CN107580411A - Gold finger lead structure and preparation method - Google Patents
Gold finger lead structure and preparation method Download PDFInfo
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- CN107580411A CN107580411A CN201710771539.0A CN201710771539A CN107580411A CN 107580411 A CN107580411 A CN 107580411A CN 201710771539 A CN201710771539 A CN 201710771539A CN 107580411 A CN107580411 A CN 107580411A
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Abstract
The present invention relates to a kind of gold finger lead structure and preparation method, gold finger lead structure includes main lead and sub- lead.Main wire ends are used to be electrically connected with edges of boards conductor, and main lead includes the first layers of copper, the first layer gold and the first solder mask.First layers of copper is used to be covered in board substrate, and the first layer gold is covered in the first layers of copper with the first solder mask.Wherein one end of sub- lead is used to be electrically connected with golden finger, and the other end of sub- lead is connected with the first layer gold.Above-mentioned gold finger lead structure, due to electroplating in the first layers of copper and non-fully upper gold, but the first layer gold in the plating of a part of region on the first layers of copper surface, the first solder mask in the plating of another part region on the first layers of copper surface, gold-plated region area in the first layers of copper can be so reduced, so as to save gold salt.
Description
Technical field
The present invention relates to golden finger manufacture technology field, more particularly to a kind of gold finger lead structure and preparation method.
Background technology
In traditional golden finger manufacturing process, electroplate hard gold and formed before golden finger step, it is necessary to add sub- lead and connection
The main lead of each sub- lead.The extension of main lead is connected on edges of boards copper conductor, by main lead, sub- lead by electric current from edges of boards
Copper conductor is transferred to golden finger opening position, realizes gold-plated purpose.However, after gold finger galvanizing, hand tears main lead off
With sub- lead, gold salt is so greatly wasted, golden finger cost of manufacture is higher.
The content of the invention
Based on this, it is necessary to the defects of overcoming prior art, there is provided a kind of gold finger lead structure and preparation method, its energy
The waste of gold salt is enough reduced, reduces golden finger cost of manufacture.
Its technical scheme is as follows：A kind of gold finger lead structure, including：Main lead, the main wire ends are used for and plate
Side conductor is electrically connected with, and the main lead includes the first layers of copper, the first layer gold and the first solder mask, and first layers of copper is used to cover
Cover on board substrate, first layer gold is covered in first layers of copper with first solder mask；And sub- lead,
Wherein one end of the sub- lead is used to be electrically connected with golden finger, the other end of the sub- lead and the first layer gold phase
Even.
A kind of described gold finger lead construction manufacturing method, comprises the following steps：It is good to outer-layer circuit graphic making
After circuit board carries out welding resistance processing, by welding resistance region and sub- lead pair corresponding to welding resistance region corresponding to golden finger, the first layer gold
The welding resistance region answered carries out windowing processing, while the adjacent peripheral region welding resistance of the main lead and the sub- lead is also carried out
Windowing is handled, and the windowing width D in the adjacent peripheral region of the main lead and sub- lead is 4mil to 8mil；Windowing is handled
The circuit board afterwards carries out gold-plated processing.
Above-mentioned gold finger lead structure and preparation method thereof, due to electroplating in the first layers of copper and non-fully upper gold, but
The first layer gold in the plating of a part of region on the first layers of copper surface, the in the plating of another part region on the first layers of copper surface
One solder mask, gold-plated region area in the first layers of copper can be so reduced, so as to save gold salt.First layers of copper and the first gold medal
Layer normally can normally electroplate conduct current to golden finger area, golden finger.Further, since the first layer gold and sub- lead
Connection, when so pulling up main lead, main lead remains able to normally take up sub- lead, and hand tears lead and can be also normally carried out.
In one of the embodiments, one end of first layer gold from first layers of copper is extended over to described first
The other end of layers of copper.In this way, during main lead pulls up, main lead is not easy to be broken, being capable of preferably band bottle opener lead disengaging
Board substrate.
In one of the embodiments, first layer gold includes the first connected layer gold section and the second layer gold section, described
First layer gold section is used to be connected with the edges of boards conductor, and the width of the first layer gold section is more than the width of the second layer gold section
Degree, the second layer gold section are connected with the sub- lead.In this way, because the first layer gold section width is more than the second layer gold section width,
It can so be easy to manually find the set location of the first layer gold section of connection edges of boards conductor, master is cut so as to be easy to play
Lead, carry out hand and tear operation.
In one of the embodiments, the width of the first layer gold section and the width of first layers of copper are adapted；Institute
The length L for stating the first layer gold section is 5mm to 15mm.In this way, because the first layer gold section width and the first layers of copper width are adapted, this
Sample can be easy to manually accurately cut off the first layer gold section and the first layers of copper being connected with edges of boards conductor.In addition, the first layer gold section
Length L is 5mm to 15mm, and the length that main wire ends can be peeled off by so playing knife is 5mm to 15mm, can conveniently carry out hand and tear master
Lead operates.Preferably, the length L of the first layer gold section is 10mm, and the first layer gold section of the length can be convenient for hand and tear master
Lead operate, and also will not be long and waste gold salt.
In one of the embodiments, the second layer gold section is disposed adjacent with first solder mask, second gold medal
The width of interval is 3mil to 9mil.During hand tears lead, width is that 3mil to 9mil the second layer gold section can take up
Sub- lead.Preferably, the width of the second layer gold section is 4mil.In this way, main lead can be with bottle opener lead, and hand tears lead process
In it is less generation wire breaking situation.
In one of the embodiments, described gold finger lead structure also includes being arranged on the main lead and the son
Terminal pad between lead, the main lead are connected by the terminal pad with the sub- lead；The terminal pad includes second
Layers of copper, the second layer gold and the second solder mask, second layers of copper are used to be covered in the board substrate, second layer gold
It is covered in second layers of copper with second solder mask, second layer gold is connected with the sub- lead, and described second
Solder mask is connected with first solder mask.In this way, the terminal pad set between main lead and sub- lead can strengthen
Bonding strength between main lead and sub- lead, avoid during tearing lead strongly, occur between main lead and sub- lead disconnected
Split phenomenon.In addition, not layer gold is completely covered in the second layers of copper, but layer gold is partially covered with, what another part then covered is the
Two solder masks, gold-plated region area in the second layers of copper can be so reduced, so as to save gold salt.
In one of the embodiments, second layer gold is ring-type, the width of second layer gold and first gold medal
The width of layer is adapted；The second layer gold end is round and smooth to be connected to the first layer gold, and the sub- wire ends are round and smooth to be connected to
Two layer gold.In this way, during the main lead of pull-up, it is susceptible to be broken between the second layer gold and the first layer gold, sub- wire ends
Phenomenon, it is preferable that hand tears lead effect.
In one of the embodiments, the sub- lead includes the first lead segments and the second lead segments, first lead
Duan Yiduan is connected with described second lead segments one end, and the first lead segments other end is used to be connected with the golden finger, described
The second lead segments other end is connected with the main lead, and the width of second lead segments is more than the width of the first lead segments.
In one of the embodiments, the first lead segments end is round and smooth is connected to the second lead segments；Described first draws
The width of line segment is 4mil to 7mil, and the width of second lead segments is 6mil to 9mil.
Brief description of the drawings
Fig. 1 is the structural representation of the gold finger lead structure described in the one of embodiment of the present invention；
Fig. 2 is the structural representation of the gold finger lead structure described in another embodiment of the present invention；
Fig. 3 is the structural representation of the gold finger lead structure described in another embodiment of the invention；
Fig. 4 is the structural representation of the gold finger lead structure described in further embodiment of the present invention.
10th, main lead, the 11, first layer gold, the 111, first layer gold section, the 112, second layer gold section, the 12, first solder mask, 20,
Sub- lead, the 21, first lead segments, the 22, second lead segments, 30, terminal pad, the 31, second layer gold, the 32, second solder mask, 40, outer
Enclose region, 100, golden finger.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
In the description of the invention, it is to be understood that term " first ", " second " are only used for describing purpose, and can not
It is interpreted as indicating or implies relative importance or imply the quantity of the technical characteristic indicated by indicating.Thus, define " the
One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".In the description of the invention, " multiple "
It is meant that at least two, such as two, three etc., unless otherwise specifically defined.
In the description of the invention, it is to be understood that, can be with when an element is considered as " connection " another element
It is directly to another element or may be simultaneously present intermediary element.On the contrary, when element for be referred to as " direct " with it is another
When element connects, in the absence of intermediary element.
As shown in figure 1, a kind of gold finger lead structure, including main lead 10 and sub- lead 20.The end of main lead 10
For being electrically connected with edges of boards conductor, the main lead 10 includes the first layers of copper, the first layer gold 11 and the first solder mask 12.It is described
First layers of copper is used to be covered in board substrate, and first layer gold 11 and first solder mask 12 are covered in described the
In one layers of copper.Wherein one end of the sub- lead 20 be used for be electrically connected with golden finger 100, the other end of the sub- lead 20 with
First layer gold 11 is connected.
Above-mentioned gold finger lead structure, it is upper golden due to electroplating in the first layers of copper and non-fully, but in the first layers of copper table
Upper first layer gold 11 is electroplated in a part of region in face, the first solder mask in the plating of another part region on the first layers of copper surface
12, gold-plated region area in the first layers of copper can be so reduced, so as to save gold salt.First layers of copper and the energy of the first layer gold 11
It is enough normally normally to electroplate conduct current to the region of golden finger 100, golden finger 100.Further, since the first layer gold 11 and son
Lead 20 connects, and when so pulling up main lead 10, main lead 10 remains able to normally take up sub- lead 20, and hand, which tears lead, also can
Enough it is normally carried out.
In the present embodiment, one end of first layer gold 11 from first layers of copper is extended over to first layers of copper
The other end.In this way, during main lead 10 pulls up, main lead 10 is not easy to be broken, and preferably band bottle opener lead 20 can depart from
Board substrate.
In addition, referring to Fig. 2, first layer gold 11 includes connected the first layer gold section 111 and the second layer gold section 112.
The first layer gold section 111 is used to be connected with the edges of boards conductor, and the width of the first layer gold section 111 is more than second gold medal
The width of interval 112.The second layer gold section 112 is connected with the sub- lead 20.In this way, due to the width of the first layer gold section 111
More than the width of the second layer gold section 112, it can so be easy to manually find the setting position of the first layer gold section 111 of connection edges of boards conductor
Put, main lead 10 is cut so as to be easy to play, carry out hand and tear operation.
In addition, the width and the width of first layers of copper of the first layer gold section 111 are adapted.The first layer gold section
111 length L is 5mm to 15mm.In this way, because the width of the first layer gold section 111 and the first layers of copper width are adapted, so can
It is easy to manually accurately cut off the first layer gold section 111 and the first layers of copper being connected with edges of boards conductor.In addition, the first layer gold section 111
Length L is 5mm to 15mm, and the length that the main end of lead 10 can be peeled off by so playing knife is 5mm to 15mm, can conveniently carry out hand and tear
Main lead 10 operates.Preferably, the length L of the first layer gold section 111 is 10mm, and the first layer gold section 111 of the length can be easy to
Hand is carried out to tear main lead 10 and operate, and also will not be long and waste gold salt.In other embodiments, referring again to Fig. 3, the first gold medal
The width of interval 111 can also be slightly less than the width of the first layers of copper, without the first layers of copper end is completely covered, can make the first bronze medal
The layer a part of region in end is exposed.
In the present embodiment, the second layer gold section 112 is disposed adjacent with first solder mask 12, the second layer gold section
112 width is 3mil to 9mil.During hand tears lead, width is that 3mil to 9mil the second layer gold section 112 being capable of band
Bottle opener lead 20.Preferably, the width of the second layer gold section 112 is 4mil.In this way, main lead 10 can with bottle opener lead 20, and
Hand tears less generation wire breaking situation during lead.
In addition, described gold finger lead structure also includes being arranged between the main lead 10 and the sub- lead 20
Terminal pad 30.The main lead 10 is connected by the terminal pad 30 with the sub- lead 20.The terminal pad 30 includes second
Layers of copper, the second layer gold 31 and the second solder mask 32.Second layers of copper is used to be covered in the board substrate.Described second
Layer gold 31 is covered in second layers of copper with second solder mask 32, second layer gold 31 and the sub- phase of lead 20
Even.Second solder mask 32 is connected with first solder mask 12.In this way, set between main lead 10 and sub- lead 20
The terminal pad 30 put can strengthen the bonding strength between main lead 10 and sub- lead 20, avoid during tearing lead strongly,
Phenomenon of rupture occurs between main lead 10 and sub- lead 20.In addition, layer gold is not completely covered in the second layers of copper, but part covers
There is layer gold, what another part then covered is the second solder mask 32, can so reduce gold-plated region area in the second layers of copper, so as to
Gold salt can be saved.
Further, second layer gold 31 is ring-type, the width of second layer gold 31 and first layer gold 11
Width is adapted.The end of second layer gold 31 is round and smooth to be connected to the first layer gold 11, and the sub- end of lead 20 is round and smooth to be connected to
Second layer gold 31.In this way, during the main lead 10 of pull-up, between the second layer gold 31 and the first layer gold 11, the end of sub- lead 20 not
It is prone to phenomenon of rupture, it is preferable that hand tears lead effect.
In the present embodiment, the sub- lead 20 includes the first lead segments 21 and the second lead segments 22.First lead segments
21 one end are connected with described one end of second lead segments 22, and the other end of the first lead segments 21 is used for and the phase of golden finger 100
Even.The other end of second lead segments 22 is connected with the main lead 10.The width of second lead segments 22 draws more than first
The width of line segment 21.Specifically, the end of the first lead segments 21 is round and smooth is connected to the second lead segments 22.First lead segments
21 width is 4mil to 7mil, and the width of second lead segments 22 is 6mil to 9mil.
Referring to Fig. 4, a kind of described gold finger lead construction manufacturing method, comprises the following steps：To outer-layer circuit figure
After circuit board that shape performs carries out welding resistance processing, by welding resistance corresponding to welding resistance region corresponding to golden finger 100, the first layer gold 11
Welding resistance region corresponding to region and sub- lead 20 carries out windowing processing, while by the phase of the main lead 10 and the sub- lead 20
The welding resistance of adjacent outer peripheral areas 40 also carries out windowing processing, and the adjacent peripheral region 40 of the main lead 10 and sub- lead 20 is opened
Window width D is 4mil to 8mil；Due to the welding resistance of main lead 10 and the adjacent peripheral region 40 of sub- lead 20 also being opened a window
Processing, so that lead is kept apart with circuit board green oil, during hand tears lead, lead will not be by circuit board green oil shadow
Ring, hand can be smoothed out and tear lead operation.
The circuit board after windowing is handled carries out gold-plated processing.
The preparation method of above-mentioned gold finger lead, this reality identical with the beneficial effect of described gold finger lead structure
Example is applied herein without repeating.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. gold finger lead structure, it is characterised in that including：Main lead, the main wire ends are used to be electrically connected with edges of boards conductor, and the main lead includes the first layers of copper, the first gold medal Layer and the first solder mask, first layers of copper are used to be covered in board substrate, first layer gold and first welding resistance Layer is covered in first layers of copper；AndSub- lead, wherein one end of the sub- lead are used to be electrically connected with golden finger, the other end of the sub- lead with it is described First layer gold is connected.
- 2. gold finger lead structure according to claim 1, it is characterised in that first layer gold is from first layers of copper One end extend over to the other end of first layers of copper.
- 3. gold finger lead structure according to claim 2, it is characterised in that first layer gold includes first to be connected Layer gold section and the second layer gold section, the first layer gold section are used to be connected with the edges of boards conductor, the width of the first layer gold section More than the width of the second layer gold section, the second layer gold section is connected with the sub- lead.
- 4. gold finger lead structure according to claim 3, it is characterised in that the width of the first layer gold section with it is described The width of first layers of copper is adapted；The length L of the first layer gold section is 5mm to 15mm.
- 5. gold finger lead structure according to claim 3, it is characterised in that the second layer gold section and the described first resistance Layer is disposed adjacent, and the width of the second layer gold section is 3mil to 9mil.
- 6. gold finger lead structure according to claim 1, it is characterised in that also include being arranged on the main lead and institute The terminal pad between sub- lead is stated, the main lead is connected by the terminal pad with the sub- lead；The terminal pad includes Second layers of copper, the second layer gold and the second solder mask, second layers of copper are used to be covered in the board substrate, and described second Layer gold is covered in second layers of copper with second solder mask, and second layer gold is connected with the sub- lead, described Second solder mask is connected with first solder mask.
- 7. gold finger lead structure according to claim 6, it is characterised in that second layer gold is ring-type, described The width of two layer gold and the width of first layer gold are adapted；The second layer gold end is round and smooth to be connected to the first layer gold, institute State that sub- wire ends are round and smooth to be connected to the second layer gold.
- 8. the gold finger lead structure according to claim 1 to 7 any one, it is characterised in that the sub- lead includes First lead segments and the second lead segments, described first lead segments one end are connected with described second lead segments one end, and described first draws The line segment other end is used to be connected with the golden finger, and the second lead segments other end is connected with the main lead, and described second The width of lead segments is more than the width of the first lead segments.
- 9. gold finger lead structure according to claim 8, it is characterised in that the round and smooth connection in the first lead segments end To the second lead segments；The width of first lead segments is 4mil to 7mil, the width of second lead segments for 6mil extremely 9mil。
- 10. a kind of gold finger lead construction manufacturing method as described in any one of claim 1 to 9, it is characterised in that including such as Lower step：After the circuit board good to outer-layer circuit graphic making carries out welding resistance processing, by welding resistance region, the first gold medal corresponding to golden finger Welding resistance region corresponding to welding resistance region corresponding to layer and sub- lead carries out windowing processing, while the main lead and the son are drawn The adjacent peripheral region welding resistance of line also carries out windowing processing, and the windowing in the adjacent peripheral region of the main lead and sub- lead is wide Degree D is 4mil to 8mil；The circuit board after windowing is handled carries out gold-plated processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710771539.0A CN107580411B (en) | 2017-08-31 | 2017-08-31 | Golden finger lead structure and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710771539.0A CN107580411B (en) | 2017-08-31 | 2017-08-31 | Golden finger lead structure and manufacturing method |
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| Publication Number | Publication Date |
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| CN107580411A true CN107580411A (en) | 2018-01-12 |
| CN107580411B CN107580411B (en) | 2019-12-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109548319A (en) * | 2018-12-28 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Fingerprint recognition support plate and the production method for improving fingerprint recognition support plate flatness |
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
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| CN104981097A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of gold finger, and gold finger circuit board |
| CN105960100A (en) * | 2016-06-30 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | Gold-plating lead adding method for golden fingers |
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| CN102045956A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
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| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN111050491B (en) * | 2019-12-19 | 2021-07-20 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
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| CN107580411B (en) | 2019-12-24 |
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