CN102056448A - Electronic module - Google Patents
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- CN102056448A CN102056448A CN 200910209344 CN200910209344A CN102056448A CN 102056448 A CN102056448 A CN 102056448A CN 200910209344 CN200910209344 CN 200910209344 CN 200910209344 A CN200910209344 A CN 200910209344A CN 102056448 A CN102056448 A CN 102056448A
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Abstract
The invention provides an electronic module which comprises a plurality of electronic elements and a shell part, wherein the shell part is provided with a circuit carrier plate, a circuit cover plate and a circuit side plate, the circuit side plate is fixedly supported between the circuit carrier plate and the circuit cover plate, the circuit cover plate is electrically connected with the circuit carrier plate through the circuit side plate, and the circuit carrier plate and the circuit cover plate as well as the circuit side plat form a space used for accommodating the electronic elements.
Description
Technical field
The invention relates to a kind of electronics module, and particularly relevant for a kind of electronics module that increases the space availability ratio in the module.
Background technology
Progress along with electronic industry, electronic product miscellaneous is also constantly weeded out the old and bring forth the new, individual digital assistant (Personal Digital Assistant for example, PDA), portable computer and intelligent mobile phone consumption electronic products such as (Smart Phone), not only volume is compact day by day, price is cheap day by day, diversification more becomes on the function, make consumption electronic products use non-simple communication of past, editor or account, still possesses other function, as support high speed Internet access, download games, shopping waits the wireless data communication function on the line, becomes most of people's lives and work and goes up indispensable part.
Integration with wireless data communication and computer is used, be subjected to the restriction of frequency range in the past, can't bear too big transmission quantity, but intelligent mobile phone has now adopted third generation mobile technology (3G) with better function, but except transferring voice, also have personal information management function, online send and receive e-mail (E-mail) function, read news, download message function, image transmission etc., therefore, each part of its internal integration and develop multiple electronics module is responsible for carrying out and the required information of MOS.
Please refer to the generalized section of Fig. 1 electronics module, have a plurality of electronic components 110 in this electronics module 100, it electrically connects by circuit board 120 and host circuit board (not illustrating), so that electronic component 110 can be carried out above-mentioned functions according to the instruction of microprocessor on the host circuit board.Yet, the area of circuit board 120 is limited, if only electronic component 110 is disposed on the single plane, can't hold more electronic component 110, and the height fall of electronic component 110 can't dwindle the height of electronics module 100 if too greatly also can influence utilization of space.In addition, as if covering above-mentioned electronic components 110 with metal cover board 130 and being fixed on the circuit board 120, though can prevent Electromagnetic Interference and increase structural strength, but metal cover board 130 can increase cost, and metal cover board 130 there is no any improvement measure for the not enough configuration space of script in the module, certainly will can't meet the requirement of thin typeization.In view of the above, how to design a kind of electronics module that need not metal cover board, can increase the space availability ratio in the module again, real problem of desiring most ardently solution for industry.
Summary of the invention
The invention provides a kind of electronics module, need not metal cover board, and the quantity of the electronic component in the module increases, to improve space availability ratio.
The present invention proposes a kind of electronics module, comprises a plurality of electronic components and a housing section.Housing section has a circuit support plate, a circuit cover plate and a circuit side plate, the circuit side plate is fixedly fastened between circuit support plate and the circuit cover plate, the circuit cover plate electrically connects by circuit side plate and circuit support plate, these electronic components are separately positioned on circuit support plate and the circuit cover plate, and circuit support plate, circuit cover plate and circuit side plate surround a space, in order to hold electronic component.
In an embodiment of the present invention, above-mentioned electronic component arrangements is on relative two surfaces of circuit support plate and circuit cover plate.
In an embodiment of the present invention, above-mentioned electronic component utilizes the design configurations of height fall in the space, to increase utilization of space.
In an embodiment of the present invention, overlapped on the short transverse of above-mentioned portions of electronics element in the space.
In an embodiment of the present invention, the foregoing circuit cover plate utilizes an opening to manifest at least one electronic component, to reduce the height of circuit cover plate.
In an embodiment of the present invention, the foregoing circuit support plate is positioned at the bottom surface of housing section, in order to bearer circuit cover plate and circuit side plate.
In an embodiment of the present invention, the foregoing circuit side plate be surrounded on housing section around, to form a circulus.
In an embodiment of the present invention, the foregoing circuit cover plate is positioned at the end face of housing section, and is covered on the circuit side plate.
In an embodiment of the present invention, the foregoing circuit support plate is tellite, ceramic substrate or semiconductor substrate.
In an embodiment of the present invention, the foregoing circuit cover plate is tellite, ceramic substrate or semiconductor substrate.
In an embodiment of the present invention, the foregoing circuit side plate is a connector, and connector has a plurality of splicing ears, electrically connects circuit support plate and circuit cover plate.
In an embodiment of the present invention, the foregoing circuit side plate is a wiring board, and wiring board has a plurality of splicing ears, electrically connects circuit support plate and circuit cover plate.
In an embodiment of the present invention, above-mentioned splicing ear comprises conductive projection, conducting film or conduction stitch.
In an embodiment of the present invention, above-mentioned housing section also comprises a metal level, is covered on the circuit cover plate, to form a metallic shield cover plate.
In an embodiment of the present invention, electronics module comprises radio frequency module, Internet module, communication module group or image transmission module.
Based on above-mentioned, electronics module of the present invention replaces existing metal cover board with the circuit cover plate, can increase the quantity of electronic component again, allows spatial accommodation learn sufficient utilization, to improve the space availability ratio in the module, makes the volume of electronics module littler.In addition, electronics module, is surrounded on around the housing section as the circuit side plate with connector or wiring board, can have signal transmission and structural bond strength simultaneously, ease of assembly.
For the above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate institute's accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the generalized section of a kind of electronics module of prior art;
Fig. 2 is the generalized section of one embodiment of the invention electronics module;
Fig. 3 is the generalized section of another embodiment of the present invention electronics module.
The main element symbol description
The 100-electronics module; The 110-electronic component; The 120-circuit board;
The 130-metal cover board; The 200-electronics module; The 202-housing section;
The 210-electronic component; 220-circuit support plate; 230-circuit cover plate;
240-circuit side plate; The 242-splicing ear; The 250-metal level;
The 300-electronics module; The C-spatial accommodation; The O-opening;
212-first electronic component; 214-second electronic component.
Embodiment
Fig. 2 is the generalized section of one embodiment of the invention electronics module.This electronics module 200 is configurable in consumption electronic products, and supports the instruction of operating system, to carry out modular function.Electronics module 200 for example is radio frequency module, Internet module, communication module group or image transmission module etc., this electronics module 200 is configurable on host circuit board (not illustrating), and have a plurality of electronic components 210 in the electronics module 200, it electrically connects by circuit support plate 220 and host circuit board, so that electronic component 210 can be carried out above-mentioned functions according to the instruction of the microprocessor on the host circuit board.
In addition, a plurality of electronic components 210 are disposed at the spatial accommodation C that circuit support plate 220, circuit cover plate 230 and circuit side plate 240 surround, to constitute an electronics module.In order to improve the space availability ratio in the module, these electronic components 210 are disposed on relative two surfaces of circuit support plate 220 and circuit cover plate 230, and the design of these electronic component 210 available height drops, the electronic component (first electronic component 212 and second electronic component 214) of reduced size is configured in upper and lower both sides respectively, so that overlapped on the short transverse of portions of electronics element 210 in spatial accommodation C.Hence one can see that, and configurable a part of electronic component 210, also configurable another part electronic component 210 on the circuit cover plate 230 has two circuit planes to be used so that original only single circuit plane becomes on circuit support plate 220.Therefore, these electronic components 210 do not need all to be disposed on the single plane, but can be disposed at dispersedly on relative two surfaces, available area thereby change are big, relatively, the quantity of electronic component 210 also can increase, and the available height drop comes overlapping a part of electronic component 210 again, allowing does not have too many remaining space among the spatial accommodation C, to improve utilization of space.Through comparison diagram 1 and Fig. 2 as can be known, the space availability ratio of electronics module 200 of the present invention is higher, and the size of circuit support plate 220 can be dwindled, and makes the volume of electronics module 200 littler.
Then, Fig. 3 is the generalized section of another embodiment of the present invention electronics module.Have a plurality of electronic components 210 in this electronics module 300.The formation of housing section 202 is haply as above-mentioned embodiment circuit support plate 220, circuit cover plate 230 and circuit side plate 240, no longer repeat at this, different is, circuit cover plate 230 utilizes an opening 0 to manifest at least one electronic component 210, allow the top of this electronic component 210 almost remain on the height at circuit cover plate 230 places or surpass, so the height of circuit cover plate 230 does not need to change because the height of portions of electronics element 210 is higher, even can reduce the height of circuit cover plate 230, and then dwindle the overall dimensions of electronics module 300.
From the above, in Fig. 1 and Fig. 2, circuit support plate 220 and circuit cover plate 230 can be the substrate of identical material or the substrate of unlike material, for example are tellite, ceramic substrate or semiconductor substrate; Preferably, be semiconductor substrate, but do not limited in the present invention.In addition, circuit side plate 240 can be a connector, and connector has a plurality of splicing ears 242, is fixed on an insulator two surfaces, in order to required signal transmission and structural joint to be provided, to electrically connect circuit support plate 220 and circuit cover plate 230.Again, circuit side plate 240 can be a wiring board, wiring board has a plurality of splicing ears 242, these splicing ears 242 can electrically be disposed on wiring board two surfaces by the via that runs through wiring board, in order to required signal transmission and structural joint to be provided, to electrically connect circuit support plate 220 and circuit cover plate 230.In the present embodiment, splicing ear 242 kenels are numerous, for example are conductive projection, conducting film or conduction stitch, and the present invention is not limited.
Moreover in Fig. 1 and Fig. 2, housing section 202 also can have a metal level 250, and it is covered on the circuit cover plate 230, so that the outer surface of circuit cover plate 230 has a metallic paint.This metallic paint is for example to attach tinsel or to be plated on the circuit cover plate 230 with comprehensive plating mode, to form a metallic shield cover plate.This metallic shield cover plate can replace existing metal cover board, so do not need to prevent with existing metal cover board the intensity of Electromagnetic Interference or increase structure again.In the present embodiment, the material of metal level 250 is numerous, for example is copper, aluminium, magnesium or its alloy, and the present invention is not limited.Because substrate of the present invention is preferably semiconductor substrate, therefore can not need to be provided with separately metal level, can reach the purpose that prevents Electromagnetic Interference.
Hence one can see that; circuit cover plate 230 is positioned at the top of housing section 202; and be covered on the circuit side plate 240; if select rigid material for use; make on its structure not yielding; with cover plate as protection electronic component 210; its outer surface plates the metal level 250 that can prevent Electromagnetic Interference; inner surface has the configurable electronic component 210 in unnecessary space again; so electronics module 200,300 need not to install additional metal cover board again; can increase the space availability ratio in the module again, solve industry existence problem for a long time, real invention for supplying to utilize on the industry.
In sum, electronics module of the present invention replaces existing metal cover board with the circuit cover plate, can increase the quantity of electronic component again, allows spatial accommodation learn sufficient utilization, to improve the space availability ratio in the module, makes the volume of electronics module littler.In addition, electronics module, is surrounded on around the housing section as the circuit side plate with connector or wiring board, can have signal transmission and structural bond strength simultaneously, and is more convenient in the assembling.Moreover electronic component is scattered in upper and lower both sides, allows the number of plies of circuit support plate can be less than the number of plies of existing circuit board, for example becomes four layers by six layers, and all the other numbers of plies then place the circuit cover plate of opposite side, so need not be confined to whole numbers of plies is placed the same side.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (13)
1. electronics module comprises:
A plurality of electronic components; And,
One housing section, have a circuit support plate, a circuit cover plate and a circuit side plate, this circuit side plate is fixedly fastened between this circuit support plate and this circuit cover plate, this circuit cover plate electrically connects by this circuit side plate and circuit support plate, described electronic component is separately positioned on this circuit support plate and this circuit cover plate, and this circuit support plate, this circuit cover plate and this circuit side plate surround a space, in order to hold described electronic component.
2. electronics module according to claim 1, wherein said electronic component arrangements is on relative two surfaces of this circuit support plate and this circuit cover plate.
3. electronics module according to claim 1, wherein overlapped on the short transverse of the described electronic component of part in this space.
4. electronics module according to claim 1, wherein this circuit support plate is positioned at the bottom surface of this housing section, in order to carry this circuit cover plate and this circuit side plate.
5. electronics module according to claim 1, wherein this circuit side plate be surrounded on this housing section around, forming a circulus, and this circuit side plate is a connector, this connector has a plurality of splicing ears, electrically connects this circuit support plate and this circuit cover plate.
6. electronics module according to claim 5, wherein said splicing ear comprise conductive projection, conducting film or conduction stitch.
7. electronics module according to claim 1, wherein this circuit cover plate is positioned at the end face of this housing section, and is covered on this circuit side plate.
8. electronics module according to claim 1, wherein this circuit support plate is tellite, ceramic substrate or semiconductor substrate.
9. electronics module according to claim 1, wherein this circuit cover plate is tellite, ceramic substrate or semiconductor substrate.
10. electronics module according to claim 1, wherein this circuit side plate is a wiring board, this wiring board has a plurality of splicing ears, electrically connects this circuit support plate and this circuit cover plate.
11. electronics module according to claim 10, wherein said splicing ear comprise conductive projection, conducting film or conduction stitch.
12. electronics module according to claim 1, wherein this housing section also comprises a metal level, is covered on this circuit cover plate, to form a metallic shield cover plate.
13. electronics module according to claim 1, wherein this electronics module comprises radio frequency module, Internet module, communication module group or image transmission module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209344 CN102056448B (en) | 2009-11-04 | 2009-11-04 | Electronic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209344 CN102056448B (en) | 2009-11-04 | 2009-11-04 | Electronic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102056448A true CN102056448A (en) | 2011-05-11 |
| CN102056448B CN102056448B (en) | 2013-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910209344 Active CN102056448B (en) | 2009-11-04 | 2009-11-04 | Electronic module |
Country Status (1)
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| CN (1) | CN102056448B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540377A (en) * | 2014-12-16 | 2015-04-22 | 苏州佳世达电通有限公司 | Electronic device |
| WO2016206320A1 (en) * | 2015-06-24 | 2016-12-29 | 中兴通讯股份有限公司 | Radio frequency power amplifier module and radio frequency communication device |
| CN106952886A (en) * | 2017-03-25 | 2017-07-14 | 华进半导体封装先导技术研发中心有限公司 | A kind of radio frequency chip encapsulating structure |
| CN108370655A (en) * | 2015-12-25 | 2018-08-03 | 株式会社东金 | The configuration method of electronic device and electromagnetic interference suppressor |
| WO2022111151A1 (en) * | 2020-11-30 | 2022-06-02 | 华为技术有限公司 | Electronic component and electronic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5007841A (en) * | 1983-05-31 | 1991-04-16 | Trw Inc. | Integrated-circuit chip interconnection system |
| EP1555864A1 (en) * | 2004-01-14 | 2005-07-20 | Thomson Licensing S.A. | RF circuit with stacked printed circuit boards |
| JP2006100302A (en) * | 2004-09-28 | 2006-04-13 | Sharp Corp | Radio frequency module and manufacturing method therefor |
| KR100911007B1 (en) * | 2007-05-18 | 2009-08-05 | 삼성에스디아이 주식회사 | Chassis base assembly and display apparatus including the same |
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2009
- 2009-11-04 CN CN 200910209344 patent/CN102056448B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540377A (en) * | 2014-12-16 | 2015-04-22 | 苏州佳世达电通有限公司 | Electronic device |
| WO2016206320A1 (en) * | 2015-06-24 | 2016-12-29 | 中兴通讯股份有限公司 | Radio frequency power amplifier module and radio frequency communication device |
| CN108370655A (en) * | 2015-12-25 | 2018-08-03 | 株式会社东金 | The configuration method of electronic device and electromagnetic interference suppressor |
| CN108370655B (en) * | 2015-12-25 | 2020-03-17 | 株式会社东金 | Electronic device, communication device, and method for arranging electromagnetic interference suppressing body |
| US10729044B2 (en) | 2015-12-25 | 2020-07-28 | Tokin Corporation | Electronic device and method for disposing electromagnetic interference suppressor |
| CN106952886A (en) * | 2017-03-25 | 2017-07-14 | 华进半导体封装先导技术研发中心有限公司 | A kind of radio frequency chip encapsulating structure |
| CN106952886B (en) * | 2017-03-25 | 2019-08-09 | 华进半导体封装先导技术研发中心有限公司 | A kind of radio frequency chip encapsulating structure |
| WO2022111151A1 (en) * | 2020-11-30 | 2022-06-02 | 华为技术有限公司 | Electronic component and electronic device |
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| Publication number | Publication date |
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| CN102056448B (en) | 2013-02-27 |
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