CN107182167A - Thick copper PCB power panels - Google Patents
Thick copper PCB power panels Download PDFInfo
- Publication number
- CN107182167A CN107182167A CN201610137552.6A CN201610137552A CN107182167A CN 107182167 A CN107182167 A CN 107182167A CN 201610137552 A CN201610137552 A CN 201610137552A CN 107182167 A CN107182167 A CN 107182167A
- Authority
- CN
- China
- Prior art keywords
- thick copper
- power panels
- areas
- pcb power
- endoporus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention discloses a kind of thick copper PCB power panels, including non-functional pad, the core material of the non-functional pad is provided with the Pu Tongqu of ring-type, and the Breadth Maximum of the hollow space in the Pu Tong areas is not more than the diameter of the endoporus to be drilled of the non-functional pad.The thick copper PCB power panels provided using the present invention can effectively reduce the difference in height of ectonexine core plate, it is to avoid due to starved defect caused by difference in height.Qie Putong areas are hollow ring-type, and the Breadth Maximum of hollow space is not more than the diameter of the endoporus to be drilled of non-functional pad, and then hole wall edge is respectively positioned in the range of Pu Tong areas after follow-up drilling, that is, the setting hole wall for passing through Pu Tong areas is not in segregation phenomenon.Qie Putong areas are annular in shape, in boring procedure, effectively reduce the copper face product of bit cutting, reduce resulting heat, reduce temperature of diamond bit, it is ensured that while drilling reliability, reduce the abrasion to drill bit, and then reduce the processing cost of thick copper PCB power panels.
Description
Technical field
The present invention relates to printed circuit board technology field, more specifically to a kind of thick copper PCB power supplys
Plate.
Background technology
Printed circuit board (PCB), also known as printed circuit board (PCB), are electronic component electrical connections
Supplier.It is the mistake for greatly reducing wiring and assembling using the major advantage of circuit board, improves
The gentle productive labor rate of Automated water.According to the wiring board number of plies, pcb board can be divided into single sided board, dual platen,
Four laminates, six laminates and other multilayer circuit boards.
Thick copper PCB power panels are a kind of conventional printed circuit boards, refer generally to any layer inside and outside pcb board part
The plate for power module more than or equal to 3oz.Because ectonexine is all higher than using the thickness of copper foil
2oz, the difference in height of generation influences very big for the starved that pcb board part is pressed.Namely in pcb board part
Easily there is cavity in interior resin.And easily there is the defect of hole wall separation in the hole wall of pcb board part.Therefore,
Non-functional pad for thick copper PCB power panels need to carry out paving Copper treatment to its internal layer.Non-functional pad is
The transmission of plate signal is not involved in, with the copper dish that do not play function of the All other routes without conducting.Existing skill
The generally circular in cross section region in internal layer Pu Tong areas of non-functional pad in art.Though by setting Pu Tong areas effectively to keep away
The problem of pad hole wall is separated is exempted from.But in the boring procedure of pad endoporus, during bit cutting copper dish
Substantial amounts of heat can be produced, while the abrasion to drill bit is larger.So that thick copper PCB power panels plus
Work cost is higher, and the reliability of power supply panel hole is relatively low.
In summary, thick copper PCB power panels how to be efficiently solved and starved, pad endoporus easily occur
Reliability is relatively low and the problems such as higher processing cost, is current those skilled in the art asking of being badly in need of solving
Topic.
The content of the invention
In view of this, it is an object of the invention to provide a kind of thick copper PCB power panels, the thick copper PCB
The structure design of power panel can efficiently solve thick copper PCB power panels and starved, pad endoporus easily occurs
Reliability is relatively low and the problem of higher processing cost.
In order to achieve the above object, the present invention provides following technical scheme：
A kind of thick copper PCB power panels, including non-functional pad, the core material of the non-functional pad are set
It is equipped with the Pu Tongqu of ring-type, the Breadth Maximum of the hollow space in the Pu Tong areas is not more than described non-functional
The diameter of the endoporus to be drilled of pad.
Preferably, in above-mentioned thick copper PCB power panels, the hollow space is rounded, and circular diameter is not
More than the diameter of the endoporus to be drilled of the non-functional pad.
Preferably, in above-mentioned thick copper PCB power panels, the Breadth Maximum of the hollow space in the Pu Tong areas with
The diameter difference of the endoporus to be drilled of the non-functional pad is in the range of 0.4mm-0.5mm.
Preferably, in above-mentioned thick copper PCB power panels, the aperture of the endoporus to be drilled is less than 1.0mm, institute
The Breadth Maximum of the hollow space in Shu Putong areas is smaller than the diameter of the endoporus to be drilled of the non-functional pad
0.4mm；Or, the aperture of the endoporus to be drilled is more than 1.0mm, the hollow space in the Pu Tong areas
Diameter small 0.5mm of the Breadth Maximum than the endoporus to be drilled of the non-functional pad.
Preferably, in above-mentioned thick copper PCB power panels, the Pu Tong areas, which have to prevent from drilling, twines the opening of silk,
One end of the opening is communicated to the hollow space in the Pu Tong areas, and the other end is communicated to the Pu Tong areas
Outward flange.
Preferably, in above-mentioned thick copper PCB power panels, the Pu Tong areas are provided with described at least two and are open.
Preferably, in above-mentioned thick copper PCB power panels, the week being open described at least two along the Pu Tong areas
To evenly distributed.
Preferably, in above-mentioned thick copper PCB power panels, opening being radially arranged along the Pu Tong areas.
Preferably, in above-mentioned thick copper PCB power panels, the width range of the opening is 0.1mm-0.3mm.
Preferably, in above-mentioned thick copper PCB power panels, the edge line of the hollow space is wave.
The thick copper PCB power panels that the present invention is provided include non-functional pad, the core material of non-functional pad
Pu Tongqu is provided with, the center in Pu Tong areas is in hollow, that is, does not lay copper foil, Ji Putong areas are in ring
Shape.Its Breadth Maximum of the hollow space of ring-type is not more than the diameter of the endoporus to be drilled of non-functional pad,
Exactly follow-up drilling can be drilled into Pu Tongqu.
Using the present invention provide thick copper PCB power panels when, due to non-functional pad core material set
You Putong areas, it is thus possible to the effective difference in height for reducing ectonexine core plate, it is to avoid because difference in height is drawn
The starved defect risen.Qie Putong areas are hollow ring-type, and the Breadth Maximum of hollow space is not more than NOT function
The diameter of the endoporus to be drilled of energy pad, and then hole wall edge is respectively positioned on Pu Tong areas model after follow-up drilling
In enclosing, that is, the setting hole wall for passing through Pu Tong areas is not in segregation phenomenon.Qie Putong areas are annular in shape,
In boring procedure, the copper face product of bit cutting is effectively reduced, resulting heat, drop is reduced
Low temperature of diamond bit, it is ensured that while drilling reliability, reduces the abrasion to drill bit, and then reduce thick copper
The processing cost of PCB power panels.
In a preferred embodiment, the thick copper PCB power panels that the present invention is provided, its Pu Tong area tool
There is opening, one end of the opening is communicated to the hollow space in the Pu Tong areas, and the other end is communicated to institute
The outward flange in Shu Putong areas.And then in drilling, the copper wire of generation disconnects at opening, thus twines
Silk level is short, and cutting is finished and can siphoned away by dust sucting pipeline, it is to avoid hole wall is rubbed by copper wire, enters one
Step improves the process reliability of endoporus, and then improves the yields of thick copper PCB power panels.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be right
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that,
Drawings in the following description are only some embodiments of the present invention, for those of ordinary skill in the art
For, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
A kind of structure in embodiment middle berth copper area of thick copper PCB power panels that Fig. 1 provides for the present invention
Schematic diagram.
Marked in accompanying drawing as follows：
Pu Tong areas 1, hollow space 2, opening 3.
Embodiment
The embodiment of the invention discloses a kind of thick copper PCB power panels, to avoid lacking for thick copper PCB power panels
Glue, the reliability for improving pad endoporus, reduce processing cost.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is entered
Row is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the invention,
Rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
There is the every other embodiment made and obtained under the premise of creative work, belong to what the present invention was protected
Scope.
Referring to Fig. 1, a kind of embodiment middle berth of thick copper PCB power panels that Fig. 1 provides for the present invention
The structural representation in copper area 1.
In a kind of embodiment, the thick copper PCB power panels that the present invention is provided include non-functional weldering
Disk, the core material of non-functional pad is provided with Pu Tong areas 1, and the center in Pu Tong areas 1 is in hollow, also
It is not lay copper foil, Ji Putong areas 1 are ring-type.It should be noted that ring-type herein refers to during inside is
Empty structure, it is not limited to annulus.The inward flange of specific cyclic structure can be that circle can also be
Square or other shapes, the outward flange of cyclic structure can also be configured according to actual conditions.One
As for non-functional pad, the outward flange in Pu Tong areas 1 is generally circular.Specific non-functional pad
Definition refer to prior art, not repeat herein.Pu Tong areas 1 are the region for being equipped with copper foil, are passed through
Spread copper and on the one hand reduce the difference in height of ectonexine core plate, and then reduce starved defect.Meanwhile, ring-type
Its Breadth Maximum of hollow space 2 is not more than the diameter of the endoporus to be drilled of non-functional pad, that is, hollow bulb
Points 2 maximum roomy diameter less than or equal to endoporus to be drilled, and then subsequently drilling can be drilled into Pu Tongqu
1, to avoid hole wall from separating.It should be noted that the structure in above-mentioned Pu Tong areas 1 refers to thick copper PCB power supplys
The structure in Pu Tong areas 1 before the interior hole drilling of the non-functional pad of plate, that is, its width of hollow space 2
Refer to the magnitude relationship before drilling with the relation of diameter of bore.
The setting in ring-type Pu Tong areas 1, that is, inner figure is optimized, non-functional pad is carried out
Windowing design.Specifically, copper can be integrally spread within the outward flange of Xian Duiputong areas 1 during processing, then root
According to the graphic designs of the inward flange of Pu Tong areas 1, the copper of part within inward flange is etched away, the paving of ring-type is formed
Copper area 1.Certainly, as needed, can also directly ring-type Pu Tong areas 1 outward flange and inward flange it
Between spread copper.The structure of Pu Tong areas 1 of non-functional pad core material is mainly elaborated above, for thick copper PCB
Other Each parts and annexation of power panel etc. refer to dependency structure of the prior art, this
Place is repeated no more.
Using the present invention provide thick copper PCB power panels when, due to non-functional pad core material set
You Putong areas 1, it is thus possible to the effective difference in height for reducing ectonexine core plate, it is to avoid because difference in height is drawn
The starved defect risen.Qie Putong areas 1 are hollow ring-type, and the Breadth Maximum of hollow space 2 is no more than non-
The diameter of the endoporus to be drilled of function pads, and then hole wall edge is respectively positioned on Pu Tong areas 1 after follow-up drilling
In the range of, that is, the setting hole wall for passing through Pu Tong areas 1 is not in segregation phenomenon.Qie Putong areas 1 are in
Ring-type, in boring procedure, effectively reduces the copper face product of bit cutting, reduces resulting heat
Amount, reduces temperature of diamond bit, it is ensured that while drilling reliability, reduces the abrasion to drill bit, and then drop
The processing cost of low thick copper PCB power panels.
Further, hollow space 2 can be with rounded.Because the endoporus of common non-functional pad is circle,
Therefore hollow space 2 is provided in round accordingly, can reduce the copper face of bit cutting to greatest extent
Product, and then drill bit heat is effectively reduced, reduce bit wear.When hollow space 2 is circle, then set
The diameter that circular diameter is not more than the endoporus to be drilled of non-functional pad is put, thus is enabled to during drilling
The hole wall of endoporus is located just at the inward flange in Pu Tong areas 1 or is drilled into Pu Tong areas 1, to avoid after drilling
The separation of hole wall.Certainly, according to specific needs, hollow space 2 can also be set to other shapes,
But still need to ensure the diameter that its width is not more than endoporus to be drilled.
Specifically, the endoporus to be drilled of the Breadth Maximum nand function pad of the hollow space 2 in Pu Tong areas 1
Diameter difference can be arranged in the range of 0.4mm-0.5mm.Namely the hollow space 2 in Pu Tong areas 1 is most
Big width is less than the diameter 0.4mm-0.5mm of endoporus to be drilled, circular when hollow space 2 is circle
Diameter is less than the diameter 0.4mm-0.5mm of endoporus to be drilled.Certainly for a certain determination Pu Tong areas 1 and
Speech, the diameter difference of the endoporus to be drilled of the Breadth Maximum nand function pad of its hollow space 2 should be to determine
Value, and the value is in above-mentioned number range.When the two is in above-mentioned number range, on the one hand can
Be effectively ensured drilling after hole wall occur without segregation phenomenon, while so that the area of bit cutting copper as far as possible
It is small, reduce heat and produce.
For different size endoporus, when the aperture of endoporus to be drilled is less than 1.0mm, Pu Tong areas 1
The Breadth Maximum of hollow space 2 can than the endoporus to be drilled of non-functional pad the small 0.4mm of diameter；Treating
When the aperture for boring endoporus is more than 1.0mm, the Breadth Maximum of the hollow space 2 in Pu Tong areas 1 can be than non-functional
The small 0.5mm of diameter of the endoporus to be drilled of pad.
On the basis of the various embodiments described above, Pu Tong areas 1, which can set to prevent from drilling, twines the opening 3 of silk,
One end of opening 3 is communicated to the hollow space 2 in Pu Tong areas 1, and the other end is communicated to the outward flange in Pu Tong areas 1.
Set namely on Pu Tongqu 1 and be communicated to the inward flange of Pu Tong areas 1 and outer peripheral gap, and then bored
Kong Shi, the copper wire of generation disconnects at opening 3, thus twines that silk level is short, and finish can be by dust suction for cutting
Pipeline is siphoned away, it is to avoid hole wall is rubbed by copper wire, is further improved the process reliability of endoporus, is entered
And improve the yields of thick copper PCB power panels.
Further, Pu Tong areas 1 can set at least two openings 3, thus during drilling, be opened each
Copper wire disconnects at mouth 3, thus copper wire is shorter, more effectively avoids what copper wire device to hole wall friction was caused
Hole wall is damaged.
Further, the circumference that at least two openings 3 can be along Pu Tong areas 1 is evenly distributed, that is,
Multiple openings 3 are provided with, and 3 circumference with predetermined interval along Pu Tong areas 1 of multiple openings is evenly distributed, enters
And the copper wire produced is isometric, easily siphoned away by dust sucting pipeline.Specifically, four openings 3 can be set,
Four openings 3 are uniformly arranged with 90 degree for interval.
Opening 3 specifically being radially arranged along Pu Tong areas 1, that is, pawnshop copper area 1 outward flange or interior
When circle is in edge, opening 3 being radially arranged along circular.When opening 3 is provided with multiple, Duo Gekai
Mouth 3 can be disposed radially.It is disposed radially with multiple openings 3 and evenly distributed is in the circumferential
Example, Pu Tong areas 1 are in class plum blossom-shaped structure, as plum blossom disk.Certainly, as needed, opening 3 also may be used
Set with the radial skew in relative Pu Tong areas 1, be in 15-30 degree angles such as between radial direction, multiple openings 3
When being obliquely installed, Pu Tong areas 1 are in foliaceous, in boring procedure, produce the copper wire that length is not waited,
So that the length of part copper wire is extremely short, thus it can be obtained shorter by way of multiple openings 3 are set
Copper wire, it is to avoid the friction to hole wall.
The width range of opening 3 could be arranged to 0.1mm-0.3mm, can be specifically 0.2mm.When
So opening 3 width can according to size, the size of hollow space 2 in Pu Tong areas 1 in Pu Tong areas 1 etc. because
Element is configured, to cause the copper wire of its generation that can either drill shorter, and does not cause hole wall after drilling
Large area separation.
In order that copper wire is shorter after must drilling, the edge line of the hollow space 2 in Pu Tong areas 1 could be arranged to
Wave, that is, the inward flange in Pu Tong areas 1 are set to wave.Thus in drilling, working angles
Middle copper wire disconnects at wave, and then make it that copper wire is shorter, it is to avoid the friction to hole wall, and due to
The Breadth Maximum of hollow space 2 is not more than the aperture of endoporus to be drilled, therefore hole wall surrounding will not go out after drilling
Now separate.Certainly, can also be by hollow space 2 when being provided with opening 3 on Pu Tongqu 1 as needed
Edge be set to wave, further shorten copper wire length.
In order to prevent due to ectonexine core plate difference in height produce starved, can core material blank
Region sets Pu Tong areas 1, that is, carries out paving Copper treatment, to reduce the defect that plate presses plastic emitting, improves thick
The yields of copper PCB power panels.
The embodiment of each in this specification is described by the way of progressive, what each embodiment was stressed
All it is that identical similar portion is mutual referring to i.e. between the difference with other embodiment, each embodiment
Can.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or make
With the present invention.A variety of modifications to these embodiments will be aobvious for those skilled in the art
And be clear to, generic principles defined herein can not depart from the spirit or scope of the present invention
In the case of, realize in other embodiments.Therefore, the present invention is not intended to be limited to shown in this article
These embodiments, and be to fit to consistent with features of novelty with principles disclosed herein most wide
Scope.
Claims (10)
1. a kind of thick copper PCB power panels, including non-functional pad, it is characterised in that described
The core material of non-functional pad is provided with the Pu Tongqu of ring-type, the hollow space in the Pu Tong areas
Breadth Maximum be not more than the non-functional pad endoporus to be drilled diameter.
2. thick copper PCB power panels according to claim 1, it is characterised in that described
Hollow space is rounded, and circular diameter is not more than the straight of the endoporus to be drilled of the non-functional pad
Footpath.
3. thick copper PCB power panels according to claim 1, it is characterised in that described
The diameter difference of the Breadth Maximum of the hollow space in Pu Tong areas and the endoporus to be drilled of the non-functional pad
In the range of 0.4mm-0.5mm.
4. thick copper PCB power panels according to claim 3, it is characterised in that described
The aperture of endoporus to be drilled is less than 1.0mm, and the Breadth Maximum of the hollow space in the Pu Tong areas compares institute
State the small 0.4mm of diameter of the endoporus to be drilled of non-functional pad；Or, the hole of the endoporus to be drilled
Footpath is more than 1.0mm, and the Breadth Maximum of the hollow space in the Pu Tong areas is than the non-functional pad
Endoporus to be drilled the small 0.5mm of diameter.
5. the thick copper PCB power panels according to claim any one of 1-4, its feature exists
In the Pu Tong areas, which have to prevent from drilling, twines the opening of silk, and one end of the opening is communicated to institute
The hollow space in Shu Putong areas, the other end is communicated to the outward flange in the Pu Tong areas.
6. thick copper PCB power panels according to claim 5, it is characterised in that described
Pu Tong areas are provided with described at least two and are open.
7. thick copper PCB power panels according to claim 6, it is characterised in that at least
Circumference of two openings along the Pu Tong areas is evenly distributed.
8. thick copper PCB power panels according to claim 5, it is characterised in that described
Be open being radially arranged along the Pu Tong areas.
9. thick copper PCB power panels according to claim 5, it is characterised in that described
The width range of opening is 0.1mm-0.3mm.
10. thick copper PCB power panels according to claim 1, it is characterised in that described
The edge line of hollow space is wave.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610137552.6A CN107182167A (en) | 2016-03-10 | 2016-03-10 | Thick copper PCB power panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610137552.6A CN107182167A (en) | 2016-03-10 | 2016-03-10 | Thick copper PCB power panels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107182167A true CN107182167A (en) | 2017-09-19 |
Family
ID=59830041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610137552.6A Pending CN107182167A (en) | 2016-03-10 | 2016-03-10 | Thick copper PCB power panels |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107182167A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862693A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of annular pad and its management-control method |
| CN110461106A (en) * | 2019-07-26 | 2019-11-15 | 江门崇达电路技术有限公司 | A method of making large aperture via hole on thick copper circuit board |
| CN113038722A (en) * | 2021-02-01 | 2021-06-25 | 广州广合科技股份有限公司 | PCB hole burr improving method |
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| CN201657498U (en) * | 2010-01-19 | 2010-11-24 | 深南电路有限公司 | Welding pad and circuit board therewith |
| CN103717012A (en) * | 2012-09-28 | 2014-04-09 | 杭州华三通信技术有限公司 | PCB board via impedance control method and structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201657498U (en) * | 2010-01-19 | 2010-11-24 | 深南电路有限公司 | Welding pad and circuit board therewith |
| CN103717012A (en) * | 2012-09-28 | 2014-04-09 | 杭州华三通信技术有限公司 | PCB board via impedance control method and structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862693A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of annular pad and its management-control method |
| CN109862693B (en) * | 2019-02-01 | 2022-01-07 | 奥士康精密电路（惠州）有限公司 | Annular welding disk and control method thereof |
| CN110461106A (en) * | 2019-07-26 | 2019-11-15 | 江门崇达电路技术有限公司 | A method of making large aperture via hole on thick copper circuit board |
| CN113038722A (en) * | 2021-02-01 | 2021-06-25 | 广州广合科技股份有限公司 | PCB hole burr improving method |
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Application publication date: 20170919 |