CN105392290A - Fabrication method of regularly composed reinforcing panel with single electrophoretic surface - Google Patents

Fabrication method of regularly composed reinforcing panel with single electrophoretic surface Download PDF

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Publication number
CN105392290A
CN105392290A CN201510917259.7A CN201510917259A CN105392290A CN 105392290 A CN105392290 A CN 105392290A CN 201510917259 A CN201510917259 A CN 201510917259A CN 105392290 A CN105392290 A CN 105392290A
Authority
CN
China
Prior art keywords
electrophoresis
steel band
reinforcing panel
fabrication method
steel belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510917259.7A
Other languages
Chinese (zh)
Inventor
王中飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Midas Precision Electronic Co Ltd
Original Assignee
Suzhou Midas Precision Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Midas Precision Electronic Co Ltd filed Critical Suzhou Midas Precision Electronic Co Ltd
Priority to CN201510917259.7A priority Critical patent/CN105392290A/en
Publication of CN105392290A publication Critical patent/CN105392290A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a fabrication method of a regularly composed reinforcing panel with a single electrophoretic surface, and relates to the technical field of processing of flexible circuit boards. The fabrication method comprises the following steps: laminating a steel belt, a PET raw film and a high-viscosity adhesive tape to obtain a raw material belt; making the steel belt surface of the raw material belt obtained in the first step upward, and carrying out electrophoresis through an electrophoresis device; and forming a colored coating on the steel belt surface, so as to obtain an electrophoresis intermediate material. According to the fabrication method of the reinforcing panel, the reinforcing panel with the single electrophoretic surface can be produced; the problem of poor pasting of a thermosetting adhesive caused by double-sided electrophoresis is avoided; and meanwhile, the regularly composed reinforcing panel obtained by punching the steel belt which is subjected to the electrophoresis is relatively low in cost.

Description

A kind of rule composing reinforcing chip manufacture method of one side electrophoresis
Technical field
The present invention relates to flexible PCB processing technique field, particularly a kind of rule composing reinforcing chip manufacture method of one side electrophoresis.
Background technology
Current adagio starts to adopt coloured reinforcing chip in producing, and the steel disc surface of such reinforcing chip scribbles coloring matter, and another side is still hot-setting adhesive.The method of processing such reinforcing chip mainly contains two kinds: one, first to the steel disc rule composing after shaping, then overall one side electrophoresis; Two, to steel band overall two-sided electrophoresis, then punch forming steel disc.These two kinds of methods all have weak point, and front a kind of processing time consuming is with high costs, owing to there is electrodeposited coating between rear a kind of hot-setting adhesive and steel disc, and poor adhesion.
Summary of the invention
The technical problem to be solved in the present invention is: provide the one side electrophoresis reinforcing chip that a kind of productivity ratio is high, cost is low.
For solving the problems of the technologies described above, the invention provides a kind of rule composing reinforcing chip manufacture method of one side electrophoresis, comprising the following steps:
Step one, by steel band, the former film of PET and high adhesive tape fit, obtain raw band;
Step 2, to be faced up by the steel band of the raw band in step one, carry out electrophoresis by electrophoretic apparatus, steel band face obtains colored coating, obtains material in the middle of electrophoresis;
Step 3, the steel band of material in the middle of electrophoresis in step 2 to be separated with the former film of PET, high adhesive tape, by steel band rolling;
Step 4, the steel band in step 3 is die-cut by forming cutter justifying, obtain the rule composing reinforcing chip of one side electrophoresis.
This reinforcing chip manufacture method can produce the reinforcing chip of one side electrophoresis, avoids the problem that hot-setting adhesive that two-sided electrophoresis causes is pasted not strongly, adopts the steel band die-cut acquisition rule composing reinforcing chip cost after electrophoresis lower simultaneously.
Accompanying drawing explanation
Fig. 1 is the production equipment schematic diagram that reinforcing chip manufacture method of the present invention adopts.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
As shown in Figure 1, the raw material that this reinforcing chip manufacture method adopts has: the former film of steel band 1, PET 2 and high adhesive tape 3.
Equipment has: electrophoretic apparatus 4, forming cutter.
Concrete production stage comprises:
Step one, steel band 1, the former film of PET 2 and high adhesive tape 3 to be fitted, obtain raw band;
Step 2, to be faced up by the steel band 1 of the raw band in step one, carry out electrophoresis by electrophoretic apparatus 4, steel band face obtains colored coating, obtains material in the middle of electrophoresis;
Step 3, the steel band 1 of material in the middle of electrophoresis in step 2 to be separated with the former film of PET 2, high adhesive tape 3, by steel band 1 rolling;
Step 4, the steel band 1 in step 3 is die-cut by forming cutter justifying, obtain the rule composing reinforcing chip of one side electrophoresis.
This reinforcing chip manufacture method can produce the reinforcing chip of one side electrophoresis, avoids the problem that hot-setting adhesive that two-sided electrophoresis causes is pasted not strongly, adopts the steel band die-cut acquisition rule composing reinforcing chip cost after electrophoresis lower simultaneously
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (1)

1. a rule composing reinforcing chip manufacture method for one side electrophoresis, is characterized in that, comprise the following steps:
Step one, by steel band, the former film of PET and high adhesive tape fit, obtain raw band;
Step 2, to be faced up by the steel band of the raw band in step one, carry out electrophoresis by electrophoretic apparatus, steel band face obtains colored coating, obtains material in the middle of electrophoresis;
Step 3, the steel band of material in the middle of electrophoresis in step 2 to be separated with the former film of PET, high adhesive tape, by steel band rolling;
Step 4, the steel band in step 3 is die-cut by forming cutter justifying, obtain the rule composing reinforcing chip of one side electrophoresis.
CN201510917259.7A 2015-12-11 2015-12-11 Fabrication method of regularly composed reinforcing panel with single electrophoretic surface Pending CN105392290A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510917259.7A CN105392290A (en) 2015-12-11 2015-12-11 Fabrication method of regularly composed reinforcing panel with single electrophoretic surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510917259.7A CN105392290A (en) 2015-12-11 2015-12-11 Fabrication method of regularly composed reinforcing panel with single electrophoretic surface

Publications (1)

Publication Number Publication Date
CN105392290A true CN105392290A (en) 2016-03-09

Family

ID=55424000

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510917259.7A Pending CN105392290A (en) 2015-12-11 2015-12-11 Fabrication method of regularly composed reinforcing panel with single electrophoretic surface

Country Status (1)

Country Link
CN (1) CN105392290A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107249255A (en) * 2017-06-09 2017-10-13 上达电子(深圳)股份有限公司 It is die cut gummed paper applying method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103173839A (en) * 2013-03-22 2013-06-26 株洲永盛电池材料有限公司 Method and device for continuous electrophoretic deposition of single side of metal strip
CN103600529A (en) * 2013-10-30 2014-02-26 苏州米达思精密电子有限公司 Black reinforced steel disc structure
CN103847162A (en) * 2014-02-21 2014-06-11 苏州米达思精密电子有限公司 Surface gold-plated golden reinforcing piece and preparation process thereof
CN104320906A (en) * 2014-09-01 2015-01-28 苏州米达思精密电子有限公司 Regularly arranged winding stiffener and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103173839A (en) * 2013-03-22 2013-06-26 株洲永盛电池材料有限公司 Method and device for continuous electrophoretic deposition of single side of metal strip
CN103600529A (en) * 2013-10-30 2014-02-26 苏州米达思精密电子有限公司 Black reinforced steel disc structure
CN103847162A (en) * 2014-02-21 2014-06-11 苏州米达思精密电子有限公司 Surface gold-plated golden reinforcing piece and preparation process thereof
CN104320906A (en) * 2014-09-01 2015-01-28 苏州米达思精密电子有限公司 Regularly arranged winding stiffener and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107249255A (en) * 2017-06-09 2017-10-13 上达电子(深圳)股份有限公司 It is die cut gummed paper applying method

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Application publication date: 20160309

RJ01 Rejection of invention patent application after publication