CN205429174U - Array antenna of low thermal resistance connectorless feed - Google Patents
Array antenna of low thermal resistance connectorless feed Download PDFInfo
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- CN205429174U CN205429174U CN201620190905.4U CN201620190905U CN205429174U CN 205429174 U CN205429174 U CN 205429174U CN 201620190905 U CN201620190905 U CN 201620190905U CN 205429174 U CN205429174 U CN 205429174U
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Abstract
The utility model relates to an array antenna technical field, the utility model discloses an array antenna of low thermal resistance connectorless feed, its characterized in that is specifically including printing board, antenna element and receiving and dispatching subassembly, set up the plated -through hole on the printing board, the one end of plated -through hole is passed through the conducting resin and is connected antenna element, and the receiving and dispatching subassembly is connected to one end in addition, carries out the feed through the plated -through hole for antenna array. Owing to no longer need the connector to carry out high frequency signal transmission, eliminated owing to the signal transmission loss that the connector brought between array antenna and the feed network, also avoided bringing the condition of array unit inefficacy because the connector becomes invalid to array antenna's electric property and reliability have been promoted.
Description
Technical field
This utility model relates to array antenna technique, the array antenna of a kind of low thermal resistance connectorless feed, connectorless, thus improves ruggedness and the reliability of complete machine electronic equipment.
Background technology
In order to ensure the highly reliable interconnection of high-performance between radio-frequency cable and antenna element, large scale array antenna typically uses radio frequency connector to carry out unit feed.Conventional radio frequency connector includes N Connector, SMA adapter etc..
Large-scale array antenna, on the premise of guaranteed output capacity, antenna is attached by the previously mentioned radio frequency connector of many employings with transmitting-receiving subassembly.And adapter one end connects transmitting-receiving subassembly, the other end is then by current excitation or coupling excitation, it is achieved the energy injection to antenna.
The mode of current excitation is more common in microstrip antenna and wire antenna, and the inner wire of adapter is directly connected by this kind of antenna with antenna, by the transmission of high frequency electric by current fed antenna.The mode of coupling excitation is more common in electromagnetic horn, and the inner wire of adapter is stretched into inside antenna chamber by this kind of antenna, by setting up electric field on a certain cross section of cavity, it is achieved desired energy transmits.
Carry out antenna feed although with adapter and there is plurality of advantages, but this mode exists some shortcomings being difficult to overcome: one is that adapter can bring unnecessary loss, and along with the rising of operating frequency, loss also can strengthen therewith.Two is in large scale array, and the use of a large amount of adapters can affect the reliability of array.Three is the radiating requirements using adapter to be attached cannot meeting array.
The power capacity of array antenna is constantly promoting at present, after high performance components is installed in printed board, components and parts are always maintained at the condition of high temperature, the reaction of components and parts internal chemical is caused to be accelerated with particle migration, component failure rate is greatly improved, directly affect the reliability of electronic product to adapt to this trend, thermoelectric integral design is carried out for array antenna and has become the urgent needs of Antenna Design.And traditional adapter feed that uses only ensure that the transmission of antenna radio-frequency signal, it is impossible to meet the needs of array antenna heat radiation.
Summary of the invention
The above-mentioned technical problem existed for array antenna of the prior art, the utility model discloses the array antenna of a kind of low thermal resistance connectorless feed.
The technical solution of the utility model is as follows:
The utility model discloses the array antenna of a kind of low thermal resistance connectorless feed, it specifically includes printed board, antenna element and transmitting-receiving subassembly, in described printed board, plated-through hole is set, one end of plated-through hole connects antenna element by conducting resinl, other end connects transmitting-receiving subassembly, is fed to aerial array by plated-through hole.High frequency signal transmission is carried out owing to being no longer necessary to adapter between array antenna and feeding network, eliminate the signal transmission attenuation brought due to adapter, it also avoid the situation bringing array element to lose efficacy due to adapter inefficacy, thus improve electric property and the reliability of array antenna.
Further, above-mentioned array antenna takes forced air cooling to cool down, and cooling system includes blower fan, ventilation shaft, front outer flow passage and front inner flow passage；Blower fan is used for producing fluid；Front outer flow passage is for being transported to antenna array by cooling gas；Ventilation shaft is for realizing front outer flow passage and the transition of front inner flow passage；Front inner flow passage is formed by the bay of proper alignment.Using the array antenna of low thermal resistance connectorless feed, correspondence takes forced air cooling to cool down, and reduces the cost of entirety, improves cooling effectiveness.
Further, the diameter of above-mentioned through hole is between 0.2mm to 0.4mm.This size had both met demand, again instant microwave processes.Depending on the concrete form of the position associative array antenna element of through hole, the impedance matching between microwave transmission line and array antenna unit should be ensured, avoid the situations such as electric feed signal is shorted to occur again.
Further, antenna element uses all-metal material to be processed.Making slotline antennas array element from conventionally employed printed circuit board technology different, aerial array of the present utility model needs to take into account thermal conduction characteristic, therefore uses all-metal material to be processed antenna element.
Further, above-mentioned antenna element is notch cuttype slotline antennas unit, and the stairstepping fluting of slotline antennas uses multistage ladder to carry out matching Chebyshev's transition line.Ladder line of rabbet joint unit can take into account electric property and machinability best.
Further, above-mentioned array antenna also includes that metal basal board, described metal basal board put into printing board slot, printed board is laminated with metal basal board, obtains Metal Substrate force fit plate.Metal Substrate force fit plate is as good as with common multilamellar high frequency printed board, can carry out such as the making of other special process such as back drill, metallization groove, controlled depth milling, radio frequency line.Metal basal board printed board possesses low thermal resistance characteristic, can efficiently solve heat dissipation problem, thus improve ruggedness and the reliability of complete machine electronic equipment.
By using above technical scheme, the beneficial effects of the utility model are: carry out high frequency signal transmission owing to being no longer necessary to adapter between array antenna and feeding network, eliminate the signal transmission attenuation brought due to adapter, it also avoid the situation bringing array element to lose efficacy due to adapter inefficacy, thus improve electric property and the reliability of array antenna.
Conventional printed board is the species complex that resin, reinforcing material and Copper Foil are constituted, and mostly is the non-conductor of heat, and heat is difficult to distribute.If electronic equipment local pyrexia can not be got rid of, electronic devices and components certainly will be caused to lose efficacy because of high temperature.Metal basal board printed board possesses low thermal resistance characteristic, can efficiently solve heat dissipation problem, thus improve ruggedness and the reliability of complete machine electronic equipment.
Accompanying drawing explanation
Fig. 1 is the array antenna structure schematic diagram according to the design of traditional array antenna design method.
Fig. 2 is the array antenna structure schematic diagram according to this utility model design.
Fig. 3 is the air-cooled configuration diagram of aerial array in this utility model.
Detailed description of the invention
Below in conjunction with Figure of description, describe detailed description of the invention of the present utility model in detail.
As a example by certain array antenna design, Fig. 1 is seen according to the array antenna structure of traditional array Antenna Design, being electrically connected by adapter between antenna element and transmitting-receiving subassembly, antenna element and transmitting-receiving subassembly are arranged on antenna substrate both sides, and adapter is arranged in antenna substrate by soldering processes.
According to method of the present utility model, preferable for heat conductivity metal basal board is processed into antenna element, it is pressed together on the surface of printed board or embeds the centre of multilayer board, its typical structure is as shown in Figure 2, Embedded metal basal board also can use as stratum itself, it can be connected with plated-through hole, and realizes heat in metal core board internal layer and the transmission on surface by thermal hole.The metal basal board that this makes it possible to internal for the printed board heat produced to be transmitted to rapidly be pressed together on top layer by its interior louvre distributes again, enables printed board to carry out work that is reliable and that ensure service life under lower temperature (or the operating temperature allowed).Compare traditional connected mode, and the radio frequency loss of new aerial array reduces about 0.3dB, does not use liquid-cooling heat radiation mode to meet the needs of chip operation simultaneously, reduces full battle array power consumption.The method for designing of visible this array antenna, while the low thermal resistance achieving array dispels the heat, possesses reliability and the manufacturability of excellence.
Low thermal resistance connectorless feed array antenna take forced air cooling mode that antenna array is cooled down, air-cooled framework as shown in Figure 3: cooling system is made up of blower fan, front outer flow passage and front inner flow passage.Blower fan meets, for producing wind speed and blast, the fluid that design requires.Cooling gas is transported to antenna array by front outer flow passage.Mozzle is for realizing front outer flow passage and the transition of front inner flow passage.Front inner flow passage is by the bay self-assembling formation of proper alignment.
Owing to array antenna uses connectorless feeding classification, use when array of designs antenna electromagnetism cycle boundary to combine the method for full-wave simulation and the electric property of antenna is carried out design of Simulation, use design of Simulation to be conducive at the beginning of design and the electromagnetic performance of antenna is estimated.The aerial array of connectorless need rely on plated-through hole feed, diameter and the position of through hole directly affect for electrically having of antenna, the diameter of through hole between 0.2mm to 0.4mm, the demand processed with suitable microwave treatment.Depending on the concrete form of the position associative array antenna element of through hole, typically should ensure the impedance matching between microwave transmission line and array antenna unit, avoid the situations such as electric feed signal is shorted to occur again.
After array electric property is completed Electromagnetic Simulation design, heat-sinking capability for array is designed again, array heat-sinking capability is directly related with the form of array antenna unit, slotline antennas array element is made different from conventionally employed printed circuit board technology, the aerial array of this project needs to take into account thermal conduction characteristic, therefore uses all-metal material to be processed antenna element.Slotline antennas all polymorphic in, ladder line of rabbet joint unit can take into account electric property and machinability best, and therefore the array antenna more options notch cuttype slotline antennas unit of low thermal resistance connectorless feed is as array antenna unit.
Radiant section height and the width of slotline antennas are determined by array operating frequency lower limit, the height of antenna operation wavelength the shortest with array is similar, the spacing of antenna is then determined by array upper operational frequency limit and sweep limits, and the spacing of antenna is about about array the shortest operation wavelength half.The stairstepping fluting design of slotline antennas is to use multistage ladder to carry out matching Chebyshev's transition line, and the equation of Chebyshev's transition line isWherein ΓmFor maximum reflection coefficient, Z in the passband of designLFor impedance after conversion, Z0Initial impedance for feed.When the quantity of ladder is n, there is a following relation:AndThe phase shift that can obtain every grade of ladder afterwards isAndAnd then use following two formulas to calculate to obtain the reflection coefficient of ladders at different levels:AndThe impedance ratio of last ladder at different levels just can be obtained by following formula:The overall height of antenna is determined by radiant body height and radiating fin height, and the height of radiating fin is affected by antenna material and chip heat consumption, and the highest then fin height of heat consumption is the highest.
Array adds man-hour, initially with the printed board of microwave printed board processes antenna feed, contains the beam-forming network of each antenna element, and circuit board is internal containing transmitting radio frequency signal and the plated-through hole of heat inside printed board.Groove is milled out in advance, it is desirable to cell wall is smooth, without batch cutting edge of a knife or a sword, burr in the copper region of burying of printed board.Then using the metal basal board of copper or aluminum to be processed antenna element, microwave metal basal board requires have heat dispersion, good capability of electromagnetic shielding, high mechanical properties and the toughness of excellence and have the performances such as angularity is little, dimensional stability is high.Antenna can use metal that antenna is processed while ensureing antenna performance, to promote the heat-sinking capability of antenna to use the form such as slotline antennas or electromagnetic horn.In order to be laminated with printed board, the profile of metal basal board and printed board should be mated, metal basal board should be able to smoothly put into printing board slot, custom-shaped or the press strip of size is coordinated when lamination, press strip fits tightly with metal basal board so that metal basal board flatness controls meeting in the range of engine request.Finally printed board is laminated with metal basal board, specifically one side bonding with printed board for metal basal board is carried out brown to promote engaging force, by pressing after brown, make metal basal board together with printed board secure bond.In order to eliminate the integrity problem that between metal basal board and plate, inevitable offset causes, while the matching adjusted between metal basal board thickness and thickness of slab, also need during pressing plate to use buffering resistance glue material, generally select the mould release membrance of corresponding model, appropriate pressing condition can ensure that pressure uniformity, so that gap filler is abundant, gummosis amount and metal basal board can also be controlled with the flatness between printed board simultaneously.The Metal Substrate force fit plate so made, is as good as with common multilamellar high frequency printed board, can carry out such as the making of other special process such as back drill, metallization groove, controlled depth milling, radio frequency line.In order to meet the electric of array antenna and cooling requirements, printed board would generally design substantial amounts of plated-through hole, and these plated-through holes can realize the circuit turn-on of different interlayer, has the effect of longitudinally heat transfer simultaneously.The heat-conducting effect of through hole is affected by the quantity of through hole, size, pore wall thickness.In addition to through hole, heat transmission can be carried out with specialized designs louvre, the effect of the factors affect such as the quantity of this louvre, size, copper facing thickness, consent percentage rate and plug socket resin type to array antenna integral heat sink around electronic devices and components installation place.
The coefficient gone out given in the above embodiments and parameter; it is available to those skilled in the art realize or use utility model; utility model does not limit and only takes aforementioned disclosed numerical value; in the case of without departing from the thought of utility model; above-described embodiment can be made various modifications or adjustment by those skilled in the art; thus the protection domain of utility model is not limited by above-described embodiment, and should be the maximum magnitude meeting the inventive features that claims are mentioned.
Claims (6)
1. the array antenna of a low thermal resistance connectorless feed, it is characterized in that specifically including printed board, antenna element and transmitting-receiving subassembly, in described printed board, plated-through hole is set, one end of plated-through hole connects antenna element by conducting resinl, other end connects transmitting-receiving subassembly, is fed to aerial array by plated-through hole.
2. the array antenna of low thermal resistance connectorless feed as claimed in claim 1, it is characterised in that described array antenna takes forced air cooling to cool down, and cooling system includes blower fan, ventilation shaft, front outer flow passage and front inner flow passage；Blower fan is used for producing fluid；Front outer flow passage is for being transported to antenna array by cooling gas；Ventilation shaft is for realizing front outer flow passage and the transition of front inner flow passage；Front inner flow passage is formed by the bay of proper alignment.
3. the array antenna of low thermal resistance connectorless feed as claimed in claim 1, it is characterised in that the diameter of described through hole is between 0.2mm to 0.4mm.
4. the array antenna of low thermal resistance connectorless feed as claimed in claim 1, it is characterised in that described antenna element uses all-metal material to be processed.
5. the array antenna of low thermal resistance connectorless feed as claimed in claim 1, it is characterised in that described antenna element is notch cuttype slotline antennas unit, the stairstepping fluting of slotline antennas uses multistage ladder to carry out matching Chebyshev's transition line.
6. the array antenna of low thermal resistance connectorless feed as claimed in claim 1, it is characterised in that described array antenna also includes that metal basal board, described metal basal board put into printing board slot, printed board is laminated with metal basal board, obtains Metal Substrate force fit plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201620190905.4U CN205429174U (en) | 2016-03-11 | 2016-03-11 | Array antenna of low thermal resistance connectorless feed |
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| CN201620190905.4U CN205429174U (en) | 2016-03-11 | 2016-03-11 | Array antenna of low thermal resistance connectorless feed |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633596A (en) * | 2016-03-11 | 2016-06-01 | 中国电子科技集团公司第二十九研究所 | Low-thermal-resistance connector-less feed array antenna and implementation method therefor |
| CN107087382A (en) * | 2017-06-21 | 2017-08-22 | 中国电子科技集团公司第二十九研究所 | A kind of heat-radiating integrated transceiver architecture of antenna and preparation method |
| CN113839169A (en) * | 2020-06-24 | 2021-12-24 | 深圳市万普拉斯科技有限公司 | Antenna module and mobile terminal |
-
2016
- 2016-03-11 CN CN201620190905.4U patent/CN205429174U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633596A (en) * | 2016-03-11 | 2016-06-01 | 中国电子科技集团公司第二十九研究所 | Low-thermal-resistance connector-less feed array antenna and implementation method therefor |
| CN105633596B (en) * | 2016-03-11 | 2019-08-16 | 中国电子科技集团公司第二十九研究所 | A kind of array antenna and its implementation of low thermal resistance connectorless feed |
| CN107087382A (en) * | 2017-06-21 | 2017-08-22 | 中国电子科技集团公司第二十九研究所 | A kind of heat-radiating integrated transceiver architecture of antenna and preparation method |
| CN113839169A (en) * | 2020-06-24 | 2021-12-24 | 深圳市万普拉斯科技有限公司 | Antenna module and mobile terminal |
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