JPH09293988A - Manufacture of shielding plate for multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a shielding plate at a low cost for a multilayer printed wiring board, wherein the manufacturing method is excellent in continuous productivity. SOLUTION: A method for manufacturing a shielding plate is carried out through such a manner that an adhesive agent layer 5 is previously applied to the surface of a one-side copper-foiled insulating film 4 and dried up to turn half-cured for the formation of a laminated film 6 of continuous length, the laminated films 6 are continuously fed from an upper and a lower feed roller, 10a and 10b, and an inner circuit board 9 is continuously fed, whereby the laminated films 6 are laminated sandwiching the inner circuit boards 9 between them so as to make the adhesive agent layers 5 come into contact with the circuit boards 9. At this point, adhesive agent composed of epoxy vinyl ester resin where 20 to 80% of epoxy group contained in it is partially turned to esterify by acrylic acid, organic peroxide, and hardening agent is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a shield board for a multilayer printed wiring board, which is excellent in productivity.

[0002]

2. Description of the Related Art Conventionally, a shield plate for a multilayer printed wiring board has been formed by superposing a prepreg on an inner layer circuit board, further stacking a copper foil or an outer layer board on the prepreg, and heating and pressing by a press. .

[0003]

However, this pressing step has a drawback in that the molding time is long and the productivity is low, and in addition, auxiliary materials such as a cushioning material are required and the manufacturing cost is increased.

The present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a method of manufacturing a shield plate for a multilayer printed wiring board, which is excellent in productivity and contributes to cost reduction.

[0005]

Means for Solving the Problems As a result of intensive research aimed at achieving the above object, the present inventor has found that an insulating film with a copper foil having an adhesive applied to the film surface in advance or an adhesive film applied to a roughened surface in advance. The inventors have found that the above object can be achieved by continuously laminating an adhesive-coated copper foil coated with an agent on an inner layer circuit board with a heating roll, and completed the present invention.

[0006] That is, the present invention is a long film-like laminate in which an adhesive is applied, dried and semi-cured in advance on the film surface of an insulating film with a single-sided copper foil, or an adhesive is applied in advance to a roughened surface of a copper foil. While the copper foil with adhesive applied, dried, and semi-cured is continuously supplied from the two upper and lower unwinding rolls, the inner layer circuit board is also continuously supplied, and both sides of the inner layer circuit board are In producing a shield board for a multilayer printed wiring board by passing between the heat rolls so as to be sandwiched by the adhesive surface of the film-like laminate and laminating the film-like laminate on both surfaces of the inner layer circuit board, an adhesive Is (A) an epoxy vinyl ester resin obtained by partially esterifying 20 to 80% of epoxy groups in an epoxy resin having at least two epoxy groups in the molecule with acrylic acid, (B) an organic peroxide and (C). ) Curing Which is a method for manufacturing a multilayer printed circuit board for shielding plate, characterized in that as an essential component.
Further, it is a method for producing a shield plate for a multilayer printed wiring board, which comprises drying the adhesive at a temperature equal to or higher than the decomposition temperature of the (B) organic peroxide compounded in the adhesive.

Hereinafter, the present invention will be described in detail.

The inner layer circuit board used in the present invention is not particularly limited as long as it satisfies the characteristics as a multilayer printed wiring board. For example, a glass epoxy copper clad laminate,
It can be used by forming a circuit on a glass polyimide copper clad laminate, a polyimide flexible copper clad laminate, or the like.

The resin composition of the adhesive used in the present invention contains (A) epoxy vinyl ester resin, (B) organic peroxide and (C) curing agent as essential components.

As the epoxy vinyl ester resin (A) which is a component of the resin composition, 20 to 80% of the epoxy groups in the epoxy resin having at least two epoxy groups in the molecule are partially esterified with acrylic acid. Use what you did. The method of synthesizing these epoxy vinyl ester resins and the esterification reaction are not particularly limited, and any method can be used. The acrylic acid referred to in the present invention includes methacrylic acid. The partial esterification of the epoxy resin with acrylic acid was set to 20 to 80%, but if it is less than 20%, the resin flow is not sufficiently controlled, and if it exceeds 80%, gelation occurs during pre-curing, which is not preferable. Specific examples of the epoxy vinyl ester resin include, for example, VR-60M-
3X (manufactured by Showa Highpolymer Co., Ltd.) and the like can be mentioned, and these can be used alone or in combination of two or more kinds.

As the organic peroxide (B) which is a component of the resin composition, for example, benzoyl peroxide, dicumyl peroxide, tertiary butyl peroxybenzoate and the like which can be a radical reaction initiator are used. These organic peroxides can be used alone or in combination of two or more.

The hardener (C), which is another component, is not particularly limited as long as it can be used as a hardener for epoxy resin, and examples thereof include aromatic diamine, dicyandiamide, and acid anhydride. If necessary, a curing accelerator such as an imidazole, a tertiary amine or a Lewis acid complex can be used in combination.

The resin composition of the adhesive used in the present invention is
(A) Epoxy vinyl ester resin, (B) organic peroxide, and (C) curing agent as essential components, but as long as it does not deviate from the object of the present invention, and if necessary, fine powder of inorganic material Alternatively, organic fillers, other additives, etc. can be added. The resin composition thus obtained is uniformly dissolved in a solvent such as methyl ethyl ketone or cellosolve and used as an adhesive.

This adhesive is applied to the insulating film surface of the copper foil-insulating film or the roughened surface of the copper foil, dried and semi-cured at a temperature not lower than the decomposition temperature of the organic peroxide, and the resin flow is adjusted. Can be laminated on both sides of the inner layer circuit board with a heat roll to produce a shield board for a multilayer printed wiring board. In order to satisfy the characteristics of the printed wiring board, it is desirable to post-cure in an oven or the like after laminating.

Next, the present invention will be described with reference to the drawings.

FIG. 1 (a) is a sectional view of a film-like laminate used in the present invention, FIG. 1 (b) is a schematic sectional view for explaining a method for manufacturing a shield plate for a multilayer printed wiring board, and FIG. It is a fragmentary sectional view of the obtained shield board for printed wiring boards.

In FIG. 1 (a), 4 is an insulating film with a copper foil having a copper foil 1 on an insulating film 3 with a copper foil adhesive 2 interposed therebetween. An adhesive 5 is applied to the insulating film surface of the insulating film 4 with copper foil, dried, and semi-cured to form a film-like laminate 6. The copper foil adhesive 2 interposed between the insulating film 3 and the copper foil 1 and the adhesive 5 applied to the insulating film surface of the insulating film 3 may be the same or different, and satisfy the characteristics of the printed wiring board. If it is, it can be used without particular limitation.

In FIG. 1 (b), the film-like laminate 6 produced as described above is wound around the unwinding rolls 10a and 10b so that the adhesive 5 surface is on the outside so that it can be continuously supplied. It has been turned. Further, the inner layer circuit board 9 having the circuit 8 formed on the substrate 7 is also continuously supplied. The film-shaped laminate 6 is sandwiched between the upper and lower surfaces of the continuously supplied inner-layer circuit board 9, that is, the adhesive 5 surface of the film-laminated body 6 faces the circuit 8 surface of the inner-layer circuit board 9. Can be continuously supplied, passed between the heat rolls 11a and 11b, and laminated on both surfaces of the inner layer circuit board 9 to manufacture the shield board 12 for a multilayer printed wiring board. The layer structure of the obtained shield plate for a multilayer printed wiring board is shown in FIG.

According to the method for producing a shield plate for a multilayer printed wiring board of the present invention, the adhesive is semi-cured and a heat roll process is employed to continuously produce a shield plate for a multilayer printed wiring board having a good plate thickness accuracy. Therefore, the molding time of the conventional pressing process can be shortened. In addition, since a cushioning material or other auxiliary material is not required during the pressing step, the manufacturing cost is reduced, which contributes to cost reduction.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to embodiments. The present invention is not limited by these examples. In the following examples and comparative examples, "part"
Means “parts by weight” unless otherwise specified.

Example 1 100 parts of VR-60M-3X epoxy vinyl ester resin (manufactured by Showa Highpolymer Co., Ltd., 33% of trade name epoxy group is esterified with methacrylic acid), benzoyl peroxide (decomposition temperature 105 ° C.) An adhesive was obtained by dissolving 1 part and 3.0 parts of diaminodiphenylmethane as a curing agent in a mixed solvent of methyl ethyl ketone and ethyl cellosolve. Apply this adhesive to the insulation film surface of copper foil insulation film TLF-521M (Toshiba Chemical Co., Ltd., trade name) to a thickness of ± 30 μm after drying with a roll coater and dry at 130 ℃, half It was cured to produce a film-like laminate. next,
The film-like laminate is formed on both sides of a glass epoxy inner layer circuit board formed by the etched foil method.
The laminate was continuously laminated with a hot roll at ℃, cut into a predetermined size, and then post-cured in an oven at 160 ℃ for 1 hour to produce a shield board for a multilayer printed wiring board.

Example 2 A shield for a multilayer printed wiring board was prepared in the same manner as in Example 1 except that a polyimide flexible copper clad laminate was used as the inner layer circuit board instead of the glass epoxy inner layer circuit board. A board was manufactured.

Comparative Example 1 On both sides of a glass epoxy inner layer circuit board on which a circuit was formed by an etched foil method, a copper foil was superposed with a glass epoxy prepreg on the both sides, and a press was integrally molded under heating at 170 ° C. for 2 hours. A shield board for a multilayer printed wiring board was manufactured.

Comparative Example 2 100 parts of epoxy resin Epicoat 828 (trade name of Yuka Shell Co., trade name, epoxy equivalent 190) and 18.0 parts of diaminodiphenylmethane as a curing agent were dissolved in a mixed solvent of methyl ethyl ketone and ethyl cellosolve to form an adhesive. Obtained. Using this adhesive, a shield plate for a multilayer printed wiring board was manufactured in the same manner as in Example 1.

Appearance of the shield plates for multilayer printed wiring boards produced in Examples 1 and 2 and Comparative Examples 1 and 2,
The productivity was tested and the results are shown in Table 1. In all cases, the present invention was excellent, and the effects of the present invention could be confirmed.

[0026]

[Table 1] * 1: ○: Good, ×: Bad.

[0027]

As is clear from the above description and Table 1, according to the method for manufacturing a shield plate for a multilayer printed wiring board of the present invention, it is possible to manufacture continuously, the productivity is excellent, and the cushion material and the like are used. It is possible to manufacture a shield plate for a multilayer printed wiring board, which does not require auxiliary materials and contributes to cost reduction.

[Brief description of drawings]

FIG. 1 (a) is a schematic cross-sectional view of a film laminate used in the present invention, and FIG. 1 (b) is a schematic cross-sectional view illustrating a method for manufacturing a shield plate for a multilayer printed wiring board according to the present invention.

FIG. 2 is a schematic cross-sectional view of a shield plate for a multilayer printed wiring board according to the present invention.

[Explanation of symbols]

 1 Copper Foil 2 Adhesive for Copper Foil 3 Insulating Film 4 Insulating Film with Copper Foil 5 Adhesive 6 Film Laminate 7 Substrate 8 Inner Layer Circuit 9 Inner Layer Circuit Board 10a, 10b Unwinding Roll 11a, 11b Heat Roll 12 Multilayer Printed Wiring Shield plate for plate

Claims (2)

[Claims] 1. A long film laminate in which an adhesive is applied, dried and semi-cured in advance on the film side of an insulating film with a copper foil on one side, or an adhesive is applied in advance on a roughened surface of a copper foil.
While the dried and semi-cured copper foil with adhesive is continuously supplied from the upper and lower unwinding rolls, the inner layer circuit board is also continuously supplied, and both sides of the inner layer circuit board are laminated in the above film form. When passing between the heat rolls so as to be sandwiched by the adhesive surface of the body and laminating the film-like laminate on both surfaces of the inner layer circuit board to manufacture a shield board for a multilayer printed wiring board, the adhesive is ( A) 20 epoxy groups in an epoxy resin having at least two epoxy groups in the molecule
~ 80% epoxy vinyl ester resin partially esterified with acrylic acid, (B) organic peroxide and (C)
A method for producing a shield board for a multilayer printed wiring board, which comprises a curing agent as an essential component. 2. The method for producing a shield plate for a multilayer printed wiring board according to claim 1, wherein the adhesive is dried at a temperature equal to or higher than the decomposition temperature of (B) the organic peroxide compounded in the adhesive.