CN102056448B - Electronic module - Google Patents
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- CN102056448B CN102056448B CN 200910209344 CN200910209344A CN102056448B CN 102056448 B CN102056448 B CN 102056448B CN 200910209344 CN200910209344 CN 200910209344 CN 200910209344 A CN200910209344 A CN 200910209344A CN 102056448 B CN102056448 B CN 102056448B
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- electronics module
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Abstract
The invention provides an electronic module which comprises a plurality of electronic elements and a shell part, wherein the shell part is provided with a circuit carrier plate, a circuit cover plate and a circuit side plate, the circuit side plate is fixedly supported between the circuit carrier plate and the circuit cover plate, the circuit cover plate is electrically connected with the circuit carrier plate through the circuit side plate, and the circuit carrier plate and the circuit cover plate as well as the circuit side plat form a space used for accommodating the electronic elements.
Description
Technical field
The invention relates to a kind of electronics module, and particularly relevant for a kind of electronics module that increases the space availability ratio in the module.
Background technology
Progress along with electronic industry, electronic product miscellaneous is also constantly weeded out the old and bring forth the new, individual digital assistant (Personal Digital Assistant for example, PDA), the consumption electronic products such as portable computer and intelligent mobile phone (Smart Phone), not only volume is day by day compact, price is increasingly cheap, diversification more becomes on the function, make consumption electronic products use non-simple communication of past, editor or account, still possesses other function, as support high speed Internet access, download games, shopping waits the wireless data communication function on the line, becomes most of people's lives and the upper indispensable part of work.
Integration with wireless data communication and computer is used, be subject to the restriction of frequency range in the past, can't bear too large transmission quantity, but intelligent mobile phone has now adopted third generation mobile technology (3G) with better function, but except transferring voice, also have personal information management function, online send and receive e-mail (E-mail) function, read news, Download Info function, image transmission etc., therefore, each part of its internal integration and develop multiple electronics module is responsible for carrying out and the required information of MOS.
Please refer to the generalized section of Fig. 1 electronics module, have a plurality of electronic components 110 in this electronics module 100, it is electrically connected by circuit board 120 and host circuit board (not illustrating), so that electronic component 110 can be carried out above-mentioned functions according to the instruction of microprocessor on the host circuit board.Yet, the area of circuit board 120 is limited, if only electronic component 110 is disposed on the single plane, can't hold more electronic component 110, if and the too large utilance that also can affect the space of the height fall of electronic component 110, can't dwindle the height of electronics module 100.In addition, if cover above-mentioned electronic components 110 and be fixed on the circuit board 120 with metal cover board 130, though can prevent Electromagnetic Interference and increase structural strength, but metal cover board 130 can increase cost, and metal cover board 130 certainly will can't meet the requirement of thin type for originally inadequate configuration space and measure without any improvement in the module.Accordingly, how to design a kind of electronics module that need not metal cover board, can increase again the space availability ratio in the module, real problem of desiring most ardently solution for industry.
Summary of the invention
The invention provides a kind of electronics module, need not metal cover board, and the quantity of the electronic component in the module increases, to improve space availability ratio.
The present invention proposes a kind of electronics module, comprises a plurality of electronic components and a housing section.Housing section has a circuit board, a circuit cover plate and a circuit side plate, the circuit side plate is fixedly fastened between circuit board and the circuit cover plate, the circuit cover plate is electrically connected by circuit side plate and circuit board, these electronic components are separately positioned on circuit board and the circuit cover plate, and circuit board, circuit cover plate and circuit side plate surround a space, in order to containing electronic components.
In an embodiment of the present invention, above-mentioned electronic component arrangements is on relative two surfaces of circuit board and circuit cover plate.
In an embodiment of the present invention, above-mentioned electronic component utilizes the design configurations of height fall in the space, to increase the utilance in space.
In an embodiment of the present invention, overlapped on the short transverse of above-mentioned portions of electronics element in the space.
In an embodiment of the present invention, the foregoing circuit cover plate utilizes an opening to manifest at least one electronic component, to reduce the height of circuit cover plate.
In an embodiment of the present invention, the foregoing circuit support plate is positioned at the bottom surface of housing section, in order to bearer circuit cover plate and circuit side plate.
In an embodiment of the present invention, the foregoing circuit side plate be surrounded on housing section around, to form a circulus.
In an embodiment of the present invention, the foregoing circuit cover plate is positioned at the end face of housing section, and is covered on the circuit side plate.
In an embodiment of the present invention, the foregoing circuit support plate is tellite, ceramic substrate or semiconductor substrate.
In an embodiment of the present invention, the foregoing circuit cover plate is tellite, ceramic substrate or semiconductor substrate.
In an embodiment of the present invention, the foregoing circuit side plate is a connector, and connector has a plurality of splicing ears, is electrically connected circuit board and circuit cover plate.
In an embodiment of the present invention, the foregoing circuit side plate is a wiring board, and wiring board has a plurality of splicing ears, is electrically connected circuit board and circuit cover plate.
In an embodiment of the present invention, above-mentioned splicing ear comprises conductive projection, conducting film or conduction stitch.
In an embodiment of the present invention, above-mentioned housing section also comprises a metal level, is covered on the circuit cover plate, to form a metallic shield cover plate.
In an embodiment of the present invention, electronics module comprises radio frequency module, Internet module, communication module group or image transmission module.
Based on above-mentioned, electronics module of the present invention replaces existing metal cover board with the circuit cover plate, can increase again the quantity of electronic component, allows spatial accommodation learn sufficient utilization, to improve the space availability ratio in the module, makes the volume of electronics module less.In addition, electronics module, is surrounded on around the housing section as the circuit side plate with connector or wiring board, can have simultaneously signal transmission and structural bond strength, ease of assembly.
For the above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate institute's accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the generalized section of a kind of electronics module of prior art;
Fig. 2 is the generalized section of one embodiment of the invention electronics module;
Fig. 3 is the generalized section of another embodiment of the present invention electronics module.
The main element symbol description
The 100-electronics module; The 110-electronic component; The 120-circuit board;
The 130-metal cover board; The 200-electronics module; The 202-housing section;
The 210-electronic component; The 220-circuit board; 230-circuit cover plate;
240-circuit side plate; The 242-splicing ear; The 250-metal level;
The 300-electronics module; The C-spatial accommodation; The O-opening;
212-the first electronic component; 214-the second electronic component.
Embodiment
Fig. 2 is the generalized section of one embodiment of the invention electronics module.This electronics module 200 is configurable in consumption electronic products, and supports the instruction of operating system, to carry out modular function.Electronics module 200 is such as being radio frequency module, Internet module, communication module group or image transmission module etc., this electronics module 200 is configurable on host circuit board (not illustrating), and have a plurality of electronic components 210 in the electronics module 200, it is electrically connected by circuit board 220 and host circuit board, so that electronic component 210 can be carried out above-mentioned functions according to the instruction of the microprocessor on the host circuit board.
In addition, a plurality of electronic components 210 are disposed at the spatial accommodation C that circuit board 220, circuit cover plate 230 and circuit side plate 240 surround, to consist of an electronics module.In order to improve the space availability ratio in the module, these electronic components 210 are disposed on relative two surfaces of circuit board 220 and circuit cover plate 230, and the design of these electronic component 210 available height drops, the electronic component (the first electronic component 212 and the second electronic component 214) of reduced size is configured in respectively upper and lower both sides, so that overlapped on the short transverse of portions of electronics element 210 in spatial accommodation C.Hence one can see that, and on circuit board 220 configurable a part of electronic component 210, also configurable another part electronic component 210 on the circuit cover plate 230 has two circuit planes to be used so that original only single circuit plane becomes.Therefore, these electronic components 210 do not need all to be disposed on the single plane, but can be disposed at dispersedly on relative two surfaces, available area thereby change are large, relatively, the quantity of electronic component 210 also can increase, and the available height drop comes overlapping a part of electronic component 210 again, allowing does not have too many remaining space among the spatial accommodation C, to improve the utilance in space.Through comparison diagram 1 and Fig. 2 as can be known, the space availability ratio of electronics module 200 of the present invention is higher, and the size of circuit board 220 can be dwindled, and makes the volume of electronics module 200 less.
Then, Fig. 3 is the generalized section of another embodiment of the present invention electronics module.Have a plurality of electronic components 210 in this electronics module 300.The formation of housing section 202 is haply such as above-mentioned embodiment circuit board 220, circuit cover plate 230 and circuit side plate 240, no longer repeat at this, different is, circuit cover plate 230 utilizes an opening O to manifest at least one electronic component 210, allow the top of this electronic component 210 almost remain on the height at circuit cover plate 230 places or surpass, the height of portions of electronics element 210 is higher and change therefore the height of circuit cover plate 230 does not need, even can reduce the height of circuit cover plate 230, and then dwindle the overall dimensions of electronics module 300.
From the above, in Fig. 1 and Fig. 2, circuit board 220 and circuit cover plate 230 can be the substrate of identical material or the substrate of unlike material, for example are tellite, ceramic substrate or semiconductor substrate; Preferably, be semiconductor substrate, but do not limited in the present invention.In addition, circuit side plate 240 can be a connector, and connector has a plurality of splicing ears 242, is fixed on an insulator two surfaces, in order to required signal transmission and structural joint to be provided, to be electrically connected circuit board 220 and circuit cover plate 230.Again, circuit side plate 240 can be a wiring board, wiring board has a plurality of splicing ears 242, these splicing ears 242 can electrically be disposed on wiring board two surfaces by the via that runs through wiring board, in order to required signal transmission and structural joint to be provided, to be electrically connected circuit board 220 and circuit cover plate 230.In the present embodiment, splicing ear 242 kenels are numerous, for example are conductive projection, conducting film or conduction stitch, and the present invention is not limited.
Moreover in Fig. 1 and Fig. 2, housing section 202 also can have a metal level 250, and it is covered on the circuit cover plate 230, so that the outer surface of circuit cover plate 230 has a metallic paint.This metallic paint is for example to attach tinsel or to be plated on the circuit cover plate 230 with comprehensive plating mode, to form a metallic shield cover plate.This metallic shield cover plate can replace existing metal cover board, therefore do not need to prevent with existing metal cover board the intensity of Electromagnetic Interference or increase structure again.In the present embodiment, the material of metal level 250 is numerous, for example is copper, aluminium, magnesium or its alloy, and the present invention is not limited.Because substrate of the present invention is preferably semiconductor substrate, therefore can not need to arrange separately metal level, can reach the purpose that prevents Electromagnetic Interference.
Hence one can see that; circuit cover plate 230 is positioned at the top of housing section 202; and be covered on the circuit side plate 240; if select rigid material; make on its structure not yielding; with the cover plate as protection electronic component 210; its outer surface plates the metal level 250 that can prevent Electromagnetic Interference; inner surface has again the configurable electronic component 210 in unnecessary space; therefore electronics module 200,300 need not to install additional metal cover board again; can increase again the space availability ratio in the module, solve industry existence problem for a long time, real invention for supplying to utilize on the industry.
In sum, electronics module of the present invention replaces existing metal cover board with the circuit cover plate, can increase again the quantity of electronic component, allows spatial accommodation learn sufficient utilization, to improve the space availability ratio in the module, makes the volume of electronics module less.In addition, electronics module, is surrounded on around the housing section as the circuit side plate with connector or wiring board, can have simultaneously signal transmission and structural bond strength, and is more convenient in the assembling.Moreover electronic component is scattered in upper and lower both sides, allows the number of plies of circuit board can be less than the number of plies of existing circuit board, for example becomes four layers by six layers, and all the other numbers of plies then place the circuit cover plate of opposite side, therefore need not be confined to whole numbers of plies is placed the same side.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (13)
1. electronics module comprises:
A plurality of electronic components; And,
One housing section, have a circuit board, a circuit cover plate and a circuit side plate, this circuit side plate is fixedly fastened between this circuit board and this circuit cover plate, this circuit cover plate is electrically connected by this circuit side plate and circuit board, described electronic component is separately positioned on this circuit board and this circuit cover plate, and this circuit board, this circuit cover plate and this circuit side plate surround a space, in order to hold described electronic component;
Wherein, this circuit cover plate utilizes an opening to manifest at least one electronic component in the described electronic component, allows the top of this at least one electronic component remain on the height at this circuit cover plate place or surpasses.
2. electronics module according to claim 1, wherein said electronic component arrangements is on relative two surfaces of this circuit board and this circuit cover plate.
3. electronics module according to claim 1 is wherein overlapped on the short transverse of the described electronic component of part in this space.
4. electronics module according to claim 1, wherein this circuit board is positioned at the bottom surface of this housing section, in order to carry this circuit cover plate and this circuit side plate.
5. electronics module according to claim 1, wherein this circuit side plate be surrounded on this housing section around, forming a circulus, and this circuit side plate is a connector, this connector has a plurality of splicing ears, is electrically connected this circuit board and this circuit cover plate.
6. electronics module according to claim 5, wherein said splicing ear comprise conductive projection, conducting film or conduction stitch.
7. electronics module according to claim 1, wherein this circuit cover plate is positioned at the end face of this housing section, and is covered on this circuit side plate.
8. electronics module according to claim 1, wherein this circuit board is tellite, ceramic substrate or semiconductor substrate.
9. electronics module according to claim 1, wherein this circuit cover plate is tellite, ceramic substrate or semiconductor substrate.
10. electronics module according to claim 1, wherein this circuit side plate is a wiring board, this wiring board has a plurality of splicing ears, is electrically connected this circuit board and this circuit cover plate.
11. electronics module according to claim 10, wherein said splicing ear comprise conductive projection, conducting film or conduction stitch.
12. electronics module according to claim 1, wherein this housing section also comprises a metal level, is covered on this circuit cover plate, to form a metallic shield cover plate.
13. electronics module according to claim 1, wherein this electronics module comprises radio frequency module, Internet module, communication module group or image transmission module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209344 CN102056448B (en) | 2009-11-04 | 2009-11-04 | Electronic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209344 CN102056448B (en) | 2009-11-04 | 2009-11-04 | Electronic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102056448A CN102056448A (en) | 2011-05-11 |
| CN102056448B true CN102056448B (en) | 2013-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910209344 Active CN102056448B (en) | 2009-11-04 | 2009-11-04 | Electronic module |
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| CN (1) | CN102056448B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540377A (en) * | 2014-12-16 | 2015-04-22 | 苏州佳世达电通有限公司 | Electronic device |
| CN204721340U (en) * | 2015-06-24 | 2015-10-21 | 中兴通讯股份有限公司 | A kind of radio frequency power amplification modules and radio frequency communication devices |
| JP2017118015A (en) * | 2015-12-25 | 2017-06-29 | 株式会社トーキン | Electronic device and arrangement method of electromagnetic interference suppression body |
| CN106952886B (en) * | 2017-03-25 | 2019-08-09 | 华进半导体封装先导技术研发中心有限公司 | A kind of radio frequency chip encapsulating structure |
| CN114582850A (en) * | 2020-11-30 | 2022-06-03 | 上海华为技术有限公司 | Electronic element and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5007841A (en) * | 1983-05-31 | 1991-04-16 | Trw Inc. | Integrated-circuit chip interconnection system |
| CN1756474A (en) * | 2004-09-28 | 2006-04-05 | 夏普株式会社 | Radio frequency module and manufacturing method thereof |
| CN1918955A (en) * | 2004-01-14 | 2007-02-21 | 汤姆森特许公司 | RF circuit with stacked printed circuit boards |
| CN101308618A (en) * | 2007-05-18 | 2008-11-19 | 三星Sdi株式会社 | Chassis base assembly and display device including the same |
-
2009
- 2009-11-04 CN CN 200910209344 patent/CN102056448B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5007841A (en) * | 1983-05-31 | 1991-04-16 | Trw Inc. | Integrated-circuit chip interconnection system |
| CN1918955A (en) * | 2004-01-14 | 2007-02-21 | 汤姆森特许公司 | RF circuit with stacked printed circuit boards |
| CN1756474A (en) * | 2004-09-28 | 2006-04-05 | 夏普株式会社 | Radio frequency module and manufacturing method thereof |
| CN101308618A (en) * | 2007-05-18 | 2008-11-19 | 三星Sdi株式会社 | Chassis base assembly and display device including the same |
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| Publication number | Publication date |
|---|---|
| CN102056448A (en) | 2011-05-11 |
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