnetic shielding performance.
In the second electroless plating method, the porosity of the metal shielding layer 13 is 80% to 98%.
The material of the metal shielding layer 13 may be at least one or a combination of metals such as copper, nickel, silver, and titanium.
Wherein, the thickness of the metal shielding layer 13 is 2-6 μm.
Thirdly, referring to fig. 4, a conductive adhesion layer 14 is formed on the surface of the metal shielding layer 13 away from the insulating layer 12, so as to obtain the electromagnetic shielding structure 20.
Wherein, the thickness of the conductive adhesion layer 14 is 5-10 μm.
In this embodiment, the material of the conductive adhesive layer 14 is anisotropic thermosetting conductive adhesive. The anisotropic thermosetting conductive adhesive is composed of flexible resin, conductive powder, thermosetting resin, a hardening agent and the like.
Fourthly, referring to fig. 5, the release film 11 is removed to obtain an electromagnetic shielding structure 20.
The electromagnetic shielding structure 20 includes an insulating layer 12, a metal shielding layer 13 formed on the insulating layer 12, and a conductive adhesion layer 14 formed on the metal shielding layer 13 and opposite to the insulating layer 12.
The insulating layer 12 is an insulating film selected from any one of insulating ink, a thermoplastic polyurethane film, a thermoplastic polyimide film, a polyester imide film, a fluorocarbon ethylene film, an imide fiber paper, and a polybutylene terephthalate film, or a combination of at least two of the above films. Typical but non-limiting examples of such combinations are: a combination of a thermoplastic polyurethane film and a thermoplastic polyimide film, a combination of a polyester imide film and a fluorocarbon ethylene film, a combination of an imide fiber paper and a polybutylene to titanic acid film, a combination of a thermoplastic polyimide film and a polyester imide film, a combination of a thermoplastic polyurethane film and a fluorocarbon ethylene film or a polyester film, a combination of a thermoplastic polyimide film and a polyester imide film, and the like.
In the present embodiment, the insulating layer 12 is insulating ink. Wherein the insulating ink is composed of black paste/filler, flexible resin, thermosetting resin, hardener and the like.
A plurality of holes with irregular positions, sizes and sizes are formed on the metal shielding layer 13, and the aperture of each hole is smaller than 30 micrometers. The term "irregularity" herein specifically means: the positions of the holes are randomly distributed and are not limited to a certain position; the shapes of the holes are various and are not limited to a certain shape, and the shapes of the adjacent holes can be the same or different; the size of the holes is not limited to a certain size, and the sizes of the adjacent holes may be the same or different.
Referring to fig. 5-6, the first embodiment of the invention further provides a method for manufacturing a circuit board 100, which includes the following steps:
referring to fig. 5, a first step of providing the electromagnetic shielding structure 20 is provided.
The electromagnetic shielding structure 20 includes an insulating layer 12, a metal shielding layer 13 formed on the insulating layer 12, and a conductive adhesion layer 14 formed on the metal shielding layer 13 and opposite to the insulating layer 12.
The insulating layer 12 is an insulating film selected from any one or a combination of at least two of insulating ink, a thermoplastic polyurethane film, a thermoplastic polyimide film, a polyester imide film, a fluorocarbon vinyl film, an imide fiber paper and a polybutylene terephthalate film. Typical but non-limiting examples of such combinations are: a combination of a thermoplastic polyurethane film and a thermoplastic polyimide film, a combination of a polyester imide film and a fluorocarbon ethylene film, a combination of an imide fiber paper and a polybutylene to titanic acid film, a combination of a thermoplastic polyimide film and a polyester imide film, a combination of a thermoplastic polyurethane film and a fluorocarbon ethylene film or a polyester film, a combination of a thermoplastic polyimide film and a polyester imide film, and the like.
In the present embodiment, the insulating layer 12 is insulating ink. Wherein the insulating ink is composed of black paste/filler, flexible resin, thermosetting resin, hardener and the like.
A plurality of holes with irregular positions, sizes and dimensions are formed on the metal shielding layer 13, and the aperture of each hole is smaller than 30 micrometers. The term "irregularity" herein specifically means: the positions of the holes are randomly distributed and are not limited to a certain position; the shapes of the holes are various and are not limited to a certain shape, and the shapes of the adjacent holes can be the same or different; the size of the holes is not limited to a certain size, and the sizes of the adjacent holes may be the same or different.
Referring to fig. 6, a circuit substrate 30 is provided and the electromagnetic shielding structure 20 is pressed on the circuit substrate 30.
The circuit board 30 at least includes a substrate layer 31, an outer conductive circuit layer 32 formed on the substrate layer 31, and a protection layer 33 formed on the outer conductive circuit layer 32 and opposite to the substrate layer 31. A plurality of openings 331 are formed on the protective layer 33, and a part of the outer layer conductive trace layer 32 is exposed from the openings 331. The conductive adhesive layer 14 is attached to the protection layer 33, and a portion of the conductive adhesive layer 14 is filled in the opening 331 and electrically connected to the outer conductive trace layer 32.
The passivation layer 33 may be a cover film or a solder mask layer.
In this embodiment, the circuit board 30 is a single-sided circuit board, but in other embodiments, the circuit board may be a double-sided circuit board or a multilayer circuit board.
The first embodiment of the present invention further provides a circuit board 100, wherein the circuit board 100 includes a circuit substrate 30 and an electromagnetic shielding structure 20 formed on the circuit substrate 30. The circuit board 30 at least includes a substrate layer 31, an outer conductive circuit layer 32 formed on the substrate layer 31, and a protection layer 33 formed on the outer conductive circuit layer 32 and opposite to the substrate layer 31. Wherein, a plurality of openings 331 are formed on the protection layer 33. The electromagnetic shielding structure 20 includes an insulating layer 12, a metal shielding layer 13 formed on the insulating layer 12, and a conductive adhesion layer 14 formed on the metal shielding layer 13 and opposite to the insulating layer 12. The conductive adhesive layer 14 is attached to the protection layer 33, and a portion of the conductive adhesive layer 14 is filled in the opening 331 and electrically connected to the outer conductive trace layer 32. A plurality of holes with irregular positions, sizes and sizes are formed on the metal shielding layer 13, and the aperture of each hole is smaller than 30 micrometers. The irregularity here means in particular: the positions of the holes are randomly distributed; the shapes of the holes are various, can be the same or different; the holes may be uniform or non-uniform in size.
Referring to fig. 7, the second embodiment of the present invention further provides a circuit board 200, where the circuit board 200 includes a circuit substrate 30 and an electromagnetic shielding structure 40 formed on the circuit substrate 30. The electromagnetic shielding structure 40 is manufactured by the manufacturing method for manufacturing the electromagnetic shielding structure 20. The circuit board 30 at least includes a substrate layer 31, an outer conductive circuit layer 32 formed on the substrate layer 31, and a protection layer 33 formed on the outer conductive circuit layer 32 and opposite to the substrate layer 31. Wherein, a plurality of openings 331 are formed on the protection layer 33. The electromagnetic shielding structure 40 includes an insulating layer 42, a metal shielding layer 43 formed on the insulating layer 42, and a conductive adhesion layer 44 formed on the metal shielding layer 43 and opposite to the insulating layer 42. The conductive adhesive layer 44 is attached to the protection layer 33, a portion of the conductive adhesive layer 44, the metal shielding layer 43 and the insulating layer 42 is attached to the inner wall of the opening 331, and the conductive adhesive layer 44 is electrically connected to the outer conductive trace layer 32. Since a portion of the conductive adhesive layer 44, the metal shielding layer 43 and the insulating layer 42 are attached to the inner wall of the opening 331, a recess 45 is formed in the electromagnetic shielding structure 40 at a position corresponding to the opening 331.
The present invention will be specifically described below with reference to examples and comparative examples.
Example 1
An electromagnetic shielding structure is provided, in which the thickness of the insulating layer 12 is 6 μm, the thickness of the metal shielding layer 13 is 3 μm, the porosity of the hole of the metal shielding layer 13 is 96%, and the thickness of the conductive adhesive layer 14 is 8 μm. And testing the product characteristics of the product, wherein the product characteristics comprise a shielding attenuation value test, a lattice test, a bending test and a thermal stress test.
Example 2
An electromagnetic shielding structure is provided, in which the thickness of the insulating layer 12 is 6 μm, the thickness of the metal shielding layer 13 is 3 μm, the porosity of the hole of the metal shielding layer 13 is 90%, and the thickness of the conductive adhesion layer 14 is 8 μm. And testing the product characteristics of the product, wherein the product characteristics comprise a shielding attenuation value test, a lattice test, a bending test and a thermal stress test.
Example 3
An electromagnetic shielding structure is provided, in which the thickness of the insulating layer 12 is 6 μm, the thickness of the metal shielding layer 13 is 4 μm, the porosity of the hole of the metal shielding layer 13 is 96%, and the thickness of the conductive adhesion layer 14 is 8 μm. And testing the product characteristics of the product, wherein the product characteristics comprise a shielding attenuation value test, a lattice test, a bending test and a thermal stress test.
Comparative example 1
Commercially available electromagnetic shielding structures are provided and tested for product characteristics including a shield attenuation value test, a percent test, a bend test, and a thermal stress test. The commercially available electromagnetic shielding structure used in this example was a copper foil.
The following table shows the test results of examples 1 to 4 and comparative example 1.
Therefore, the shielding attenuation value of the electromagnetic shielding structure with irregular holes provided by the invention can reach more than 80 decibels and is higher than that of the commercially available electromagnetic shielding structure, and the plate explosion is not easy to occur.
According to the electromagnetic shielding structure, the circuit board and the manufacturing method, the holes are plated on the metal shielding layer 13 by chemical plating or vertical lattice plating, 1) the holes are favorable for volatilization of moisture, so that the risk of board explosion can be reduced, and the electromagnetic shielding structure does not need an additional baking step before being pressed on a circuit substrate, so that the manufacturing process can be shortened, and the energy consumption can be reduced; 2) the holes are formed by chemical plating or vertical lattice plating, so that the positions, the shapes and the sizes of the holes are irregular, the positions, the sizes and the shapes of the holes do not need to be additionally controlled when the holes are manufactured, and the manufacturing method is simpler.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A method for manufacturing an electromagnetic shielding structure comprises the following steps:
providing a bearing substrate, wherein the bearing substrate comprises an insulating layer and a release film, the insulating layer is formed on the release film, and a protective coating is further formed on the exposed surface of the release film;
forming a chemical plating layer on the surface of the insulating layer far away from the release film by adopting a chemical plating mode, wherein the chemical plating layer is provided with a plurality of holes with irregular positions, sizes and shapes, and the chemical plating solution used by the chemical plating comprises a pore regulator, a nickel compound, sodium hypophosphite, a complexing agent, a pH value buffering agent and a KI stabilizing agent; the pore regulator is manganese sulfate, manganese chloride or manganese nitrate, the concentration of the pore regulator is 10-20g/L, the concentration of the nickel compound is 10-35g/L, the concentration of sodium hypophosphite is 15-45g/L, the concentration of the complexing agent is 10-35g/L, the concentration of the pH value buffering agent is 0-20g/L, the concentration of the KI stabilizer is 0-2mg/L, the pH value of the chemical plating solution is 3-4, the temperature of the chemical plating solution is 50-90 ℃, and the chemical plating time is 2-15 minutes;
forming an electroplating metal layer on the chemical plating layer by electroplating to obtain a metal shielding layer, wherein the porosity of the metal shielding layer is 35-65%;
baking; and
and forming a conductive adhesion layer on the surface of the metal shielding layer far away from the insulating layer.
2. A method for manufacturing an electromagnetic shielding structure comprises the following steps:
providing a bearing substrate, wherein the bearing substrate comprises an insulating layer and a release film, the insulating layer is formed on the release film, and a protective coating is further formed on the exposed surface of the release film;
carrying out surface treatment on the insulating layer;
forming a chemical plating metal layer on the insulating layer by a chemical plating method to obtain a metal shielding layer, and forming a plurality of chemical plating layers with vertical lattices on the surface of the insulating layer to obtain the metal shielding layer, wherein the vertical lattices are provided with a plurality of holes with irregular positions, sizes and shapes; the chemical plating solution used by the chemical plating comprises a pore regulator, a nickel compound, sodium hypophosphite, a complexing agent, a pH value buffering agent and a KI stabilizer; the pore regulator is saccharin sodium/bissulfonylimide, the concentration of the pore regulator is 0.5-2g/L, the concentration of the nickel compound is 10-35g/L, the concentration of the sodium hypophosphite is 15-45g/L, the concentration of the complexing agent is 10-35g/L, the concentration of the pH value buffering agent is 0-20g/L, the concentration of the KI stabilizer is 0-2mg/L, the pH value of the electroless plating solution is 6.0-8.0, the temperature of the electroless plating solution is 40-60 ℃, and the time of the electroless plating is 2-15 minutes;
the porosity of the metal shielding layer is 80% -98%;
baking; and
and forming a conductive adhesion layer on the surface of the metal shielding layer far away from the insulating layer.
3. An electromagnetic shielding structure, characterized in that the electromagnetic shielding structure is prepared by the method of claim 1; the electromagnetic shielding structure comprises an insulating layer, a metal shielding layer formed on the insulating layer and a conductive adhesion layer formed on the metal shielding layer and opposite to the insulating layer, wherein the metal shielding layer comprises a chemical plating layer formed on the insulating layer and a plating metal layer formed on the chemical plating layer, and a plurality of holes with irregular positions, sizes and shapes are formed on the chemical plating layer; the conductive adhesion layer is formed on the plating metal layer.
4. An electromagnetic shielding structure, characterized in that the electromagnetic shielding structure is prepared by the method of claim 2; the electromagnetic shielding structure comprises an insulating layer, a metal shielding layer formed on the insulating layer and a conductive adhesion layer formed on the metal shielding layer and opposite to the insulating layer, wherein the metal shielding layer comprises a chemical plating layer, the chemical plating layer is provided with a plurality of vertical lattices, and the vertical lattices are provided with a plurality of holes with irregular positions, sizes and shapes.
5. A circuit board comprises an outer layer conducting circuit layer and a protective layer, wherein a plurality of openings are formed in the protective layer, and part of the outer layer conducting circuit layer is exposed out of the openings; the PCB is characterized in that the PCB further comprises an electromagnetic shielding structure according to claim 3, wherein a conductive adhesion layer of the electromagnetic shielding structure is adhered to the protective layer, part of the conductive adhesion layer, the metal shielding layer and the insulating layer are adhered to the inner wall of the opening, the conductive adhesion layer is electrically connected with the outer conductive circuit layer, and a recess is formed in the position of the electromagnetic shielding structure corresponding to the opening.
6. A circuit board comprises an outer layer conducting circuit layer and a protective layer, wherein a plurality of openings are formed in the protective layer, and part of the outer layer conducting circuit layer is exposed out of the openings; the PCB is characterized in that the PCB further comprises an electromagnetic shielding structure according to claim 4, wherein a conductive adhesion layer of the electromagnetic shielding structure is adhered to the protective layer, part of the conductive adhesion layer, the metal shielding layer and the insulating layer are adhered to the inner wall of the opening, the conductive adhesion layer is electrically connected with the outer conductive circuit layer, and a recess is formed in the position of the electromagnetic shielding structure corresponding to the opening.
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| CN2019101127623 | 2019-02-13 | ||
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| TWI398198B (en) * | 2010-09-13 | 2013-06-01 | Zhen Ding Technology Co Ltd | Printed circuit board having grounded and shielded structure |
| US20150305144A1 (en) * | 2012-06-07 | 2015-10-22 | Tatsuta Electric Wire & Cable Co., Ltd. | Shield film and shield printed wiring board |
| CN104582240B (en) * | 2013-10-25 | 2017-08-25 | 富葵精密组件(深圳)有限公司 | circuit board and circuit board manufacturing method |
| CN106793727A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
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