CN109905976A - A kind of local laminating type of Rigid Flex cover film - Google Patents
A kind of local laminating type of Rigid Flex cover film Download PDFInfo
- Publication number
- CN109905976A CN109905976A CN201910288796.8A CN201910288796A CN109905976A CN 109905976 A CN109905976 A CN 109905976A CN 201910288796 A CN201910288796 A CN 201910288796A CN 109905976 A CN109905976 A CN 109905976A
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- China
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- soft board
- fpc soft
- cover film
- cover
- rigid flex
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Abstract
The invention belongs to printed wiring board manufacturing fields, in particular to a kind of local laminating type of Rigid Flex cover film, Cover is only fitted in the dynamic bending region of FPC soft board by part patch Cover mode of the invention, compared with traditional whole plate pastes Cover method, it has the advantage that a Cover can paste multiple pcb boards, saves Cover purchase cost；The conventional brill nozzle of conventional drilling parameter and selection, save the cost and raising production efficiency can be used in drilling；The risk that copper causes having no copper in the holes is not plated without having to worry about polyimides (PI) film location；When Rigid Flex designs, it is only necessary to the thickness of hardboard is considered, to reduce difficulty；In soft board lamination without passing through plasma treatment Cover to increase its roughness, so the risk of lamination plate bursting is needed not worry about, thus reduce production procedure, improving production efficiency.
Description
Technical field
The invention belongs to printed wiring board manufacturing fields, relate generally to the quality control of Rigid Flex production process, tool
Body is related to a kind of local laminating type of Rigid Flex cover film.
Background technique
Printed circuit board (PCB) industry production Rigid Flex is all made of the side that whole plate pastes epiphragma (Cover) at this stage
Formula, this mode are required to after soft board drilling and pressing because Cover whole plate is attached on soft board (faying face including soft board and hardboard)
Special drilling parameter and special brill nozzle, no person's hole wall extra coarse mark；Soft board has to pass through plasma treatment roughening before pressing
The surface Cover, then can just be pressed together with hardboard after brownification, no person Cover layers and without flowing prepreg (No flow PP)
Layer cohesive force is inadequate, leads to plate bursting problem occur；Whole plate pastes the Rigid Flex of Cover, after must beating plasma after holes drilled through
Copper can just be sunk, the binding site of no person Cover and polyimides (PI) film is easy to appear that copper is bad or disconnected copper problem, gives
PCB signal integrity brings fatal problem.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the invention proposes a kind of part fittings of Rigid Flex cover film
Mode had both reduced the difficulty of cover film fitting, and had reduced the process of fitting, and reduce risk, improve production efficiency.
To achieve the goals above, the technical scheme adopted by the invention is that:
The present invention provides a kind of local laminating types of Rigid Flex cover film, comprising the following steps:
S1, flexible circuit board (Flexible Printed Circuit, abbreviation FPC soft board) sawing sheet:
FPC soft board is cut into the size that suitable producing line produces according to the size of customer demand and internal pair production demand；
S2, sawing sheet drying-plate:
It is toasted 4 hours under the conditions of FPC soft board after sawing sheet is placed in 100 DEG C, removes the moisture content of FPC soft board, it is soft to stablize FPC
Plate performance；
S3, internal layer pre-treatment:
Internal layer pre-treatment is carried out to FPC soft board, removes the impurity such as grease and the oxide on copper removal surface；
S4, patch dry film:
Dry film is pasted on handling clean FPC soft board face, stands 15 minutes after pasting dry film；
S5, the imaging of interior light:
The internal layer data figure of client is transferred on dry film；
S6, development:
The graphical display on FPC soft board is come out by chemical medicinal liquid；
S7, internal layer etching:
Unwanted figure on FPC soft board is etched away by chemical medicinal liquid；
S8, internal layer automatic optics inspection (Automated Optical Inspection, abbreviation AOI):
AOI detection is carried out to the figure of FPC soft board, defect plate is removed；
S9, epiphragma (Cover) is pasted:
Suitable cover film is selected according to customer demand, the size in region is bent according to FPC soft board dynamic, cover film is cut
It is cut into single PCS size, and does cover film register guide timberline on FPC soft board, uses automatic attaching machine, then with MK point
(mark point) is anchor point, and cover film is fitted in the fitting marking line region for having carried out the FPC soft board of figure；
S10, cover film (Cover) are pressed fastly:
Using fast press device, by the cover film posted by certain temperature and pressure, within a certain period of time effectively
It is incorporated on FPC soft board.
Preferably, internal layer pre-treating method described in S3 is first to handle FPC soft board with acid deoiling agent, then distinguish
FPC soft board is handled with the mixture of sulfuric acid, sulfuric acid and hydrogen peroxide, it is finally that the FPC soft board distilled water hydro-peening handled well is clean.
Preferably, the Carbon Dioxide sodium solution that the selection of chemical medicinal liquid described in S6 mass fraction is 2%, and the liquid of solution
Temperature is 40 DEG C.
Preferably, chemical medicinal liquid described in S7 selects chlorination copper etchant solution, Cu in etching solution2+Molar concentration be
2mol/L, and the liquid temperature of etching solution is 50 DEG C.
Preferably, the frame line of cover film described in S9 is beyond FPC soft board dynamic bending region 0.5mm.
Preferably, the frame line of cover film described in S9 exceeds soft or hard combination dynamic area 0.5mm.
Preferably, the frame line of cover film described in S9 is more than or equal to the distance between the drilling in FR-4 hardboard
0.5mm。
Preferably, the point of MK described in S9 is two, and the shape of two MK points is not identical.
Preferably, the condition pressed fastly described in S10 is 100MPa, presses 120 seconds under the conditions of 180 DEG C.
Compared with prior art, the beneficial effects of the present invention are:
A kind of local laminating type of Rigid Flex cover film proposed by the present invention, traditional whole plate paste Cover method phase
Than having the advantage that
(1) part patch Cover mode, a Cover can paste multiple pcb boards, save Cover purchase cost；
(2) part patch Cover mode, conventional drilling parameter can be used for drilling and selection is conventional bores nozzle, save the cost and mentions
High efficiency；
(3) part patch Cover mode, drilling hole is interior not to be plated copper and causes in hole without having to worry about polyimides (PI) film location
Risk without copper；
(4) soft or hard designing since Cover is only fitted on FPC soft board by part patch Cover mode of the invention
When the plate thickness of board (R-F pcb board), it is only necessary to consider the thickness of hardboard, and not have to the thickness for considering Cover, to reduce
Difficulty；
(5) it due to part patch Cover mode of the invention, is not bonded in the faying face of FR-4 hardboard and FPC soft board
Cover, therefore in soft board lamination without passing through plasma treatment Cover to increase its roughness, so needing not worry about layer
The risk of plate bursting is pressed, thus reduce production procedure, improving production efficiency.
Detailed description of the invention:
Fig. 1 is bonding structure schematic diagram of the cover film on FPC soft board dynamic bending region.
In figure: 1-FR-4 hardboard, 41- drilling, 2-FPC soft board, 3- cover film, 4- register guide timberline, 5-MK point.
Specific embodiment
Specific embodiments of the present invention will be further explained below.It should be noted that for these implementations
The explanation of mode is used to help understand the present invention, but and does not constitute a limitation of the invention.In addition, invention described below
Technical characteristic involved in each embodiment can be combined with each other as long as they do not conflict with each other.
Embodiment 1:
The present invention provides a kind of local laminating types of Rigid Flex cover film, comprising the following steps:
S1, FPC soft board sawing sheet:
FPC soft board is cut into the size that suitable producing line produces according to the size of customer demand and internal pair production demand；
S2, sawing sheet drying-plate:
It is toasted 4 hours under the conditions of FPC soft board after sawing sheet is placed in 100 DEG C, removes the moisture content of FPC soft board, it is soft to stablize FPC
Plate performance；
S3, internal layer pre-treatment:
Internal layer pre-treatment is carried out to FPC soft board, is first handled FPC soft board 5 minutes with the agent of DS-220 acid deoiling；Then distinguish
With mixture (volume ratio of sulfuric acid and hydrogen peroxide is 1:1) each processing FPC soft board 3 minutes of sulfuric acid, sulfuric acid and hydrogen peroxide；Finally
The FPC soft board handled well is embathed completely with distilled water, when hydro-peening, FPC soft board is fixed in 45 degree angles, then uses sprinkler head past
The top of FPC soft board is washed by water, water-break-free in the case where split uniformly and in 30 seconds to the moisture film on FPC soft board, FPC soft board
Cleannes be to have reached the requirement of quality, with impurity such as the grease and the oxides that go to copper removal surface, ensure internal layer circuit production
It is good；
S4, patch dry film:
Dry film is pasted on handling clean FPC soft board face, stands 15 minutes after pasting dry film；
S5, the imaging of interior light:
The internal layer data figure of client is transferred on dry film；
S6, development:
The Carbon Dioxide sodium solution for being 2% by mass fraction (the liquid temperature of solution is 40 DEG C) is by the figure on FPC soft board
It shows；
S7, internal layer etching:
Pass through chlorination copper etchant solution (Cu in etching solution2+Molar concentration be 2mol/L, and the liquid temperature of etching solution be 50 DEG C)
Etch away unwanted figure on FPC soft board；
S8, internal layer AOI:
AOI detection is carried out by figure of the VCTA-S810 type AOI detection device to FPC soft board, defect plate is removed；
S9, patch Cover:
Suitable cover film is selected according to customer demand, the size in region is bent according to FPC soft board dynamic, according to Fig. 1 institute
The method shown determines the fit area of cover film, i.e. the frame line of cover film is covered beyond FPC soft board dynamic bending region 0.5mm
The frame line of epiphragma exceeds soft or hard combination dynamic area 0.5mm, and between the drilling in the frame line of cover film and FR-4 hardboard
Distance be more than or equal to 0.5mm, cover film is then cut by single PCS size according to above-mentioned standard, and do on FPC soft board
Cover film register guide timberline (two marking lines), the two sides of cover film are arranged in two marking line asymmetry, i.e., wherein one mark
Timberline and covering film edge, another marking line are positioned over outside film edge, and this marking line is at a distance from covering film edge
Equal to fitting tolerance, allow the case where finding deviation when pad pasting in time, in order to accurate pad pasting, finally uses automatic laminating machine utilizing
Cover film is fitted in the fitting marking line region for having carried out the FPC soft board of figure with MK point (mark point) for anchor point by device,
For the alignment precision for effectively improving automatic attaching machine, two MK points are designed, and the shape of two MK points is not identical, such as Fig. 1 institute
Show, the section of a MK point is circle, and the section of another MK point is rectangle；
S10, Cover are pressed fastly:
Using fast press device, is pressed 120 seconds under the conditions of 100MPa, 180 DEG C, the cover film posted is effectively combined
On FPC soft board, solidify the fitting that Cover can be completed in 1 hour after pressing at 170 DEG C.
Compared with traditional whole plate pastes Cover method, the local laminating type of the present embodiment is had the advantage that
(1) in timeliness: existing automatic attaching machine can satisfy the required precision of part patch Cover, with manual whole plate
Patch is compared to the advantage high with precision, throughput rate is fast；
(2) in process: being required to when reducing laminated soft sheet and when electroless copper the process of plasma treatment, i.e., directly reduce
Two processes make project planner only need to consider the thickness of hardboard, and do not have to the thickness for considering Cover, reduce to plate
The difficulty and calculation process of thickness design；
(3) in cost: Rigid Flex, without managing drilling parameter and boring nozzle type, is using conventional parameter in drilling
The hole crude product matter of drilling can be met；Cover sawing sheet need to only open the material of soft board dynamic zone position, and a Cover can meet production
The needs of several piece Rigid Flex；
(4) in quality: without having to worry about the risk after Rigid Flex lamination because of plate bursting caused by Cover roughness deficiency；Nothing
It need to worry that PI location hole does not plate the risk of copper in electroless copper in hole.
Above the embodiments of the present invention are described in detail, but the present invention is not limited to described embodiments.It is right
For those skilled in the art, in the case where not departing from the principle of the invention and spirit, these embodiments are carried out more
Kind change, modification, replacement and modification, still fall in protection scope of the present invention.
Claims (9)
1. a kind of local laminating type of Rigid Flex cover film, it is characterised in that: the following steps are included:
S1, FPC soft board sawing sheet:
FPC soft board is cut into the size of suitable producing line production；
S2, sawing sheet drying-plate:
It is toasted 4 hours under the conditions of FPC soft board after sawing sheet is placed in 80 DEG C, removes the moisture content of FPC soft board, stablize FPC soft board
Energy；
S3, internal layer pre-treatment:
Internal layer pre-treatment is carried out to FPC soft board, removes the impurity such as grease and the oxide on copper removal surface；
S4, patch dry film:
Dry film is pasted on handling clean FPC soft board face, stands 15 minutes after pasting dry film；
S5, the imaging of interior light:
The internal layer data figure of client is transferred on dry film；
S6, development:
The graphical display on FPC soft board is come out by chemical medicinal liquid；
S7, internal layer etching:
Unwanted figure on FPC soft board is etched away by chemical medicinal liquid；
S8, internal layer AOI:
AOI detection is carried out to the figure of FPC soft board, defect plate is removed；
S9, epiphragma is pasted:
The size that region is bent according to FPC soft board dynamic, is cut into single PCS size for cover film, and do and cover on FPC soft board
Then cover film is fitted in using MK point as anchor point using automatic attaching machine and has carried out figure by epiphragma register guide timberline
The fitting marking line region of FPC soft board；
S10, cover film are pressed fastly:
It is effectively combined within a certain period of time using fast press device by the cover film posted by certain temperature and pressure
On FPC soft board.
2. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S3
The internal layer pre-treating method stated is first to handle FPC soft board with acid deoiling agent, then respectively with sulfuric acid, sulfuric acid and hydrogen peroxide
Mixture handles FPC soft board, finally that the FPC soft board distilled water hydro-peening handled well is clean.
3. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S6
It is 2% Carbon Dioxide sodium solution that the chemical medicinal liquid stated, which selects mass fraction, and the liquid temperature of solution is 40 DEG C.
4. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S7
The chemical medicinal liquid stated selects chlorination copper etchant solution, Cu in etching solution2+Molar concentration be 2mol/L, and the liquid temperature of etching solution be 50
℃。
5. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S9
The frame line for the cover film stated is beyond FPC soft board dynamic bending region 0.5mm.
6. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S9
The frame line for the cover film stated exceeds soft or hard combination dynamic area 0.5mm.
7. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S9
The distance between the frame line for the cover film stated and the drilling in FR-4 hardboard are more than or equal to 0.5mm.
8. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: institute in S9
The MK point stated is two, and the shape of two MK points is not identical.
9. a kind of local laminating type of Rigid Flex cover film according to claim 1, it is characterised in that: in S10
The condition pressed fastly is 100MPa, presses 120 seconds under the conditions of 180 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910288796.8A CN109905976A (en) | 2019-04-11 | 2019-04-11 | A kind of local laminating type of Rigid Flex cover film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910288796.8A CN109905976A (en) | 2019-04-11 | 2019-04-11 | A kind of local laminating type of Rigid Flex cover film |
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| Publication Number | Publication Date |
|---|---|
| CN109905976A true CN109905976A (en) | 2019-06-18 |
Family
ID=66954651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910288796.8A Pending CN109905976A (en) | 2019-04-11 | 2019-04-11 | A kind of local laminating type of Rigid Flex cover film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036756A1 (en) * | 2020-08-20 | 2022-02-24 | 瑞声声学科技(深圳)有限公司 | Sheet-type fpc and manufacturing method therefor |
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| CN103889170A (en) * | 2014-02-28 | 2014-06-25 | 双鸿电子(惠州)有限公司 | Method for manufacturing multilayer vehicle-mounted flexible printed board |
| CN103906362A (en) * | 2014-02-28 | 2014-07-02 | 双鸿电子(惠州)有限公司 | Mobile phone capacitive screen flexible printed circuit board manufacturing method |
| CN205546185U (en) * | 2016-02-03 | 2016-08-31 | 深圳市精诚达电路科技股份有限公司 | Treat circuit board of reinforcement |
| CN108617114A (en) * | 2018-06-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of production method of laser control depth covering type Rigid Flex |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN108990317A (en) * | 2018-07-13 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A method of improving Rigid Flex level to level alignment degree |
-
2019
- 2019-04-11 CN CN201910288796.8A patent/CN109905976A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889170A (en) * | 2014-02-28 | 2014-06-25 | 双鸿电子(惠州)有限公司 | Method for manufacturing multilayer vehicle-mounted flexible printed board |
| CN103906362A (en) * | 2014-02-28 | 2014-07-02 | 双鸿电子(惠州)有限公司 | Mobile phone capacitive screen flexible printed circuit board manufacturing method |
| CN205546185U (en) * | 2016-02-03 | 2016-08-31 | 深圳市精诚达电路科技股份有限公司 | Treat circuit board of reinforcement |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN108617114A (en) * | 2018-06-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of production method of laser control depth covering type Rigid Flex |
| CN108990317A (en) * | 2018-07-13 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A method of improving Rigid Flex level to level alignment degree |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036756A1 (en) * | 2020-08-20 | 2022-02-24 | 瑞声声学科技(深圳)有限公司 | Sheet-type fpc and manufacturing method therefor |
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Application publication date: 20190618 |