CN102045956A - Method for plating gold on equilong connecting fingers - Google Patents
Method for plating gold on equilong connecting fingers Download PDFInfo
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- CN102045956A CN102045956A CN 201010608968 CN201010608968A CN102045956A CN 102045956 A CN102045956 A CN 102045956A CN 201010608968 CN201010608968 CN 201010608968 CN 201010608968 A CN201010608968 A CN 201010608968A CN 102045956 A CN102045956 A CN 102045956A
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- gold
- plating
- golden finger
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Abstract
The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides, equilong connecting finger patterns and leads for gold plating in the board on the PCB; (2) sticking an anti-plating adhesive tape to the non-gold plating area; (3) utilizing the leads for gold plating in the board as the gold-plating leads to plate gold on the equilong connecting fingers; (4) tearing off the anti-plating adhesive tape; (5) fusing the leads for gold plating in the board by a laser fuse method; and (6) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not led out from the tips of the connecting fingers on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads are not thoroughly removed so that the residues of the gold-plating leads are left on the board or the gold-plating leads are excessively removed so that the copper at the tips of the connecting fingers is exposed.
Description
Technical field
The present invention relates to a kind of gold plating method of isometric golden finger.
Background technology
Making isometric golden finger and isometric golden finger is being carried out in the gold-plated process, the method that prior art adopts is at first by outer figure and outer erosion figure in the plate and glodclad wire etching to be come out, utilize welding resistance printing ink to cover non-gold-plated zone then, undertaken gold-plated by glodclad wire, the finishing touch profile, machinery is removed glodclad wire and chamfering, and described chamfering is used for the convenient groove of pegging graft.
What this kind mode adopted is to draw the glodclad wire that 8-18mil does not wait width from isometric golden finger termination, the conductive layer during as gold-plated finger, and glodclad wire is a kind of technology boost line in fact, it is not retained in final product; After having plated gold, behind recontour, adopt the V carving method to remove glodclad wire, the problem that has precision because of the removal method of machinery, glodclad wire exists removal totally not cause it to remain on the plate face, perhaps remove and excessively cause the golden finger termination to occur revealing copper, there is hidden danger in reliability in causing that product golden finger zone is long-term and using.
Summary of the invention
The technical problem that the present invention mainly solves provides and a kind of glodclad wire is not set on pcb board, thereby needn't adopt mechanical system to remove the isometric golden finger gold plating method of glodclad wire.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of gold plating method of isometric golden finger is provided, comprises:
(1) prepares pcb board, on pcb board, make in figure in the ejecting plate, conduction auxiliary limit, isometric golden finger figure and the plate gold-plated with lead-in wire, auxiliary limit of conduction and golden finger are spaced from each other, and the gold-plated auxiliary limit of all golden fingers and conduction that makes with going between conducts mutually in the described plate;
(2) paste anti-plating adhesive tape in non-gold-plated zone;
(3) utilize and gold-platedly in the plate carry out gold-plated as glodclad wire to isometric golden finger with going between;
(4) tear anti-plating adhesive tape;
(5) utilize the gold-plated lead-in wire of using in the laser fuse method fusing plate;
(6) pcb board is carried out welding resistance, recontour and chamfered.
Wherein, in step (1), gold-platedly in the described plate be of a size of 0.1-0.2mm with wire widths.
Wherein, in step (5), it is that 1100 degree, time are 1 minute that described laser fuse method adopts the temperature of laser fuse.
Wherein, described anti-plating adhesive tape is blue adhesive tape.
The invention has the beneficial effects as follows: because the isometric golden finger gold plating method of the present invention is not drawn glodclad wire in the termination of pcb board golden finger, needn't remove this glodclad wire, naturally do not exist removal totally not cause it to remain on the plate face, perhaps remove and excessively cause the golden finger termination copper to occur revealing, there is the problem of hidden danger in reliability in causing that product golden finger zone is long-term and using, adopt the gold-plated glodclad wire that replaces with going between in the setting of golden finger end in the plate, can reach the purpose that makes isometric golden finger mutual conduction, and it is gold-plated thinner in the plate with lead-in wire, can adopt laser fuse method gold-plated in the plate with lead-in wire fusing, make between the golden finger, cut off between the auxiliary limit of golden finger and conduction and connect, laser fuse method only needs the time of several seconds, the efficient height, with short production cycle, and laser fuse method cost is very low.
Description of drawings
Fig. 1 is a pcb board embodiment who adopts the gold plating method of the isometric golden finger of the present invention;
Fig. 2 is the schematic diagram after anti-plating adhesive tape is sticked in the non-gold-plated zone of pcb board;
Fig. 3 is the schematic diagram after gold-plated to pcb board;
Fig. 4 tears the schematic diagram behind the anti-plating adhesive tape on the pcb board;
Fig. 5 is gold-plated with the schematic diagram behind the lead-in wire in the fusing plate;
Fig. 6 is to the final effect figure after pcb board welding resistance, recontour, the chamfering.
Wherein, 1, figure in the plate; 2, golden finger; 3, the auxiliary limit of conduction; 4, gold-plated in the plate with lead-in wire; 5, anti-plating adhesive tape.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
Embodiment as the gold plating method of the isometric golden finger of the present invention as Fig. 1 to Fig. 6, comprising:
(1) prepares pcb board, on pcb board, make in figure 1 in the ejecting plate, conduction auxiliary limit 3, isometric golden finger 2 figures and the plate gold-plated with lead-in wire 4, the auxiliary limit 3 of conduction is spaced from each other with golden finger 2, gold-platedly in the described plate makes all golden fingers 2 and conduction assist limit 3 to conduct mutually with lead-in wire 4;
(2) paste anti-plating adhesive tape 5 in non-gold-plated zone;
(3) utilize and gold-platedly in the plate 4 carry out gold-plated to isometric golden finger 2 as glodclad wire with going between;
(4) tear anti-plating adhesive tape 5;
(5) utilize the gold-plated lead-in wire 4 of using in the laser fuse method fusing plate;
(6) pcb board is carried out welding resistance, recontour and chamfered.
In the present embodiment, described anti-plating adhesive tape 5 can be blue adhesive tape.
Because the isometric golden finger gold plating method of the present invention is not drawn glodclad wire in the termination of pcb board golden finger, needn't remove this glodclad wire, naturally do not exist removal totally not cause it to remain on the plate face, perhaps remove and excessively cause the golden finger termination copper to occur revealing, there is the problem of hidden danger in reliability in causing that product golden finger zone is long-term and using, adopt the gold-plated glodclad wire that replaces with going between in the setting of golden finger end in the plate, can reach the purpose that makes isometric golden finger mutual conduction, and it is gold-plated thinner in the plate with lead-in wire, can adopt laser fuse method gold-plated in the plate with lead-in wire fusing, make between the golden finger, cut off between the auxiliary limit of golden finger and conduction and connect, laser fuse method only needs the time of several seconds, the efficient height, with short production cycle, and laser fuse method cost is very low.
In one embodiment, in step (1), gold-platedly in the described plate be of a size of 0.1-0.2mm with wire widths.In step (5), it is that 1100 degree, time are 1 minute that described laser fuse method adopts the temperature preferred value of laser fuse.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (4)
1. the gold plating method of an isometric golden finger is characterized in that, comprising:
(1) prepares pcb board, on pcb board, make in figure in the ejecting plate, conduction auxiliary limit, isometric golden finger figure and the plate gold-plated with lead-in wire, auxiliary limit of conduction and golden finger are spaced from each other, and the gold-plated auxiliary limit of all golden fingers and conduction that makes with going between conducts mutually in the described plate;
(2) paste anti-plating adhesive tape in non-gold-plated zone;
(3) utilize and gold-platedly in the plate carry out gold-plated as glodclad wire to isometric golden finger with going between;
(4) tear anti-plating adhesive tape;
(5) utilize the gold-plated lead-in wire of using in the laser fuse method fusing plate;
(6) pcb board is carried out welding resistance, recontour and chamfered.
2. according to the gold plating method of the described isometric golden finger of claim 1, it is characterized in that: in step (1), gold-platedly in the described plate be of a size of 0.1-0.2mm with wire widths.
3. according to the gold plating method of the described isometric golden finger of claim 2, it is characterized in that: in step (5), it is that 1100 degree, time are 1 minute that described laser fuse method adopts the temperature of laser fuse.
4. according to the gold plating method of the described isometric golden finger of claim 1, it is characterized in that: described anti-plating adhesive tape is blue adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010608968A CN102045956B (en) | 2010-12-28 | 2010-12-28 | Method for plating gold on equilong connecting fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010608968A CN102045956B (en) | 2010-12-28 | 2010-12-28 | Method for plating gold on equilong connecting fingers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102045956A true CN102045956A (en) | 2011-05-04 |
| CN102045956B CN102045956B (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010608968A Expired - Fee Related CN102045956B (en) | 2010-12-28 | 2010-12-28 | Method for plating gold on equilong connecting fingers |
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| CN (1) | CN102045956B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
| CN104427780A (en) * | 2013-09-05 | 2015-03-18 | 三星泰科威株式会社 | Operation method of chip mounter |
| CN105323964A (en) * | 2014-06-26 | 2016-02-10 | 胜华电子（惠阳）有限公司 | Method for manufacturing bright silver plating circuit board without lead wires |
| CN105813397A (en) * | 2016-04-11 | 2016-07-27 | 广州兴森快捷电路科技有限公司 | Method for improving corrosion resistance of golden finger |
| CN107580411A (en) * | 2017-08-31 | 2018-01-12 | 广州兴森快捷电路科技有限公司 | Gold finger lead structure and preparation method |
| CN111315151A (en) * | 2020-04-01 | 2020-06-19 | 江苏苏杭电子有限公司 | Processing technology of leadless plug electrogilding and plate surface gilding printed circuit board |
| CN114501814A (en) * | 2022-01-27 | 2022-05-13 | 深圳市景旺电子股份有限公司 | Method for removing gold-plated lead of printed circuit board and method for manufacturing gold finger |
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| CN1230013A (en) * | 1998-03-19 | 1999-09-29 | 三菱电机株式会社 | Mfg. method of semiconductor device and semiconductor device |
| US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
| CN101624715A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for selective thick-gold electroplating without gold plated lead |
| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
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2010
- 2010-12-28 CN CN201010608968A patent/CN102045956B/en not_active Expired - Fee Related
Patent Citations (5)
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| CN1230013A (en) * | 1998-03-19 | 1999-09-29 | 三菱电机株式会社 | Mfg. method of semiconductor device and semiconductor device |
| US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
| CN101624715A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for selective thick-gold electroplating without gold plated lead |
| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
| CN104427783B (en) * | 2013-08-19 | 2017-08-25 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible PCB with golden finger and preparation method thereof |
| CN104427780A (en) * | 2013-09-05 | 2015-03-18 | 三星泰科威株式会社 | Operation method of chip mounter |
| CN105323964A (en) * | 2014-06-26 | 2016-02-10 | 胜华电子（惠阳）有限公司 | Method for manufacturing bright silver plating circuit board without lead wires |
| CN105813397A (en) * | 2016-04-11 | 2016-07-27 | 广州兴森快捷电路科技有限公司 | Method for improving corrosion resistance of golden finger |
| WO2017177832A1 (en) * | 2016-04-11 | 2017-10-19 | 广州兴森快捷电路科技有限公司 | Method for improving corrosion resistance of gold finger |
| US20190198692A1 (en) * | 2016-04-11 | 2019-06-27 | Guangzhou Fastprint Circuit Tech Co., Ltd | Method for improving corrosion resistance of gold finger |
| US10978599B2 (en) | 2016-04-11 | 2021-04-13 | Guangzhou Fastprint Circuit Tech Co., Ltd. | Method for improving corrosion resistance of gold finger |
| CN107580411A (en) * | 2017-08-31 | 2018-01-12 | 广州兴森快捷电路科技有限公司 | Gold finger lead structure and preparation method |
| CN111315151A (en) * | 2020-04-01 | 2020-06-19 | 江苏苏杭电子有限公司 | Processing technology of leadless plug electrogilding and plate surface gilding printed circuit board |
| CN114501814A (en) * | 2022-01-27 | 2022-05-13 | 深圳市景旺电子股份有限公司 | Method for removing gold-plated lead of printed circuit board and method for manufacturing gold finger |
| CN114501814B (en) * | 2022-01-27 | 2023-06-02 | 深圳市景旺电子股份有限公司 | Method for removing gold-plated lead of printed circuit board and method for manufacturing golden finger |
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| CN102045956B (en) | 2012-09-05 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20151228 |
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| EXPY | Termination of patent right or utility model |