CN110662355A - Process for improving drilling efficiency of printed circuit board - Google Patents
Process for improving drilling efficiency of printed circuit board Download PDFInfo
- Publication number
- CN110662355A CN110662355A CN201910900088.5A CN201910900088A CN110662355A CN 110662355 A CN110662355 A CN 110662355A CN 201910900088 A CN201910900088 A CN 201910900088A CN 110662355 A CN110662355 A CN 110662355A
- Authority
- CN
- China
- Prior art keywords
- drilling
- hole
- printed circuit
- drilled
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 33
- 230000009191 jumping Effects 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- -1 two bores Chemical compound 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The invention discloses a process for improving the drilling efficiency of a printed circuit board, which comprises the following steps: determining the number, the aperture and the spacing of the drilled holes according to the board, the board thickness and the hole site design parameters of the printed circuit board to be drilled; placing the printed circuit board to be drilled on a workbench to perform drilling operation; and selecting jumping tracks according to the drilling quantity and the drilling positions to drill in sequence, wherein the hole spacing between adjacent drilled holes is not less than 5-7MIL during drilling, hole site design parameters comprise the drilling quantity, the drilling spacing and the drilling aperture, the jumping tracks follow the hole site drilled for the first time as a reference point, subsequent drilled holes are far away from the hole site drilled for the last time, and the hole sites drilled for two adjacent drilling operations are arranged in a central symmetry manner. In the technical scheme, the drilling process of the printed circuit board is completed completely, the thickness of the minimum hole wall is ensured to be within the design range, the hole wall can not be broken, and the subsequent process is convenient to process.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a process for improving the drilling efficiency of a printed circuit board.
Background
In the prior art, the design of the near hole of the traditional circuit board, two near holes of 3.2MM on the socket terminal, the flow requires to plate the technology according to the figure, all need to plate the hole in the figure with tin, namely two bores, if two holes are accomplished in one bore, again according to customer's original design compensation aperture, do not consider the equipment precision, the dry film can not the hole sealing can be broken by air, the figure is electroplated and also has liquid medicine to go into, leads to having copper on the NPTH hole. The existing technology is to drill holes twice, but the drilling twice has the following defects that the drilling is divided into two drilling procedures, the processing efficiency is low, the secondary drilling has the risk of drilling leakage and cutter breakage, the drilling deviation can occur, the drilling deviation can be limited, the tin can be melted in the limited 24-hour secondary drilling after tin plating, and the pattern board surface is easy to scrape after the pattern is printed. PTHs are copper-sinker Through Hole with copper on the Hole walls, typically VIA holes (VIA) and device holes. NPTH is a Non-copper sinking Hole (Non flat Through Hole), the Hole wall has no copper, generally is a positioning Hole and a screw Hole, and can be sealed by a dry film or drilled or punched for the second time after rubber plug before electroplating or electroplating. MIL, Chinese translation, MIL, i.e., one thousandth of an inch, equals 0.0254mm (millimeters).
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a process for improving the drilling efficiency of a printed circuit board, overcomes the defects of two times of drilling in the prior art, avoids scraping the surface of a faceplate in a secondary drill and avoids the risk of tin melting in the secondary drill during overtime control, and improves the production efficiency and reduces the production cost by applying one-time drilling.
In order to achieve the purpose, the invention adopts the technical scheme that: a process for improving the drilling efficiency of a printed circuit board comprises the following steps:
s1, determining the number, the aperture and the spacing of drilled holes according to the design parameters of the plate, the plate thickness and the hole site of the printed circuit board to be drilled;
s2, placing the printed circuit board to be drilled on a workbench to perform drilling operation;
s3, selecting jumping drill tracks according to the number and the positions of the drill holes to drill holes in sequence, wherein the hole spacing between the adjacent drill holes is not less than 5-7MIL during drilling.
Further, the hole site design parameters include the number of drilled holes, the spacing between drilled holes, and the diameter of drilled holes.
Furthermore, the track of the jump drill follows the hole site of the first drilling as a reference point, and the subsequent drilling is far away from the hole site of the previous drilling.
Furthermore, the hole sites of two adjacent drilling operations are arranged in central symmetry.
Further, the distance between two holes closest to each other in the drilling process is 6 MIL.
Further, the hole pitch is the minimum hole wall width of the two holes.
Compared with the prior art, the invention has the beneficial effects that: in the technical scheme, the drilling process of the printed circuit board is completed completely, the thickness of the minimum hole wall is ensured to be within the design range, the hole wall can not be broken, and the subsequent process is convenient to process.
Detailed Description
The invention relates to a process for improving the drilling efficiency of a printed circuit board, which comprises the following steps:
s1, determining the number, the aperture and the spacing of drilled holes according to the design parameters of the plate, the plate thickness and the hole site of the printed circuit board to be drilled;
s2, placing the printed circuit board to be drilled on a workbench to perform drilling operation;
s3, selecting jumping drill tracks according to the number and the positions of the drill holes to drill holes in sequence, wherein the hole spacing between the adjacent drill holes is not less than 5-7MIL during drilling.
Further, the hole site design parameters include the number of drilled holes, the spacing between drilled holes, and the diameter of drilled holes. The track of the jump drill follows the track of the first drill hole as a reference point, and the subsequent drill holes are far away from the hole position of the previous drill hole, and the specific implementation is to program the corresponding track of the jump drill on the drilling machine, and the drilling action is executed by the program set by the evidence of the drilling machine. The hole sites of two adjacent drilling operations are arranged in a centrosymmetric manner, stress deformation exists in the drilling process, the hole sites in sequence are arranged in a centrosymmetric manner, and the stress deformation among the hole sites can be reduced, namely, the stress balance is realized. The distance between two holes closest to each other in the drilling process is 6MIL, and the parameter is the optimal scheme for actual production. The hole pitch is the minimum hole wall width of two holes, which is also called the intermediate bridge.
In the traditional technical scheme, one scheme is that two holes are finished at one time in a drilling process, the hole pitch is designed to be 6MIL in an original drilling process, but in the actual machining design, the holes need to be compensated by 2MIL, the pitch is only 4MIL after the hole drilling compensation, an intermediate bridge is basically not supported by stress, and the hole wall can be broken under the impact of the drilling process and is proved to be broken by practice; the other scheme is that after compensation is carried out according to the original design, the design is not optimized, the two holes are drilled twice, one hole is drilled firstly, the other hole is drilled after electroplating, and two drilling procedures are needed.
In the technical scheme of the invention, because the original design of a customer cannot be changed, according to the characteristics of the printed circuit board, the width of the hole wall is preferentially ensured to be 6MIL in the machining process, under the condition of thermal expansion and cold contraction of subsequent processes, the intermediate bridge is ensured to be unchanged, the holes are compensated according to a single side, the distance between the holes can ensure the machining capacity of the machine, the intermediate bridge of the 6MIL cannot be broken, two holes are drilled at one time, and the holes cannot be broken in the dry film process.
Under the condition of drilling hole near hole design, parts of socket fixing holes and fixing hole ports of printed circuit boards such as television boxes, routers and the like are densely arranged, so that the interface position is near hole design. Aiming at the technical problems in the near hole design, a new design concept is developed and applied to the engineering design of the circuit board similar to the near hole and the drilling process manufacturing of the circuit board. In order to reduce the processing times of drilling, the characteristics of the original design of the products are broken through, the process of drilling after the pattern is electrified is changed, the hole sealing capability of the dry film can be achieved in the process of an outer layer circuit according to the acceptance standard of the industry and the original design requirement is not violated through the optimization of the drilling technology design of a circuit board factory. The drilling equipment is the existing technology or material, and the technicians can directly purchase or order from the market according to the required product model and specification.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
The present invention is described in detail and completely by the technical solutions in the above embodiments, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Claims (6)
1. A process for improving the drilling efficiency of a printed circuit board is characterized by comprising the following steps:
s1, determining the number, the aperture and the spacing of drilled holes according to the design parameters of the plate, the plate thickness and the hole site of the printed circuit board to be drilled;
s2, placing the printed circuit board to be drilled on a workbench to perform drilling operation;
s3, selecting jumping drill tracks according to the number and the positions of the drill holes to drill holes in sequence, wherein the hole spacing between the adjacent drill holes is not less than 5-7MIL during drilling.
2. The process for improving the drilling efficiency of printed circuit boards of claim 1 wherein the hole site design parameters include the number of drilled holes, the spacing between drilled holes, and the diameter of drilled holes.
3. The process for improving the drilling efficiency of the printed circuit board as claimed in claim 1, wherein the track of the jump drill follows the reference point of the first drilling hole, and the subsequent drilling holes are far away from the previous drilling hole.
4. The process for improving the drilling efficiency of the printed circuit board as claimed in claim 3, wherein the hole sites of two adjacent drilling operations are arranged in a central symmetry.
5. The process for improving the drilling efficiency of the printed circuit board as claimed in claim 4, wherein the distance between two holes closest to each other in the drilling process is 6 MIL.
6. The process for improving the drilling efficiency of printed circuit boards of claim 5 wherein the hole pitch is the minimum hole wall width of two holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910900088.5A CN110662355A (en) | 2019-09-23 | 2019-09-23 | Process for improving drilling efficiency of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910900088.5A CN110662355A (en) | 2019-09-23 | 2019-09-23 | Process for improving drilling efficiency of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110662355A true CN110662355A (en) | 2020-01-07 |
Family
ID=69038996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910900088.5A Pending CN110662355A (en) | 2019-09-23 | 2019-09-23 | Process for improving drilling efficiency of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110662355A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970827A (en) * | 2020-08-05 | 2020-11-20 | 金禄电子科技股份有限公司 | Drilling method of drilling machine |
| CN112638044A (en) * | 2021-02-19 | 2021-04-09 | 四川英创力电子科技股份有限公司 | Drilling positioning method for multilayer printed circuit board |
| CN115229897A (en) * | 2021-12-29 | 2022-10-25 | 龙南骏亚电子科技有限公司 | Method and device for drilling through holes of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332340A (en) * | 1992-07-27 | 1994-07-26 | Excellon Automation | Drilling method and apparatus using variable dwell times |
| CN102039432A (en) * | 2010-09-30 | 2011-05-04 | 北大方正集团有限公司 | Printed circuit board (PCB) drilling method and equipment |
| CN104942873A (en) * | 2014-03-27 | 2015-09-30 | 维嘉数控科技（苏州）有限公司 | Drilling method for printed circuit board and drilling equipment thereof |
-
2019
- 2019-09-23 CN CN201910900088.5A patent/CN110662355A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332340A (en) * | 1992-07-27 | 1994-07-26 | Excellon Automation | Drilling method and apparatus using variable dwell times |
| CN102039432A (en) * | 2010-09-30 | 2011-05-04 | 北大方正集团有限公司 | Printed circuit board (PCB) drilling method and equipment |
| CN104942873A (en) * | 2014-03-27 | 2015-09-30 | 维嘉数控科技（苏州）有限公司 | Drilling method for printed circuit board and drilling equipment thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970827A (en) * | 2020-08-05 | 2020-11-20 | 金禄电子科技股份有限公司 | Drilling method of drilling machine |
| CN111970827B (en) * | 2020-08-05 | 2021-10-01 | 金禄电子科技股份有限公司 | Drilling method of drilling machine |
| CN112638044A (en) * | 2021-02-19 | 2021-04-09 | 四川英创力电子科技股份有限公司 | Drilling positioning method for multilayer printed circuit board |
| CN115229897A (en) * | 2021-12-29 | 2022-10-25 | 龙南骏亚电子科技有限公司 | Method and device for drilling through holes of PCB |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200107 |