CN205864957U - Screening arrangement and electronic equipment - Google Patents
Screening arrangement and electronic equipment Download PDFInfo
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- CN205864957U CN205864957U CN201620865558.0U CN201620865558U CN205864957U CN 205864957 U CN205864957 U CN 205864957U CN 201620865558 U CN201620865558 U CN 201620865558U CN 205864957 U CN205864957 U CN 205864957U
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Abstract
This application provides a kind of screening arrangement and electronic equipment, described screening arrangement is for shielding the electronic devices and components arranged on a printed circuit, described screening arrangement includes: substrate, and described substrate can be attached on described printed circuit board (PCB) and cover sets at least one described electronic devices and components；Described substrate have back to first surface and second surface；Wherein, described first surface at least one described electronic devices and components faced by when described substrate is connected on described printed circuit board (PCB)；Being provided with at least one through hole on described substrate, at least one through hole can wear for trip bolt；Insulation division, described insulation division and described substrate are one-body molded, and described insulation division covers first surface and/or the subregion of second surface of described substrate.The screening arrangement of the application can effectively prevent electronic devices and components to be short-circuited, thus protects the printed circuit board (PCB) of electronic equipment, it is to avoid printed circuit board (PCB) is destroyed.
Description
Technical field
The application relates to electromangnetic spectrum field, particularly relates to a kind of screening arrangement.
The application relates to technical field of electronic products, particularly relates to a kind of electronic equipment.
Background technology
The description of this part only provides the background information relevant to disclosure, and does not constitute prior art.
Along with the development of electronic technology, each class of electronic devices emerges in an endless stream.According to the operation principle of electronic circuit, only
Alternating current to be had exists, and just will necessarily produce electromagenetic wave radiation.This electricity that electronic devices and components in electronic equipment produce
Electromagnetic wave radiation neighbouring other electronic devices and components will be produced electromagnetic interference (Electromagnetic Interference,
EMI).This electromagnetic interference may cause the decay of signal or lose completely, thus affects the properly functioning of electronic equipment.
In order to reduce the electromagnetic interference adverse effect to electronic equipment, generally at the printed circuit board (PCB) of electronic equipment
Screening arrangement is set on (Printed Circuit Board, PCB) to absorb and/or reflection electromagnetic interference energy.This shielding fills
Put encirclement electronic devices and components, thus the electromagenetic wave radiation operationally produced by electronic devices and components is limited in certain area, with
Shielding electromagenetic wave radiation, prevents from other neighbouring electronic devices and components are produced electromagnetic interference.
It should be noted that introduction to technical background above be intended merely to the convenient technical scheme to the application carry out clear,
Complete explanation, and facilitate the understanding of those skilled in the art to illustrate.Can not be merely because these schemes be the application's
Background section is set forth and thinks that technique scheme is known to those skilled in the art.
Utility model content
Generally, the electronic devices and components printed circuit board (PCB) of electronic equipment arranged deviate from the surface of printed circuit board (PCB) and extend also
There is certain height.In some cases, when screening arrangement is located at the electronic devices and components on printed circuit board (PCB), have one
The top of the electronic devices and components determining height dimension may contact on the inwall of screening arrangement.Due to screening arrangement generally tool
The material having conductivity is made, therefore, when electronic devices and components contact on the inwall of screening arrangement, charged under running status
Electronic devices and components owing to contacting mutually with the inwall of the screening arrangement that can conduct electricity, thus electronic devices and components are easily short-circuited, as
This, there is destroyed risk in the printed circuit board (PCB) of electronic equipment.
It is arranged in casting of electronic device additionally, screening arrangement is likely to touch back to the surface of electronic devices and components
Other band electrical component, consequently, it is possible to produce electric current in screening arrangement, and then screening arrangement easily generate heat and may be destroyed.
In view of this, this application provides a kind of screening arrangement and electronic equipment, at least to solve one of the problems referred to above.
To achieve these goals, this application provides following technical scheme.
On the one hand the application provides a kind of screening arrangement, and described screening arrangement is for arranging on a printed circuit
Electronic devices and components shield, and described screening arrangement includes:
Substrate, described substrate can be attached on described printed circuit board (PCB) and cover sets at least one described electronic devices and components；Institute
State substrate have back to first surface and second surface, wherein, described first surface is connected to described print at described substrate
In the face of at least one described electronic devices and components time on printed circuit board；At least one through hole it is provided with on described substrate, at least one
Described through hole can wear for trip bolt；Described substrate can be connected by the trip bolt worn in through hole at least one described
On the printed circuit board；
Insulation division, described insulation division and described substrate are one-body molded；Described insulation division covers the first surface of described substrate
And/or the subregion of second surface.
Preferably, the material of described substrate includes following any one: steel alloy, rustless steel, metal-base composites.
Preferably, described screening arrangement also includes that limiting section, described limiting section are arranged on the edge of described first surface
And deviate from the extension of described first surface；When described substrate is connected on described printed circuit board (PCB), described limiting section and described printing
The sidewall of circuit board is inconsistent to carry out spacing to described substrate.
Preferably, described substrate is partially toward the bending of described first surface to form described limiting section by antermarginal.
Preferably, described substrate being provided with at least one groove, at least one described through hole is separately positioned at least one
On the diapire of individual described groove.
Preferably, the material of described insulation division includes following at least one: resin, rubber, glass fibre, asbestos.
Preferably, the thickness of described insulation division is in the range of 3 to 5 microns.
Preferably, described insulation division by physical vapour deposition (PVD) or chemical gaseous phase formation of deposits at the first surface of described substrate
And/or on the subregion of second surface.
Preferably, the pressure voltage of described insulation division is in the range of not less than 100 volts.
Preferably, the scope of the peeling force between described insulation division and the first surface of described substrate and/or second surface
For not less than 10 Ns.
On the other hand the application provides a kind of electronic equipment, comprising:
Printed circuit board (PCB), described printed circuit board (PCB) is provided with electronic devices and components；
Screening arrangement as described in one of above-mentioned embodiment, described screening arrangement is arranged the most also
Electronic devices and components at least one described are shielded；Described insulation division is in the face of at least one described electronic devices and components.
Preferably, described electronic equipment includes following any one: mobile phone, Flat electronic equipment, computer, GPS lead
Boat instrument, personal digital assistant, intelligence wearable device.
By above technical scheme, the application is by the first surface at the electronic devices and components on printed circuit board (PCB)
On insulation division is set, thus electronic devices and components deviate from printed circuit board (PCB) extend there is certain altitude time, electronic devices and components will top
Touch on insulation division, thus can effectively prevent electronic devices and components to be short-circuited, and then make the printed circuit board (PCB) of electronic equipment keep away
Exempt from destroyed.
Additionally, insulation division can also be arranged on substrate back on the second surface of electronic devices and components, such that it is able to by substrate
And carry out conduction insulation between the band electrical component outside the screening arrangement of the application, thus can effectively avoid in a substrate
Produce and make its electric current generated heat, it is to avoid substrate is destroyed.
Other application will become obvious according to description provided herein.The description of this utility model content and tool
Body example is only intended to the purpose illustrated, it is not intended that limit scope of the present utility model.
Accompanying drawing explanation
Accompanying drawing described here is only used for task of explanation, and is not intended to limit model disclosed in the present application by any way
Enclose.It addition, the shape of each parts in figure and proportional sizes etc. are only schematically, it is adapted to assist in the understanding to the application, and
It not shape and the proportional sizes specifically limiting each parts of the application.Those skilled in the art, can under teachings of the present application
To select various possible shape and proportional sizes to implement the application as the case may be.In the accompanying drawings:
Fig. 1 is the Facad structure schematic diagram of the screening arrangement of the application embodiment；
Fig. 2 is the structure schematic diagram of the screening arrangement of the application embodiment；
Fig. 3 is the plan structure schematic diagram of the screening arrangement of the application embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the application embodiment, the technical scheme in the application embodiment is carried out clearly
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the application rather than whole realities
Execute mode.Based on the embodiment in the application, those of ordinary skill in the art are institute under not making creative work premise
Other embodiments all obtained, broadly fall into the scope of the application protection.
It should be noted that when element is referred to as " being arranged at " another element, and it can be directly on another element
Or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can be to be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left ",
For illustrative purposes only, being not offered as is unique embodiment for " right " and similar statement.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field belonging to the application
The implication that technical staff is generally understood that is identical.Term used in the description of the present application is intended merely to describe tool herein
The purpose of the embodiment of body, it is not intended that in limiting the application.Term as used herein "and/or" includes one or more
Arbitrary and all of combination of relevant Listed Items.
Embodiment 1
As it is shown in figure 1, be the Facad structure schematic diagram of the screening arrangement 100 of the application embodiment；As in figure 2 it is shown, be
The structure schematic diagram of the screening arrangement 100 of the application embodiment；As it is shown on figure 3, be the shielding of the application embodiment
The plan structure schematic diagram of device 100.Seeing also Fig. 1 to Fig. 3, the screening arrangement 100 that the present embodiment provides is for setting
The electronic devices and components (not shown) put in printed circuit board (PCB) (not shown) shields.
The screening arrangement 100 of the present embodiment includes: substrate 10, described substrate 10 can be attached on described printed circuit board (PCB) and
Cover sets at least one described electronic devices and components；Described substrate 10 have back to first surface 101 and second surface 102, its
In, described first surface 101 is first in the face of at least one described electronics when described substrate 10 is connected on described printed circuit board (PCB)
Device；Being provided with at least one through hole 103 on described substrate 10, at least one described through hole 103 can wear for trip bolt；Logical
Cross the trip bolt worn at least one described through hole 103 can be connected on the printed circuit board by described substrate 10；Absolutely
Edge 20, described insulation division 20 and described substrate 10 are one-body molded；Described insulation division 20 covers the first surface of described substrate 10
101 and/or the subregion of second surface 102.
The screening arrangement 100 of the embodiment of the present application is by the first surface at the electronic devices and components on printed circuit board (PCB)
Insulation division 20 is set on 101, thus electronic devices and components deviate from printed circuit board (PCB) extend there is certain altitude time, electronic devices and components
To contact on insulation division 20, thus can effectively prevent electronic devices and components to be short-circuited, and then make the printing electricity of electronic equipment
Road plate is avoided destroyed.
Additionally, insulation division 20 can also be arranged on substrate 10 back on the second surface 102 of electronic devices and components, thus can
So that conduction insulation will be carried out between substrate 10 and the band electrical component outside the screening arrangement 100 of the embodiment of the present application, thus
Can effectively avoid in substrate 10, produce the electric current making it generate heat, it is to avoid substrate 10 is destroyed.
Substrate 10 is plate-shaped and has certain plate face area, in order to the electronics unit device being located on printed circuit board (PCB)
On part, thus electronic devices and components are carried out electromagnetic shielding.
In order to reach electromagnetic shielding action, substrate 10 should be made of an electrically conducting material.Preferably, the material bag of substrate 10
Include following any one: steel alloy, rustless steel, metal-base composites.
Steel alloy, rustless steel or metal-base composites have preferably electric conductivity.And above-mentioned material is easy to get in reality,
The cost of the substrate 10 making to use any one material above-mentioned to make is relatively low.
At least one through hole 103 arranged on substrate 10 is for wearing for trip bolt, so that substrate is fixedly installed on print
On printed circuit board.
In order to avoid the cap body of trip bolt because exceeding the second surface 102 of substrate 10 and shape is arranged in pairs in electronics as far as possible
The interference of other parts in apparatus casing, in the present embodiment, can arrange at least one groove 104 on the substrate 10,
At least one through hole 103 is separately positioned on the diapire of at least one groove 104.So, it is located at least one at trip bolt
Time in individual through hole 103, the cap body of trip bolt can be housed in correspondingly in groove, such that it is able to make the cap body of trip bolt
Upper surface be less than second surface 102, or, less than second surface 102, thus reach the cap body avoiding trip bolt to other zero
Parts form the problem interfered.
At least one through hole 13 and accordingly at least one groove 104 evenly spaced can be arranged on substrate 10 edge
Place, thus it is located in setting that at least one through hole 103, substrate 10 can relatively be consolidated by trip bolt on a printed circuit.
For the ease of substrate 10 is installed on a printed circuit, can be provided on the substrate 10 when mounted to base
Plate carries out spacing limiting section.Concrete, please continue to refer to Fig. 1 to Fig. 3, screening arrangement 100 can also include limiting section 30, limit
Position portion 30 is arranged on the edge of first surface 101 and deviates from first surface 101 and extend；When substrate 10 is connected to printed circuit board (PCB)
On, limiting section 30 is inconsistent to carry out spacing to substrate 10 with the sidewall of printed circuit board (PCB).
When being installed on a printed circuit by substrate 10, the limiting section 30 being arranged on substrate 10 edge can block in advance
It is located on the sidewall of printed circuit board (PCB), thus substrate 10 is carried out spacing.
Limiting section 30 can be one-body molded with substrate 10, and so, limiting section 30 is a part for substrate 10 self structure.
Concrete, substrate 10 bends to form described limiting section 30 by the antermarginal first surface 101 that is partially toward.As such, it is possible to it is simple
Changing the molding procedure of limiting section 30, actual manufacturing process is relatively simple.
In the present embodiment, insulation division 20 covers the first surface 101 of substrate 10 and/or the part district of second surface 102
Territory.Such as, insulation division 20 can the subregion of first surface 101 of a covering substrate 10；Or, insulation division 20 can also be only
Cover the subregion of the first surface 101 of substrate 10；Or, insulation division 20 can also cover the first surface 101 of substrate 10
Subregion with second surface 102.
When the subregion of the first surface 101 of 20 covering substrates 10 of insulation division, insulation division 20 is just to being arranged on print
Electronic devices and components on printed circuit board.In reality, insulation division 20 covers the subregion of the first surface 101 of substrate 10 according to it
Just to the position of electronic devices and components carry out adaptive change and adjust, this is not construed as limiting by the application.
Same, when the subregion of the second surface 102 of 20 covering substrates 10 of insulation division, insulation division 20 is just to setting
Put other band electrical component in casting of electronic device.In reality, insulation division 20 covers the portion of the second surface 102 of substrate 10
Subregion can also according to its just to the position of band electrical component carry out adaptive change and adjust, this is not limited by the application
Fixed.
Same, when insulation division 20 covers the subregion of the first surface 101 of substrate 10 and second surface 102, insulation
The subregion of first surface 101 and second surface 102 that portion 20 covers substrate 10 carries out adaptation according to situation described above
Change and adjustment, this is also not construed as limiting by the application.
Fig. 1 and Fig. 3 schematically illustrates insulation division 20 and covers on the subregion of first surface 101.But, it should
Being understood by, Fig. 1 and Fig. 3 is only illustrative a kind of embodiment of description the application, in order to highlight the technical side of the application
Case, insulation division 20 covers the subregion of second surface 102, and insulation division 20 covers first surface 101 and second surface 102
Figure of description corresponding to the embodiment of subregion carried out simply.However, it should be understood that the embodiment of the present application is in scope
On be the most therefore restricted.
Insulation division 20 can include the current material with insulating properties of any appropriate.Concrete, such as, insulation division 20
Material include following at least one: resin, rubber, glass fibre, asbestos.Any one material above-mentioned is respectively provided with preferably
Insulate the performance conducted electricity, and any one material above-mentioned is also common insulant, thus manufacturing cost is relatively low.
Additionally, in order to make insulation division 20 have enough insulating properties, insulation division 20 should cover on the surface of substrate 201
Certain thickness.It is preferred that the thickness of insulation division 20 is in the range of 3 to 5 microns.When the thickness of insulation division 20 is less than 3 microns, difficult
To ensure that insulation division 20 has the performance of enough insulation conductions；When the thickness of insulation division 20 is more than 5 microns, increasing is processed
The difficulty manufactured, makes manufacturing cost increase.Therefore, in the embodiment of the present application, the thickness of insulation division 20 is 3 to 5 microns and is advisable.
When the electronic devices and components arranged on a printed circuit or the band electrical component being arranged in casting of electronic device
When touching insulation division 20, insulation division 20 can be by the electronic devices and components on printed circuit board (PCB) or band electrical component and substrate 10
Between carry out conduction insulation.Therefore, insulation division 20 has sufficiently large insulation resistance, so that insulation division 20 is touching printing
When electronic devices and components on circuit board or band electrical component, it is possible to bear a range of magnitude of voltage and the most breakdown, protect
Card insulation division 20 can be permanent for the electronic devices and components on substrate 10 and printed circuit board (PCB) or between band electrical component provide
Insulation protection.
In reality, the supply voltage of electronic equipment is generally below predetermined threshold.This predetermined threshold is with the kind of electronic equipment
(such as, mobile phone, Flat electronic equipment, computer etc.), model (such as, same kind of electronic equipment has not model)
Different and may be different.And when the scope of the pressure voltage of insulation division 20 is not less than 100 volts, can substantially meet majority
The use demand of electronic equipment.When the scope of the pressure voltage of insulation division 20 is higher, manufacturing cost not only can be made to be greatly improved, and
And the category being suitable for electronic equipment expands the most therewith.Therefore, in the case of taking into account manufacturing cost and the suitability,
The scope of the pressure voltage of insulation division 20 is preferable not less than 100 volts.
When electronic equipment operationally, being arranged on electronic devices and components on printed circuit board (PCB) can generate heat；And when electronic equipment stops
After only running, the heat that electronic devices and components produce can gradually disperse, thus, electronic devices and components can slowly cool down.So, by this Shen
Please the screening arrangement 100 of embodiment for the electronic devices and components arranged on a printed circuit are shielded, screening arrangement 100
Often it is in the environment colded and heat succeed each other.Therefore, insulation division 20 should with first surface 101 and/or the second surface 102 of substrate 10
There is certain peel strength, it is to avoid insulation division 20 in the environment colded and heat succeed each other with the first surface 101 and/or of substrate 10
Two surface 102 phases are peeled off.
For these reasons, in the embodiment of the present application, insulation division 20 and substrate 10 are one-body molded.Concrete, insulation division
The material of 20 parts contacted with first surface 101 and/or the second surface 102 of substrate 10 reaches molecule or former with substrate 10
Melting mutually of sub-rank, so that insulation division 20 forms a part for substrate 10.
In a specific embodiment, insulation division 20 can be by physical vapour deposition (PVD) or chemical gaseous phase formation of deposits at base
On the first surface 101 of plate 10 and/or the subregion of second surface 102.
In the present embodiment, utilize physical vapour deposition (PVD) (Physical Vapor Deposition, PVD) technique permissible
Insulant is transferred to first surface 101 and/or the second surface 102 of substrate 10, to be formed with the form of atom or molecule
Described insulation division 20.Or, utilizing chemical gaseous phase to deposit (Chemical Vapor Deposition, CVD) technique can be by absolutely
Edge material is passed through the reative cell being placed with substrate 10 in gaseous form, by space gas-phase chemical reaction at the first of substrate 10
Deposit on surface 101 and/or second surface 102, to form described insulation division 20.
Utilize physical vapour deposition (PVD) or chemical vapor deposition method at the first surface 101 of substrate 10 and/or second surface
102 form described insulation division 20, and it is higher with the peel strength of the first surface 101 of substrate 10 and/or second surface 102.From
And make insulation division 20 can remain to close over the first surface 101 and/or second at substrate 10 in the environment of colding and heat succeed each other
Situation about peeling off it is not susceptible on surface 102.
It is demonstrated experimentally that insulation division 20 and substrate 10 are one-body molded, the first surface 101 of insulation division 20 and substrate 10 and/or
Peeling force between second surface 102 is in the range of less than 10 Ns.Thus the insulation division 20 preferably avoided is from the of substrate 10
Peel off on one surface 101 and/or second surface 102.
The screening arrangement 100 of the embodiment of the present application is by the first surface at the electronic devices and components on printed circuit board (PCB)
Insulation division 20 is set on 101, thus electronic devices and components deviate from printed circuit board (PCB) extend there is certain altitude time, electronic devices and components
To contact on insulation division 20, thus can effectively prevent electronic devices and components to be short-circuited, and then make the printing electricity of electronic equipment
Road plate is avoided destroyed.
Additionally, insulation division 20 can also be arranged on substrate 10 back on the second surface 102 of electronic devices and components, such that it is able to
Conduction insulation will be carried out between substrate 10 and the band electrical component outside the screening arrangement 100 of the embodiment of the present application, thus can
Effectively avoid in substrate 10, produce the electric current making it generate heat, it is to avoid substrate 10 is destroyed.
Embodiment 2
The embodiment of the present application provides a kind of electronic equipment, comprising: printed circuit board (PCB), described printed circuit board (PCB) is arranged
There are electronic devices and components；Screening arrangement 100 as described in one of above-mentioned embodiment, described screening arrangement 100 is arranged on described print
Shield on printed circuit board and to electronic devices and components at least one described；Described insulation division 20 is in the face of at least one described electronics
Components and parts.
Preferably, described electronic equipment includes following any one: mobile phone, Flat electronic equipment, computer, GPS lead
Boat instrument, personal digital assistant, intelligence wearable device.
It should be noted that in this application, the electronic devices and components that printed circuit board (PCB) and printed circuit board (PCB) are arranged can
Thinking the existing structure of any appropriate, this is not construed as limiting by the application.
Additionally, for the basic function realizing electronic equipment, the electronic equipment in the application can also include that other is required
Module or parts.Such as, mobile phone can also include communication module, battery etc..It should be noted that the electricity that the present embodiment provides
Other required module that subset includes or parts can select the existing structure of any appropriate.For being clearly briefly described this
The technical scheme that application is provided, will no longer repeat above-mentioned part at this.However, it should be understood that the present embodiment is in scope
On be the most therefore restricted.
It should be noted that in the description of the present application, term " first ", " second " etc. are only used for describing purpose and difference
, the most there is not sequencing in similar object, can not be interpreted as instruction or hint relative importance.Additionally,
In the description of the present application, except as otherwise noted, " multiple " are meant that two or more.
Any digital value in the application all includes the lower value between lower limit to higher limit with an incremented
With all values of upper value, between any lower value and any much higher value, there is the interval of at least two unit.For example,
If elaborating that the quantity of parts or the value of process variable are from 1 to 90, preferably from 21 to 80, more preferably from 30 to 70,
Such as 15 to 85,22 to 68,43 to 51,30 to 32 are listed the most clearly equivalent during then purpose illustrates that this description.
For the value less than 1, suitably think that a unit is 0.0001,0.001,0.01,0.1.These only want clear and definite table
The example reached, it is believed that likely combining of the numerical value enumerated between minimum and peak is all to exist in a similar manner
This description is expressly set forth.
It should be understood that above description is to illustrate rather than to limit.By reading above-mentioned retouching
Stating, the many embodiments outside the example provided and many application will be the most all aobvious and easy
See.Therefore, the scope of this teaching should not determine with reference to foregoing description, but should with reference to aforementioned claim and this
The four corner of the equivalent that a little claim are had determines.Include specially for comprehensive purpose, all articles and reference
The disclosure of profit application and bulletin is all passed through with reference to being incorporated herein.Theme disclosed herein is omitted in aforementioned claim
Any aspect is not intended to abandon this body matter, also should not be considered as applicant and is not thought of as disclosed by this theme
A part for application theme.
Claims (12)
1. a screening arrangement, the electronic devices and components that described screening arrangement is used for arranging on a printed circuit shield,
It is characterized in that, described screening arrangement includes:
Substrate, described substrate can be attached on described printed circuit board (PCB) and cover sets at least one described electronic devices and components；Described base
Plate have back to first surface and second surface, wherein, described first surface described substrate be connected to described printing electricity
In the face of at least one described electronic devices and components time on the plate of road；At least one through hole it is provided with, described at least one on described substrate
Through hole can wear for trip bolt；Described substrate can be connected to institute by the trip bolt worn in through hole at least one described
State on printed circuit board (PCB)；
Insulation division, described insulation division and described substrate are one-body molded；Described insulation division cover described substrate first surface and/or
The subregion of second surface.
2. screening arrangement as claimed in claim 1, it is characterised in that the material of described substrate includes following any one:
Steel alloy, rustless steel, metal-base composites.
3. screening arrangement as claimed in claim 1, it is characterised in that described screening arrangement also includes limiting section, described spacing
Portion is arranged on the edge of described first surface and deviates from the extension of described first surface；When described substrate is connected to described printing electricity
On the plate of road, described limiting section is inconsistent to carry out spacing to described substrate with the sidewall of described printed circuit board (PCB).
4. screening arrangement as claimed in claim 3, it is characterised in that described substrate is partially toward described first by antermarginal
Surface bends to form described limiting section.
5. screening arrangement as claimed in claim 1, it is characterised in that be provided with at least one groove on described substrate, at least
One described through hole is separately positioned on the diapire of at least one described groove.
6. screening arrangement as claimed in claim 1, it is characterised in that the material of described insulation division includes following at least one
Kind: resin, rubber, glass fibre, asbestos.
7. screening arrangement as claimed in claim 1, it is characterised in that the thickness of described insulation division is in the range of 3 to 5 microns.
8. screening arrangement as claimed in claim 1, it is characterised in that described insulation division is by physical vapour deposition (PVD) or chemical gaseous phase
Formation of deposits is on the first surface of described substrate and/or the subregion of second surface.
9. screening arrangement as claimed in claim 1, it is characterised in that the pressure voltage of described insulation division is in the range of being not less than
100 volts.
10. screening arrangement as claimed in claim 1, it is characterised in that the first surface of described insulation division and described substrate and/
Or the peeling force between second surface is in the range of not less than 10 Ns.
11. 1 kinds of electronic equipments, it is characterised in that including:
Printed circuit board (PCB), described printed circuit board (PCB) is provided with electronic devices and components；
Screening arrangement as described in one of the claims, described screening arrangement is arranged on the printed circuit board and to extremely
Few described electronic devices and components shield；Described insulation division is in the face of at least one described electronic devices and components.
12. electronic equipments as claimed in claim 11, it is characterised in that described electronic equipment includes following any one:
Mobile phone, Flat electronic equipment, computer, GPS navigator, personal digital assistant, intelligence wearable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620865558.0U CN205864957U (en) | 2016-08-11 | 2016-08-11 | Screening arrangement and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620865558.0U CN205864957U (en) | 2016-08-11 | 2016-08-11 | Screening arrangement and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205864957U true CN205864957U (en) | 2017-01-04 |
Family
ID=57657664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620865558.0U Active CN205864957U (en) | 2016-08-11 | 2016-08-11 | Screening arrangement and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205864957U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874228A (en) * | 2019-03-28 | 2019-06-11 | 联想(北京)有限公司 | Electronic equipment |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
-
2016
- 2016-08-11 CN CN201620865558.0U patent/CN205864957U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874228A (en) * | 2019-03-28 | 2019-06-11 | 联想(北京)有限公司 | Electronic equipment |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111050534B (en) * | 2019-12-19 | 2022-02-18 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
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