CN203435230U - Gold finger electroplating structure of multilayer printed circuit board - Google Patents
Gold finger electroplating structure of multilayer printed circuit board Download PDFInfo
- Publication number
- CN203435230U CN203435230U CN201320598651.6U CN201320598651U CN203435230U CN 203435230 U CN203435230 U CN 203435230U CN 201320598651 U CN201320598651 U CN 201320598651U CN 203435230 U CN203435230 U CN 203435230U
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- gold
- finger
- plated finger
- circuit board
- printed circuit
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Abstract
The utility model discloses a gold finger electroplating structure of a multilayer printed circuit board, which comprises a multilayer printed circuit board body and a technological edge that surrounds the multilayer printed circuit board body. The gold finger structure of the multilayer printed circuit board is characterized in that: the edge of the multilayer printed circuit board body is provided with a gold finger electroplating area and at least one electroplating gold-finger conductive part; the gold finger electroplating area is connected with the electroplating gold-finger conductive part through a lead wire which is arranged outside the surface layer of the multilayer printed circuit board and the gold finger electroplating area; the technological edge is provided with a conductive gold finger electroplating assisting part; and the gold finger electroplating assisting part is communicated with the electroplating gold-finger conductive part through leads which are embedded in the technological edge and the multilayer printed circuit board body. The multilayer printed circuit board provided by the utility model has the following advantages: simple structure, low cost, easy machining and stable performance. When the gold finger structure of the multilayer printed circuit board provided by the utility model is used for performing a gold finger electroplating step, the following functions are obtained: simple operation, high gold electroplating effect and no lead residue on the surface of the technological edge.
Description
Technical field
The utility model relates to the gold-plated finger play of multilayer board field, is specifically related to the gold-plated finger structure of a kind of multilayer board.
Background technology
In the process of electrogilding finger, the method that prior art adopts is lead-in wire to be set on printed circuit board (PCB) technique edges is communicated with gold-plated finger district, then utilize welding resistance ink to cover non-gold-plated region, by on technique edges, to lead-in wire, energising realizes gold-plated finger, finishing touch profile, the lead portion in V-cut SEPARATION OF GOLD finger outside.But after V-cut, technique edges is still easily leaded residual, the outward appearance of the multilayer circuit board that audio amplifier is finally made and quality.
Summary of the invention
In view of this, the utility model discloses on a kind of technique edges without the residual gold-plated finger structure of lead-in wire.
The purpose of this utility model is achieved through the following technical solutions: the gold-plated finger structure of a kind of multilayer board, comprise multilayer board body and around the technique edges of multilayer board body, described multilayer board body edges is provided with gold-plated finger district and at least one gold-plated finger conductive part, and described gold-plated finger district is connected by being arranged on the lead-in wire in this surface layer of multilayer board, outside, gold-plated finger district with gold-plated finger conductive part; Described technique edges is provided with the gold-plated finger assisted parts of conduction, and described gold-plated finger assisted parts is communicated with by being embedded in the wire of technique edges and multilayer board body interior with gold-plated finger conductive part.
During electrogilding finger, power supply can be connected to gold-plated finger assisted parts, gold-plated finger assisted parts will conduct to gold-plated finger conductive part by being embedded in the wire of technique edges and multilayer board body interior, finally make to go between charged, make gold-plated finger district plated with gold floor.The utility model is embedded in the conduction that is communicated with gold-plated finger conductive part and gold-plated finger assisted parts the inside of technique edges and multilayer board body, when follow-up V-cut operation is removed the lead-in wire in golden finger outside, technique edges remained on surface lead-in wire be can avoid, thereby outward appearance and the quality of prepared finished printed circuit board product improved.
Further, described gold-plated finger conductive part and gold-plated finger assisted parts are heavy copper hole.
Heavy copper hole has advantages of that processing is simple, conducting is respond well, after gold-plated finger, without removing separately, is especially suitable as gold-plated finger conductive part of the present utility model and gold-plated finger assisted parts.
Further, the wire of the gold-plated finger assisted parts of described connection and gold-plated finger conductive part is 170 °-190 ° with the angle that is connected the lead-in wire in gold-plated finger conductive part and gold-plated finger district.
The angle of wire and lead-in wire is 170 °-190 °, and the two is similar to arranging of straight line, is conducive to conservation, simplifies technique, is also conducive to the thorough removal that will go between of follow-up V-cut operation.
Further, described multilayer board body is provided with orifice ring, and described gold-plated finger conductive part and orifice ring distance are greater than 8mil.
The utility model is embedded in the conduction that is communicated with gold-plated finger conductive part and gold-plated finger assisted parts the inside of technique edges and multilayer board body, when follow-up V-cut operation is removed the lead-in wire in golden finger outside, can avoid technique edges remained on surface lead-in wire, thereby put forward outward appearance and the quality that guarantees the finished printed circuit board product that makes.
Accompanying drawing explanation
Fig. 1 is partial enlarged drawing of the present utility model.
Fig. 2 is part sectioned view of the present utility model.
Embodiment
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail:
The present embodiment provides a kind of multilayer board gold-plated finger structure, as Fig. 1 and Fig. 2 comprise multilayer board body 1 and around the technique edges 2 of multilayer board body 1, described multilayer board body 1 edge is provided with gold-plated finger district 3 and a gold-plated finger conductive part 4, and described gold-plated finger district 3 is connected by being arranged on the lead-in wire 5 in multilayer board body 1 top layer, 3 outsides, gold-plated finger district with gold-plated finger conductive part 4; Described technique edges 2 is provided with the gold-plated finger assisted parts 6 of conduction, and described gold-plated finger assisted parts 6 is communicated with by being embedded in the wire 7 of technique edges 2 and multilayer board body 1 inside with gold-plated finger conductive part 4.
In the present embodiment, the inner side of described gold-plated finger conductive part is concordant with gold-plated finger district outermost.
During electrogilding finger, power supply can be connected to gold-plated finger assisted parts 6, gold-plated finger assisted parts 6 will conduct to gold-plated finger conductive part 4 by being embedded in the wire 7 of technique edges 2 and multilayer board body 1 inside, finally make to go between 5 charged, make gold-plated finger district 3 plated with gold floor.The utility model is embedded in the conduction that is communicated with gold-plated finger conductive part and gold-plated finger assisted parts the inside of technique edges and multilayer board body, when follow-up V-cut operation is removed the lead-in wire in golden finger outside, technique edges remained on surface lead-in wire be can avoid, thereby outward appearance and the quality of prepared finished printed circuit board product improved.
Further, described gold-plated finger conductive part 4 and gold-plated finger assisted parts 6 are heavy copper hole.
The processing of heavy copper hole is simple, and conduction is good, after gold-plated finger without other removal.
The wire of the gold-plated finger assisted parts of described connection and gold-plated finger conductive part is 180 ° with the angle that is connected the lead-in wire in gold-plated finger conductive part and gold-plated finger district.
The Multilayer printed circuit board structure of the present embodiment is simple, with low cost, is easy to processing, stable performance.Use the gold-plated finger structure of multilayer board of the present embodiment to carry out gold-plated finger operation, simple to operate, gold-plated effect is good and technique edges is surperficial residual without lead-in wire.
Be more than wherein specific implementation of the present utility model, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection range of the present utility model.
Claims (4)
1. the gold-plated finger structure of multilayer board, comprise multilayer board body (1) and around the technique edges (2) of multilayer board body (1), it is characterized in that: described multilayer board body (1) edge is provided with gold-plated finger district (3) and at least one gold-plated finger conductive part (4), described gold-plated finger district (3) is connected by being arranged on the lead-in wire (5) in this surface layer of multilayer board, outside, gold-plated finger district with gold-plated finger conductive part (4); Described technique edges (2) is provided with the gold-plated finger assisted parts (6) of conduction, and described gold-plated finger assisted parts (6) is communicated with by being embedded in the inner wire (7) of technique edges (2) and multilayer board body (1) with gold-plated finger conductive part (4).
2. the gold-plated finger structure of multilayer board according to claim 1, is characterized in that: described gold-plated finger conductive part (4) and gold-plated finger assisted parts (6) are heavy copper hole.
3. the gold-plated finger structure of multilayer board according to claim 1 and 2, is characterized in that: the wire (7) of the gold-plated finger assisted parts of described connection (6) and gold-plated finger conductive part (4) is 170 °-190 ° with the angle that is connected the lead-in wire (5) in gold-plated finger conductive part (4) and gold-plated finger district (3).
4. the gold-plated finger structure of multilayer board according to claim 3, is characterized in that: described multilayer board body is provided with orifice ring, and described gold-plated finger conductive part and orifice ring distance are greater than 8mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320598651.6U CN203435230U (en) | 2013-09-27 | 2013-09-27 | Gold finger electroplating structure of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320598651.6U CN203435230U (en) | 2013-09-27 | 2013-09-27 | Gold finger electroplating structure of multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203435230U true CN203435230U (en) | 2014-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320598651.6U Expired - Fee Related CN203435230U (en) | 2013-09-27 | 2013-09-27 | Gold finger electroplating structure of multilayer printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN203435230U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852025A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of preparation method of golden finger |
| US10978599B2 (en) | 2016-04-11 | 2021-04-13 | Guangzhou Fastprint Circuit Tech Co., Ltd. | Method for improving corrosion resistance of gold finger |
| CN113271726A (en) * | 2021-05-18 | 2021-08-17 | 广州广合科技股份有限公司 | Three-side gold plating method for gold finger |
-
2013
- 2013-09-27 CN CN201320598651.6U patent/CN203435230U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10978599B2 (en) | 2016-04-11 | 2021-04-13 | Guangzhou Fastprint Circuit Tech Co., Ltd. | Method for improving corrosion resistance of gold finger |
| CN106852025A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of preparation method of golden finger |
| CN113271726A (en) * | 2021-05-18 | 2021-08-17 | 广州广合科技股份有限公司 | Three-side gold plating method for gold finger |
| CN113271726B (en) * | 2021-05-18 | 2022-03-04 | 广州广合科技股份有限公司 | Three-side gold plating method for gold finger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20210927 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |