CN212344142U - Electronic component and electronic equipment - Google Patents

Electronic component and electronic equipment Download PDF

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Publication number
CN212344142U
CN212344142U CN202020133945.1U CN202020133945U CN212344142U CN 212344142 U CN212344142 U CN 212344142U CN 202020133945 U CN202020133945 U CN 202020133945U CN 212344142 U CN212344142 U CN 212344142U
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CN
China
Prior art keywords
frame plate
circuit board
printed circuit
stiffener
reinforcing member
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Active
Application number
CN202020133945.1U
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Chinese (zh)
Inventor
郭健强
王晓岩
罗文君
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication date
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Priority to CN202020133945.1U priority Critical patent/CN212344142U/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits

Abstract

The application provides an electronic component and electronic equipment, relates to electron technical field for solve the problem of how to strengthen frame board and printed circuit board and be connected the reliability. An electronic assembly, comprising: a frame plate having a first side; a first printed circuit board located at a first side of the frame plate and connected with the frame plate; at least one first stiffener; the first reinforcing part is positioned on the side surface of the frame plate and is close to the first printed circuit board; the first reinforcing member is connected to both the frame plate and the first printed circuit board; wherein the side of the frame plate intersects the first printed circuit board.

Description

Electronic component and electronic equipment
Technical Field
The present application relates to the field of electronic technologies, and in particular, to an electronic component and an electronic device.
Background
Electronic products (such as mobile phones, tablet computers, notebook computers, intelligent wearable devices, etc.) have become indispensable tools in people's daily life. Generally, an electronic product mounts electronic components, such as electronic components connected to a display module, a camera module, an audio cavity component, a battery, and an antenna, on a Printed Circuit Board Assembly (PCBA) single board.
As shown in fig. 1, the sandwich printed circuit board assembly single board includes a main board 11 and a sub board 12 connected by a Frame Board (FB) 13. The solder joints 14 between the frame plate 13 and the main plate 11 and between the frame plate 13 and the sub-plate 12 have the characteristics of small height (low standoff) of the solder joint 14, large Distance (DNP) from the solder joint 14 to the center of the single plate, relatively low-temperature solder with relatively poor strength, and the like, so that the mechanical reliability of the solder joints 14 is low, and the solder joints are easily broken when external force is applied, thereby causing product damage.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an electronic component and electronic equipment, which are used for solving the problem of how to enhance the connection reliability of a frame plate and a printed circuit board.
In order to achieve the above purpose, the following technical solutions are adopted in this embodiment:
in a first aspect, an electronic assembly is provided, comprising: a frame plate having a first side; a first printed circuit board located at a first side of the frame plate and connected with the frame plate; at least one first stiffener; the first reinforcing part is positioned on the side surface of the frame plate and is close to the first printed circuit board; the first reinforcing member is connected to both the frame plate and the first printed circuit board; wherein the side of the frame plate intersects the first printed circuit board. In the embodiment of the application, the first reinforcing piece connected with the frame plate and the first printed circuit board is added, and the thickness of the first reinforcing piece is smaller than that of the frame plate. In this way, the first reinforcing member and the frame plate both function to support the first printed circuit board. Therefore, the first reinforcing member shares the mechanical falling stress of the frame plate and the first printed circuit board (according to the simulation of the stress analysis software, the stress between the frame plate and the first printed circuit board can be reduced by 64% when the frame plate falls), so that the supporting effect of the frame plate on the first printed circuit board is improved. And, since the thickness of the first reinforcing member is smaller than the thickness of the frame plate. Therefore, the second electronic device can be arranged at the gap between the first reinforcing member and the second printed circuit board without affecting the wiring efficiency and space of the second printed circuit board. Therefore, the supporting effect of the frame plate and the first printed circuit board is improved, the integration level of each device in the electronic assembly is improved, and the miniaturization of the electronic assembly is realized.
Optionally, at least part of the at least one first stiffener makes a turn around the contour of the frame plate. Simple structure and wide supporting surface.
Optionally, at least part of the at least one first reinforcing member is a block structure, and each first reinforcing member is connected to at least one side surface of the frame plate. The structure variability is strong, can be according to the arrangement of each device in the electronic component, the structure of adjustment first reinforcement.
Optionally, the frame plate is shaped as a plate-like structure.
Optionally, the frame plate has an opening extending through the frame plate in a direction perpendicular to the first printed circuit board.
Optionally, a first reinforcing member is disposed in the opening, and the first reinforcing member is connected to a plurality of side surfaces of the frame plate to divide the opening into a plurality of regions. The structure is flexible, and the first printed circuit board can be supported to the greatest extent.
Optionally, at least part of the at least one first stiffener is located within the opening. The supporting effect of the frame plate on the first printed circuit board is improved, and meanwhile, the outer contour of the frame plate does not need to be expanded outwards, so that the integration level of the electronic assembly is improved.
Optionally, at least a portion of the at least one first stiffener includes a plurality of stiffeners arranged in a stack; the adjacent reinforcing parts are connected, and the cross sectional area of the reinforcing parts is gradually reduced along the direction far away from the first printed circuit board; at least a portion of the plurality of reinforcing portions is connected to the frame plate, and the reinforcing portion closest to the first printed circuit board is connected to the first printed circuit board. Therefore, the connection area of the first reinforcing part and the first printed circuit board is not increased, and meanwhile, the connection stability of the first reinforcing part and the frame plate is further improved, so that the connection reliability of the first reinforcing part and the first printed circuit board is improved, and the purpose of improving the connection reliability and stability of the frame plate and the first printed circuit board is achieved.
Optionally, at least part of the at least one first reinforcement comprises overlapping multi-layer reinforcements; the mutually overlapped reinforcing parts are connected, and each layer of reinforcing part is connected with the first printed circuit board. Considering that the second printed circuit board still needs to set up electronic components such as resistance, power management unit towards first printed circuit board one side, through the lapped mode of rib, can strengthen the area of being connected of first reinforcement and first printed circuit board when avoiding the electronic component of high-low unevenness on the second printed circuit board.
Optionally, the first reinforcement is of unitary construction with the frame panel. Simple structure and convenient preparation.
Optionally, the first stiffener has a thickness of 0.2-0.5mm in a direction perpendicular to the first printed circuit board; the width of the first reinforcing member is 0.2-2.0 mm. The thickness of the first stiffener in a first direction perpendicular to the first printed circuit board is too large and the space occupied by the first stiffener is too large, which affects the arrangement of other devices in the electronic assembly. The thickness of the first reinforcing member is too small, and the stability of the connection of the first reinforcing member to the first printed circuit board is poor.
Optionally, the thickness of the reinforcement part in a direction perpendicular to the first printed circuit board is 0.2-0.5 mm. The thickness of the first stiffener in a first direction perpendicular to the first printed circuit board is too large and the space occupied by the first stiffener is too large, which affects the arrangement of other devices in the electronic assembly. The thickness of the first reinforcing member is too small to exert a supporting effect.
Optionally, the first reinforcing member is soldered to the first printed circuit board, the distance between adjacent solder joints is 0.4mm to 0.8mm, and the width of the solder joint is 0.3mm to 0.6 mm. The welding spot spacing is too small or too large, and the welding effect is poor.
Optionally, the frame plate further has a second side opposite the first side; the electronic assembly further includes a second printed circuit board and a second stiffener; the second printed circuit board is positioned on the second side of the frame plate and connected with the frame plate; the second reinforcing part is positioned on the side surface of the frame plate and is close to the second printed circuit board; the second stiffener is connected to both the frame plate and the second printed circuit board. By providing the first reinforcement member between the first printed circuit board and the frame plate and the second reinforcement member between the second printed circuit board and the frame plate, the connection reliability of the first printed circuit board and the frame plate and the connection reliability of the second printed circuit board and the frame plate can be respectively improved. No matter which of the first printed circuit board and the second printed circuit board is the main board or the daughter board, the reliability of the sandwich printed circuit board assembly single board is higher, and the reliability of the product can be improved.
In a second aspect, an electronic device is provided, comprising the electronic assembly of any of the first aspect.
Drawings
Fig. 1 is a schematic cross-sectional view of an electronic assembly provided in the related art;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
fig. 3a is a schematic cross-sectional view of an electronic assembly according to an embodiment of the present disclosure;
fig. 3b is a schematic structural diagram of a frame plate according to an embodiment of the present application;
fig. 3c is a schematic structural diagram of another frame plate provided in the embodiment of the present application;
FIG. 3d is a schematic cross-sectional view of another electronic assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of another electronic assembly provided in an embodiment of the present application;
fig. 5a is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 5b is a structural relationship diagram of another frame plate and a first reinforcing member according to the embodiment of the present application;
FIG. 5c is a schematic cross-sectional view of another electronic assembly provided in the embodiments of the present application;
fig. 5d is a schematic top view of an electronic assembly according to an embodiment of the present application;
FIG. 5e is a cross-sectional view taken along line A1-A2 of FIG. 5 d;
fig. 5f is a schematic top view of another electronic assembly provided in an embodiment of the present application;
fig. 6a is a schematic top view of another electronic assembly provided in an embodiment of the present application;
fig. 6b is a schematic top view of another electronic assembly provided by an embodiment of the present application;
fig. 7a is a schematic top view of another electronic assembly provided in an embodiment of the present application;
fig. 7b is a schematic top view of another electronic assembly provided by an embodiment of the present application;
FIG. 8 is a schematic cross-sectional view of yet another electronic assembly provided in accordance with an embodiment of the present disclosure;
FIG. 9 is a schematic cross-sectional view of yet another electronic assembly provided in accordance with an embodiment of the present disclosure;
fig. 10a is a schematic cross-sectional view of another electronic assembly provided in the embodiments of the present application;
FIG. 10b is a schematic cross-sectional view of yet another electronic assembly provided in accordance with an embodiment of the present application;
FIG. 10c is a schematic cross-sectional view of yet another electronic assembly provided in accordance with an embodiment of the present application;
fig. 11 is a schematic cross-sectional view of another electronic assembly provided in the embodiments of the present application;
fig. 12a is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 12b is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 12c is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 12d is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 13a is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 13b is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 13c is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 13d is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 14a is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 14b is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
FIG. 14c is a cross-sectional view taken along line B1-B2 of FIG. 14B, according to an embodiment of the present application;
FIG. 14d is another cross-sectional view taken along line B1-B2 of FIG. 14B according to an embodiment of the present application;
fig. 14e is a structural relationship diagram of a frame plate and a first reinforcing member according to an embodiment of the present application;
fig. 15 is a schematic cross-sectional structure diagram of another electronic component according to an embodiment of the present disclosure.
Reference numerals:
1-an electronic device; 2-a display module; 3-middle frame; 4-a shell; 5-cover plate; 11-a main board; 12-daughter boards; 13-a frame plate; 14-a solder joint; 100-an electronic component; 10-a first printed circuit board; 20-a first stiffener; 21-a reinforcement; 30-a second printed circuit board; 41-a first electronic device; 42-a second electronic device; 50-second stiffener.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
Further, in the present application, directional terms such as "upper", "lower", "left", "right", and the like are defined with respect to a schematically placed orientation of a component in the drawings, and it is to be understood that these directional terms are relative concepts, which are used for descriptive and clarifying purposes, and may vary accordingly depending on the orientation in which the component is placed in the drawings.
In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate.
The embodiment of the application provides an electronic device, which can be a terminal device with a display interface, such as a mobile phone, a television, a display, a tablet personal computer and a vehicle-mounted computer, or an intelligent display wearable device, such as an intelligent watch and an intelligent bracelet, or a communication device, such as a server, a storage and a base station, or an intelligent automobile. The embodiment of the present application does not specifically limit the specific form of the electronic device. For convenience of description, the following embodiments are all exemplified by taking an electronic device as a mobile phone.
In this case, as shown in fig. 2, the electronic device 1 mainly includes a display module 2, a middle frame 3, a housing (or referred to as a battery cover, a rear case) 4, and a cover plate 5.
Display module assembly 2 has the light-emitting side that can make the people see display screen and the back that sets up with above-mentioned light-emitting side is relative, and display module assembly 2's back is close to center 3, and apron 5 sets up the light-emitting side at display module assembly 2.
The display module 2 includes a Display Panel (DP).
In one possible embodiment of the present application, the display module 2 is a liquid crystal display module. In this case, the display screen is a Liquid Crystal Display (LCD). Based on this, the display module 2 further includes a backlight unit (BLU) located on the back side of the liquid crystal display (the side surface away from the LCD for displaying pictures).
The backlight module can provide light source for the liquid crystal display screen, so that each sub-pixel in the liquid crystal display screen can emit light to realize image display.
Alternatively, in another possible embodiment of the present application, the display module 2 is an organic light emitting diode display module. In this case, the display screen is an Organic Light Emitting Diode (OLED) display screen. Because the electroluminescent layer is arranged in each sub-pixel in the OLED display screen, the OLED display screen can realize self-luminescence after receiving the working voltage. In this case, the display module 2 having the OLED display does not need to be provided with the backlight module.
The cover plate 5 is located on a side of the display module 2 away from the middle frame 3, and the cover plate 5 may be, for example, Cover Glass (CG), which may have a certain toughness.
The middle frame 3 is located between the display module 2 and the housing 4, and the surface of the middle frame 3 away from the display module 2 is used for arranging the electronic component 100. After the housing 4 and the middle frame 3 are closed, the electronic component 100 is located between the housing 4 and the middle frame 3.
The electronic component 100 may be, for example, a device obtained by integrating a wireless Access Point (AP), a Double Data Rate (DDR), a UFS (unified file system, UNIX file system), a radio frequency power amplifier (RF PA), a Radio Frequency Integrated Circuit (RFIC), a Power Management Unit (PMU), a wireless local area network (wireless fidelity, WIFI), a charger (charger), and other electronic components on a single board of a Printed Circuit Board Assembly (PCBA).
The stability of the connections between the components in the electronic assembly 100 directly affects the performance and life of the electronic assembly 100. Based on this, the present application provides an electronic component 100, which aims to improve the stability of the electronic component 100.
The structure of the electronic component 100 will be described below as an example.
As shown in fig. 3a, the electronic assembly 100 includes a Frame Board (FB) 13, a first Printed Circuit Board (PCB) 10, and at least one first stiffener 20.
As shown in fig. 3B, the frame plate 13 has a first side a and a second side B opposite to the first side a, wherein the frame plate 13 may be, for example, a PCB.
As shown in fig. 3a, the first printed circuit board 10 is located on a first side a of the frame plate 13, the frame plate 13 having a side a intersecting the first printed circuit board 10.
Regarding the structure of the frame plate 13, in one possible embodiment, as shown in fig. 3b, the frame plate 13 is shaped as a plate-like structure.
The orthographic projection of the frame plate 13 on the first printed circuit board 10 may be a closed figure with any shape, and fig. 3b illustrates the frame plate 13 as a rectangular plate as an example.
In this case, the plurality of faces constituting the outer contour of the frame plate 13 are all the side faces a of the frame plate 13.
In another possible embodiment, as shown in fig. 3c, the frame plate 13 is shaped as a plate-like structure, and the frame plate 13 has an opening 131 penetrating the frame plate 13 in a first direction X perpendicular to the first printed circuit board.
The shape of the opening 131 is not limited, and the orthographic projection of the opening 131 on the first printed circuit board 10 may be a closed figure with any shape, and fig. 3c illustrates that the opening 131 is rectangular.
In this case, the plurality of faces constituting the outer contour of the frame plate 13 are side faces a of the frame plate 13, and the respective faces constituting the contour of the opening 131 are also side faces a of the frame plate 13.
In order to communicate signals between the first printed circuit board 10 and the frame plate 13, the first printed circuit board 10 is electrically connected to the frame plate 13.
The manner in which the first printed circuit board 10 and the frame plate 13 are connected is not limited. For example, the first printed circuit board 10 and the frame plate 13 may be soldered by Ball Grid Array (BGA) or Wafer Level Chip Scale Packaging (WLCSP) technology to connect the first printed circuit board 10 and the frame plate 13.
Regarding the number of first stiffening members 20, in one possible embodiment, as shown in fig. 3a, the electronic assembly 100 comprises one first stiffening member 20.
Regarding the number of first stiffening members 20, in another possible embodiment, as shown in fig. 3d, the electronic assembly 100 comprises a plurality of first stiffening members 20.
Whether the electronic component 100 includes one first reinforcing member 20 or a plurality of first reinforcing members 20, each first reinforcing member 20 is located on the side face a of the frame plate 13, and each first reinforcing member 20 is disposed adjacent to the first printed circuit board 10. As will be understood from the description relating to fig. 3b and 3c, the side a of the frame plate 13 may be plural, and therefore, the first reinforcing member 20 may be provided on the side of any one of the sides a of the frame plate 13.
The first reinforcing member 20 is disposed near the first printed circuit board 10, that is, the first reinforcing member 20 is disposed at an end of the frame plate 13 near the first side a. It will be appreciated that the first reinforcement member 20 is located away from the second side B of the frame plate 13 and close to the first side a of the frame plate 13. Therefore, no matter what the structure of the first stiffener 20, the thickness h2 of the first stiffener 20 is smaller than the thickness h1 of the first printed circuit board 10 along the first direction X perpendicular to the first printed circuit board 10, and the space between the first stiffener 20 and the second side B of the first printed circuit board 10 can be used for arranging other electronic components.
In order to enable the first reinforcement member 20 to reinforce the connection of the first printed circuit board 10 to the frame plate 13, as shown in fig. 3a and 3d, the first reinforcement member 20 is connected to both the frame plate 13 and the first printed circuit board 10.
Since the first reinforcement member 20 is located at the side a of the frame plate 13, in order to simplify the structure, in some embodiments, the first reinforcement member 20 is connected with the side a of the frame plate 13.
Alternatively, the first reinforcing member 20 and the frame plate 13 are separate structures, and as for the connection manner of the first reinforcing member 20 and the side face a of the frame plate 13, for example, the first reinforcing member 20 and the frame plate 13 may be bonded or welded.
Alternatively, the first reinforcement member 20 and the frame plate 13 are of an integral structure, and both are directly of a connecting structure when the manufacturing is completed.
For example, the frame plate 13 is a PCB, and the shape of the first reinforcing member 20 located on the side surface a of the frame plate 13 is milled by a milling cutter.
As for the connection manner of the first reinforcement member 20 and the first printed circuit board 10, for example, it may be the same as the connection manner of the frame plate 13 and the first printed circuit board 10, so as to reduce the process steps and simplify the process.
It should be noted that, in general, an electronic product carries electronic components through a Printed Circuit Board Assembly (PCBA) board, and the PCBA board generally includes a main board, a sub-board, and a frame board 13 located between the main board and the sub-board and connected to the main board and the sub-board respectively. The first printed circuit board 10 may be a main board or a sub-board.
The structure of the electronic component 100 provided in the present application will be described below with reference to several embodiments.
Example one
As shown in fig. 4, the electronic component 100 includes a frame plate 13, a first printed circuit board 10, a first stiffener 20, and a second printed circuit board 30.
As shown in fig. 3B, the frame plate 13 is shaped as a plate-like structure having opposite first and second sides a, B.
As shown in fig. 4, the first printed circuit board 10 is located on the first side a of the frame plate 13, and is electrically connected to the frame plate 13. The second printed circuit board 30 is located on the second side B of the frame plate 13 and is electrically connected to the frame plate 13.
The first reinforcing member 20 is located at the side a of the frame plate 13, and the first reinforcing member 20 is disposed adjacent to the first printed circuit board 10. Wherein the first stiffener 20 is connected to both the frame plate 13 and the first printed circuit board 10.
Regarding the number and structure of the first reinforcing members 20 included in the electronic component 100, in one possible embodiment, as shown in fig. 5a, the electronic component 100 includes one first reinforcing member 20, and the first reinforcing member 20 is wound around the contour of the frame plate 13.
In this case, as shown in fig. 5a, the first reinforcing member 20 is optionally provided with a solder 14 around its circumference, and the first reinforcing member 20 is soldered to the first printed circuit board 10 by the solder 14.
Alternatively, as shown in fig. 5b, a partial region of the first reinforcing member 20 is provided with a welding point 14, and the first reinforcing member 20 is welded to the first printed circuit board 10 by the welding point 14.
The solder joint 14 may be, for example, tin plating, nickel plating, gold plating, organic solder mask (OSP), nickel plating gold (ENIG), electroless nickel palladium plating gold (ENEPIG), or the like.
As analyzed by the stress analysis software, the thickness h2 of the first stiffener 20 along the first direction X perpendicular to the first printed circuit board 10 is too large, and the space occupied by the first stiffener 20 is too large, which affects the arrangement of other devices in the electronic assembly 100. The thickness h2 of the first reinforcing member 20 is too small, and the stability of the connection of the first reinforcing member 20 to the first printed circuit board 10 is poor. Based on this, in some embodiments, as shown in fig. 4, the thickness h2 of the first stiffener 20 along the first direction X perpendicular to the first printed circuit board 10 is 0.2-0.5 mm.
Similarly, too large width w of the first reinforcing member 20 requires a high connecting effect between the first reinforcing member 20 and the frame plate 13, and too small width w of the first reinforcing member 20 has an insignificant auxiliary supporting effect on the frame plate 13. Based on this, in some embodiments, as shown in FIG. 4, the width w of the first stiffener 20 is 0.2-2.0 mm.
In this way, since the first reinforcing member 20 is connected to both the frame plate 13 and the first printed circuit board 10, the contact area of the frame plate 13 and the first printed circuit board 10 is increased. Therefore, the supporting effect of the frame plate 13 on the first printed circuit board 10 can be increased to improve the reliability and stability of the connection of the frame plate 13 with the first printed circuit board 10.
In addition, in the case where the first reinforcing member 20 is connected to the first printed circuit board 10 by soldering, it is considered that the number of the pads 14 and the size of the pads 14 are related to the soldering effect of the first reinforcing member 20 and the first printed circuit board 10. In some embodiments, among the pads 14 located between the first stiffener 20 and the first printed circuit board 10, a pitch (pitch) between adjacent pads 14 is 0.4mm to 0.8mm, and a width of the pads 14 is 0.3mm to 0.6 mm.
It should be noted that, in the embodiment of the present application, the width of the solder joint 14 can be understood as the size of the solder joint 14 along the arrangement direction of the solder joints 14.
Regarding the shape (cross-sectional shape) of the first reinforcing member 20 in the thickness direction, alternatively, as shown in fig. 4, the first reinforcing member 20 is a plate-like structure.
The purpose of improving the reliability and stability of the connection between the frame plate 13 and the first printed circuit board 10 is achieved by improving the reliability of the connection between the first reinforcing member 20 and the first printed circuit board 10 by further improving the stability of the connection between the first reinforcing member 20 and the frame plate 13 without increasing the connection area between the first reinforcing member 20 and the first printed circuit board 10. Alternatively, as shown in fig. 5c, the first reinforcing member 20 includes a plurality of reinforcing portions 21 stacked in the thickness direction of the first reinforcing member 20 in a sectional view.
Adjacent reinforcing parts 21 are connected, and the cross-sectional area of the reinforcing parts 21 is gradually reduced in a direction Y away from the first printed circuit board 10 (i.e., in a direction from the first printed circuit board 10 to the second printed circuit board 30); at least some of the plurality of reinforcing parts 21 are connected to the frame plate 13 (each reinforcing part 21 is connected to the frame plate 13 as illustrated in fig. 5 c), and the reinforcing part 21 closest to the first printed circuit board 10 is connected to the first printed circuit board 10.
Here, the cross-sectional area of the reinforcing part 21 refers to an area of a cross section of the reinforcing part 21 in a direction parallel to the first printed circuit board 10. The cross-sectional area of the reinforcing portion 21 gradually decreases, and may be gradually decreased in a regular manner, or may not be constant, but the whole tends to decrease.
Considering that the second printed circuit board 30 is further provided with an electronic device such as a resistor, a Power Management Unit (PMU), etc. on the side facing the first printed circuit board 10, in order to avoid the electronic device with high and low unevenness on the second printed circuit board 30, the connection area between the first stiffener 20 and the first printed circuit board 10 is increased. As shown in fig. 5d, optionally, the first reinforcement 20 comprises overlapping multi-layer reinforcements 21. The reinforcement parts 21 overlapping each other are connected, and each layer of the reinforcement parts 21 is connected to the first printed circuit board 10.
As shown in fig. 5d, the first reinforcing member 20 includes overlapped multiple layers of reinforcing parts 21, and each layer may include one reinforcing part 21 or a plurality of reinforcing parts 21.
Further, as shown in fig. 5e (a cross-sectional view taken along a1-a2 in fig. 5 d), the first reinforcing member 20 may include a plurality of layers of reinforcing parts 21, each layer of reinforcing part 21 may be connected to the frame plate 13, or only a part of the reinforcing parts 21 may be connected to the frame plate 13. However, each layer of the reinforcing part 21 is connected to the first printed circuit board 10, and therefore, the solder 14 on the reinforcing part 21, which is far from the first printed circuit board 10, has a smaller thickness in the first direction X than the solder 14 on the reinforcing part 21, which is near the first printed circuit board 10.
As shown in fig. 5d and 5f, the structure of the multi-layer reinforcing portion 21 in the first reinforcing member 20 is not limited as long as the entire first reinforcing member 20 is wound around the frame plate 13 after the multi-layer reinforcing portion 21 is overlapped. In fig. 5f, for clarity of illustration, the reinforcing portions 21 of different layers are shown by different filling patterns, and after the two layers of reinforcing portions 21 are overlapped with each other, they are wound around the frame plate 13 for one circle.
With the structure shown in fig. 5c to 5f, in order to facilitate the preparation of the reinforcing part 21 and to ensure that the strength of the reinforcing part 21 is satisfactory, the thickness of the reinforcing part 21 in the direction Y perpendicular to the first printed circuit board 10 is 0.2 to 0.5 mm.
Regarding the number and structure of the first reinforcing members 20 included in the electronic component 100, in another possible embodiment, as shown in fig. 6a, the electronic component 100 includes one first reinforcing member 20, and the first reinforcing member 20 is provided on any side surface a of the frame plate 13.
Note that, as shown in fig. 6a, the frame plate 13 includes a plurality of side surfaces a, and the first reinforcing member 20 may be provided at any position of any side surface. As shown in fig. 6a, the first reinforcing member 20 is located on the side of one side face a. As shown in fig. 6b, the first reinforcing member 20 may also be located at the side of the plurality of side surfaces a.
Regarding the sectional shape of the first reinforcing member 20, alternatively, referring to the structure of the first reinforcing member 20 in fig. 4, the first reinforcing member 20 is plate-shaped.
Regarding the cross-sectional shape of the first stiffener 20, alternatively, with reference to the description above regarding fig. 5c, the first stiffener 20 includes a plurality of stiffeners 21 that are stacked in the thickness direction of the first stiffener 20. Adjacent reinforcing parts 21 are connected, and the cross-sectional area of the reinforcing parts 21 is gradually reduced in a direction Y away from the first printed circuit board 10 (i.e., in a direction from the first printed circuit board 10 to the second printed circuit board 30); at least a part of the plurality of reinforcing parts 21 is connected to the frame plate 13, and the reinforcing part 21 closest to the first printed circuit board 10 is connected to the first printed circuit board 10. That is, the first reinforcement 20 is stepped.
With respect to the cross-sectional shape of the first stiffener 20, optionally, with reference to the description above with respect to fig. 5c, the first stiffener 20 comprises overlapping layers of stiffeners 21. The reinforcement parts 21 overlapping each other are connected, and each layer of the reinforcement parts 21 is connected to the first printed circuit board 10.
Regarding the number and structure of the first reinforcing members 20 included in the electronic component 100, in another possible embodiment, as shown in fig. 7a, the electronic component 100 includes a plurality of first reinforcing members 20, the first reinforcing members 20 are block-shaped structures, and each first reinforcing member 20 is connected to at least one side surface a of the frame plate 13.
The first reinforcing member 20 may have any shape, may have a regular structure as shown in fig. 7a, or may have an irregular structure as shown in fig. 7 b. The structure of the first reinforcing member 20 illustrated in fig. 7a and 7b is merely illustrative and not limitative in any way.
Further, as shown in fig. 7a, the first reinforcing member 20 may be connected to one side surface a of the frame plate 13, and as shown in fig. 7b, the first reinforcing member 20 may also be connected to a plurality of side surfaces a of the frame plate 13.
Regarding the sectional shape of the first reinforcing member 20, alternatively, referring to the structure of the first reinforcing member 20 in fig. 4, the first reinforcing member 20 is plate-shaped.
With respect to the cross-sectional shape of the first stiffener 20, optionally, with reference to the description above with respect to fig. 5c, the first stiffener 20 is stepped.
With respect to the cross-sectional shape of the first stiffener 20, optionally, with reference to the description above with respect to fig. 5c, the first stiffener 20 comprises overlapping layers of stiffeners 21.
Where the first reinforcing member 20 includes overlapping layers of reinforcing portions 21, the reinforcing portions 21 may overlap with other first reinforcing members 20. For example, the two first reinforcing members 20 each include overlapping multi-layer reinforcing portions 21, and the reinforcing portions 21 of the two first reinforcing members 20 overlap. Alternatively, for example, the first reinforcing member 20 includes a plurality of overlapped reinforcing portions 21, and the reinforcing portion 21 of this first reinforcing member 20 is overlapped with the other first reinforcing members 20 having a plate-like structure.
The electronic component 100 includes a plurality of first reinforcing members 20, and the structures of the plurality of first reinforcing members 20 are not limited to the same structure, and may be any of the first reinforcing members 20 described above. For example, among the plurality of first reinforcing members 20, a part of the first reinforcing members 20 has a plate-like structure, a part of the first reinforcing members 20 has a step-like structure, and a part of the first reinforcing members 20 has a plurality of overlapped reinforcing portions 21.
In some embodiments, the structure is integrated in order to enrich the functionality of the electronic assembly 100. As shown in fig. 8, the electronic assembly 100 further includes a first electronic device 41 and a second electronic device 42. The first electronic device 41 is electrically connected to the first printed circuit board 10, and the second electronic device 42 is electrically connected to the second printed circuit board 30.
The first electronic device 41 may be, for example, a Radio Frequency Integrated Circuit (RFIC), a resistor (resistance), a wireless local area network (WIFI), and the like. The second electronic device 42 may be, for example, a Power Management Unit (PMU), a resistor, a Package On Package (POP) structure, and the like, and the package on package structure may be integrated with a device such as a wireless Access Point (AP) and a Double Data Rate (DDR).
In the embodiment of the present application, the first reinforcing member 20 connected to the frame plate 13 and the first printed circuit board 10 is added, and the thickness of the first reinforcing member 20 is made smaller than that of the frame plate 13. In this way, the first reinforcing member 20 and the frame plate 13 both function to support the first printed circuit board 10. Therefore, the first stiffener 20 shares the mechanical drop stress of the frame plate 13 and the first printed circuit board 10 (according to the simulation of the stress analysis software, the stress between the frame plate 13 and the first printed circuit board 10 can be reduced by 64% during the mechanical drop), so that the supporting effect of the frame plate 13 on the first printed circuit board 10 is improved. And, since the thickness of the first reinforcing member 20 is smaller than the thickness of the frame plate 13. Therefore, as shown in fig. 8, the second electronic device 42 may be disposed at the gap between the first stiffener 20 and the second printed circuit board 30 without affecting the wiring efficiency and space of the second printed circuit board 30. Therefore, the supporting effect of the frame plate 13 and the first printed circuit board 10 can be increased, the integration level of each device in the electronic component 100 can be improved, and the electronic component 100 can be miniaturized.
In addition, in the embodiment of the present application, the connection area of the frame plate 13 and the first printed circuit board 10 is increased to improve the connection effect of the frame plate 13 and the first printed circuit board 10. Compared with the structure that the connection effect between the frame plate 13 and the first printed circuit board 10 is improved by dispensing between the frame plate 13 and the first printed circuit board 10, the structure adopted by the embodiment of the application does not have the problem of dispensing removal when the electronic component 100 is repaired, and the operation is more convenient. Compared with the structure shown in fig. 9 in which the connection effect of the frame plate 13 and the first printed circuit board 10 is improved by increasing the width of the frame plate 13 (the portions of the two side edges of the frame plate 13 in fig. 9) as the non-functional region having no influence on the circuit function, the second electronic device 42 may be disposed under the first stiffener 20, and the second electronic device 42 does not need to extend to the edge, so that the integration level of each device in the electronic component 100 is higher.
Example two
The second embodiment is the same as the first embodiment in that: the frame plate 13 and the first reinforcement member 20 are identical in structure.
The second embodiment is different from the first embodiment in that: the electronic assembly 100 further includes a second stiffener.
As shown in fig. 10a, the electronic component 100 further includes a second reinforcing member 50, the second reinforcing member 50 is located at a side of the frame plate 13, and the second reinforcing member 50 is disposed adjacent to the second printed circuit board 30; the second reinforcement member 50 is connected to both the frame plate 13 and the second printed circuit board 30.
The structure of the second reinforcing member 50 may be the same as that of the first reinforcing member 20 according to any one of the first to third embodiments. For example, the electronic component 100 may include one second reinforcement member 50. In this case, the second reinforcement 50 may have the same structure as the first reinforcement 20 illustrated in fig. 5a, and be disposed around the frame plate 13 in a circle, as viewed in plan view. The second stiffener 50 also has a block-like structure, similar to the structure of the first stiffener 20 illustrated in fig. 6 a. The electronic component 100 may include a plurality of second reinforcing members 50. In this case, the structure of the second reinforcing member 50 may be the same as the structure of the first reinforcing member 20 illustrated in fig. 7a in a block-like structure in a plan view.
As for the cross-sectional shape of the second reinforcement 50, as shown in fig. 10a, the second reinforcement 50 has the same structure as the first reinforcement 20, and the second reinforcement 50 has a plate-like structure. Alternatively, as shown in fig. 10b, the second reinforcement member 50 has the same structure as the first reinforcement member 20, and the second reinforcement member 50 may have a stepped structure. Alternatively, as shown in fig. 10c, the second reinforcing member 50 has the same structure as the first reinforcing member 20, and the second reinforcing member 50 may have a lap joint structure. The second stiffener 50 is different from the first stiffener 20 in that the first stiffener 20 is connected to the first printed circuit board 10, and the second stiffener 50 is connected to the second printed circuit board 30, and for the features of the second stiffener 50, detailed description is omitted, and reference may be made to the description of the first stiffener 20 in the first embodiment.
The material and the manufacturing process of the second reinforcing member 50 may be the same as those of the first reinforcing member 20. The second reinforcement 50 may be connected to the frame plate 13 in the same manner as the first reinforcement 20 may be connected to the frame plate 13. The second reinforcing member 50 may be connected to the second printed circuit board 30 in the same manner as the first reinforcing member 20 is connected to the first printed circuit board 10.
In the present embodiment, by providing the first reinforcing member 20 between the first printed circuit board 10 and the frame plate 13 and providing the second reinforcing member 50 between the second printed circuit board 30 and the frame plate 13, it is possible to improve the connection reliability of the first printed circuit board 10 and the frame plate 13 and the connection reliability of the second printed circuit board 30 and the frame plate 13, respectively. No matter which of the first printed circuit board 10 and the second printed circuit board 30 is the main board or the daughter board, the reliability of the sandwich printed circuit board assembly single board is higher, and the reliability of the product can be improved.
EXAMPLE III
The third embodiment is the same as the first embodiment in that the first reinforcing member 20 has the same structure.
The third embodiment is different from the first embodiment in the structure of the frame plate 13.
As shown in fig. 3c, the frame plate 13 has a plate-like structure in shape, and the frame plate 13 has an opening 131 penetrating the frame plate 13 in a first direction X perpendicular to the first printed circuit board. In this case, a plurality of faces of the outer contour of the frame plate 13 are the side faces a of the frame plate 13, and each face of the contour of the opening 131 (the inner contour of the frame plate 13) is also the side face a of the frame plate 13.
In the embodiment of the present application, the structure of the first reinforcing member 20 may be the same as that of the first reinforcing member 20 in the first embodiment, but in the present embodiment, the first reinforcing member 20 may be provided not only on the outer contour side of the frame plate 13, but also on the inner contour side of the frame plate 13 as shown in fig. 11. Here, the structure of the first reinforcing member 20 is not described again, and the description of the first reinforcing member 20 in the first embodiment may be referred to, and the description of the installation position of the first reinforcing member 20 is focused on.
In the case where the electronic component 100 includes a first stiffener 20:
since the first reinforcing member 20 is at the periphery of the frame plate 13, the first reinforcing member 20 facilitates the preparation. In some embodiments, as shown in fig. 12a, the first stiffener 20 is wrapped around the outer contour of the frame plate 13. Alternatively, as shown in fig. 12b, the first reinforcement member 20 is disposed outside the frame plate 13.
Since the first reinforcement 20 is inside the frame plate 13, there is no need to increase the outer contour of the frame plate 13, thereby reducing the size of the frame plate 13. In some embodiments, as shown in fig. 12c, the first stiffener 20 is wrapped around the inner contour of the frame plate 13. Alternatively, as shown in fig. 12d, the first reinforcement member 20 may be provided inside the frame plate 13.
In the case where the electronic component 100 includes a plurality of first reinforcing members 20:
to facilitate the preparation of the first reinforcing member 20, in some embodiments, as shown in fig. 13a, a plurality of first reinforcing members 20 are each provided on the periphery of the frame plate 13.
In order to reduce the size of the frame plate 13, in some embodiments, as shown in fig. 13b, a plurality of first reinforcing members 20 are each provided on the inner side of the frame plate 13.
Wherein the first reinforcing member 20 may be a block structure of an arbitrary shape. Since the triangle shape has stability, in order to enhance the stability of the connection of the first reinforcement member 20 with the frame plate 13, as shown in fig. 13b, in some embodiments, the first reinforcement member 20 is provided at the corner of the frame plate 13, being connected with both sides of the frame plate 13.
Further, the first reinforcement 20 may include overlapping multi-layer reinforcements 21. Since the frame plate 13 has the opening 131, the frame plate 13 is not connected to the first printed circuit board 10 at the position of the opening 131, resulting in easy detachment of the frame plate 13 from the first printed circuit board 10. As shown in fig. 13c, in some embodiments, a first stiffener 20 including multiple layers of stiffeners 21 has a stiffener 21 overlapping another first stiffener 20 in the electronic assembly 100. Of course, in the case where the plurality of first reinforcing members 20 include the plurality of layers of the reinforcing portions 21, a part of the reinforcing portions 21 may not overlap with other first reinforcing members 20.
In order to be able to adjust the layout of the first stiffener 20 according to the arrangement positions of the first electronic device 41 on the first printed circuit board 10 and the second electronic device 41 on the second printed circuit board 30. In some embodiments, as shown in fig. 13d, the plurality of first reinforcing members 20 are partially disposed on the inner side of the frame plate 13 and partially disposed on the outer side of the frame plate 13.
Here, fig. 13d illustrates the first reinforcing members 20 in various structures, that is, the structures of the plurality of first reinforcing members 20 included in the electronic component 100 are not necessarily the same, and the first reinforcing member 20 may be the structure of any one of the first reinforcing members 20 illustrated in the first embodiment.
In the embodiment of the present application, as shown in fig. 11, in the case that the electronic component 100 includes a plurality of first reinforcing members 20 all located in the opening of the frame plate 13, even if the outer contour of the frame plate 13 coincides with the outer contour of the first printed circuit board 10, the first reinforcing members 20 may still have a stable effect on the first printed circuit board 10. However, when the outer contour of the frame plate 13 coincides with the outer contour of the first printed circuit board 10, the stability of the frame plate 13 and the first printed circuit board 10 cannot be improved by adding dispensing.
Example four
The fourth embodiment is the same as the third embodiment in that the frame plate 13 has the same structure.
The fourth embodiment is different from the first embodiment in that the first reinforcing member 20 located in the opening 131 has a different structure.
As shown in fig. 14a and 14b, the electronic component 100 includes a first reinforcing member 20 positioned in the opening 131, and the first reinforcing member 20 is connected to the plurality of sides a of the frame plate 13 to divide the opening 131 into a plurality of regions.
That is, the first reinforcing member 20 has a mesh structure in a plan view, and divides the opening 131 into a plurality of regions, but the shape and size of each divided region are not limited, and fig. 14a and 14b are only schematic.
It should be noted that, in view of the sectional shape, the sectional shape of the first reinforcing member 20 in the present embodiment may be the same as the sectional shape of the first reinforcing member 20 in the first embodiment. As shown in fig. 14c (a cross-sectional view taken along B1-B2 in fig. 14B), the first reinforcing member 20 has a plate-like structure. Alternatively, as shown in FIG. 14d (cross-sectional view along B1-B2 in FIG. 14B), the first stiffener 20 has a stepped configuration. Alternatively, as shown in fig. 14e, the first reinforcing member 20 has a lap joint structure.
Here, as shown in fig. 14e, when the span of the first stiffener 20 is large, the middle portion is easily sunk, and the first stiffener 20 is formed in a lap joint structure such that the stiffener 21 close to the first printed circuit board 10 corresponds to a bridge and the stiffener 21 relatively far from the first printed circuit board 10 corresponds to a bridge pier, thereby improving the connection effect between the first stiffener 20 and the first printed circuit board 10.
It should be noted that the first reinforcing member 20 according to any one of the first embodiment may be provided on the periphery of the frame plate 13.
The electronic assembly 100 provided in this embodiment can adjust the shape of the first stiffener 20 according to the arrangement of the first electronic device 41 on the first printed circuit board 10 and the second electronic device 42 on the second printed circuit board 30, so as to increase the contact area between the first stiffener 20 and the first printed circuit board 10 to the maximum extent, thereby improving the supporting effect of the frame plate 13 on the first printed circuit board 10.
EXAMPLE five
The fifth embodiment is the same as the third and fourth embodiments in that: the frame plate 13 and the first reinforcement member 20 are identical in structure.
The fifth embodiment is different from the third and fourth embodiments in that: the electronic assembly 100 further comprises a second stiffener 50.
As shown in fig. 15, the electronic component 100 further includes a second reinforcing member 50, the second reinforcing member 50 is located at a side of the frame plate 13, and the second reinforcing member 50 is disposed adjacent to the second printed circuit board 30; the second reinforcement member 50 is connected to both the frame plate 13 and the second printed circuit board 30.
The structure of the second reinforcing member 50 may be the same as the structure of the first reinforcing member 20 illustrated in the third and fourth embodiments.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (15)

1. An electronic assembly, comprising:
a frame plate having a first side;
a first printed circuit board positioned at the first side of the frame plate and connected with the frame plate;
at least one first stiffener; the first reinforcing part is positioned on the side surface of the frame plate and is close to the first printed circuit board; the first stiffener is connected to both the frame plate and the first printed circuit board;
wherein the side of the frame plate intersects the first printed circuit board.
2. The electronic assembly of claim 1, wherein at least a portion of the at least one first stiffener circumscribes a contour of the frame plate.
3. The electronic assembly of claim 1, wherein at least a portion of the at least one first stiffener is a block-like structure, and each first stiffener is connected to at least one side of the frame plate.
4. The electronic assembly of claim 1, wherein the frame plate is shaped as a plate-like structure.
5. The electronic assembly of claim 4, wherein the frame plate has an opening through the frame plate in a direction perpendicular to the first printed circuit board.
6. The electronic assembly of claim 5, wherein the opening has a first stiffener disposed therein, the first stiffener being coupled to a plurality of sides of the frame plate to divide the opening into a plurality of regions.
7. The electronic assembly of claim 5, wherein at least a portion of the at least one first stiffener is positioned within the opening.
8. The electronic assembly of claim 2, 3 or 6, wherein at least a portion of the at least one first stiffener comprises a plurality of stiffeners arranged in a stack;
the adjacent reinforcing parts are connected, and the cross sectional area of each reinforcing part is gradually reduced along the direction far away from the first printed circuit board; at least a part of the plurality of reinforcing parts is connected to the frame plate, and the reinforcing part closest to the first printed circuit board is connected to the first printed circuit board.
9. The electronic assembly of claim 2, 3 or 6, wherein at least a portion of the at least one first stiffener comprises overlapping layers of stiffeners;
the mutually overlapped reinforcing parts are connected, and each layer of reinforcing part is connected with the first printed circuit board.
10. The electronic assembly of claim 1, wherein the first stiffener is a unitary structure with the frame plate.
11. The electronic assembly of claim 2, wherein the first stiffener has a thickness of 0.2-0.5mm in a direction perpendicular to the first printed circuit board; the width of the first reinforcing member is 0.2-2.0 mm.
12. The electronic assembly of claim 8, wherein the thickness of the stiffener in a direction perpendicular to the first printed circuit board is 0.2-0.5 mm.
13. The electronic assembly of claim 2, 3 or 6, wherein the first stiffener is soldered to the first printed circuit board with a spacing between adjacent solder bumps of 0.4mm to 0.8mm and a width of the solder bumps of 0.3mm to 0.6 mm.
14. The electronic assembly of claim 1, wherein the frame plate further has a second side opposite the first side;
the electronic assembly further includes a second printed circuit board and a second stiffener;
the second printed circuit board is positioned on the second side of the frame plate and connected with the frame plate;
the second stiffener is positioned on the side of the frame plate and is disposed adjacent to the second printed circuit board; the second stiffener is connected to both the frame plate and the second printed circuit board.
15. An electronic device, characterized in that it comprises an electronic assembly according to any one of claims 1-14.
CN202020133945.1U 2020-01-20 2020-01-20 Electronic component and electronic equipment Active CN212344142U (en)

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CN101467500B (en) * 2006-06-27 2012-08-08 松下电器产业株式会社 Interconnect substrate and electronic circuit mounted structure
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