CN102817055A - Ultrathin palladium plating and gold plating process for lead wire frame - Google Patents
Ultrathin palladium plating and gold plating process for lead wire frame Download PDFInfo
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- CN102817055A CN102817055A CN2012102896880A CN201210289688A CN102817055A CN 102817055 A CN102817055 A CN 102817055A CN 2012102896880 A CN2012102896880 A CN 2012102896880A CN 201210289688 A CN201210289688 A CN 201210289688A CN 102817055 A CN102817055 A CN 102817055A
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- H01—ELECTRIC ELEMENTS
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Abstract
The present invention discloses an ultrathin palladium plating and gold plating process for a lead wire frame. The process comprises the following steps: carrying out electrolysis degreasing, carrying out an activation treatment on a lead wire frame substrate, carrying out electrodeposition of a nickel plating layer, carrying out an activation treatment on the nickel layer, carrying out electrodeposition of a palladium plating thin layer, and carrying out high-frequency pulse electrodeposition of a gold plating thin layer, wherein a palladium-plated lead wire frame substrate is placed into a gold plating liquid to carry out electrodeposition for 10-20 s, cleaned with gold recovery water, dried and is subjected to gold protection to obtain the finished product. According to the present invention, under the premise of ensurence of passing of the test trial, the ultrathin gold-palladium plating layer is formed, wherein a thickness of the electroplated palladium layer is 0.02-0.1 mum, and is far lower than a thickness of 2-5 mum of the electroplated palladium layer in the existing process, and the electroplated gold layer is 0.003-0.01 mum, and is far lower than a thickness of 0.3-1.2 mum of the electroplated gold layer in the existing process, such that excellent performances of the original palladium plating layer and the original gold plating layer are ensured, gold consumption and palladium consumption are reduced, use of noble metals is substantially reduced, metal utilization rate is effectively improved, and cost is saved.
Description
[technical field]
The present invention relates to a kind of lead frame electroplating technology, relate to the ultra-thin plating palladium of a kind of lead frame craft of gilding especially, belong to IC chip processing and manufacturing technical field.
[background technology]
Gold utensil has high chemicalstability, is insoluble to common acid, only is dissolved in chloroazotic acid, so the gold plate solidity to corrosion is strong, and good anti-tarnishing ability is arranged, and coating ductility is good, is prone to polishing, thus the decorative coating of doing commonly used, like plating jewellery, clock and watch part, artwork etc.The good conductivity of gold is prone to welding, and is high temperature resistant, and the thermal conductivity of gold is 70% of a silver.Thereby be widely used in the plating that precision instrumentation, press plate, unicircuit, military electronics shell, electric contact etc. require electrical parameter performance part steady in a long-term.
Palladium is a kind of good contact material (specific resistance is 0.099 Ω mm/m).Thickness of coating generally is 2～5 μ m.Palladium coating weldableness is good, and palladium coating is a kind of effective diffusion impervious layer, and high-frequency component is often done the middle layer with palladium, to prevent the outside surface diffusion of matrix metal.The main drawback of palladium coating is responsive especially to some organism, and the surface is prone to form " brown powder ", and contact resistance is increased greatly.
Adopt the lead frame of existing technology, the palladium thickness of coating is 2～5 μ m, and gold plate thickness will reach the test of products requirement that could satisfy the client more than the 0.3-1.2 μ m, increases gold/palladium layer thickness usually and can improve the q&r of lead frame.But along with rising steadily of precious metal price, cost also improves thereupon.Like this, just be faced with technically and how can reduce the challenge that gold/palladium layer thickness saving cost keeps even improve the q&r of lead frame again.
[summary of the invention]
The technical problem that the present invention will solve is the deficiency that overcomes prior art; Reduce palladium coating and gold plate thickness when a kind of premium properties that guarantees original palladium coating and gold plate is provided, reduce precious metal consumption, practice thrift the ultra-thin plating palladium of the lead frame craft of gilding of cost.
The present invention adopts following technical scheme for solving the problems of the technologies described above:
The ultra-thin plating palladium of a kind of lead frame craft of gilding is characterized in that may further comprise the steps:
A, electrolytic degreasing: the lead frame matrix is put into electrolytic solution electrolysis 20～30s, dry up with the tap water cleaning then;
B, lead frame matrix activation treatment: the activated solution of the lead frame matrix of electrolytic degreasing being put into room temperature soaks 10～20s, cleans with tap water then, dries up with washed with de-ionized water again;
C, electrodeposit nickel plating layer: the lead frame matrix that activation treatment is crossed is put into nickel plating bath galvanic deposit 50～60s, use washed with de-ionized water then, dry up lead frame;
D, nickel dam activation treatment: the lead frame matrix of nickeling layer is put into the nickel activated solution soak 5-12s, dry up again with washed with de-ionized water then;
E, galvanic deposit plating palladium thin layer: the lead frame matrix after the nickel activation is put into palladium plating solution galvanic deposit 10～20s, dry up again with washed with de-ionized water then;
F, the gold-plated thin layer of high-frequency impulse galvanic deposit: the lead frame matrix that will plate behind the palladium is put into golden plating bath galvanic deposit 10～20s, cleans with golden recycle-water then to dry up again;
G, cross the gold protection: will gold-plated lead frame put into gold and protect solution to soak 5-20s, dry up with washed with de-ionized water then, promptly get the lead frame of ultra-thin palladium coating gold plate.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding; It is characterized in that described electrolytic solution contains alkaline defatting agent; Described alkaline defatting agent is formed by removing oil-bound distemper and wetting agent; The described content that removes oil-bound distemper is 60～80g/L, and electrolytic current density is 5～25 amperes/square decimeter, and the temperature of electrolytic solution is 50～60 ℃.
The commodity of above-mentioned alkaline defatting agent are called Ronaclean DLF, commercially available getting.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding is characterized in that described activated solution for the acid oxygenant that removes, contains out cylinder salt 80～120g/L, and the described cylinder salt of opening is the conduction activator salt.
The contained trade(brand)name Actronal 988 that opens cylinder salt of above-mentioned acidic oxidation agent opens cylinder salt, commercially available getting.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding; It is characterized in that said nickel plating bath contains nickel sulfamic acid 50～70g/L, boronic acid containing 35～55g/L, the nickel plating bath temperature is 50～60 ℃; The pH value is 3.5～4.5, and the current density of plating is 5～25 amperes/square decimeter.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding, the thickness that it is characterized in that described electroless nickel layer are 0.5～2 μ m.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding is characterized in that the nickeliferous acvator 100～200ml/L of described nickel activated solution, sulfur acid 10～30ml/L, and the temperature of nickel activated solution is a room temperature.
The commodity of the used nickel acvator of the present invention are called PC-1 nickel acvator, commercially available getting.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding; It is characterized in that described palladium plating solution contains palladium salts solution 50～70ml/L, open cylinder salt 250～500ml/L, the temperature of palladium plating solution is 40～50 ℃; The pH value is 7.2～8.0, and current density is 1～10 ampere/square decimeter.
Above-mentioned palladium salts solution is Palladure 200 (ROHM AND HAAS electronic material palladium solution, commercially available getting), and the described cylinder salt of opening is that Palladure 200 opens cylinder salt (commercially available getting).
Palladium content will be controlled at 5.0～7.0g/L in the above-mentioned palladium plating solution, and the specific gravity control of palladium plating solution is 5～15, and the proportion of palladium plating solution can be by Palladure conducting salt adjustment (the Palladure conducting salt is commercially available to be got).
The ultra-thin plating palladium of aforesaid lead frame craft of gilding; It is characterized in that described golden plating bath contains the preplating gold and opens cylinder agent 850～950ml/L, potassium auric cyanide 2.2～3.6g/L, the temperature of described golden plating bath is 40～45 ℃; The pH value is 3.5～4.0, and current density is 3～10 amperes/square decimeter.Described preplating gold is opened the commodity Auro Strike GP-3 SEA (commercially available getting) by name of cylinder agent.
The gold content of above-mentioned golden plating bath is controlled at 1.0～3.0g/L, and the specific gravity control of golden plating bath can be adjusted with commodity Auro Strike GP-3SEA conducting salt by name 8～12, and this conducting salt is commercially available to be got.
The golden recycle-water that cleans gold plate among the present invention is RO water, i.e. reverse osmosis water.
The ultra-thin plating palladium of aforesaid lead frame craft of gilding is characterized in that the temperature of described gold protection solution is 20～40 ℃, and the pH value is 2.0～3.5.
Above-mentioned gold protection solution contains component 140～160ml/L of commodity PostDip XP-680823-B MU (commercially available getting) by name, component 5～20ml/L of commodity PostDip XP-680823-B Antifoam (commercially available getting) by name.
Start from the consideration of practicing thrift cost among the present invention, can also be after the palladium thin layer be plated in galvanic deposit, with using flushing with clean water again behind the RO water cleaning lead frame matrix, said RO water is reverse osmosis water.
The present invention compared with prior art has following advantage:
The galvanized palladium coating of the present invention outward appearance light silvery white, crystallization is careful level and smooth, connectivity and weldability are good, can replace silver-plated and outside lead zinc-plated of inner lead and the liner of lead frame, palladium than silver-colored, tin is cheap, has reduced the use of the silver-colored and tin of precious metal; Plate thin gold plate after the plating palladium again, can make contact resistance stable, and when plug, the self-lubricating function of gold plate can improve wear resistance.
The present invention is guaranteeing under the prerequisite that testing experiment passes through that form ultrafine gold, palladium coating, galvanized palladium layer thickness is 0.02～0.1um; Far below the galvanized palladium layer thickness of existing technology 2～5um, galvanized golden layer thickness is 0.003～0.01um, far below the galvanized golden layer thickness 0.3～1.2um of existing technology; When guaranteeing the premium properties of original palladium coating and gold plate, reduced consumption golden, palladium, reduced precious metal greatly and use; Effectively improve using rate of metal, practice thrift cost.
This technology is suitable for the surface treatment of the Industrial products and the ornaments of particular requirement, can replace Gold plated Layer to be used for the electrical-contact element such as conducting ring, potentiometer, brush of instrument; Can be used for electric-conductor, the silver-plated rear defence silver of electronic devices and components variable color top layer.
[embodiment]
Describe the present invention below in conjunction with embodiment:
The ultra-thin plating palladium of a kind of lead frame craft of gilding, it may further comprise the steps:
A, electrolytic degreasing: the lead frame matrix is put into the alkaline defatting agent electrolytic solution that contains except that oil-bound distemper 60～80g/L; In current density is 5～25 amperes/square decimeter; The electrolytic solution temperature is 50～60 ℃ of following electrolysis 20～30s, cleans the lead frame matrix with tap water then and dries up;
B, lead frame matrix activation treatment: the acidic oxidation agent solution that contains out cylinder salt 80～120g/L of the lead frame matrix of electrolytic degreasing being put into room temperature soaks 10～20s, cleans the lead frame matrix with tap water then, dries up with washed with de-ionized water again;
C, electrodeposit nickel plating layer: the lead frame matrix that activation processing is crossed is put into and is contained nickel sulfamic acid 50～70g/L; Boric acid 35～55g/L; Temperature is 50～60 ℃; The pH value be in 3.5～4.5 the nickel plating bath with current density electro-deposition 50～60s of 5～25 amperes/square decimeter, the thickness that makes electroless nickel layer is 0.5～2 μ m, dries up with washed with de-ionized water lead frame matrix then again;
D, nickel dam activation treatment: the lead frame matrix of nickeling layer is put into nickeliferous acvator 100～200ml/L, sulfuric acid 10～30ml/L, temperature is to soak 5-12s in the nickel activated solution of room temperature, dries up with washed with de-ionized water lead frame matrix then again;
E, galvanic deposit plating palladium thin layer: the lead frame matrix after the nickel activation put into contain Palladure 200 ROHM AND HAAS electronic material palladium solution 50～70ml/L; Palladure 200 opens cylinder salt 250～500ml/L; Temperature is 40～50 ℃; The pH value is 7.2～8.0, and current density is galvanic deposit 10～20s in 1～10 ampere/square decimeter the palladium plating solution, dries up with washed with de-ionized water lead frame matrix after cleaning with the palladium recycle-water again again;
F, the gold-plated thin layer of high-frequency impulse galvanic deposit: will plate lead frame matrix behind the palladium and put into and contain the preplating gold and open cylinder agent 850～950ml/L; Potassium auric cyanide 2.2～3.6g/L; Temperature is 40～45 ℃; The pH value be in 3.5～4.0 the golden plating bath with 3～10 amperes of/square decimeter galvanic deposit 10～20s of current density, obtain accomplishing galvanized lead frame, clean lead frame with golden recycle-water then and dry up again;
G, cross the gold protection: gold-plated lead frame is put into contained PostDip XP-680823-B MU140～160ml/L; PostDip XP-680823-B Antifoam 5～20ml/L; Temperature is 20～40 ℃; The pH value is to soak 5～20s in 2.0～3.5 the gold protection solution, dries up with washed with de-ionized water then, promptly gets the lead frame of ultra-thin palladium coating gold plate.
Above technology is immersion plating technology, can in common equipment such as plating tank, accomplish.
Further specify the present invention through embodiment below:
Embodiment 1:
The lead frame matrix is put into the alkaline defatting agent electrolytic solution that contains except that oil-bound distemper 60g/L, is 5 amperes/square decimeter in current density, and the electrolytic solution temperature is 50 ℃ of following electrolysis 30s, cleans the lead frame matrix with tap water then and dries up;
The acidic oxidation agent solution that contains out cylinder salt 80g/L of above-mentioned lead frame matrix being put into room temperature soaks 20s, cleans the lead frame matrix with tap water then, dries up with washed with de-ionized water again;
Above-mentioned lead frame matrix put into contain nickel sulfamic acid 50g/L; Boric acid 55g/L; Temperature is 50 ℃; The pH value be in 4.5 the nickel plating bath with 5 amperes/square decimeter current density electro-deposition 60s, the thickness that makes electroless nickel layer is 0.5～2 μ m, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix is put into nickeliferous acvator 100ml/L, sulfuric acid 10ml/L, temperature is to soak 5s in the nickel activated solution of room temperature, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix put into contain Palladure 200 ROHM AND HAAS electronic material palladium solution 50ml/L; Palladure 200 opens cylinder salt 250ml/L; Temperature is 50 ℃; The pH value is 7.2, and current density is galvanic deposit 10s in 1 ampere/square decimeter the palladium plating solution, dries up with washed with de-ionized water lead frame matrix after cleaning with the palladium recycle-water again again;
Above-mentioned lead frame matrix put into contain the preplating gold and open cylinder agent 850ml/L; Potassium auric cyanide 2.2g/L; Temperature is 40 ℃; The pH value be in 4.0 the golden plating bath with 3 amperes of/square decimeter galvanic deposit 10s of current density, obtain accomplishing galvanized lead frame, clean lead frame with golden recycle-water then and dry up again;
At last; Above-mentioned lead frame put into contain PostDip XP-680823-B MU140ml/L; PostDip XP-680823-B Antifoam 5ml/L, temperature is 20 ℃, the pH value is to soak 20s in 3.5 the gold protection solution; Dry up with washed with de-ionized water then, promptly get the lead frame of ultra-thin palladium coating gold plate.
The palladium layer thickness that embodiment 1 technology is plated is 0.02～0.08um, and institute's plated thickness is 0.003～0.007um.
Embodiment 2:
The lead frame matrix is put into the alkaline defatting agent electrolytic solution that contains except that oil-bound distemper 70g/L, is 10 amperes/square decimeter in current density, and the electrolytic solution temperature is 55 ℃ of following electrolysis 25s, cleans the lead frame matrix with tap water then and dries up;
The acidic oxidation agent solution that contains out cylinder salt 100g/L of above-mentioned lead frame matrix being put into room temperature soaks 15s, cleans the lead frame matrix with tap water then, dries up with washed with de-ionized water again;
Above-mentioned lead frame matrix put into contain nickel sulfamic acid 60g/L; Boric acid 45g/L; Temperature is 55 ℃; The pH value be in 4.0 the nickel plating bath with 15 amperes/square decimeter current density electro-deposition 55s, the thickness that makes electroless nickel layer is 0.5～2 μ m, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix is put into nickeliferous acvator 150ml/L, sulfuric acid 20ml/L, temperature is to soak 9s in the nickel activated solution of room temperature, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix put into contain Palladure 200 ROHM AND HAAS electronic material palladium solution 60ml/L; Palladure 200 opens cylinder salt 380ml/L; Temperature is 45 ℃; The pH value is 7.6, and current density is galvanic deposit 15s in 5 amperes/square decimeter the palladium plating solution, dries up with washed with de-ionized water lead frame matrix after cleaning with the palladium recycle-water again again;
Above-mentioned lead frame matrix put into contain the preplating gold and open cylinder agent 900ml/L; Potassium auric cyanide 2.9g/L; Temperature is 43 ℃; The pH value be in 3.8 the golden plating bath with 6 amperes of/square decimeter galvanic deposit 15s of current density, obtain accomplishing galvanized lead frame, clean lead frame with golden recycle-water then and dry up again;
At last; Above-mentioned lead frame put into contain PostDip XP-680823-B MU150ml/L; PostDip XP-680823-B Antifoam 12ml/L, temperature is 30 ℃, the pH value is to soak 15s in 3.0 the gold protection solution; Dry up with washed with de-ionized water then, promptly get the lead frame of ultra-thin palladium coating gold plate.
The palladium layer thickness that embodiment 2 technologies are plated is 0.02～0.01um, and institute's plated thickness is 0.003～0.01um.
Embodiment 3:
The lead frame matrix is put into the alkaline defatting agent electrolytic solution that contains except that oil-bound distemper 80g/L, is 25 amperes/square decimeter in current density, and the electrolytic solution temperature is 60 ℃ of following electrolysis 20s, cleans the lead frame matrix with tap water then and dries up;
The acidic oxidation agent solution that contains out cylinder salt 120g/L of above-mentioned lead frame matrix being put into room temperature soaks 10s, cleans the lead frame matrix with tap water then, dries up with washed with de-ionized water again;
Above-mentioned lead frame matrix put into contain nickel sulfamic acid 70g/L; Boric acid 35g/L; Temperature is 60 ℃; The pH value be in 3.5 the nickel plating bath with 25 amperes/square decimeter current density electro-deposition 50s, the thickness that makes electroless nickel layer is 0.5～2 μ m, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix is put into nickeliferous acvator 200ml/L, sulfuric acid 30ml/L, temperature is to soak 12s in the nickel activated solution of room temperature, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix put into contain Palladure 200 ROHM AND HAAS electronic material palladium solution 70ml/L; Palladure 200 opens cylinder salt 500ml/L; Temperature is 40 ℃; The pH value is 8.0, and current density is galvanic deposit 20s in 10 amperes/square decimeter the palladium plating solution, dries up with washed with de-ionized water lead frame matrix after cleaning with the palladium recycle-water again again;
Above-mentioned lead frame matrix put into contain the preplating gold and open cylinder agent 950ml/L; Potassium auric cyanide 3.6g/L; Temperature is 45 ℃; The pH value be in 3.5 the golden plating bath with 10 amperes of/square decimeter galvanic deposit 20s of current density, obtain accomplishing galvanized lead frame, clean lead frame with golden recycle-water then and dry up again;
At last; Above-mentioned lead frame put into contain PostDip XP-680823-B MU160ml/L; PostDip XP-680823-B Antifoam 20ml/L, temperature is 40 ℃, the pH value is to soak 5s in 2.0 the gold protection solution; Dry up with washed with de-ionized water then, promptly get the lead frame of ultra-thin palladium coating gold plate.
The palladium layer thickness that embodiment 3 technologies are plated is 0.04～0.1um, and institute's plated thickness is 0.004～0.01um.
Embodiment 4:
The lead frame matrix is put into the alkaline defatting agent electrolytic solution that contains except that oil-bound distemper 70g/L, is 151 amperes/square decimeter in current density, and the electrolytic solution temperature is 60 ℃ of following electrolysis 25s, cleans the lead frame matrix with tap water then and dries up;
The acidic oxidation agent solution that contains out cylinder salt 90g/L of above-mentioned lead frame matrix being put into room temperature soaks 13s, cleans the lead frame matrix with tap water then, dries up with washed with de-ionized water again;
Above-mentioned lead frame matrix put into contain nickel sulfamic acid 65g/L; Boric acid 40g/L; Temperature is 55 ℃; The pH value be in 3.5 the nickel plating bath with 10 amperes/square decimeter current density electro-deposition 55s, the thickness that makes electroless nickel layer is 0.5～2 μ m, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix is put into nickeliferous acvator 180ml/L, sulfuric acid 25ml/L, temperature is to soak 10s in the nickel activated solution of room temperature, dries up with washed with de-ionized water lead frame matrix then again;
Above-mentioned lead frame matrix put into contain Palladure 200 ROHM AND HAAS electronic material palladium solution 65ml/L; Palladure 200 opens cylinder salt 450ml/L; Temperature is 45 ℃; The pH value is 7.5, and current density is galvanic deposit 15s in 7 amperes/square decimeter the palladium plating solution, dries up with washed with de-ionized water lead frame matrix after cleaning with the palladium recycle-water again again;
Above-mentioned lead frame matrix put into contain the preplating gold and open cylinder agent 900ml/L; Potassium auric cyanide 2.6g/L; Temperature is 45 ℃; The pH value be in 3.5 the golden plating bath with 5 amperes of/square decimeter galvanic deposit 15s of current density, obtain accomplishing galvanized lead frame, clean lead frame with golden recycle-water then and dry up again;
At last; Above-mentioned lead frame put into contain PostDip XP-680823-B MU155ml/L; PostDip XP-680823-B Antifoam 15ml/L, temperature is 35 ℃, the pH value is to soak 10s in 2.5 the gold protection solution; Dry up with washed with de-ionized water then, promptly get the lead frame of ultra-thin palladium coating gold plate.
The palladium layer thickness that embodiment 4 technologies are plated is 0.03～0.09um, and institute's plated thickness is 0.004～0.09um.
Claims (9)
1. the ultra-thin plating palladium of lead frame craft of gilding is characterized in that may further comprise the steps:
A, electrolytic degreasing: the lead frame matrix is put into electrolytic solution electrolysis 20～30s, dry up with the tap water cleaning then;
B, lead frame matrix activation treatment: the activated solution of the lead frame matrix of electrolytic degreasing being put into room temperature soaks 10～20s, cleans with tap water then, dries up with washed with de-ionized water again;
C, electrodeposit nickel plating layer: the lead frame matrix that activation treatment is crossed is put into nickel plating bath galvanic deposit 50～60s, dry up again with washed with de-ionized water then;
D, nickel dam activation treatment: the lead frame matrix of nickeling layer is put into the nickel activated solution soak 5-12s, dry up again with washed with de-ionized water then;
E, galvanic deposit plating palladium thin layer: the lead frame matrix after the nickel activation is put into palladium plating solution galvanic deposit 10～20s, dry up again with washed with de-ionized water then;
F, the gold-plated thin layer of high-frequency impulse galvanic deposit: the lead frame matrix that will plate behind the palladium is put into golden plating bath galvanic deposit 10～20s, cleans with golden recycle-water then to dry up again;
G, cross the gold protection: will gold-plated lead frame matrix put into gold and protect solution to soak 5-20s, dry up with washed with de-ionized water then, promptly get the lead frame of ultra-thin palladium coating gold plate.
2. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding; It is characterized in that described electrolytic solution contains alkaline defatting agent; Described alkaline defatting agent is formed by removing oil-bound distemper and wetting agent; The described content that removes oil-bound distemper is 60～80g/L, and current density is 5～25 amperes/square decimeter, and the temperature of electrolytic solution is 50～60 ℃.
3. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding is characterized in that described activated solution is the acidic oxidation agent, contains out cylinder salt 80～120g/L.
4. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding; It is characterized in that said nickel plating bath contains nickel sulfamic acid 50～70g/L, boronic acid containing 35～55g/L, the nickel plating bath temperature is 50～60 ℃; The pH value is 3.5～4.5, and current density is 5～25 amperes/square decimeter.
5. the ultra-thin plating palladium of lead frame according to claim 4 craft of gilding, the thickness that it is characterized in that described electroless nickel layer is 0.5～2 μ m.
6. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding is characterized in that the nickeliferous acvator 100～200ml/L of described nickel activated solution, sulfur acid 10～30ml/L, and the temperature of nickel activated solution is a room temperature.
7. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding; It is characterized in that described palladium plating solution contains palladium salts solution 50～70ml/L, open cylinder salt 250～500ml/L, the temperature of palladium plating solution is 40～50 ℃; The pH value is 7.2～8.0, and current density is 1～10 ampere/square decimeter.
8. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding; It is characterized in that described golden plating bath contains the preplating gold and opens cylinder agent 850～950ml/L; Potassium auric cyanide 2.2～3.6g/L; The temperature of described golden plating bath is 40～45 ℃, and the pH value is 3.5～4.0, and current density is 3～10 amperes/square decimeter.
9. the ultra-thin plating palladium of lead frame according to claim 1 craft of gilding is characterized in that the temperature of described gold protection solution is 20～40 ℃, and the pH value is 2.0～3.5.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105112892A (en) * | 2015-02-13 | 2015-12-02 | 河源西普电子有限公司 | Chemical nickel, palladium and gold plating technique for printed circuit board |
| CN106119915A (en) * | 2016-06-27 | 2016-11-16 | 中山品高电子材料有限公司 | The electro-plating method of lead frame |
| CN109930193A (en) * | 2019-04-17 | 2019-06-25 | 合肥新汇成微电子有限公司 | A kind of electroplate liquid is than recanalization salt adding method |
| CN109989083A (en) * | 2019-04-28 | 2019-07-09 | 天水华洋电子科技股份有限公司 | Pretreating process is electroplated in the super roughening lead frame of one kind |
| CN110230079A (en) * | 2015-01-16 | 2019-09-13 | 哈钦森技术股份有限公司 | Golden electroplating solution and method |
| CN112251783A (en) * | 2020-10-31 | 2021-01-22 | 山东新恒汇电子科技有限公司 | Process for electroplating in welding hole of smart card module |
| CN115418689A (en) * | 2022-11-04 | 2022-12-02 | 新恒汇电子股份有限公司 | Smart card carrier band film-coating palladium-plating process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1774803A (en) * | 2004-05-27 | 2006-05-17 | 新光电气工业株式会社 | Lead frame for semiconductor device |
| CN1838407A (en) * | 2005-03-25 | 2006-09-27 | 新光电气工业株式会社 | Leadframe for semiconductor device |
| CN1848420A (en) * | 2005-04-15 | 2006-10-18 | 三星Techwin株式会社 | Lead frame for semiconductor package |
| CN101626007A (en) * | 2009-08-07 | 2010-01-13 | 广州市香港科大霍英东研究院 | Ultrathin pre-plating layer lead frame and preparation method thereof |
-
2012
- 2012-08-15 CN CN201210289688.0A patent/CN102817055B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1774803A (en) * | 2004-05-27 | 2006-05-17 | 新光电气工业株式会社 | Lead frame for semiconductor device |
| CN1838407A (en) * | 2005-03-25 | 2006-09-27 | 新光电气工业株式会社 | Leadframe for semiconductor device |
| CN1848420A (en) * | 2005-04-15 | 2006-10-18 | 三星Techwin株式会社 | Lead frame for semiconductor package |
| CN101626007A (en) * | 2009-08-07 | 2010-01-13 | 广州市香港科大霍英东研究院 | Ultrathin pre-plating layer lead frame and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 冯小龙: "连续高速电镀技术在集成电路引线框架生产中的应用", 《电镀与涂饰》, vol. 22, no. 6, 31 December 2003 (2003-12-31) * |
| 张允诚 等: "《电镀手册》", 31 January 2007, article "电镀手册" * |
| 方景礼: "《电镀配合物-理论与应用》", 31 January 2008, article "电镀配合物-理论与应用" * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110230079A (en) * | 2015-01-16 | 2019-09-13 | 哈钦森技术股份有限公司 | Golden electroplating solution and method |
| CN110230079B (en) * | 2015-01-16 | 2022-03-11 | 哈钦森技术股份有限公司 | Gold plating solution and method |
| CN105112892A (en) * | 2015-02-13 | 2015-12-02 | 河源西普电子有限公司 | Chemical nickel, palladium and gold plating technique for printed circuit board |
| CN106119915A (en) * | 2016-06-27 | 2016-11-16 | 中山品高电子材料有限公司 | The electro-plating method of lead frame |
| CN109930193A (en) * | 2019-04-17 | 2019-06-25 | 合肥新汇成微电子有限公司 | A kind of electroplate liquid is than recanalization salt adding method |
| CN109989083A (en) * | 2019-04-28 | 2019-07-09 | 天水华洋电子科技股份有限公司 | Pretreating process is electroplated in the super roughening lead frame of one kind |
| CN112251783A (en) * | 2020-10-31 | 2021-01-22 | 山东新恒汇电子科技有限公司 | Process for electroplating in welding hole of smart card module |
| CN115418689A (en) * | 2022-11-04 | 2022-12-02 | 新恒汇电子股份有限公司 | Smart card carrier band film-coating palladium-plating process |
| CN115418689B (en) * | 2022-11-04 | 2023-04-07 | 新恒汇电子股份有限公司 | Film-covering palladium plating process for smart card carrier tape |
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