JPH0992998A - Manufacture of shielding plate for composite multilayer printed wiring board - Google Patents
Manufacture of shielding plate for composite multilayer printed wiring boardInfo
- Publication number
- JPH0992998A JPH0992998A JP27186795A JP27186795A JPH0992998A JP H0992998 A JPH0992998 A JP H0992998A JP 27186795 A JP27186795 A JP 27186795A JP 27186795 A JP27186795 A JP 27186795A JP H0992998 A JPH0992998 A JP H0992998A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy
- layers
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フレックスリジッド複
合多層配線板、キャビティダウン構造プラスチックパッ
ケージ（チップキャビティとＩ／Ｏピンとがパッケージ
の同じ側にありパッケージ他面が放熱などに利用できる
構造）等に使用されるシールド板で、樹脂フローの制御
が可能である複合多層プリント配線板用シールド板の製
造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flex-rigid composite multilayer wiring board, a cavity down structure plastic package (a structure in which a chip cavity and an I / O pin are on the same side of the package, and the other surface of the package can be used for heat dissipation, etc.). The present invention relates to a method for manufacturing a shield plate for a composite multilayer printed wiring board, which is a shield plate used for, and is capable of controlling resin flow.
【０００２】[0002]
【従来の技術】従来、多層プリント配線板は、内層回路
板をガラスクロスに樹脂を含浸させたプリプレグを介し
て外層板又は銅箔と重ね合わせ、プレスにより加熱加圧
成形をして一体にしていた。2. Description of the Related Art Conventionally, in a multilayer printed wiring board, an inner layer circuit board is laminated with an outer layer board or a copper foil through a prepreg obtained by impregnating glass cloth with a resin, and heat and pressure molding is carried out by a press to integrate them. It was
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、多層接
着部分と非接着部分が混在するフレックスリジッド複合
多層配線板においては、非接着部分への樹脂の流れ込
み、またキャビティダウン構造プラスチックパッケージ
を実装する配線板においては、階段状に露出させた接続
用端子が樹脂フローによって埋没するという欠点があっ
た。However, in a flex-rigid composite multilayer wiring board in which a multilayer adhesive portion and a non-adhesive portion are mixed, resin flows into the non-adhesive portion, and a wiring board on which a cavity-down structure plastic package is mounted. However, there is a drawback in that the connecting terminals exposed in a stepped manner are buried by the resin flow.
【０００４】本発明は、上記の欠点を解消するためにな
されたもので、樹脂フローの制御が可能なため、接続用
端子などが樹脂フローによって埋没することがなく、キ
ャビティダウン構造のプラスチックパッケージ等に好適
な複合多層プリント配線板用シールド板の製造法を提供
しようとするものである。The present invention has been made to solve the above-mentioned drawbacks, and since the resin flow can be controlled, the connecting terminals and the like are not buried by the resin flow, and a plastic package having a cavity-down structure or the like. Another object of the present invention is to provide a suitable method for producing a shield plate for a composite multilayer printed wiring board.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、後述する樹脂組
成物を、有機過酸化物の分解温度で予備硬化させること
によって、上記の目的が達成できることを見いだし、本
発明を完成したものである。Means for Solving the Problems As a result of earnest studies to achieve the above object, the present inventor found that the resin composition described below was pre-cured at the decomposition temperature of the organic peroxide. The present invention has been completed by finding out that the above object can be achieved.
【０００６】即ち、本発明は、（Ａ）分子内に少なくと
も 2個以上のエポキシ基を有するエポキシ樹脂の20〜80
％をアクリル酸類により部分エステル化したエポキシビ
ニルエステル樹脂、（Ｂ）有機過酸化物および（Ｃ）エ
ポキシ樹脂硬化剤を必須成分とする樹脂組成物を予め回
路形成した回路板上に塗布し、前記（Ｂ）の有機過酸化
物の分解温度で予備硬化させた後、外層板又は銅箔を重
ね合わせて加熱加圧一体に成形することを特徴とするキ
ャビティダウン構造の複合多層プリント配線板用シール
ド板の製造法である。That is, the present invention provides (A) an epoxy resin having 20 to 80 epoxy groups having at least two epoxy groups in the molecule.
A resin composition containing, as essential components, an epoxy vinyl ester resin partially esterified with acrylic acid, (B) an organic peroxide, and (C) an epoxy resin curing agent, is applied onto a circuit board on which a circuit has been formed in advance, and (B) A shield for a composite multilayer printed wiring board having a cavity-down structure, which is pre-cured at the decomposition temperature of the organic peroxide, and then laminated with an outer layer board or a copper foil and integrally molded by heating and pressing. It is a method of manufacturing a plate.
【０００７】以下、本発明を詳細に説明する。The present invention will be described in detail below.
【０００８】本発明に用いる樹脂組成物は、（Ａ）エポ
キシビニルエステル樹脂、（Ｂ）有機過酸化物および
（Ｃ）エポキシ樹脂硬化剤を必須成分とするものであ
る。The resin composition used in the present invention contains (A) epoxy vinyl ester resin, (B) organic peroxide and (C) epoxy resin curing agent as essential components.
【０００９】本発明に用いる（Ａ）エポキシビニルエス
テル樹脂としては、分子内に少なくとも 2個以上のエポ
キシ基を有するエポキシ樹脂の20〜80％を、アクリル酸
類により部分エステル化したものを使用する。これらの
エポキシビニルエステル樹脂の合成法、エステル化反応
の反応方法については特に制限されるものではなく、い
かなる方法でも使用することができる。エポキシ樹脂の
アクリル酸類により部分エステル化を20〜80％とした
が、20％未満では、樹脂フローの制御が十分でなく、ま
た、80％を超えると予備硬化時にゲル化が起こり好まし
くない。エポキシビニルエステル樹脂の具体的なものと
して、例えば、ＶＲ−６０Ｍ−３Ｘ（昭和高分子社製、
商品名）等が挙げられ、これらは単独又は混合して使用
することができる。As the (A) epoxy vinyl ester resin used in the present invention, a resin obtained by partially esterifying 20 to 80% of an epoxy resin having at least two epoxy groups in the molecule with acrylic acid is used. The method for synthesizing these epoxy vinyl ester resins and the reaction method for the esterification reaction are not particularly limited, and any method can be used. The partial esterification was set to 20 to 80% by acrylic acid of the epoxy resin, but if it is less than 20%, the resin flow is not sufficiently controlled, and if it exceeds 80%, gelation occurs during pre-curing, which is not preferable. Specific examples of the epoxy vinyl ester resin include, for example, VR-60M-3X (manufactured by Showa High Polymer Co., Ltd.,
Trade names) and the like, and these can be used alone or in combination.
【００１０】本発明に用いる（Ｂ）有機過酸化物とし
は、ベンゾイルパーオキサイド、ジクミルパーオキサイ
ド、タイシャリーブチルパーベンゾエート等のラジカル
反応開始剤となり得るものが使用される。As the organic peroxide (B) used in the present invention, those which can be a radical reaction initiator such as benzoyl peroxide, dicumyl peroxide, and tertiary butyl perbenzoate are used.
【００１１】本発明に用いる（Ｃ）エポキシ樹脂硬化剤
としては、芳香族ジアミン、ジシアンジアミド、フェノ
ール類、酸無水物等が挙げられ、必要に応じてイミダゾ
ール類、３級アミン、ルイス酸コンプレックス等の硬化
促進剤を併用することができる。Examples of the (C) epoxy resin curing agent used in the present invention include aromatic diamines, dicyandiamides, phenols, acid anhydrides and the like. If necessary, imidazoles, tertiary amines, Lewis acid complexes, etc. A curing accelerator can be used in combination.
【００１２】本発明に用いる樹脂組成物は、（Ａ）エポ
キシビニルエステル樹脂、（Ｂ）有機過酸化物および
（Ｃ）エポキシ樹脂硬化剤を必須成分とするものである
が、本発明の目的に反しない範囲において、また、必要
に応じて微粉末の無機質又は有機質の充填剤および添加
剤等を添加配合することができる。この樹脂組成物をメ
チルエチルケトン、セロソルブ等の溶剤を用いて均一に
溶解し、予め回路形成した回路板上に塗布するが、塗布
方法には特に制限はなく、スクリーン印刷、カーテンコ
ート、スプレー法等が挙げられる。The resin composition used in the present invention contains (A) epoxy vinyl ester resin, (B) organic peroxide and (C) epoxy resin curing agent as essential components. Fine powder inorganic or organic fillers and additives may be added and blended as long as they do not conflict with each other. This resin composition is uniformly dissolved using a solvent such as methyl ethyl ketone or cellosolve, and applied on a circuit board on which a circuit has been formed in advance, but the application method is not particularly limited, and screen printing, curtain coating, spraying, etc. may be used. Can be mentioned.
【００１３】本発明に用いる回路板は、通常のプリント
配線板に使用される銅張積層板が用いられ、例えば、ガ
ラスエポキシ銅張積層板、フレキシブル銅張積層板、ポ
リイミド銅張積層板等が挙げられる。As the circuit board used in the present invention, a copper clad laminate used in a usual printed wiring board is used, and examples thereof include a glass epoxy copper clad laminate, a flexible copper clad laminate, and a polyimide copper clad laminate. Can be mentioned.
【００１４】本発明に用いる外層板又は銅箔としては、
通常多層板に使用されている銅張積層板或いはそこに回
路形成されているものが使用される。また、銅箔として
は、通常銅張積層板用として用いられているものが使用
される。As the outer layer plate or copper foil used in the present invention,
A copper clad laminate which is usually used for a multilayer board or one having a circuit formed thereon is used. Further, as the copper foil, one generally used for copper-clad laminates is used.
【００１５】予め回路形成した回路板上に樹脂組成物を
塗布し、オーブン等により有機過酸化物の分解温度に加
熱し、溶剤を乾燥し樹脂組成物を半硬化状態にする。そ
して、ルーター加工等必要な加工を施してキャビティダ
ウン構造となるように配置した後、外層板又は銅箔を重
ね合わせて、熱プレス等により加熱加圧成形することに
よって、樹脂フローが制御された複合多層プリント配線
板用シールド板を製造することができる。The resin composition is applied onto a circuit board on which a circuit has been formed in advance, and is heated to the decomposition temperature of the organic peroxide in an oven or the like, and the solvent is dried to bring the resin composition into a semi-cured state. Then, after performing necessary processing such as router processing and arranging so as to have a cavity-down structure, the outer layer plate or the copper foil is overlapped and heated and pressure-molded by a heat press or the like to control the resin flow. A shield plate for a composite multilayer printed wiring board can be manufactured.
【００１６】[0016]
【作用】本発明の複合多層プリント配線板用シールド板
の製造方法を用いれば、フレックスリジッド複合多層配
線板、キャビティダウン構造プラスチックパッケージ等
樹脂フロー等の制御が必要とされる用途において優れた
複合多層プリント配線板用シールド板を製造することが
できる。By using the method for manufacturing a shield plate for a composite multilayer printed wiring board according to the present invention, a composite multilayer excellent in a flexible rigid composite multilayer wiring board, a cavity down structure plastic package or the like in which control of resin flow is required. A shield plate for a printed wiring board can be manufactured.
【００１７】[0017]
【実施例】本発明を実施例によって図面を用いて具体的
に説明するが、本発明はこれらの実施例によって限定さ
れるものではない。以下の実施例及び比較例において
「部」とは「重量部」を意味する。EXAMPLES The present invention will be specifically described with reference to the drawings by examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, "part" means "part by weight".
【００１８】実施例１ エポキシビニルエステル樹脂のＶＲ−６０Ｍ−３Ｘ（昭
和高分子社製商品名、エポキシ基の33.3％をメタクリル
酸でエステル化） 100部、ベンゾイルパーオキサイド
（分解温度105 ℃） 1部、およびエポキシ樹脂硬化剤と
してジアミノジフェニルメタン 3.0部をメチルエチルケ
トンとエチルセロソルブとの混合溶剤に溶解し樹脂組成
物溶液とした。Example 1 Epoxy vinyl ester resin VR-60M-3X (trade name of Showa High Polymer Co., Ltd., 33.3% of epoxy groups are esterified with methacrylic acid) 100 parts, benzoyl peroxide (decomposition temperature 105 ° C.) 1 Parts and 3.0 parts of diaminodiphenylmethane as an epoxy resin curing agent were dissolved in a mixed solvent of methyl ethyl ketone and ethyl cellosolve to obtain a resin composition solution.
【００１９】次に図１（ａ）に示したように、予め回路
形成したガラスエポキシ銅張積層板１に、上記で製造し
た樹脂組成物溶液をスクリーン印刷で塗布し、オーブン
で110 ℃，60分間，乾燥・半硬化させて、厚さ50μｍの
樹脂組成物２を形成した。次いで図１（ｂ）のように、
ルーターで所定の箇所を切り取り、切欠部３を形成し
て、樹脂組成物２付の回路板４を作った。次いで図１
（ｃ）のように、同様にして作製した樹脂組成物層２付
の回路板４を、切欠部３の小さいものから下にして複数
枚重ね合わせ、その下面にガラスエポキシ銅張積層板１
を重ね合わせて層構成した。このように構成したものを
上下の加熱プレス５に挟み、170 ℃，90分間，製品圧40
ｋｇ／ｃｍ2 の条件で、加熱加圧一体に成形して、図１
（ｄ）のような、キャビティダウン構造のプラスチック
パッケージ複合多層プリント配線板用シールド板６を製
造した。Next, as shown in FIG. 1A, the resin composition solution prepared above is applied by screen printing to a glass epoxy copper clad laminate 1 on which a circuit has been formed in advance, and the glass epoxy copper clad laminate 1 is heated at 110 ° C. and 60 ° C. in an oven. The resin composition 2 having a thickness of 50 μm was formed by drying and semi-curing for a minute. Then, as shown in FIG.
A predetermined portion was cut with a router to form a cutout portion 3 to make a circuit board 4 with the resin composition 2. Then Fig. 1
As shown in (c), a plurality of circuit boards 4 with a resin composition layer 2 produced in the same manner are stacked one on top of the other with the cutouts 3 having a small size, and the glass epoxy copper clad laminate 1 is placed on the lower surface thereof.
Were stacked to form a layer. The thus constructed product is sandwiched between the upper and lower heating presses 5 and the product pressure is kept at 170 ° C for 90 minutes.
Under the condition of kg / cm 2 , heat and pressure were integrally molded, and
A cavity-down structure plastic package composite multilayer printed wiring board shield plate 6 as shown in (d) was manufactured.
【００２０】実施例２ 実施例１において、エポキシビニルエステル樹脂のＶＲ
−６０Ｍ−３Ｘ（昭和高分子社製商品名、エポキシ基の
33.3％をメタクリル酸でエステル化）の替わりにＶＲ−
６０Ｍ−４Ｘ（昭和高分子社製商品名、エポキシ基の2
5.0％をメタクリル酸でエステル化）を用いた以外は、
すべて実施例１と同一にして複合多層プリント配線板用
シールド板を製造した。Example 2 In Example 1, the VR of the epoxy vinyl ester resin was used.
-60M-3X (Showa Polymer Co., Ltd. trade name, epoxy group
VR-instead of 33.3% esterified with methacrylic acid)
60M-4X (Showa High Polymer Co., Ltd. product name, epoxy group 2
Except that 5.0% was esterified with methacrylic acid)
A shield plate for a composite multilayer printed wiring board was manufactured in the same manner as in Example 1.
【００２１】比較例１ 実施例１において、予め回路形成したガラスエポキシ銅
張積層板に樹脂組成物を塗布する替わりに、打抜き金型
で所定箇所を打ち抜いたガラスエポキシプリプレグのＴ
ＬＰ−５５１（東芝ケミカル社製商品名、ガラスクロス
の厚さ30μｍ）を用いて、加熱プレスで170 ℃，90分，
圧力40ｋｇ／ｃｍ2 の条件で加熱加圧一体に成形し、キ
ャビティ構造の複合多層プリント配線板用シールド板を
製造した。Comparative Example 1 Instead of applying the resin composition to the glass epoxy copper clad laminate having a circuit formed in advance in Example 1, the glass epoxy prepreg T punched at a predetermined portion with a punching die was used.
Using LP-551 (Toshiba Chemical Co., Ltd. trade name, glass cloth thickness 30 μm), heat press at 170 ° C. for 90 minutes,
Heat and pressure were integrally molded under a pressure of 40 kg / cm 2 to produce a cavity-structured shield plate for a composite multilayer printed wiring board.
【００２２】比較例２ 実施例１において、加熱プレス前にガラスエポキシプリ
プレグのＴＬＰ−５５１（東芝ケミカル社製商品名、ガ
ラスクロスの厚さ30μｍ）を、150 ℃、オーブンで20分
間ベーキングした以外は、比較例１と同様にしてキャビ
ティ構造の複合多層プリント配線板用シールド板を製造
した。Comparative Example 2 Except that in Example 1, glass epoxy prepreg TLP-551 (trade name of Toshiba Chemical Co., glass cloth thickness 30 μm) was baked at 150 ° C. for 20 minutes in an oven before hot pressing. A composite multilayer printed wiring board shield plate having a cavity structure was manufactured in the same manner as in Comparative Example 1.
【００２３】実施例１〜２及び比較例１〜２で製造した
複合多層プリント配線板用シールド板について、樹脂フ
ロー及び内層ボイドの有無を試験したのでその結果を表
１に示した。本発明はいずれも優れた特性を示し、本発
明の効果を確認することができた。The shield plates for composite multilayer printed wiring boards produced in Examples 1 and 2 and Comparative Examples 1 and 2 were tested for resin flow and the presence or absence of inner layer voids. The results are shown in Table 1. All of the present invention exhibited excellent characteristics, and the effect of the present invention could be confirmed.
【００２４】[0024]
【表１】 ＊1 ：◎印…フロー少なく制御可、×印…フロー大きく制御不可、△印…フロー なく制御不可。[Table 1] * 1: ◎: Control is possible with few flows, ×: Control is not possible with large flows, Δ: Control is not possible without flows.
【００２５】[0025]
【発明の効果】以上の説明及び表１から明らかなよう
に、本発明の複合多層プリント配線板用シールド板の製
造法によれば、樹脂フローの制御が可能なため、キャビ
ティダウン構造のプラスチックパッケージ等に好適な複
合多層プリント配線板用シールド板を製造することが可
能となった。As is apparent from the above description and Table 1, according to the method for manufacturing a shield plate for a composite multilayer printed wiring board of the present invention, the resin flow can be controlled, so that a plastic package having a cavity-down structure. It has become possible to manufacture a shield plate for a composite multilayer printed wiring board suitable for the above.
【図１】本発明の複合多層プリント配線板用シールド板
の製造工程を説明する説明用断面図である。FIG. 1 is an explanatory cross-sectional view illustrating a manufacturing process of a shield plate for a composite multilayer printed wiring board according to the present invention.
１ ガラスエポキシ銅張積層板 ２ 樹脂組成物層 ３ 切欠部 ４ 樹脂組成物層付の回路板 ５ 加熱プレス ６ 複合多層プリント配線板用シールド板 1 Glass Epoxy Copper Clad Laminate 2 Resin Composition Layer 3 Notch 4 Circuit Board with Resin Composition Layer 5 Heat Press 6 Shield Plate for Composite Multilayer Printed Wiring Board
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/46 Ｈ０５Ｋ 3/46 Ｔ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location H05K 3/46 H05K 3/46 T
Claims (1)
ポキシ基を有するエポキシ樹脂の20〜80％をアクリル酸
類により部分エステル化したエポキシビニルエステル樹
脂、（Ｂ）有機過酸化物および（Ｃ）エポキシ樹脂硬化
剤を必須成分とする樹脂組成物を予め回路形成した回路
板上に塗布し、前記（Ｂ）の有機過酸化物の分解温度で
予備硬化させた後、外層板又は銅箔を重ね合わせて加熱
加圧一体に成形することを特徴とするキャビティダウン
構造の複合多層プリント配線板用シールド板の製造法。1. An epoxy vinyl ester resin obtained by partially esterifying 20 to 80% of (A) an epoxy resin having at least two epoxy groups in a molecule with acrylic acid, (B) an organic peroxide and (C). ) A resin composition containing an epoxy resin curing agent as an essential component is applied on a circuit board on which a circuit has been formed in advance, and pre-cured at the decomposition temperature of the organic peroxide of (B), and then an outer layer board or a copper foil is applied. A method for manufacturing a shield plate for a composite multilayer printed wiring board having a cavity-down structure, which is characterized by being superposed and integrally molded by heating and pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27186795A JPH0992998A (en) | 1995-09-26 | 1995-09-26 | Manufacture of shielding plate for composite multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27186795A JPH0992998A (en) | 1995-09-26 | 1995-09-26 | Manufacture of shielding plate for composite multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0992998A true JPH0992998A (en) | 1997-04-04 |
Family
ID=17506009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27186795A Pending JPH0992998A (en) | 1995-09-26 | 1995-09-26 | Manufacture of shielding plate for composite multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0992998A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105758686A (en) * | 2016-04-11 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method for bent test bar of rigid-flexible combined plate |
| KR20210060014A (en) * | 2019-11-18 | 2021-05-26 | (주)이녹스첨단소재 | Composite sheet with emi shielding and heat radiation and display apparatus comprising the same |
-
1995
- 1995-09-26 JP JP27186795A patent/JPH0992998A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105758686A (en) * | 2016-04-11 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method for bent test bar of rigid-flexible combined plate |
| KR20210060014A (en) * | 2019-11-18 | 2021-05-26 | (주)이녹스첨단소재 | Composite sheet with emi shielding and heat radiation and display apparatus comprising the same |
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