CN104703397A - Method for processing blind hole in flexible circuit board - Google Patents
Method for processing blind hole in flexible circuit board Download PDFInfo
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- CN104703397A CN104703397A CN201510142267.9A CN201510142267A CN104703397A CN 104703397 A CN104703397 A CN 104703397A CN 201510142267 A CN201510142267 A CN 201510142267A CN 104703397 A CN104703397 A CN 104703397A
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Abstract
The invention applies to the field of processing of flexible circuit boards, and provides a method for processing a blind hole in a flexible circuit board. The flexible circuit board comprises a first copper foil layer, a base material and a second copper foil layer which are sequentially downwards arranged. The method comprises the steps of processing at least the part of the blind hole, corresponding to the first copper foil layer through the first energy setting laser; partially processing the rest part of the blind hole, corresponding to the base material after coordinate compensating through the second energy setting laser by an out-of-focus manner according to the spiral line track or the concentric track. According to the method, the out-of-focus method is carried out to process the base material, so that the second copper foil layer can be prevented from being damaged; meanwhile, the processing energy can be improved, and thus the processing efficiency can be increased; the coordinate compensation enables high processing precision.
Description
Technical field
The invention belongs to flexible circuit board manufacture field, particularly relate to the method for a kind of flexible circuitry board blind hole processing.
Background technology
Blind hole processing is an important process in wiring board manufacturing process, outside in wiring board, whether the kind of conventional holes is simply distinguished divided by conducting, still can divide with the difference of function: hole in piece part, tooling hole, through hole (Via), blind hole (Blind hole), buried via hole (Buried hole), wherein blind hole mainly plays conducting effect.Due to the develop rapidly in recent years along with microelectric technique, the extensive use of extensive and very lagre scale integrated circuit (VLSIC), the progress of Micro-package technique, make the manufacture of printed circuit board towards lamination, multifunction future development, make the processing of the wire of printed circuit figure granular, via more also more and more less, its boring difficulty is also more and more higher.
Common bore mode has machine drilling, laser drill, photosensitive pore-forming etc., distinct device technology is applied to different levels plank, the mechanical drilling process technology adopted in Drilling operation can not meet the requirement of this kind of high-end line plate, and the technology being competent at this capillary processing mode is exactly laser drilling processes.The advantage of laser drill is to process relatively little micro through hole, blind hole, can process aperture at 50um-200um, even can be less, and it has larger advantage at the cost of processing micropore relative to other pore-forming modes.
Multilayer circuit board is generally alternately rolled by multilayer layers of copper and multi-layer insulation (base material) and forms, and top layer and the bottom are layers of copper.As by two-sided Copper Foil and as described in the flexible circuitry board blind hole that forms of base material between two-sided Copper Foil process time, need the Copper Foil and the base material that remove top layer, retain the Copper Foil of bottom, but laser drill of the prior art is easier to hinder end copper at removal blind hole inner substrate time ratio, so processing can only be gone with smaller energy and speed, therefore cause blind hole working (machining) efficiency very low, and can cause when laser energy slightly fluctuates and hinder clear sordid drawback at the bottom of end copper or hole.
Summary of the invention
The object of the embodiment of the present invention is a kind of method providing flexible circuitry board blind hole to process, to solve the problem that existing processing blind hole by laser efficiency is low, crudy is poor.
The embodiment of the present invention is achieved in that a kind of method that flexible circuitry board blind hole is processed, and described flexible circuit board comprises ground floor Copper Foil, base material and second layer Copper Foil successively downwards, comprises step:
With the laser of the first setting energy, at least process described blind hole corresponding to the part on described ground floor Copper Foil;
With the laser of the second setting energy, in the mode of out of focus, correspond to remaining part processing on described base material according to spiral trajectory or concentric circular tracks to carrying out the described blind hole after coordinate compensation.
Further, with the laser of the first setting energy, at least process the step that described blind hole corresponds to the part on described ground floor Copper Foil and adopt positive burnt mode, process according to Circular test.
Further, the method that described coordinate compensates is: under positive coke-like state and out-of-focus appearance, processes respectively samely to form test pattern by spirte array, and respectively record process after the coordinate figure of spirte; Coordinate figure under positive coke-like state and out-of-focus appearance is compared, obtains deviate, then described deviate is compensated to described blind hole and correspond in the graphics processing of remaining part correspondence on described base material.
Further, the machining center of described test pattern under positive coke-like state overlaps with the machining center of described blind hole.
Further, the coordinate figure under described positive coke-like state and out-of-focus appearance is all captured by ccd camera.
Further, described spirte is standard cross figure.
Further, the method that described coordinate compensates comprises and repeatedly correcting, each increased number correcting spirte in the test pattern of processing.
The invention provides the method for a kind of flexible circuitry board blind hole processing, by the mode of out of focus, base material is processed, prevent from injuring second layer Copper Foil, machining energy can be improved simultaneously, make working (machining) efficiency high, carry out coordinate compensation simultaneously, make the precision of processing higher.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flexible circuit board schematic diagram that the embodiment of the present invention provides;
Fig. 2 is the schematic diagram of the flexible circuitry board blind hole do not cut that the embodiment of the present invention provides;
Fig. 3 is the method flow diagram that the embodiment of the present invention provides flexible circuitry board blind hole and processes;
Fig. 4 is the method S110 step machining sketch chart that the embodiment of the present invention provides flexible circuitry board blind hole to process;
Fig. 5 is the method S120 step machining sketch chart that the embodiment of the present invention provides flexible circuitry board blind hole to process;
Fig. 6 is that under the embodiment of the present invention provides sharp positive coke-like state and out-of-focus appearance, process data contrasts schematic diagram.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figure 1, 2, flexible circuit board 10 comprises ground floor Copper Foil 11, base material 12 and second layer Copper Foil 13 at least successively downwards.Add man-hour carrying out blind hole to described flexible circuit board 10, need excision ground floor Copper Foil 11 and base material 12, but in prior art, the often size of bad grasp laser energy or process time, the Z of base material 12 as shown in Figure 2 part is caused not removed completely, or base material 12 machined second layer Copper Foil 13 again after removing completely; Or less energy and speed processing can only be adopted at described base material 12 close to the part of described second Copper Foil 13.
As shown in Figure 3, in order to prevent not cutting through base material 12 or injure second layer Copper Foil 13, a kind of method that the embodiment of the present invention provides flexible circuitry board blind hole to process, comprises the following steps:
S110, with the laser of the first setting energy, at least processes described blind hole corresponding to the part on described ground floor Copper Foil 11;
As shown in Figure 4, positive burnt mode is adopted to process in the present embodiment.Concrete, the focus of described laser is positioned at the surface of described ground floor Copper Foil 11, adopts the laser energy of 3W to cut described blind hole corresponding to the part on ground floor Copper Foil 11.Due to the excision of described blind hole needs is ground floor Copper Foil 11 and base material 12, so, the sub-fraction of base material 12 can be worked in the present embodiment, i.e. V place.
S120, with the laser of the second setting energy, in the mode of out of focus, corresponds to remaining part processing on described base material 12 according to spiral trajectory or concentric circular tracks to carrying out the described blind hole after coordinate defocusing compensation.
As shown in Figure 5, in the present embodiment, the laser spot height that upwards out of focus is certain is processed described base material 12, because laser energy is Gaussian Profile, the energy in the middle of hot spot is large, and the energy at edge is little, after laser spot upwards regulates, the energy of laser can be increased, realize rapid processing.Particularly, the height of described laser spot out of focus is 1-2mm, and described second setting energy is 3-4W.
In the present embodiment, the mode of spiral trajectory or concentric circular tracks can be adopted to process, after described laser spot upwards regulates, the diameter of hot spot will become greatly, spiral or the concentrically ringed number of turns be reduced, thus realize the further lifting of process velocity.
The general diameter of described flexible circuitry board blind hole is smaller, the required precision of processing is high, in order to improve machining accuracy, before out of focus processing is carried out to the blind hole on described base material, the processed file corresponding to the blind hole on described base material is needed to carry out coordinate compensation, namely need to carry out coordinate compensation to out of focus processing, the spiral that the circle of positive burnt processing and out of focus are processed or the center superposition of concentric circular tracks.
The step that described coordinate compensates comprises:
S210, under positive coke-like state, processes the test pattern formed by spirte array, and records the coordinate figure Amn (X, Y) of the spirte after processing, using described coordinate figure Amn as standard value, wherein, and m >=1, n >=1;
Further, described spirte is standard cross figure, is asking in coordinate offset process, uses standard cross figure, and the standard cross figure of positive burnt processing is overlapped with the standard cross centre of figure that out of focus is processed.
As the process data contrast after Fig. 6 laser spot out of focus, graphics processing is in the present embodiment in the scope of 50*50mm, process 11*11 matrix cross figure, the coordinate of all standard cross figures in the range of work is offset to surrounding gradually by center, as B0101 and B1111 lays respectively at the outside of A0101 and A1111, concrete, the coordinate of out-of-focus appearance outwards offsets relative to the coordinate layer concentric circles trend of positive coke-like state.
S220, under out-of-focus appearance, processes same test pattern, and records the coordinate figure Bgi (X, Y) of the spirte after processing;
S230, compares described coordinate figure Bgi and described coordinate figure Amn, obtains deviate;
S240, compensates to described blind hole and corresponds in the graphics processing of remaining part correspondence on described base material by described deviate.
Wherein, the machining center of described test pattern under positive coke-like state overlaps with the machining center processed described flexible circuitry board blind hole; During described coordinate compensates, the height of out of focus is identical with the out of focus height in S120 step.
Concrete, described coordinate figure Amn and coordinate figure Bgi captures respectively by ccd camera.
Further, the method for described coordinate defocusing compensation comprises and repeatedly correcting, each quantity increasing spirte in test pattern.Standard cross matrix as processed 5*5 in the scope of 50*50mm carries out thick school, then in the quantity progressively increasing standard cross matrix, corrects further, and the quantity of described standard cross figure is more, and the range of work is larger, and the precision of correction is higher.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention; make some equivalent alternative or obvious modification without departing from the inventive concept of the premise; and performance or purposes identical, all should be considered as belonging to the scope of patent protection that the present invention is determined by submitted to claims.
Claims (7)
1. a method for flexible circuitry board blind hole processing, described flexible circuit board at least comprises ground floor Copper Foil, base material and second layer Copper Foil downwards successively, it is characterized in that, comprises step:
With the laser of the first setting energy, at least process described blind hole corresponding to the part on described ground floor Copper Foil;
With the laser of the second setting energy, in the mode of out of focus, correspond to remaining part processing on described base material according to spiral trajectory or concentric circular tracks to carrying out the described blind hole after coordinate compensation.
2. the method for flexible circuitry board blind hole processing as claimed in claim 1, is characterized in that, with the laser of the first setting energy, at least processes the step that described blind hole corresponds to the part on described ground floor Copper Foil and adopts the mode of positive Jiao, processes according to Circular test.
3. the method for flexible circuitry board blind hole processing as claimed in claim 1, it is characterized in that, the method that described coordinate compensates is: under positive coke-like state and out-of-focus appearance, processes respectively samely to form test pattern by spirte array, and respectively record process after the coordinate figure of spirte; Coordinate figure under positive coke-like state and out-of-focus appearance is compared, obtains deviate, then described deviate is compensated to described blind hole and correspond in the graphics processing of remaining part correspondence on described base material.
4. the method for flexible circuitry board blind hole processing as claimed in claim 3, it is characterized in that, the machining center of described test pattern under positive coke-like state overlaps with the machining center of described blind hole.
5. the method for flexible circuitry board blind hole processing as claimed in claim 3, is characterized in that, the coordinate figure under described positive coke-like state and out-of-focus appearance is all captured by ccd camera.
6. the method for flexible circuitry board blind hole processing as claimed in claim 3, it is characterized in that, described spirte is standard cross figure.
7. the method for flexible circuitry board blind hole processing as claimed in claim 3, is characterized in that, the method that described coordinate compensates comprises and repeatedly correcting, each increased number correcting spirte in the test pattern of processing.
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| CN201510142267.9A CN104703397B (en) | 2015-03-27 | 2015-03-27 | A kind of method of flexible circuitry board blind hole processing |
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| CN201510142267.9A CN104703397B (en) | 2015-03-27 | 2015-03-27 | A kind of method of flexible circuitry board blind hole processing |
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| CN104703397A true CN104703397A (en) | 2015-06-10 |
| CN104703397B CN104703397B (en) | 2018-03-09 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN105867297A (en) * | 2016-03-30 | 2016-08-17 | 维嘉数控科技（苏州）有限公司 | Mechanical platform coordinate compensation method and device |
| CN109068491A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of aluminium base board machining process |
| CN109922601A (en) * | 2019-03-14 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of processing method of route board blind hole |
| CN110831324A (en) * | 2019-06-17 | 2020-02-21 | 江西比亚迪电子部品件有限公司 | Novel blind hole and processing method thereof |
| CN111215754A (en) * | 2020-02-26 | 2020-06-02 | 武汉铱科赛科技有限公司 | Method, system, device and equipment for etching non-uniform insulating medium |
| CN112589296A (en) * | 2020-12-13 | 2021-04-02 | 珠海市镭通激光科技有限公司 | Laser light path system and method for processing flexible circuit board by using same |
| CN113280737A (en) * | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
| CN114425653A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser processing method and laser processing system for packaging substrate |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN105867297A (en) * | 2016-03-30 | 2016-08-17 | 维嘉数控科技（苏州）有限公司 | Mechanical platform coordinate compensation method and device |
| CN105867297B (en) * | 2016-03-30 | 2018-10-23 | 维嘉数控科技（苏州）有限公司 | The coordinate compensation method of mechanical platform and device |
| CN109068491A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of aluminium base board machining process |
| CN109922601A (en) * | 2019-03-14 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of processing method of route board blind hole |
| CN110831324A (en) * | 2019-06-17 | 2020-02-21 | 江西比亚迪电子部品件有限公司 | Novel blind hole and processing method thereof |
| CN111215754A (en) * | 2020-02-26 | 2020-06-02 | 武汉铱科赛科技有限公司 | Method, system, device and equipment for etching non-uniform insulating medium |
| CN114425653A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser processing method and laser processing system for packaging substrate |
| CN112589296A (en) * | 2020-12-13 | 2021-04-02 | 珠海市镭通激光科技有限公司 | Laser light path system and method for processing flexible circuit board by using same |
| CN113280737A (en) * | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
| CN113280737B (en) * | 2021-05-14 | 2023-08-29 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
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Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |
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