CN201838582U - Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device - Google Patents
Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device Download PDFInfo
- Publication number
- CN201838582U CN201838582U CN 201020555671 CN201020555671U CN201838582U CN 201838582 U CN201838582 U CN 201838582U CN 201020555671 CN201020555671 CN 201020555671 CN 201020555671 U CN201020555671 U CN 201020555671U CN 201838582 U CN201838582 U CN 201838582U
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- China
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- pin
- lead frame
- frame structure
- metal
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a lead frame structure with a big top and a small bottom of a metal foot of an integrated circuit or a discrete device, belonging to the field of semiconductor encapsulation technology. The lead frame structure comprises a metal base plate (1), a base island (2) and a pin (3), wherein the base island (2) and the pin (3) are arranged on the surface of the metal base plate (1) in a convex way; the lead frame structure is characterized in that the sizes of the tops of the base island (2) and the pin (3) are larger than those of the root parts of the base island (2) and the pin (3), so that the structure with the big top and the small bottom of the base island (2) and the pin (3) can be formed; and the base island (2) and the pin (3) are formed by compounding a plurality of metal layers. The lead frame structure with the big top and the small bottom of the metal foot of the integrated circuit or the discrete device is high in binding capacity of the plastic package material and the metal foot.
Description
(1) technical field
The present invention relates to a kind of integrated circuit or Discrete device packaging lead frame structure.Belong to the semiconductor packaging field.
(2) background technology
Traditional integrated circuit or Discrete device packaging mainly contain with lead frame structure: after the electroplating surface multiple layer metal is carried out in the front of employing metal substrate, promptly finish the making of lead frame.Not enough point below this kind lead frame has existed in encapsulation process: the lead frame structure of this kind is carried out electroplating surface multiple layer metal technology in the metal substrate front, and size is identical up and down for multiple layer metal, draws into the cylindrical metal leg structure.And plastic packaging material only wraps the cylindrical metal pin in the plastic packaging process, so the constraint ability of plastic packaging material and metal leg has just diminished, if when the plastic packaging material paster is not fine to pcb board, does over again and heavily pastes, and just is easy to generate the problem of pin, as shown in Figure 6.
Especially the kind of plastic packaging material is to adopt when filler is arranged, because material is at the environment and the follow-up surface-pasted stress changing relation of production process, can cause metal and plastic packaging material to produce the crack of vertical-type, its characteristic is the high more then hard more crisp more crack that is easy to generate more of proportion of filler.
(3) summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, the big integrated circuit or the up big and down small lead frame structure of discrete device metal leg of constraint ability of a kind of plastic packaging material and metal leg is provided.
The object of the present invention is achieved like this: a kind of integrated circuit or the up big and down small lead frame structure of discrete device metal leg, comprise metal substrate, Ji Dao and pin, Ji Dao and pin protrude and are arranged at metallic substrate surfaces, the size at described Ji Dao and pin top is greater than the size of root, form up big and down small Ji Dao and pin configuration, described Ji Dao and pin are formed by multilayer metal compound.
Integrated circuit of the present invention or the up big and down small lead frame structure of discrete device metal leg, the material of described multiple layer metal is respectively gold, palladium, nickel and silver from bottom to top, or is respectively gold, palladium, nickel, gold, golden nickel gold and golden nickeline.
Integrated circuit of the present invention or the up big and down small lead frame structure of discrete device metal leg, mushroom that described Ji Dao and pin are big up and small down or rivet-like structure, or other is similar to mushroom-shaped structure, and described Ji Dao and pin top are plane.
The invention has the beneficial effects as follows:
Because it is big slightly to form the size at Ji Dao and pin top in the operation of surface plating multiple layer metal layer, and the slightly little structure of size of Ji Dao and pin root, form up big and down small different size and wrapped up tightlyer, and more difficult generation is slided and fallen pin by plastic packaging material.
(4) description of drawings
Fig. 1～5 are each operation schematic diagram of production method of integrated circuit of the present invention or the up big and down small individual pen pin of discrete device metal leg lead frame structure.
Fig. 6 pin figure for what formed in the past.
Reference numeral among the figure:
(5) embodiment
Referring to Fig. 5, integrated circuit of the present invention or the up big and down small lead frame structure of discrete device metal leg, comprise metal substrate 1, basic island 2 and pin 3, base island 2 and pin 3 protrude and are arranged at metal substrate 1 surface, the size at base island 2 and pin 3 tops is greater than the size of root, form up big and down small basic island 2 and pin 3 structures, described basic island 2 and pin 3 are formed by multilayer metal compound.
Its method for packing comprises following processing step:
Referring to Fig. 1, get the suitable metal substrate of a slice thickness 1.The material of metal substrate can be carried out conversion according to the function and the characteristic of chip, for example: copper, aluminium, iron, copper alloy or dilval etc.
Referring to Fig. 2, utilize film sticking equipment to stick the photoresist film 4 and 5 that can carry out exposure imaging respectively at the front and the back side of metal substrate.
Referring to Fig. 3, the metal substrate front that utilizes exposure imaging equipment that step 2 is finished the pad pasting operation is carried out exposure imaging and is removed the part photoresist film, carries out the zone of metal cladding to expose follow-up needs on the metal substrate.
Referring to Fig. 4, the zone of the metal cladding that exposes in step 3 plates multiple layer metal, form basic island 1 and pin 2 respectively, the size at base island 2 and pin 3 tops is greater than the size of root, form up big and down small mushroom or rivet-like structure, or other is similar to mushroom-shaped structure, and basic island 1 and pin 2 can not come off.And described basic island 2 and pin 3 tops are plane, like this can be so that follow-up play the metal wire operation.Described multiple layer metal can have multilayer, and their material is respectively gold, palladium, nickel and silver from bottom to top, or is respectively gold, palladium, nickel, gold, golden nickel gold and golden nickeline.Described pin 3 is provided with individual pen.
The film operation is taken off at step 5, the positive back side of metal substrate
Referring to Fig. 5, the positive remaining photoresist film of metal substrate and the photoresist film at the metal substrate back side are removed.
Described pin 3 can be provided with multi-turn.
Claims (5)
1. integrated circuit or the up big and down small lead frame structure of discrete device metal leg, comprise metal substrate (1), Ji Dao (2) and pin (3), Ji Dao (2) and pin (3) protrude and are arranged at metal substrate (1) surface, it is characterized in that the size of the size at described Ji Dao (2) and pin (3) top greater than root, form up big and down small Ji Dao (2) and pin (3) structure, described Ji Dao (2) and pin (3) are formed by multilayer metal compound.
2. a kind of integrated circuit according to claim 1 or the up big and down small lead frame structure of discrete device metal leg, the material that it is characterized in that described multiple layer metal is respectively gold, palladium, nickel and silver from bottom to top, or is respectively gold, palladium, nickel, gold, golden nickel gold and golden nickeline.
3. a kind of integrated circuit according to claim 1 and 2 or the up big and down small lead frame structure of discrete device metal leg, it is characterized in that mushroom or rivet-like structure that described Ji Dao (2) and pin (3) are big up and small down, or other is similar to mushroom-shaped structure, and described Ji Dao (2) and pin (3) top are plane.
4. a kind of integrated circuit according to claim 1 and 2 or the up big and down small lead frame structure of discrete device metal leg is characterized in that described pin (3) is provided with single-turn or multi-turn.
5. a kind of integrated circuit according to claim 3 or the up big and down small lead frame structure of discrete device metal leg is characterized in that described pin (3) is provided with single-turn or multi-turn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020555671 CN201838582U (en) | 2010-09-30 | 2010-09-30 | Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020555671 CN201838582U (en) | 2010-09-30 | 2010-09-30 | Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201838582U true CN201838582U (en) | 2011-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020555671 Expired - Lifetime CN201838582U (en) | 2010-09-30 | 2010-09-30 | Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201838582U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013078752A1 (en) * | 2011-11-28 | 2013-06-06 | Jiangsu Changjiang Electronics Technology Co. Ltd | No-exposed-pad quad flat no-lead (qfn) packaging structures and method for manufacturing the same |
| CN105047638A (en) * | 2015-07-13 | 2015-11-11 | 郭秋卫 | Package for optimizing pins by metal hardness difference under mask exposure and manufacturing method thereof |
| CN108183091A (en) * | 2017-12-28 | 2018-06-19 | 江苏长电科技股份有限公司 | A kind of encapsulating structure and its process |
| CN113782453A (en) * | 2021-11-12 | 2021-12-10 | 深圳中科四合科技有限公司 | Manufacturing method of lead frame and lead frame structure |
-
2010
- 2010-09-30 CN CN 201020555671 patent/CN201838582U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013078752A1 (en) * | 2011-11-28 | 2013-06-06 | Jiangsu Changjiang Electronics Technology Co. Ltd | No-exposed-pad quad flat no-lead (qfn) packaging structures and method for manufacturing the same |
| CN105047638A (en) * | 2015-07-13 | 2015-11-11 | 郭秋卫 | Package for optimizing pins by metal hardness difference under mask exposure and manufacturing method thereof |
| CN108183091A (en) * | 2017-12-28 | 2018-06-19 | 江苏长电科技股份有限公司 | A kind of encapsulating structure and its process |
| CN113782453A (en) * | 2021-11-12 | 2021-12-10 | 深圳中科四合科技有限公司 | Manufacturing method of lead frame and lead frame structure |
| WO2023083360A1 (en) * | 2021-11-12 | 2023-05-19 | 深圳中科四合科技有限公司 | Manufacturing method for lead frame, and lead frame structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170111 Address after: Tianjin free trade zone (Dongjiang Bonded Port) No. 6865 North Road, 1-1-1802-7 financial and trade center of Asia Patentee after: Xin Xin finance leasing (Tianjin) Co., Ltd. Address before: 214434 Binjiang Middle Road, Jiangyin Development Zone, Jiangsu, China, 275 Patentee before: Jiangsu Changdian Sci. & Tech. Co., Ltd. |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Changjiang Electronics Technology Co., Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320000152 Denomination of utility model: Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device Granted publication date: 20110518 License type: Exclusive License Record date: 20170614 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320000152 Date of cancellation: 20200416 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200427 Address after: 214434, No. 78, mayor road, Chengjiang, Jiangsu, Jiangyin, Wuxi Patentee after: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 1-1-1802-7, North Zone, financial and Trade Center, No. 6865, Asia Road, Tianjin pilot free trade zone (Dongjiang Free Trade Port Area) Patentee before: Xin Xin finance leasing (Tianjin) Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110518 |