CN106087023A - Utilize the method that pcb board frame electroplating clamp ensures uniform current density - Google Patents
Utilize the method that pcb board frame electroplating clamp ensures uniform current density Download PDFInfo
- Publication number
- CN106087023A CN106087023A CN201610648998.5A CN201610648998A CN106087023A CN 106087023 A CN106087023 A CN 106087023A CN 201610648998 A CN201610648998 A CN 201610648998A CN 106087023 A CN106087023 A CN 106087023A
- Authority
- CN
- China
- Prior art keywords
- metal clip
- clip frame
- frame
- electroplating clamp
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides the method that the frame electroplating clamp utilizing pcb board ensures uniform current density, described frame electroplating clamp is made up of the first metal clip frame and the second metal clip frame, wherein the first metal clip frame and the second metal clip frame are connected by nut and flexible button, when starting flexible button, second metal clip frame and the first metal clip frame are completely superposed, 3rd metal clip frame and the 4th metal clip frame are symmetrical with the first metal clip frame and the second metal clip frame respectively, and the 3rd metal clip frame and the 4th metal clip frame by two loose-leaf binders and the first metal clip frame and the second metal clip frame is hinged forms；While using above-mentioned frame electroplating clamp to carry out pcb board plating, use filtering 5% high-power water-cooling formula commutator with the use of.The present invention uses the frame electroplating clamp of particular design that the uniformity of electric current density can be effectively ensured, and uses high-power water-cooling formula commutator to ensure the stability of input electric current simultaneously, is more conducive to the uniformity of plating.
Description
Technical field
The present invention relates to pcb board industry, particularly relate to pcb board frame electroplating clamp and ensure the side of uniform current density
Method.
Background technology
From the later stage sixties 20th century, electroplating industry has obtained considerable entering under the promotion of third time Industrial Revolution
Step, brings advancing by leaps and bounds and developing rapidly of technology to all trades and professions including printed circuit board industry.It is up till now
Only, the application of electroplating technology is reached its maturity by people, and promotes electroplating technology constantly to low energy consumption, low material consumption, low stain, height
Quality, high efficiency direction develop rapidly.The development of the most adjoint electroplating technology of electroplating evenness, different application
There is different requirements in field to electroplating evenness, and the lifting of electroplating evenness has become " eternal theme " of electroplating technology.Plating
Technology also has the history of good decades in the application of PCB printed circuit board industry, along with developing rapidly of electronic technology, to print
The plating requirement of circuit board processed will be more and more higher.And stable, the most directly shadow of electric current density of input electric current when electroplating
Ring the uniform of plating.
In order to improve the uniformity of plating, prior art designs mainly for electroplating cell body, anode cover plate, anode titanium basket,
Plating jet pipe, the structure of nozzle, and gear electricity edge strip, the aspect such as proper use of of negative electrode scaffold make the change made new advances, although take
Obtained some progressive, but still need to make certain improvement at aspects such as cost control, technique difficulty or ease, effect quality.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, it is provided that utilize pcb board frame electroplating clamp to ensure uniform current density
Method.
The present invention can be achieved through the following technical solutions:
Utilizing the method that pcb board frame electroplating clamp ensures uniform current density, described frame electroplating clamp is by first
Metal clip frame and the second metal clip frame composition, wherein the first metal clip frame and the second metal clip frame are connected by nut and flexible button
Connecing, when starting flexible button, the second metal clip frame and the first metal clip frame are completely superposed, the 3rd metal clip frame and the 4th metal
Folder frame is symmetrical with the first metal clip frame and the second metal clip frame respectively, and the 3rd metal clip frame and the 4th metal clip frame are by two
Loose-leaf binder and the first metal clip frame and the second metal clip frame is hinged forms；Above-mentioned frame electroplating clamp is used to carry out pcb board plating
While, use filtering 5% high-power water-cooling formula commutator with the use of.
Further, described the first metal clip frame, the second metal clip frame, the 3rd metal clip frame and the 4th metal clip frame are equal
It is acid-alkali-corrosive-resisting, and the metal material conducted electricity very well.
Further, described the first metal clip frame, the second metal clip frame, the 3rd metal clip frame and the 4th metal clip frame
Upper and lower narrow hem width is 3-5cm.
Further, described the first metal clip frame, the second metal clip frame, the 3rd metal clip frame and the 4th metal clip frame
Left and right narrow hem width is 1-3cm.
Further, described metal material can be the one in titanium alloy, 304 rustless steels, 316 rustless steels or number
Kind.
What the present invention obtained has the beneficial effect that the frame electroplating clamp using particular design, can big according to electroplating bath
Little, the degree of depth and actual production require to change the length of frame electroplating clamp, it is to avoid change the plating folder of long length in electroplating process
Tool, dual-use material, reduce equipment cost, and the design of frame, it is ensured that metal pcb board is periphery uniform force when plating,
Prevent excessive bending, deformation and the breakage caused of local deformation, thus ensure the quality of product；Simultaneously by this frame fixture and filter
The high-power water-cooling formula commutator of ripple 5% with the use of, it is possible to ensure the stability of input electric current, it is achieved plating uniform
Property.
Accompanying drawing explanation
Fig. 1 is the structural representation of pcb board frame electroplating clamp；
In accompanying drawing: 1, the first metal clip frame；2, the second metal clip frame；3, nut；4, flexible button；5, loose-leaf binder；6,
Three metal clip frames；7, the 4th metal clip frame.
Detailed description of the invention
By embodiment, detailed description of the invention and the accompanying drawing of the present invention are made an explanation below.
Embodiment
Utilizing the method that pcb board frame electroplating clamp ensures uniform current density, described frame electroplating clamp is by first
Metal clip frame 1 and the second metal clip frame 2 form, and wherein the first metal clip frame 1 and the second metal clip frame 2 by nut 3 and stretch
Button 4 connects, and when starting flexible button 4, the second metal clip frame 2 is completely superposed with the first metal clip frame 1, such that it is able to according to
The size of electroplating bath, the degree of depth and actual production require to change the length of frame electroplating clamp, it is to avoid change in electroplating process and greatly enhance
The electroplating clamp of degree, dual-use material, reduces equipment cost；3rd metal clip frame 6 and the 4th metal clip frame 7 respectively with the first metal
Folder frame 1 and the second metal clip frame 2 are symmetrical, and the 3rd metal clip frame 3 and the 4th metal clip frame 4 are by loose-leaf binder 5 and the first metal
Folder frame 1 and the second metal clip frame 2 is hinged forms, the material of four kinds of metal clip frames is identical, is acid-alkali-corrosive-resisting, and conduction
Metal material and their upper and lower narrow hem width that performance is good are 3-5cm, and left and right narrow hem width is 1-3cm, and such design is permissible
Make frame fixture closely coupled with the edge of wiring board, thus realize more preferable electroplating effect；Use above-mentioned frame electroplating clamp
While carrying out pcb board plating, use the high-power water-cooling formula commutator of filtering 5% with the use of, it is ensured that input
The stability of electric current, helps pcb board uniformly-coating further.
The foregoing is only a kind of embodiment of the present invention, not in order to limit the present invention, all essences in the present invention
Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (5)
1. utilize pcb board frame electroplating clamp ensure uniform current density method, it is characterised in that this frame electroplating clamp by
First metal clip frame and the second metal clip frame composition, wherein the first metal clip frame and the second metal clip frame are pressed with flexible by nut
Button connects, and when starting flexible button, the second metal clip frame and the first metal clip frame are completely superposed, the 3rd metal clip frame and the 4th
Metal clip frame is symmetrical with the first metal clip frame and the second metal clip frame respectively, and the 3rd metal clip frame and the 4th metal clip frame pass through
Two loose-leaf binders and the first metal clip frame and the second metal clip frame is hinged forms；Above-mentioned frame electroplating clamp is used to carry out pcb board
While plating, use filtering 5% high-power water-cooling formula commutator with the use of.
The method utilizing pcb board frame electroplating clamp to ensure uniform current density the most according to claim 1, its feature exists
In, described the first metal clip frame, the second metal clip frame, the 3rd metal clip frame and the 4th metal clip frame are all acid-alkali-corrosive-resistings,
And the metal material conducted electricity very well.
The method utilizing pcb board frame electroplating clamp to ensure uniform current density the most according to claim 1, its feature exists
In, the upper and lower narrow hem width of described the first metal clip frame, the second metal clip frame, the 3rd metal clip frame and the 4th metal clip frame is
3-5cm。
The method utilizing pcb board frame electroplating clamp to ensure uniform current density the most according to claim 1, its feature exists
In, the left and right narrow hem width of described the first metal clip frame, the second metal clip frame, the 3rd metal clip frame and the 4th metal clip frame is
1-3cm。
The method utilizing pcb board frame electroplating clamp to ensure uniform current density the most according to claim 2, its feature exists
In, described metal material is one or several in titanium alloy, 304 rustless steels, 316 rustless steels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648998.5A CN106087023B (en) | 2016-08-09 | 2016-08-09 | Ensure the method for uniform current density using pcb board frame electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648998.5A CN106087023B (en) | 2016-08-09 | 2016-08-09 | Ensure the method for uniform current density using pcb board frame electroplating clamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106087023A true CN106087023A (en) | 2016-11-09 |
| CN106087023B CN106087023B (en) | 2018-10-23 |
Family
ID=57455437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610648998.5A Active CN106087023B (en) | 2016-08-09 | 2016-08-09 | Ensure the method for uniform current density using pcb board frame electroplating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106087023B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110938837A (en) * | 2019-11-22 | 2020-03-31 | 中南大学 | Method for separating and recovering tin coating of PCB (printed circuit board) by two-stage method |
| TWI759193B (en) * | 2019-11-26 | 2022-03-21 | 奧地利商勝思科技有限公司 | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate |
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| KR20100025892A (en) * | 2008-08-28 | 2010-03-10 | 김원영 | A jig device for multistage plated of printed circuit boards |
| JP4865102B1 (en) * | 2011-04-19 | 2012-02-01 | 福井工業株式会社 | Substrate support |
| CN202246955U (en) * | 2011-08-22 | 2012-05-30 | 杭州威利广光电科技股份有限公司 | Butylece terephthalate (BT) plate electroplating frame type clamp |
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| CN102383172A (en) * | 2011-11-30 | 2012-03-21 | 常州市双进电子有限公司 | Clamp board frame used for electroplating of printed circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110938837A (en) * | 2019-11-22 | 2020-03-31 | 中南大学 | Method for separating and recovering tin coating of PCB (printed circuit board) by two-stage method |
| TWI759193B (en) * | 2019-11-26 | 2022-03-21 | 奧地利商勝思科技有限公司 | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate |
| TWI823330B (en) * | 2019-11-26 | 2023-11-21 | 奧地利商勝思科技有限公司 | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106087023B (en) | 2018-10-23 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20230907 Address after: 242000 PCB Industrial Park, Guangde Economic Development Zone, Xuancheng City, Anhui Province Patentee after: Weiliguang Technology Co.,Ltd. Address before: 242200 Guangde Economic Development Zone, Xuancheng City, Anhui Province (Zhaolian Road) Patentee before: ANHUI GUANGDE WEIZHENG OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |