CN112589296A - Laser light path system and method for processing flexible circuit board by using same - Google Patents
Laser light path system and method for processing flexible circuit board by using same Download PDFInfo
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- CN112589296A CN112589296A CN202011465544.7A CN202011465544A CN112589296A CN 112589296 A CN112589296 A CN 112589296A CN 202011465544 A CN202011465544 A CN 202011465544A CN 112589296 A CN112589296 A CN 112589296A
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- laser
- processing
- acousto
- hole
- light path
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Links
- 238000012545 processing Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000010287 polarization Effects 0.000 claims abstract description 14
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000004080 punching Methods 0.000 abstract description 3
- 238000003672 processing method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000005553 drilling Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a laser light path system and a method for processing a flexible circuit board thereof, and the key points of the technical scheme are that the laser light path system comprises a laser, an acousto-optic deflector for light splitting is arranged at the output end of the laser, two beams of laser divided by the acousto-optic deflector respectively pass through a zoom beam expander and a half-wave plate and then are combined into one beam by a polarization beam combiner, and a galvanometer scanning system and a focusing lens are sequentially arranged at the output end of the polarization beam combiner. The processing method comprises the steps of continuously processing one hole site by using positive focal laser and defocused laser, moving the flexible circuit board, and continuously processing another hole site. Compared with the prior art that all holes are punched by the positive-focus laser, the holes are punched by the negative-focus laser, and the continuous punching mode of the patent can greatly shorten the processing path, thereby greatly improving the processing efficiency.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a laser optical path system and a method for processing a flexible circuit board by using the same.
[ background of the invention ]
The blind hole processing is an important process in the manufacturing process of the circuit board, and the types of traditional holes in the circuit board can be distinguished by the difference of functions except that whether the traditional holes are conducted or not is simple: the part hole, the tool hole, through-hole (Via), blind hole (Blindhole), buried Via (Buridhole), wherein the blind hole mainly plays the effect of conducting. Due to the rapid development of microelectronic technology, the wide application of large-scale and super-large-scale integrated circuits and the progress of micro-assembly technology in recent years, the manufacture of printed circuit boards is developed towards the direction of lamination and multi-functionalization, leads of printed circuit patterns are finer, the processing of via holes is smaller and smaller, and the drilling difficulty is higher and higher.
The common drilling mode comprises mechanical drilling, laser drilling, photosensitive hole forming and the like, different equipment technologies are applied to different layers of boards, the mechanical drilling process technology adopted in the drilling processing can not meet the requirements of the high-end circuit board, and the technology capable of meeting the micropore processing mode is the laser drilling technology. The laser drilling has the advantages that relatively small micro through holes and blind holes can be machined, the bore diameter can be 50-200 um or even smaller, and the cost of machining the micro holes is higher than that of other hole forming modes.
Multilayer circuit boards are generally constructed by alternating layers of copper and dielectric material (substrate), with the top and bottom layers being copper layers. When the flexible circuit board is used for blind hole processing, the copper foil on the top layer and the base material are removed, and the copper foil on the bottom layer is reserved. Therefore, when the blind hole of the flexible circuit board is processed, the processing needs to be divided into two times, the surface copper needs to be processed by positive-focus laser, and the inner layer plate needs to be processed by defocusing laser.
The existing laser equipment has low switching speed of the positive focal laser and the defocusing laser, generally, surface copper on all hole sites is processed by the positive focal laser firstly, then the flexible circuit board is moved back to the original position to process inner layer boards of all hole sites by the defocusing laser again, and the method for processing the blind hole twice by separating one blind hole has long processing path and low efficiency.
[ summary of the invention ]
The invention aims to overcome the defects of the prior art, provides the laser optical path system capable of rapidly switching the positive focal laser and the defocused laser and the method for processing the flexible circuit board by using the laser optical path system, and greatly improves the processing efficiency.
The invention is realized by the following technical scheme:
a laser optical path system, characterized by: the laser device comprises a laser device 1, wherein an acousto-optic deflector 2 for splitting light is arranged at the output end of the laser device 1, the laser light split into two beams by the acousto-optic deflector 2 passes through a zoom beam expander 3 and a half-wave plate 4 respectively and then is combined into one beam by a polarization beam combiner 5, and a galvanometer scanning system 10 and a focusing lens 6 are sequentially arranged at the output end of the polarization beam combiner 5.
The laser optical path system as described above is characterized in that: the zoom beam expander 3 is an electric zoom beam expander.
The laser optical path system as described above is characterized in that: the laser 1 is provided with a shutter 7 for controlling the laser beam to be turned on.
The laser optical path system as described above is characterized in that: the frequency of the acousto-optic deflector 2 is 100M or more.
A method for processing a flexible circuit board by adopting the laser optical path system is characterized in that: the laser emitted by the laser 1 is linearly polarized light, the laser is divided into two light paths through the acousto-optic deflector 2, the first light path changes the focal position after passing through the zoom beam expander 3, the second light path passes through the half-wave plate 4, the polarization direction can rotate by 90 degrees, the first light path and the second light path are combined through the polarization beam combiner 5, and finally the light beams are emitted out through the mirror scanning system 10 and the focusing lens 6 in sequence for processing a sample;
when in processing, the acousto-optic deflector 2 swings to a second beam light path, positive focal laser is emitted from the focusing lens 6, and a first hole 8 is processed on a hole position to be processed of the flexible circuit board; then the acousto-optic deflector 2 is switched to swing to a first beam of light path immediately, defocused laser is emitted from the focusing lens 6, and the first hole 8 is further processed into a second hole 9 which is a required blind hole;
and after the hole sites are continuously processed by the positive focus laser and the defocusing laser, moving the flexible circuit board, and continuously processing another hole site until all the hole sites are processed.
Compared with the prior art, the invention has the following advantages:
1. the laser optical path system has very high speed of switching between the positive focus and the defocusing, when a blind hole of the flexible circuit board is processed, two times of punching are continuously not separated, and after one hole is punched by the positive focus laser and the defocusing laser, the other hole is punched; compared with the prior art that all holes are punched by the positive-focus laser, the holes are punched by the negative-focus laser, and the continuous punching mode of the patent can greatly shorten the processing path, thereby greatly improving the processing efficiency.
[ description of the drawings ]
FIG. 1 is a schematic diagram of the present invention for forming holes on a flexible printed circuit board, in which Cu and PI represent the materials of the layers, respectively;
fig. 2 is a block diagram of the optical path of the present invention.
In the figure: 1 is a laser; 2 is an acousto-optic deflector; 3, a zoom beam expander; 4 is a half-wave plate; 5 is a polarization beam combiner; 6 is a focusing lens; 7 is a shutter; 8 is a first hole; 9 is a second hole; and 10, a galvanometer scanning system.
[ detailed description ] embodiments
The technical features of the present invention will be described in further detail with reference to the accompanying drawings so that those skilled in the art can understand the technical features.
A laser light path system is shown in figure 2 and comprises a laser 1, wherein an acousto-optic deflector 2 for splitting light is arranged at the output end of the laser 1, laser split into two beams by the acousto-optic deflector 2 passes through a zoom beam expander 3 and a half-wave plate 4 respectively and then is combined into one beam by a polarization beam combiner 5, and a galvanometer scanning system 10 and a focusing lens 6 are sequentially arranged at the output end of the polarization beam combiner 5.
The acousto-optic deflector 2 is abbreviated as AOD in english, and is a device manufactured according to the acousto-optic deflection principle. The angle of the laser can be changed according to the acousto-optic interaction mechanism.
Further, the variable-power beam expander 3 is an electric variable-power beam expander, and can automatically expand beams, and the variable-power beam expander 3 can change the divergence angle of laser light, so that the focal position of the laser light can be changed. The frequency of the acousto-optic deflector 2 is more than 100M, and the positive focal and the out-of-focus light paths can be switched very quickly.
The laser 1 is provided with a shutter 7 for controlling the opening of the laser, and the shutter 7 is not essential, and the laser 1 may be electrically controlled to emit light.
The patent also claims a method for processing a flexible circuit board by using the laser optical path system, as shown in fig. 1, wherein the flexible circuit board is a multilayer circuit board, the surface layer and the bottom layer are both copper layers, the inner layer is alternately arranged into PI layers and copper layers, and the chinese name of PI is polyimide.
The method comprises the following specific steps:
the laser emitted by the laser 1 is linearly polarized light, the laser is divided into two light paths through the acousto-optic deflector 2, the first light path changes the focus position after passing through the zoom beam expander 3, the second light path rotates 90 degrees in the polarization direction after passing through the half-wave plate 4, therefore, the polarized second light path is perpendicular to the first light path, the first light path and the second light path are combined through the polarization beam combiner 5, and finally the light is emitted out through the mirror scanning system 10 and the focusing lens 6 in sequence for processing a sample. During processing, the acousto-optic deflector 2 swings to a second beam light path, positive focal laser is emitted from the focusing lens 6, and a first hole 8 is processed; then the acousto-optic deflector 2 is switched to swing to the first beam of light path rapidly, defocused laser is emitted from the focusing lens 6, and the first hole 8 is further processed into a second hole 9, namely the required blind hole.
Because the frequency of the acousto-optic deflector 2 is as high as more than 100M, the speed of switching the positive focal laser and the defocusing laser is very fast, and when a blind hole of the flexible circuit board is processed, the two processes of the positive focal laser and the defocusing laser are continuously and inseparably carried out.
The embodiment of the present invention is described only for the preferred embodiment of the present invention, and not for the purpose of limiting the spirit and scope of the invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the design concept of the present invention shall fall within the protection scope of the present invention.
Claims (5)
1. A laser optical path system, characterized by: the laser beam splitter comprises a laser (1), wherein an output end of the laser (1) is provided with an acousto-optic deflector (2) for splitting, laser split into two beams by the acousto-optic deflector (2) passes through a zoom beam expander (3) and a half-wave plate (4) respectively and then is combined into one beam by a polarization beam combiner (5), and an output end of the polarization beam combiner (5) is sequentially provided with a galvanometer scanning system (10) and a focusing lens (6).
2. The laser optical path system according to claim 1, characterized in that: the zoom beam expander (3) is an electric zoom beam expander.
3. The laser optical path system according to claim 1, characterized in that: and an optical shutter (7) for controlling the laser to be switched on and off is arranged on the laser (1).
4. The laser optical path system according to claim 1, characterized in that: the frequency of the acousto-optic deflector (2) is more than 100M.
5. A method for processing a flexible circuit board by using the laser optical path system of any one of claims 1 to 4, wherein: the laser emitted by the laser (1) is linearly polarized light, the laser is divided into two light paths through the acousto-optic deflector (2), the first light path changes the focus position after passing through the zoom beam expander (3), the second light path rotates 90 degrees after passing through the half-wave plate (4), the first light path and the second light path are combined through the polarization beam combiner (5), and finally the light is emitted out through the mirror scanning system (10) and the focusing lens (6) in sequence for processing a sample;
when in processing, the acousto-optic deflector (2) swings to a second beam light path, positive focal laser is emitted from the focusing lens (6), and a first hole (8) is processed on a hole position to be processed of the flexible circuit board; then the acousto-optic deflector (2) is switched to swing to a first beam of light path immediately, defocused laser is emitted from the focusing lens (6), and the first hole (8) is further processed into a second hole (9), namely a required blind hole;
and after the hole sites are continuously processed by the positive focus laser and the defocusing laser, moving the flexible circuit board, and continuously processing another hole site until all the hole sites are processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011465544.7A CN112589296A (en) | 2020-12-13 | 2020-12-13 | Laser light path system and method for processing flexible circuit board by using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011465544.7A CN112589296A (en) | 2020-12-13 | 2020-12-13 | Laser light path system and method for processing flexible circuit board by using same |
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| Publication Number | Publication Date |
|---|---|
| CN112589296A true CN112589296A (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011465544.7A Pending CN112589296A (en) | 2020-12-13 | 2020-12-13 | Laser light path system and method for processing flexible circuit board by using same |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5748222A (en) * | 1992-06-11 | 1998-05-05 | Zed Instruments Ltd. | Laser angroxing head employing acousto-optic modulator |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN102230883A (en) * | 2011-04-26 | 2011-11-02 | 上海理工大学 | High-resolution high-speed polarization difference imaging method |
| CN104703397A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Method for processing blind hole in flexible circuit board |
| CN106624391A (en) * | 2016-09-23 | 2017-05-10 | 张立国 | Multilayer material layered milling machining system and method based on space combination laser focal point |
| CN106994557A (en) * | 2017-04-20 | 2017-08-01 | 武汉铱科赛科技有限公司 | A kind of dynamic controllable laser-processing system and method for focal position of laser |
| CN111515526A (en) * | 2020-05-15 | 2020-08-11 | 广东正业科技股份有限公司 | Multi-beam processing device and method |
| CN111958108A (en) * | 2020-07-20 | 2020-11-20 | 华中科技大学 | Acousto-optic double-focus lens for laser processing and laser processing system |
-
2020
- 2020-12-13 CN CN202011465544.7A patent/CN112589296A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5748222A (en) * | 1992-06-11 | 1998-05-05 | Zed Instruments Ltd. | Laser angroxing head employing acousto-optic modulator |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN102230883A (en) * | 2011-04-26 | 2011-11-02 | 上海理工大学 | High-resolution high-speed polarization difference imaging method |
| CN104703397A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Method for processing blind hole in flexible circuit board |
| CN106624391A (en) * | 2016-09-23 | 2017-05-10 | 张立国 | Multilayer material layered milling machining system and method based on space combination laser focal point |
| CN106994557A (en) * | 2017-04-20 | 2017-08-01 | 武汉铱科赛科技有限公司 | A kind of dynamic controllable laser-processing system and method for focal position of laser |
| CN111515526A (en) * | 2020-05-15 | 2020-08-11 | 广东正业科技股份有限公司 | Multi-beam processing device and method |
| CN111958108A (en) * | 2020-07-20 | 2020-11-20 | 华中科技大学 | Acousto-optic double-focus lens for laser processing and laser processing system |
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Application publication date: 20210402 |