CN205275755U - Electroplating clamp - Google Patents
Electroplating clamp Download PDFInfo
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- CN205275755U CN205275755U CN201520942739.4U CN201520942739U CN205275755U CN 205275755 U CN205275755 U CN 205275755U CN 201520942739 U CN201520942739 U CN 201520942739U CN 205275755 U CN205275755 U CN 205275755U
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- fixed frame
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- electroplating clamp
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Abstract
The utility model provides an electroplating clamp. Electroplating clamp includes first fixed frame, second fixed frame, connecting device and hasp, first fixed frame with the fixed frame cooperation centre gripping of second is fixed and is waited to electroplate printed circuit board, connecting device swing joint first fixed frame with the frame is fixed to the second, the hasp is located first fixed frame, and the closure is fixed first fixed frame with the frame is fixed to the second. The utility model provides an electroplating clamp can prevent wait to electroplate printed circuit board and appear cardboard, falling board scheduling problem easily because cross thinly, simultaneously the utility model provides an electroplating clamp has simple structure, and stability is good, advantages such as fixed convenience, and can show lands improves the quality of product.
Description
Technical field
This practicality relates to the technical field that printed circuit board (PCB) manufactures, especially, it relates to a kind of electroplating clamp.
Background technology
Along with the continuous progress of printed circuit board (PCB) manufacturing technology, printed circuit board (PCB) just develops towards light, thin direction, and the design thickness of therefore present printed circuit board (PCB) is more and more thinner. But the flow process manufactured due to wiring board is very long, complex process, the printed circuit board (PCB) that design thickness is very thin there will be a lot of problem in process of production, especially very easily occurs the bad phenomenon such as clamp, board falling in electroplating process, as this reduced the good article rate of printed circuit board (PCB), also waste resource simultaneously.
Therefore, it is necessary to provide a kind of to prevent the electroplating clamp that the problem such as clamp, board falling occurs in electroplating process.
Practical novel content
The clamp that often occurs because of printed circuit board (PCB) very thin thickness in electroplating process for existing, the technical problem of board falling, the utility model provides a kind of electroplating clamp.
The utility model provides a kind of electroplating clamp, comprise the first fixed frame, the 2nd fixed frame, coupling device and snap close, described first fixed frame and described 2nd fixed frame cooperation grip electroplated printed circuit board (PCB), described coupling device is flexibly connected described first fixed frame and described 2nd fixed frame, described snap close is located at described first fixed frame, and sealed fixing described first fixed frame and described 2nd fixed frame.
In a better embodiment of the electroplating clamp of the utility model offer, described first fixed frame comprises the first frame, and described 2nd fixed frame comprises the 2nd frame, and described first frame and described 2nd frame surround closed rectangular frame structure all separately.
In a better embodiment of the electroplating clamp of the utility model offer, described first fixed frame is identical with the size of described 2nd fixed frame.
In a better embodiment of the electroplating clamp of the utility model offer, four angles of described first fixed frame and described 2nd fixed frame all carry out fillet process.
In a better embodiment of the electroplating clamp of the utility model offer, described coupling device comprises multiple hinge, and described hinge is hinged fixing described first fixed frame and described 2nd fixed frame respectively.
In a better embodiment of the electroplating clamp of the utility model offer, described snap close comprises connection section and latch part, and one end of described connection section is flexibly connected with described first fixed frame, and the other end is fixedly connected with described latch part.
In a better embodiment of the electroplating clamp of the utility model offer, described snap close has groove structure, and described first fixed frame and described 2nd fixed frame are fixed by the groove structure of described snap close.
Compared to prior art, the electroplating clamp that the utility model provides is by being fixed the electroplated printed circuit board (PCB) of very thin thickness, thus prevent described electroplated printed circuit board (PCB) from because of crossing thin, the problem such as clamp, board falling easily occurring, it is simple that the electroplating clamp that the utility model provides simultaneously has structure, good stability, the advantages such as convenient fixing, it is possible to improve the quality of product significantly.
Accompanying drawing explanation
In order to the technical scheme being illustrated more clearly in the utility model embodiment, below the accompanying drawing used required in embodiment being described is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of embodiment of the electroplating clamp that the utility model provides;
Fig. 2 is the structural representation of the snap close of the electroplating clamp shown in Fig. 1.
Embodiment
Technical problem, technical scheme and useful effect in order to make the utility model solve clearly are understood, below in conjunction with drawings and Examples, are further elaborated by the utility model. It is to be understood that specific embodiment described herein is only in order to explain the utility model, and it is not used in restriction the utility model.
Referring to Fig. 1, wherein Fig. 1 is the schematic diagram of a kind of embodiment of electroplating clamp that the utility model provides. Described electroplating clamp 100 comprises the first fixed frame 1, the 2nd fixed frame 2, coupling device 3 and snap close 4. The electroplated printed circuit board (PCB) that described first fixed frame 1 and described 2nd fixed frame 2 cooperatively interact and grip and be located at therebetween. Described coupling device 3 is for connecting described first fixed frame 1 and described 2nd fixed frame 2, and described snap close 4 is arranged on described first fixed frame 1, for sealed fixing described first fixed frame 1 and described 2nd fixed frame 2.
Described first fixed frame 1 is rectangular configuration, it pin 13 comprising the first frame 11 and being located on described first frame 11. Described first frame 11 surrounds closed rectangular frame structure, is located on described first frame 11 to described pin 13 interval. In the present embodiment, the width of described first frame 11 is 30mm, and the width of described first fixed frame 1 is 380mm, and described first fixed frame 1 length is 440mm. Wherein, being not limited to the present embodiment, the size of described first fixed frame 1 can adjust according to practical condition, and this is not limited by the utility model. In addition, four corners of described first frame 1 all carry out fillet process.
Described 2nd fixed frame 2 is rectangular configuration, and it comprises the 2nd frame 21 and the pin-and-hole 23 of described 2nd frame 21 is located at interval. Wherein, described 2nd frame 21 surrounds closed rectangular frame structure, and its four corners all carry out fillet process.
In the present embodiment, described first rectangular shaped rim 21 with the size of the 2nd rectangular shaped rim identical. And, described pin-and-hole 23 is equipped with described pin 13 one_to_one corresponding, when described electroplating clamp 100 is in closed state, described pin 13 is contained in described pin-and-hole 23, and the two cooperatively interacts and can also carry out spacing to the electroplated printed circuit board (PCB) being located between described first fixed frame 1 and described 2nd fixed frame 2. In the present embodiment, the diameter of described pin 13 is 2mm, and described pin-and-hole 23 is of a size of 4mm.
Described coupling device 3 comprises multiple hinge 31, and described multiple hinge 31 interval is located between described first fixed frame 1 and described 2nd fixed frame 2. Described coupling device 3 is by described multiple hinge 31 hinged fixing described first fixed frame 1 and described 2nd fixed frame 2 respectively. Refer to Fig. 2, it is the structural representation of the snap close of the electroplating clamp shown in Fig. 1.
Described snap close 4 comprises connection section 41 and latch part 42, and described connection section 41 one end is flexibly connected with described first fixed frame 1, and the other end is fixedly connected with described latch part 42. In the present embodiment, described connection section 41 and described latch part 42 are structure as a whole.
Described snap close 4 has groove structure, and described first fixed frame 1 and described 2nd fixed frame 2 can block and realize being fixed of the two in the groove structure into described snap close 4. And, described connection section 41 is also provided with and connects hole 411, and described connection section 41 is hinged fixing by described connection hole 411 and described first fixed frame 1.
When described first fixed frame 1 and described 2nd fixed frame 2 close, described latch part 42 is rotated by described connection section 41 and is blocked by described 2nd fixed frame 2 in the groove of described latch part 42, thus sealed fixing described first fixed frame 1 and described 2nd fixed frame 2, it is achieved the lock of described electroplating clamp 100 extremely operates.
Preferably, the width of described connection section 41 is 10mm, and the length of described latch part 42 is 30mm. Certainly, connection section 41 and described latch part 42 can also be other sizes, and concrete size can adjust according to practical condition, and this is not limited by the utility model.
The use procedure of described electroplating clamp 100 is as follows;
First described electroplating clamp 100 is opened, described snap close 4 is allocated to open position simultaneously;
Then described electroplated printed circuit board (PCB) is positioned between described first fixed frame 1 and described 2nd fixed frame 2, described electroplated printed circuit board (PCB) is carried out spacing by described pin 13, then described electroplating clamp 100 is closed, thus electroplated printed circuit board (PCB) is held between described first fixed frame 1 and described 2nd fixed frame 2;
Snap close 4 is allocated to latched position, thus described first fixed frame 1 and described 2nd fixed frame 2 are fixed together, complete the fixing of described circuit card to be printed.
Compared to prior art, the electroplating clamp 100 that the utility model provides is by gripping the electroplated printed circuit board (PCB) of very thin thickness, prevent described electroplated printed circuit board (PCB) because cross thin and easily occur clamp, the problem such as board falling, it is simple that the electroplating clamp 100 that the utility model provides simultaneously has structure, good stability, the advantages such as convenient fixing, it is possible to improve the quality of product significantly.
The foregoing is only embodiment of the present utility model; not thereby patent scope of the present utility model is limited; every utilize the utility model description to do equivalent structure or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, all it is included in scope of patent protection of the present utility model with reason.
Claims (7)
1. an electroplating clamp, it is characterized in that, comprise the first fixed frame, the 2nd fixed frame, coupling device and snap close, described first fixed frame and described 2nd fixed frame cooperation grip electroplated printed circuit board (PCB), described coupling device is flexibly connected described first fixed frame and described 2nd fixed frame, described snap close is located at described first fixed frame, and sealed fixing described first fixed frame and described 2nd fixed frame.
2. electroplating clamp according to claim 1, it is characterised in that, described first fixed frame comprises the first frame, and described 2nd fixed frame comprises the 2nd frame, and described first frame and described 2nd frame surround closed rectangular frame structure all separately.
3. electroplating clamp according to claim 2, it is characterised in that, described first fixed frame is identical with the size of described 2nd fixed frame.
4. electroplating clamp according to claim 3, it is characterised in that, four angles of described first fixed frame and described 2nd fixed frame all carry out fillet process.
5. electroplating clamp according to claim 1, it is characterised in that, described coupling device comprises multiple hinge, and described hinge is hinged fixing described first fixed frame and described 2nd fixed frame respectively.
6. electroplating clamp according to claim 1, it is characterised in that, described snap close comprises connection section and latch part, and one end of described connection section is flexibly connected with described first fixed frame, and the other end is fixedly connected with described latch part.
7. electroplating clamp according to claim 6, it is characterised in that, described snap close has groove structure, and described first fixed frame and described 2nd fixed frame are fixed by the groove structure of described snap close.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520942739.4U CN205275755U (en) | 2015-11-23 | 2015-11-23 | Electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520942739.4U CN205275755U (en) | 2015-11-23 | 2015-11-23 | Electroplating clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205275755U true CN205275755U (en) | 2016-06-01 |
Family
ID=56060346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520942739.4U Active CN205275755U (en) | 2015-11-23 | 2015-11-23 | Electroplating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205275755U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106087023A (en) * | 2016-08-09 | 2016-11-09 | 安徽广德威正光电科技有限公司 | Utilize the method that pcb board frame electroplating clamp ensures uniform current density |
| CN107796963A (en) * | 2017-11-23 | 2018-03-13 | 重庆市远望谷科技有限公司 | A kind of novel and multifunctional PCB printed boards detection fixture |
-
2015
- 2015-11-23 CN CN201520942739.4U patent/CN205275755U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106087023A (en) * | 2016-08-09 | 2016-11-09 | 安徽广德威正光电科技有限公司 | Utilize the method that pcb board frame electroplating clamp ensures uniform current density |
| CN107796963A (en) * | 2017-11-23 | 2018-03-13 | 重庆市远望谷科技有限公司 | A kind of novel and multifunctional PCB printed boards detection fixture |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |