CN112638043A - Manufacturing method of rigid-flex printed circuit board with flying tail type structure - Google Patents
Manufacturing method of rigid-flex printed circuit board with flying tail type structure Download PDFInfo
- Publication number
- CN112638043A CN112638043A CN202110108219.3A CN202110108219A CN112638043A CN 112638043 A CN112638043 A CN 112638043A CN 202110108219 A CN202110108219 A CN 202110108219A CN 112638043 A CN112638043 A CN 112638043A
- Authority
- CN
- China
- Prior art keywords
- copper layer
- substrate
- copper
- layer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing a rigid-flex printed circuit board with a flying tail type structure, which comprises the following steps of cutting, manufacturing an inner layer circuit, AOI detection, laser depth control cutting, first pressing, drilling, copper deposition, whole board electroplating, acid etching, inner layer resistance welding, character screen printing, board baking, selective gold deposition, second pressing, manufacturing an outer layer circuit, board routing, cleaning, flying needle testing and the like. Different interconnection levels of the same soft and hard combination board are separated to be made into different FR4 substrates, the hard board area of each FR4 substrate is connected through an FPC substrate and is similar to a tail of a circuit board flying out, and in the flying tail area of the structure, each FR4 substrate can be separately made into wiring and mounted with components; meanwhile, each FR4 substrate in the tail flying area can be separately installed at different positions of an electrical appliance, so that the flexibility of circuit board mounting and installation is improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a rigid-flex printed circuit board with a flying tail type structure.
Background
All layers of the same rigid-flex board area are integrally pressed together at present, and the hard board area cannot be separately used for component mounting or electrical equipment assembling. The structure only attaches all electronic components on the same hard board, thereby leading to the redundancy of the circuit design of the rigid-flex printed circuit board, excessively dense wiring, undersized line spacing and easy signal crosstalk during signal transmission. Meanwhile, with the rapid development of electronic technology, the circuit design gradually tends to be miniaturized, complicated and highly integrated, which means that the power of the circuit board will be larger and larger, and the heating sources and the heating values of all the components which are only mounted on the same hard board will be increased and increased accordingly. Heat and electromagnetic interference generated by the circuit board can adversely affect critical circuitry, causing the circuitry to fail or otherwise fail to function properly. Therefore, it is necessary to develop a method for manufacturing a rigid-flex printed circuit board, so that the rigid-flex printed circuit board can overcome the above disadvantages and meet the use requirements.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main object of the present invention is to provide a method for manufacturing a flex-rigid board with a flying tail structure, which can effectively solve the problem of the existing flex-rigid board method that components are separately mounted or electrical devices are assembled.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a rigid-flex printed circuit board with a flying tail type structure comprises the following steps:
(1) cutting: cutting according to the cutting icon size to obtain a first FR4 substrate, a second FR4 substrate, a third FR4 substrate, a fourth FR4 substrate, a first FPC substrate, a second FPC substrate, a PP layer and a covering film between corresponding layers, wherein the upper surface and the lower surface of the first FR4 substrate are respectively provided with a 2 nd copper layer and a 3 rd copper layer, the upper surface and the lower surface of the second FR4 substrate are respectively provided with a 6 th copper layer and a 7 th copper layer, the upper surface and the lower surface of the third FR4 substrate are respectively provided with an 8 th copper layer and a 9 th copper layer, the upper surface and the lower surface of the fourth FR4 substrate are respectively provided with a 12 th copper layer and a 13 th copper layer, the upper surface and the lower surface of the first FPC substrate are respectively provided with a 4 th copper layer and a 5 th copper layer, and the upper surface and the lower surface of the second FPC substrate are respectively provided with;
(2) manufacturing an inner layer circuit: manufacturing an inner layer circuit before first pressing by using a film negative, wherein the inner layer circuit layers are respectively formed on a 3 rd copper layer, a 4 th copper layer, a 5 th copper layer, a 6 th copper layer, a 9 th copper layer, a 10 th copper layer, a 11 th copper layer and a 12 th copper layer, in addition, the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer are produced by using a protective film, copper sheets are protected, chemical etching is carried out by using an acid etching line, and a required circuit pattern is obtained after etching;
(3) AOI detection: performing AOI detection on the inner layer circuit, and repairing defective products;
(4) laser depth control cutting: performing laser depth control cutting on the uncapped areas of the 3 rd copper layer, the 6 th copper layer, the 9 th copper layer and the 12 th copper layer in a laser cutting mode, performing depth control cutting on the FR4 substrate at the software combination position, and not performing cutting on the formed edge;
(5) laser cutting of the covering film and the PP layer: hollowing out the unnecessary areas of the covering films of the 4 th copper layer, the 5 th copper layer, the 10 th copper layer and the 11 th copper layer and the PP layers used among the first FR4 substrate, the second FR4 substrate, the third FR4 substrate, the fourth FR4 substrate, the first FPC substrate and the second FPC substrate by using a laser cutting mode;
(6) and (3) pasting a covering film on the soft board: attaching covering films to the surfaces of a 4 th copper layer, a 5 th copper layer, a 10 th copper layer and a 11 th copper layer, and pressing the covering films and the PFC substrate tightly by using a quick press;
(7) first pressing: pressing the first FR4 substrate, the first FPC substrate and the second FR4 substrate into a first core board and pressing the third FR4 substrate, the second FPC substrate and the fourth FR4 substrate into a second core board by using a hydraulic press;
(8) drilling: respectively drilling the first core plate and the second core plate by using a CNC (computer numerical control) drilling machine and forming plug-in holes with tail flying areas;
(9) copper deposition: performing chemical copper deposition on the first core plate and the second core plate by using a PTH line to metalize hole walls;
(10) electroplating the whole plate: adopting VCP lines to carry out whole-plate electroplating thickening on the hole surface copper foil of the first core plate and the hole surface copper foil of the second core plate;
(11) manufacturing an inner layer circuit: respectively manufacturing circuit patterns on a 2 nd copper layer, a 7 th copper layer, an 8 th copper layer and a 13 th copper layer by using a film negative film;
(12) acid etching: respectively carrying out chemical etching on the core board circuit patterns of the 2 nd copper layer and the 7 th copper layer, and the 8 th copper layer and the 13 th copper layer by using an acid etching line, and obtaining the required circuit patterns after etching;
(13) AOI inspection: carrying out AOI inspection on the pattern circuits of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer, and repairing defective products;
(14) inner layer resistance welding: silk-screen printing solder resist ink on the surfaces of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer, exposing and developing the solder resist patterns of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer tail flying areas by using a film negative after prebaking, and not making the solder resist patterns in the non-tail flying areas;
(15) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask patterns of the flying tail areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer;
(16) silk-screen printing of characters: silk-screen printing characters on the flying tail areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer by using a silk-screen printing machine;
(17) baking the plate: curing the solder resist ink and the character ink in the flying tail areas of the No. 2 copper layer, the No. 7 copper layer, the No. 8 copper layer and the No. 13 copper layer at high temperature by using an oven;
(18) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask graphs and the character graphs of the tail regions of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer;
(19) and (3) selective gold precipitation: sticking the hard board area circuit by using a blue glue sticking mode, exposing the tail flying areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer and performing regional gold immersion;
(20) and (3) appearance inspection: inspecting the gold immersion appearances of the flying tail areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer by using a 3X magnifier;
(21) laser depth control cutting: the opening cover areas of the No. 2 copper layer, the No. 7 copper layer, the No. 8 copper layer and the No. 13 copper layer are inwards cut in a laser cutting mode, the FR4 substrate at the soft and hard combination part is subjected to depth control cutting, and cutting is not performed close to a forming edge;
(22) and (3) laser cutting of the PP layer: milling a flying tail area and an uncovering area of a PP layer used among the 1 st copper layer, the first core board, the second core board and the 14 th copper layer in a laser cutting mode;
(23) and (3) second pressing: laminating the 1 st copper layer, the first core plate, the second core plate and the 14 th copper layer into a rigid-flex printed circuit board by using a hydraulic press;
(24) drilling: drilling the rigid-flex printed circuit board by using a CNC (computer numerical control) drilling machine and forming a plug-in hole with a hard board area;
(25) copper deposition: carrying out chemical copper deposition on a plug-in hole of the rigid-flex printed circuit board by using a PTH line to metalize the hole wall;
(26) electroplating the whole plate: adopting VCP lines to electroplate and thicken the hole surface copper foil and the plate surface copper foil of the rigid-flex printed circuit board;
(27) manufacturing an outer layer circuit: manufacturing outer layer circuit patterns of a 1 st copper layer and a 14 th copper layer by using a film negative film;
(28) acid etching: chemically etching the circuit patterns of the 1 st copper layer and the 14 th copper layer by using an acid etching line, and obtaining the required circuit patterns after etching;
(29) AOI detection: performing AOI detection on the circuit patterns of the 1 st copper layer and the 14 th copper layer, and repairing defective products;
(30) outer layer resistance welding: silk-screen printing solder resist ink on the surfaces of the 1 st copper layer and the 14 th copper layer, exposing and developing the solder resist patterns of the 1 st copper layer and the 14 th copper layer hard board area by using a film negative film after prebaking, and not making the solder resist pattern on the tail area part of the solder resist patterns;
(31) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask patterns of the 1 st copper layer and the 14 th copper layer hard board areas;
(32) silk-screen printing of characters: silk-screen printing characters on the hard board areas of the 1 st copper layer and the 14 th copper layer by using a silk-screen printing machine;
(33) baking the plate: curing the solder resist ink and the character ink on the 1 st copper layer and the 14 th copper layer hard board areas at high temperature by using an oven;
(34) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask graph and the character graph of the 1 st copper layer and the 14 th copper layer hard board area;
(35) depositing nickel and gold: performing surface treatment on the bonding pad in the hard board area in a nickel-gold immersion mode;
(36) and (3) appearance inspection: using a 3X magnifier to inspect the appearance of the nickel and gold deposited on the 1 st copper layer and the 14 th copper layer hard board areas;
(37) routing: milling and shaping the rigid-flexible combined plate by using a milling machine;
(38) laser depth control cutting: performing laser cutting on the uncapped area, wherein the No. 1 copper layer and the No. 14 copper layer are inward, performing depth-controlled cutting on the FR4 substrate at the soft-hard joint, and performing no cutting on the formed edge;
(39) cleaning: cleaning the formed rigid-flex printed circuit board by using a horizontal cleaning line;
(40) flying probe test: testing the formed rigid-flex printed circuit board by using a flying probe machine;
(41) and (3) appearance inspection: and (4) using a 40X magnifier to comprehensively inspect the appearance of the formed rigid-flex printed circuit board.
Preferably, the insert holes have a hole thickness of not more than 35 μm and a hole position precision of +/-2 mil.
Preferably, the thickness of the hole-surface copper foil is not less than 15 μm, and the thickness of the board-surface copper foil is not less than 30 μm.
Preferably, the depth of the controlled depth cutting in the laser controlled depth cutting in the step (4) is 1/2 of the thickness of the FR4 substrate, and the width of the controlled depth cutting is 0.2-0.4 mm.
Preferably, the step (5) of covering film has an outward expansion width of 0.2mm and an inward contraction width of 0.25 mm.
Preferably, the depth control cutting depth in the laser depth control cutting of the step (21) is 2/3 of the thickness of the FR4 substrate; the depth-control cutting width is 0.2-0.4 mm.
Preferably, the step (22) of shrinking the PP layer has a shrinking width of 0.25 mm.
Preferably, the depth of the controlled depth cutting in the laser controlled depth cutting of the step (38) is 1/2 from the thickness of the 1 st copper foil to the thickness of the 3 rd copper foil.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
different interconnection levels of the same soft and hard combination board are separated to be made into different FR4 substrates, the hard board area of each FR4 substrate is connected through an FPC substrate and is similar to a tail of a circuit board flying out, and in the flying tail area of the structure, each FR4 substrate can be separately made into wiring and mounted with components; meanwhile, each FR4 substrate in the tail flying area can be separately installed at different positions of an electrical appliance, so that the flexibility of circuit board mounting and installation is improved.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a cross-sectional view of a rigid-flex joint in accordance with a preferred embodiment of the present invention;
FIG. 2 is a flow chart of the fabrication of the preferred embodiment of the present invention.
The attached drawings indicate the following:
10. first FR4 substrate 11, No. 2 copper layer
12. No. 3 copper layer 20, second FR4 substrate
21. The 6 th and 7 th copper layers 22 and 22
30. Third FR4 substrate 31, 8 th copper layer
32. 9 th copper layer 40, fourth FR4 substrate
41. 12 th and 13 th copper layers 42 and
50. first FPC substrate 51, 4 th copper layer
52. No. 5 copper layer 60, second FPC substrate
61. The 10 th copper layer 62 and the 11 th copper layer
71. PP layer 72 and cover film
81. First core plate 82 and second core plate
83. No. 1 copper layer 84, No. 14 copper layer
90. A rigid-flex board 901 and a plug-in hole.
Detailed Description
Referring to fig. 1 to 2, the present invention discloses a method for manufacturing a flex-rigid board with a flying tail type structure, which includes the following steps:
(1) cutting: the first FR4 substrate 10, the second FR4 substrate 20, the third FR4 substrate 30, the fourth FR4 substrate 40, the first FPC substrate 50, the second FPC substrate 60 and the PP layer 71 and the cover film 72 between corresponding layers are obtained by cutting according to the cutting die size, the upper surface and the lower surface of the first FR4 substrate 10 are respectively provided with a 2 nd copper layer 11 and a 3 rd copper layer 12, the upper surface and the lower surface of the second FR4 substrate 20 are respectively provided with a 6 th copper layer 21 and a 7 th copper layer 22, the upper surface and the lower surface of the third FR4 substrate 30 are respectively provided with an 8 th copper layer 31 and a 9 th copper layer 32, the upper surface and the lower surface of the fourth FR4 substrate 40 are respectively provided with a 12 th copper layer 41 and a 13 th copper layer 42, the upper surface and the lower surface of the first FPC substrate 50 are respectively provided with a 4 th copper layer 51 and a 5 th copper layer 52, and the upper surface and the lower surface of the second FPC substrate 60 are respectively provided with a.
(2) Manufacturing an inner layer circuit: and manufacturing an inner layer circuit before first pressing by using a film negative, wherein the inner layer circuit layers are respectively formed on a 3 rd copper layer 12, a 4 th copper layer 51, a 5 th copper layer 52, a 6 th copper layer 21, a 9 th copper layer 32, a 10 th copper layer 61, an 11 th copper layer 62 and a 12 th copper layer 41, in addition, the 2 nd copper layer 11, the 7 th copper layer 22, the 8 th copper layer 31 and the 13 th copper layer 42 are produced by using a protective film, copper skins are protected, chemical etching is carried out by using an acid etching line, and a required circuit pattern is obtained after etching.
(3) AOI detection: and performing AOI detection on the inner layer circuit by using production Gerber data, and repairing defective products.
(4) Laser depth control cutting: and performing laser depth control cutting on the uncapped areas of the 3 rd copper layer 12, the 6 th copper layer 21, the 9 th copper layer 32 and the 12 th copper layer 41 in a laser cutting mode, performing depth control cutting on the FR4 substrate at the software joint, and not performing cutting on the forming edge, wherein the depth control cutting is 1/2 of the thickness of the FR4 substrate, and the depth control cutting width is 0.2-0.4 mm.
(5) Laser cutting of the covering film and the PP layer: the overlay films 72 of the 4 th copper layer 51, the 5 th copper layer 52, the 10 th copper layer 61 and the 11 th copper layer 62 and the PP layers 71 used between the first FR4 substrate 10, the second FR4 substrate 20, the third FR4 substrate 30, the fourth FR4 substrate 40, the first FPC substrate 50 and the second FPC substrate 60 are hollowed out of unnecessary areas by using a laser cutting method, the outward expansion width of each overlay film 72 is 0.2mm, and the inward contraction width of each PP layer 71 is 0.25 mm.
(6) And (3) pasting a covering film on the soft board: adhering a covering film 72 to the surfaces of the 4 th copper layer 51, the 5 th copper layer 52, the 10 th copper layer 61 and the 11 th copper layer 62, and tightly pressing the covering film 72 and the PFC substrate by using a quick press at the pressing temperature of 190 +/-5 ℃; the pressing time is 180 s.
(7) First pressing: and (2) pressing the first FR4 substrate 10, the first FPC substrate 50 and the second FR4 substrate 20 into a first core board 81 by using a hydraulic press, and pressing the third FR4 substrate 30, the second FPC substrate 60 and the fourth FR4 substrate 40 into a second core board 82, wherein the initial hot-pressing temperature is 80 ℃, the high-temperature section temperature is 200 ℃, the heating rate is 2 ℃/min, the pressing pressure is 85-500psi, and the total pressing time is 180 min.
(8) Drilling: and respectively drilling the first core plate 81 and the second core plate 82 by using a CNC (computer numerical control) drilling machine, and forming plug-in holes 901 with tail flying areas, wherein the hole thickness of the plug-in holes 901 is not more than 35 mu m, and the hole position precision is +/-2 mil.
(9) Copper deposition: the first core board 81 and the second core board 82 are chemically copper-deposited by using PTH lines, so that the hole walls are metallized, and the backlight grade is not less than 9.
(10) Electroplating the whole plate: and (3) carrying out whole-plate electroplating thickening on the hole surface copper foil of the first core plate 81 and the hole surface copper foil of the second core plate 82 by adopting a VCP line, wherein the thickness of the hole surface copper foil is not less than 15 mu m, and the thickness of the plate surface copper foil is not less than 30 mu m.
(11) Manufacturing an inner layer circuit: the 2 nd copper layer 11 and the 7 th copper layer 22, and the 8 th copper layer 31 and the 13 th copper layer 42 were patterned using a film negative.
(12) Acid etching: and chemically etching the core board circuit patterns of the 2 nd copper layer 11 and the 7 th copper layer 22, and the 8 th copper layer 31 and the 13 th copper layer 42 respectively by using an acid etching line, and obtaining the required circuit patterns after etching.
(13) AOI inspection: the pattern lines of the above-described 2 nd, 7 th, 8 th, and 13 th copper layers 11, 22, 31, and 42 were subjected to AOI inspection using production Gerber data, and defective products were repaired.
(14) Inner layer resistance welding: and (3) screen-printing solder resist ink on the surfaces of the 2 nd copper layer 11, the 7 th copper layer 22, the 8 th copper layer 31 and the 13 th copper layer 42, after prebaking, exposing and developing the solder resist pattern of the flying tail areas of the 2 nd copper layer 11, the 7 th copper layer 22, the 8 th copper layer 31 and the 13 th copper layer 42 by using a film negative, and not making the solder resist pattern in the non-flying tail areas.
(15) And (3) appearance inspection: the solder resist patterns of the above-described 2 nd copper layer 11, 7 th copper layer 22, 8 th copper layer 31 and 13 th copper layer 42 flying tail areas were examined using a 3X magnifier according to the IPC-600H standard.
(16) Silk-screen printing of characters: and (4) silk-screen printing characters on the flying tail areas of the 2 nd copper layer 11, the 7 th copper layer 22, the 8 th copper layer 31 and the 13 th copper layer 42 by using a silk-screen printing machine according to the IPC-600H standard.
(17) Baking the plate: and (3) curing the solder resist ink and the character ink in the flying tail areas of the 2 nd copper layer 11, the 7 th copper layer 22, the 8 th copper layer 31 and the 13 th copper layer 42 at a high temperature by using an oven, wherein the baking temperature is 150 +/-5 ℃ and the baking time is 60 min.
(18) And (3) appearance inspection: solder resist patterns and character patterns in the tail regions of the above-described 2 nd copper layer 11, 7 th copper layer 22, 8 th copper layer 31 and 13 th copper layer 42 were examined using a 3X magnifier according to the IPC-600H standard.
(19) And (3) selective gold precipitation: and (3) pasting the hard board area circuit by using a blue paste mode, and exposing the tail flying areas of the 2 nd copper layer 11, the 7 th copper layer 22, the 8 th copper layer 31 and the 13 th copper layer 42 and performing regional gold immersion.
(20) And (3) appearance inspection: the gold immersion appearance of the above-described 2 nd, 7 th, 8 th, 31 th and 13 th copper layers 11, 22, 42 tail regions was examined using a 3X magnifier according to IPC-600H standard.
(21) Laser depth control cutting: the uncapping areas of the No. 2 copper layer 11, the No. 7 copper layer 22, the No. 8 copper layer 31 and the No. 13 copper layer 42 are inwards cut in a laser cutting mode, the FR4 substrate at the soft-hard joint is subjected to depth control cutting, cutting is not performed near the forming edge, and the depth control cutting is 2/3 the thickness of the FR4 substrate; the depth-control cutting width is 0.2-0.4 mm.
(22) And (3) laser cutting of the PP layer: and hollowing the flying tail area and the uncapping area of the PP layer 71 used among the 1 st copper layer 83, the first core board 81, the second core board 82 and the 14 th copper layer 84 by using a laser cutting mode, wherein the retraction width of the PP layer 71 is 0.25 mm.
(23) And (3) second pressing: and (3) pressing the 1 st copper layer 83, the first core plate 81, the second core plate 82 and the 14 th copper layer 84 into the rigid-flex printed circuit board 90 by using a hydraulic press, wherein the initial hot-pressing temperature is 80 ℃, the high-temperature section temperature is 200 ℃, the heating rate is 2 ℃/min, the pressing pressure is 85-500psi, and the total pressing time is 180 min.
(24) Drilling: and (3) drilling the rigid-flex printed circuit board 90 by using a CNC (computer numerical control) drilling machine, and forming plug-in holes 901 in the hard board area, wherein the hole thickness of the plug-in holes 901 is not more than 35 mu m, and the hole position precision is +/-2 mil.
(25) Copper deposition: the PTH line is adopted to perform chemical copper deposition on the plug-in hole 901 of the rigid-flex printed circuit board 90, so that the hole wall is metallized, and the backlight grade is not less than 9.
(26) Electroplating the whole plate: the VCP lines are adopted to carry out whole-plate electroplating thickening on the hole surface copper foil and the plate surface copper foil of the rigid-flexible combined plate 90, the thickness of the hole surface copper foil is not less than 15 mu m, and the thickness of the plate surface copper foil is not less than 30 mu m.
(27) Manufacturing an outer layer circuit: the film negative is used to make the outer layer circuit pattern of the 1 st copper layer 83 and the 14 th copper layer 84.
(28) Acid etching: the wiring patterns of the 1 st copper layer 83 and the 14 th copper layer 84 are chemically etched using an acid etching line to obtain the desired wiring patterns after etching.
(29) AOI detection: the production Gerber data is used to perform AOI inspection of the circuit patterns of the 1 st copper layer 83 and the 14 th copper layer 84 and to repair defective products.
(30) Outer layer resistance welding: and (3) screen-printing solder resist ink on the surfaces of the 1 st copper layer 83 and the 14 th copper layer 84, exposing and developing the solder resist pattern in the hard board areas of the 1 st copper layer 83 and the 14 th copper layer 84 by using a film negative after prebaking, and not making the solder resist pattern in the tail area.
(31) And (3) appearance inspection: the solder resist pattern of the 1 st copper layer 83 and the 14 th copper layer 84 hard board region was examined using a 3X magnifier according to IPC-600H standard.
(32) Silk-screen printing of characters: characters are silk-screened on the hardboard areas of the 1 st copper layer 83 and the 14 th copper layer 84 using a silk-screen machine according to IPC-600H standard.
(33) Baking the plate: the solder resist ink and the character ink on the hard board areas of the 1 st copper layer 83 and the 14 th copper layer 84 are cured at a high temperature of 150 + -5 deg.C for 60min using an oven.
(34) And (3) appearance inspection: the solder resist pattern and the character pattern of the hard board regions of the 1 st copper layer 83 and the 14 th copper layer 84 were examined using a 3X magnifier according to IPC-600H standard.
(35) Depositing nickel and gold: and performing surface treatment on the bonding pad in the hard board area in a nickel-gold immersion mode.
(36) And (3) appearance inspection: the appearance of the electroless nickel gold was examined in the hard plate areas of the 1 st and 14 th copper layers 83, 84 using a 3X magnifier according to IPC-600H standard.
(37) Routing: and (4) milling the rigid-flexible combined board 90 by using a milling machine.
(38) Laser depth control cutting: and (3) performing laser cutting on the uncapped area, wherein the No. 1 copper layer 83 and the No. 14 copper layer 84 are inward, the FR4 substrate at the soft and hard joint is subjected to depth control cutting, cutting is not performed by a forming edge, and the depth control cutting is 1/2 of the thickness of the No. 1 copper foil to the No. 3 copper foil.
(39) Cleaning: and cleaning the formed rigid-flex printed circuit board 90 by using a horizontal cleaning line to ensure that the board surface cleanliness is not less than 36 mN/m.
(40) Flying probe test: the formed rigid-flex printed circuit board 90 was tested using a flying probe machine.
(41) And (3) appearance inspection: according to the IPC-600H standard, the appearance of the rigid-flex printed circuit board 90 after molding is comprehensively inspected by using a 40X magnifier.
The design of the invention is characterized in that: different interconnection levels of the same soft and hard combination board are separated to be made into different FR4 substrates, the hard board area of each FR4 substrate is connected through an FPC substrate and is similar to a tail of a circuit board flying out, and in the flying tail area of the structure, each FR4 substrate can be separately made into wiring and mounted with components; meanwhile, each FR4 substrate in the tail flying area can be separately installed at different positions of an electrical appliance, so that the flexibility of circuit board mounting and installation is improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (8)
1. A manufacturing method of a rigid-flex printed circuit board with a flying tail type structure is characterized by comprising the following steps: the method comprises the following steps:
(1) cutting: cutting according to the cutting icon size to obtain a first FR4 substrate, a second FR4 substrate, a third FR4 substrate, a fourth FR4 substrate, a first FPC substrate, a second FPC substrate, a PP layer and a covering film between corresponding layers, wherein the upper surface and the lower surface of the first FR4 substrate are respectively provided with a 2 nd copper layer and a 3 rd copper layer, the upper surface and the lower surface of the second FR4 substrate are respectively provided with a 6 th copper layer and a 7 th copper layer, the upper surface and the lower surface of the third FR4 substrate are respectively provided with an 8 th copper layer and a 9 th copper layer, the upper surface and the lower surface of the fourth FR4 substrate are respectively provided with a 12 th copper layer and a 13 th copper layer, the upper surface and the lower surface of the first FPC substrate are respectively provided with a 4 th copper layer and a 5 th copper layer, and the upper surface and the lower surface of the second FPC substrate are respectively provided with;
(2) manufacturing an inner layer circuit: manufacturing an inner layer circuit before first pressing by using a film negative, wherein the inner layer circuit layers are respectively formed on a 3 rd copper layer, a 4 th copper layer, a 5 th copper layer, a 6 th copper layer, a 9 th copper layer, a 10 th copper layer, a 11 th copper layer and a 12 th copper layer, in addition, the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer are produced by using a protective film, copper sheets are protected, chemical etching is carried out by using an acid etching line, and a required circuit pattern is obtained after etching;
(3) AOI detection: performing AOI detection on the inner layer circuit, and repairing defective products;
(4) laser depth control cutting: performing laser depth control cutting on the uncapped areas of the 3 rd copper layer, the 6 th copper layer, the 9 th copper layer and the 12 th copper layer in a laser cutting mode, performing depth control cutting on the FR4 substrate at the software combination position, and not performing cutting on the formed edge;
(5) laser cutting of the covering film and the PP layer: hollowing out the unnecessary areas of the covering films of the 4 th copper layer, the 5 th copper layer, the 10 th copper layer and the 11 th copper layer and the PP layers used among the first FR4 substrate, the second FR4 substrate, the third FR4 substrate, the fourth FR4 substrate, the first FPC substrate and the second FPC substrate by using a laser cutting mode;
(6) and (3) pasting a covering film on the soft board: attaching covering films to the surfaces of a 4 th copper layer, a 5 th copper layer, a 10 th copper layer and a 11 th copper layer, and pressing the covering films and the PFC substrate tightly by using a quick press;
(7) first pressing: pressing the first FR4 substrate, the first FPC substrate and the second FR4 substrate into a first core board and pressing the third FR4 substrate, the second FPC substrate and the fourth FR4 substrate into a second core board by using a hydraulic press;
(8) drilling: respectively drilling the first core plate and the second core plate by using a CNC (computer numerical control) drilling machine and forming plug-in holes with tail flying areas;
(9) copper deposition: performing chemical copper deposition on the first core plate and the second core plate by using a PTH line to metalize hole walls;
(10) electroplating the whole plate: adopting VCP lines to carry out whole-plate electroplating thickening on the hole surface copper foil of the first core plate and the hole surface copper foil of the second core plate;
(11) manufacturing an inner layer circuit: respectively manufacturing circuit patterns on a 2 nd copper layer, a 7 th copper layer, an 8 th copper layer and a 13 th copper layer by using a film negative film;
(12) acid etching: respectively carrying out chemical etching on the core board circuit patterns of the 2 nd copper layer and the 7 th copper layer, and the 8 th copper layer and the 13 th copper layer by using an acid etching line, and obtaining the required circuit patterns after etching;
(13) AOI inspection: carrying out AOI inspection on the pattern circuits of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer, and repairing defective products;
(14) inner layer resistance welding: silk-screen printing solder resist ink on the surfaces of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer, exposing and developing the solder resist patterns of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer tail flying areas by using a film negative after prebaking, and not making the solder resist patterns in the non-tail flying areas;
(15) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask patterns of the flying tail areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer;
(16) silk-screen printing of characters: silk-screen printing characters on the flying tail areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer by using a silk-screen printing machine;
(17) baking the plate: curing the solder resist ink and the character ink in the flying tail areas of the No. 2 copper layer, the No. 7 copper layer, the No. 8 copper layer and the No. 13 copper layer at high temperature by using an oven;
(18) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask graphs and the character graphs of the tail regions of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer;
(19) and (3) selective gold precipitation: sticking the hard board area circuit by using a blue glue sticking mode, exposing the tail flying areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer and performing regional gold immersion;
(20) and (3) appearance inspection: inspecting the gold immersion appearances of the flying tail areas of the 2 nd copper layer, the 7 th copper layer, the 8 th copper layer and the 13 th copper layer by using a 3X magnifier;
(21) laser depth control cutting: the opening cover areas of the No. 2 copper layer, the No. 7 copper layer, the No. 8 copper layer and the No. 13 copper layer are inwards cut in a laser cutting mode, the FR4 substrate at the soft and hard combination part is subjected to depth control cutting, and cutting is not performed close to a forming edge;
(22) and (3) laser cutting of the PP layer: milling a flying tail area and an uncovering area of a PP layer used among the 1 st copper layer, the first core board, the second core board and the 14 th copper layer in a laser cutting mode;
(23) and (3) second pressing: laminating the 1 st copper layer, the first core plate, the second core plate and the 14 th copper layer into a rigid-flex printed circuit board by using a hydraulic press;
(24) drilling: drilling the rigid-flex printed circuit board by using a CNC (computer numerical control) drilling machine and forming a plug-in hole with a hard board area;
(25) copper deposition: carrying out chemical copper deposition on a plug-in hole of the rigid-flex printed circuit board by using a PTH line to metalize the hole wall;
(26) electroplating the whole plate: adopting VCP lines to electroplate and thicken the hole surface copper foil and the plate surface copper foil of the rigid-flex printed circuit board;
(27) manufacturing an outer layer circuit: manufacturing outer layer circuit patterns of a 1 st copper layer and a 14 th copper layer by using a film negative film;
(28) acid etching: chemically etching the circuit patterns of the 1 st copper layer and the 14 th copper layer by using an acid etching line, and obtaining the required circuit patterns after etching;
(29) AOI detection: performing AOI detection on the circuit patterns of the 1 st copper layer and the 14 th copper layer, and repairing defective products;
(30) outer layer resistance welding: silk-screen printing solder resist ink on the surfaces of the 1 st copper layer and the 14 th copper layer, exposing and developing the solder resist patterns of the 1 st copper layer and the 14 th copper layer hard board area by using a film negative film after prebaking, and not making the solder resist pattern on the tail area part of the solder resist patterns;
(31) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask patterns of the 1 st copper layer and the 14 th copper layer hard board areas;
(32) silk-screen printing of characters: silk-screen printing characters on the hard board areas of the 1 st copper layer and the 14 th copper layer by using a silk-screen printing machine;
(33) baking the plate: curing the solder resist ink and the character ink on the 1 st copper layer and the 14 th copper layer hard board areas at high temperature by using an oven;
(34) and (3) appearance inspection: using a 3X magnifier to inspect the solder mask graph and the character graph of the 1 st copper layer and the 14 th copper layer hard board area;
(35) depositing nickel and gold: performing surface treatment on the bonding pad in the hard board area in a nickel-gold immersion mode;
(36) and (3) appearance inspection: using a 3X magnifier to inspect the appearance of the nickel and gold deposited on the 1 st copper layer and the 14 th copper layer hard board areas;
(37) routing: milling and shaping the rigid-flexible combined plate by using a milling machine;
(38) laser depth control cutting: performing laser cutting on the uncapped area, wherein the No. 1 copper layer and the No. 14 copper layer are inward, performing depth-controlled cutting on the FR4 substrate at the soft-hard joint, and performing no cutting on the formed edge;
(39) cleaning: cleaning the formed rigid-flex printed circuit board by using a horizontal cleaning line;
(40) flying probe test: testing the formed rigid-flex printed circuit board by using a flying probe machine;
(41) and (3) appearance inspection: and (4) using a 40X magnifier to comprehensively inspect the appearance of the formed rigid-flex printed circuit board.
2. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the hole thickness of the plug-in hole is not more than 35 mu m, and the hole position precision is +/-2 mil.
3. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the thickness of the hole surface copper foil is not less than 15 mu m, and the thickness of the plate surface copper foil is not less than 30 mu m.
4. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the depth control cutting depth in the laser depth control cutting in the step (4) is 1/2 of the thickness of the FR4 substrate, and the depth control cutting width is 0.2-0.4 mm.
5. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the outward expansion width of the covering film in the step (5) is 0.2mm, and the inward contraction width of the PP layer is 0.25 mm.
6. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the depth control cutting depth in the laser depth control cutting in the step (21) is 2/3 of the thickness of the FR4 substrate; the depth-control cutting width is 0.2-0.4 mm.
7. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the retraction width of the PP layer in the step (22) is 0.25 mm.
8. The method for manufacturing the rigid-flex printed circuit board with the flying tail type structure according to claim 1, wherein the method comprises the following steps: the depth control cutting depth in the laser depth control cutting in the step (38) is 1/2 of the thickness of the 1 st copper foil to the 3 rd copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110108219.3A CN112638043B (en) | 2021-01-27 | 2021-01-27 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110108219.3A CN112638043B (en) | 2021-01-27 | 2021-01-27 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112638043A true CN112638043A (en) | 2021-04-09 |
| CN112638043B CN112638043B (en) | 2022-04-01 |
Family
ID=75295049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110108219.3A Active CN112638043B (en) | 2021-01-27 | 2021-01-27 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112638043B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051323A (en) * | 2021-11-19 | 2022-02-15 | 阔智科技（广州）有限公司 | High-precision windowing process for connecting flexible printed circuit board with flexible and rigid combined board |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06250763A (en) * | 1993-02-10 | 1994-09-09 | Internatl Business Mach Corp <Ibm> | Calculation element and manufacture thereof |
| JP2007220735A (en) * | 2006-02-14 | 2007-08-30 | Fujikura Ltd | Method for manufacturing multi-layer printed wiring board including flying tail |
| CN103260356A (en) * | 2012-02-21 | 2013-08-21 | 三星电机株式会社 | Method of manufacturing flying tail type rigid-flexible printed circuit board and manufacturing method thereof |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN104853542A (en) * | 2015-04-17 | 2015-08-19 | 广州杰赛科技股份有限公司 | Manufacturing method of rigid-flex printed circuit board |
| JP5999249B2 (en) * | 2013-02-28 | 2016-09-28 | 株式会社村田製作所 | Flexible multilayer board |
| CN108401382A (en) * | 2018-01-23 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | Rigid-flex combined board and preparation method thereof |
| CN108617114A (en) * | 2018-06-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of production method of laser control depth covering type Rigid Flex |
| CN108990267A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of Rigid Flex and production method of outer double soft boards |
| CN110324988A (en) * | 2019-07-12 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | Fly tail rigid-flex combined board and preparation method thereof |
| CN110536563A (en) * | 2019-09-20 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | Fly tail hierarchic structure rigid-flex combined board and production method |
-
2021
- 2021-01-27 CN CN202110108219.3A patent/CN112638043B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06250763A (en) * | 1993-02-10 | 1994-09-09 | Internatl Business Mach Corp <Ibm> | Calculation element and manufacture thereof |
| JP2007220735A (en) * | 2006-02-14 | 2007-08-30 | Fujikura Ltd | Method for manufacturing multi-layer printed wiring board including flying tail |
| CN103260356A (en) * | 2012-02-21 | 2013-08-21 | 三星电机株式会社 | Method of manufacturing flying tail type rigid-flexible printed circuit board and manufacturing method thereof |
| US20130213695A1 (en) * | 2012-02-21 | 2013-08-22 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
| JP5999249B2 (en) * | 2013-02-28 | 2016-09-28 | 株式会社村田製作所 | Flexible multilayer board |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN104853542A (en) * | 2015-04-17 | 2015-08-19 | 广州杰赛科技股份有限公司 | Manufacturing method of rigid-flex printed circuit board |
| CN108401382A (en) * | 2018-01-23 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | Rigid-flex combined board and preparation method thereof |
| CN108617114A (en) * | 2018-06-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of production method of laser control depth covering type Rigid Flex |
| CN108990267A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of Rigid Flex and production method of outer double soft boards |
| CN110324988A (en) * | 2019-07-12 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | Fly tail rigid-flex combined board and preparation method thereof |
| CN110536563A (en) * | 2019-09-20 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | Fly tail hierarchic structure rigid-flex combined board and production method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051323A (en) * | 2021-11-19 | 2022-02-15 | 阔智科技（广州）有限公司 | High-precision windowing process for connecting flexible printed circuit board with flexible and rigid combined board |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112638043B (en) | 2022-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7435352B2 (en) | Method of forming solder resist pattern | |
| CN112638043B (en) | Manufacturing method of rigid-flex printed circuit board with flying tail type structure | |
| CN111050484B (en) | Manufacturing method of ultra-precise circuit | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN113141723B (en) | Surface treatment method of printed circuit board and printed circuit board | |
| CN110708859A (en) | Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block | |
| CN111182743B (en) | Manufacturing method of ceramic-based circuit board | |
| CN111107715A (en) | Manufacturing method of HDI plate back drilling hole | |
| CN113597113A (en) | Manufacturing method of high-reflectivity white oil circuit board | |
| CN111417265A (en) | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB | |
| CN109548321B (en) | Manufacturing method of positive undercut PCB | |
| CN114245565A (en) | Method for manufacturing rigid-flex board electromagnetic shielding film inner paste | |
| CN109982511B (en) | Manufacturing method of PCB (printed Circuit Board) convenient for detecting whether copper-free hole is drilled in missing mode or not | |
| KR101596098B1 (en) | The manufacturing method of printed circuit board | |
| CN115243478A (en) | Manufacturing method of butterfly-shaped rigid-flex board | |
| CN114286516B (en) | Manufacturing method of tail-separating ladder electric-thickness golden finger soft and hard combined plate | |
| CN113301734B (en) | Method for improving back drilling capability of high-multilayer circuit board | |
| CN113709984A (en) | Method for manufacturing circuit board by using laser to process electroplating holes, welding pads, anti-plating and anti-corrosion patterns | |
| CN113141703A (en) | Metal-based rigid-flex board and production method thereof | |
| CN113692131A (en) | Method for manufacturing circuit board by using laser to process electroplating hole plating-resistant and conductive pattern | |
| CN112788851A (en) | Processing method of blind groove with plug-in hole | |
| CN112752443A (en) | Processing method of printed circuit board with step position containing bonding structure | |
| CN111465202A (en) | Drilling machining method for improving precision of gong platform | |
| CN113709983B (en) | Circuit board manufacturing method for plating hole, bonding pad plating resistance and conductive pattern by laser processing | |
| CN111343790B (en) | PCB soft and hard combination process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |