TWI704715B - Antenna array module and manufacturing method thereof - Google Patents

Abstract

An antenna array module is provided, which includes a line layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a slot and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and includes a second dielectric material; the thermal conductivity of the second dielectric material is lower than the thermal conductivity of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the millimeter wave signal is coupled to the metal plate from the signal line via the slot.

Description

Antenna array module and manufacturing method thereof

The disclosure relates to an antenna, particularly an antenna array module.

5G wireless network can achieve higher data capacity and faster data transmission, so it has become the trend of future development. Small cells can be applied to 5G wireless networks, and can increase data capacity, data transmission speed and overall network efficiency, so it can effectively improve service quality.

In order to improve the performance of small base stations, how to develop a phased array antenna with high gain and beam adjustment function has become an important issue.

Phased array antennas include multiple antenna array modules (antenna units), and these antenna array modules are driven by their internal chips; however, due to the limitations of the structure and materials of the existing antenna array modules, these chips produce The heat energy cannot effectively dissipate heat, so it also affects the performance of the antenna array module. In addition, when the module uses high heat dissipation materials, although the heat dissipation characteristics are improved, the radiation gain of the antenna is also affected.

Therefore, how to propose an antenna array module that can effectively improve the various limitations of the conventional antenna array module has become an urgent problem.

In view of the above-mentioned problems of the prior art, one of the objectives of the present disclosure is to provide an antenna array module and a manufacturing method thereof to solve various limitations of the antenna array module of the prior art.

According to one of the objectives of the present disclosure, an antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal sheet, and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material, and the ground layer includes a coupling slot, where the signal line is connected to the chip. The antenna dielectric layer is located on the circuit layer and includes a second dielectric material. The thermal conductivity of the second dielectric material is less than the thermal conductivity of the first dielectric material. The metal sheet is located on the antenna dielectric layer, and the millimeter wave signal is coupled to the metal sheet by the signal line through the coupling slot.

According to one of the objectives of the present disclosure, a method for manufacturing an antenna array module is further provided, which includes the following steps: forming a circuit layer with a multi-layer structure stacking combination of a signal line, a ground layer, a coupling slot and a first dielectric material, and at the same time A side heat dissipation electrode is formed on the side. A second dielectric material is formed on the circuit layer to serve as an antenna dielectric layer, and the thermal conductivity of the second dielectric material is smaller than that of the first dielectric material. A metal sheet is formed on the antenna dielectric layer. Connect the chip and the signal line in the circuit layer to complete the mold making.

The following will describe embodiments of the antenna array module and its manufacturing method according to the present disclosure with reference to related drawings. For clarity and convenience of the drawings, the components in the drawings may be exaggerated or exaggerated in size and proportion. Presented in a reduced scale.

Please refer to FIG. 1, which is a cross-sectional view of the antenna array module of the first embodiment of the disclosure. The antenna array module 11 includes a circuit layer 111, an antenna dielectric layer 112, a metal sheet 113, a chip 114 and a side heat dissipation electrode 115.

The circuit layer 111 includes a plurality of signal lines L, a ground layer G, and a first dielectric material D1. The chip 114 and the signal lines L are located on the first dielectric material D1, and the chip 114 is connected to the signal lines L, wherein the ground layer G includes the coupling slot S.

The antenna dielectric layer 112 is located on the circuit layer 111 and includes a second dielectric material D2; wherein, the thermal conductivity of the second dielectric material D2 is less than the thermal conductivity of the first dielectric material D1; in this embodiment, the first dielectric material D1 The thermal conductivity is 3~6 W/mK (W means the thermal power unit watt, m means the length unit meter, and K is the Kjeldahl temperature scale), the thermal conductivity of the second dielectric material D2 is 0.2~1 W/mK, and the dielectric The loss (Loss tangent) is less than 0.008 @10GHz; for example, the dielectric loss (Loss tangent) is 0.001~0.005 @10GHz; in another embodiment, the thermal conductivity of the first dielectric material D1 is 2~8 W/mK, and The thermal conductivity of the second dielectric material D2 is 0.1~1 W/mK, and the dielectric loss is 0.0005~0.008 @10GHz; in another embodiment, the thermal conductivity of the first dielectric material D1 is 2.5~5 W/mK, and The thermal conductivity of the second dielectric material D2 is 0.2~0.8 W/mK, and the dielectric loss is 0.0005~0.004 @10GHz. For example, Darfon DT-171W or DT-178W can be used as the first dielectric material D1 with a thermal conductivity of 3 W/mK; the second dielectric material D2 can be a semiconductor molding material with a thermal conductivity of 0.9W/mK , The dielectric loss is 0.008 @10GHz. For example, the first dielectric material D1 can be Dupont 9K7, which has a thermal conductivity of 4.6 W/m.K; the second dielectric material D2 can be RTduroid® 5880, which has a thermal conductivity of 0.2 W/m.K and a dielectric loss of 0.0009 @10GHz. For example, the first dielectric material D1 can be Dupont 9K7, which has a thermal conductivity of 4.6 W/m.K; the second dielectric material D2 can be RO4003C, which has a thermal conductivity of 0.71 W/m.K and a dielectric loss of 0.0027 @10GHz.

The dielectric loss measurement method of the second dielectric material is the measurement method of IEC 61189-2-721-2015 for dielectric loss measurement.

The metal sheet 113 is located on the antenna dielectric layer 112, and the millimeter wave signal is coupled to the metal sheet 113 by the signal line L through the coupling slot S.

The side heat dissipation electrodes 115 are arranged on the sides of the circuit layer 111 and connected to the ground layer G; the side heat dissipation electrodes 115 can be soldered on a substrate to fix the antenna array module 11 on the substrate (not (Shown in the figure); in addition, the side heat dissipation electrodes 115 can also be connected to the high-frequency signal of the circuit layer 111; in another embodiment, the side heat dissipation electrodes 115 can also cover the side of the circuit layer 111; in another In an embodiment, the side heat dissipation electrode 115 may also include a plurality of electrode pieces arranged on the side of the circuit layer 111, and there is a gap between adjacent electrode pieces; wherein, the side heat dissipation electrode 115 may be made of metal materials such as copper, silver, etc. .

It can be seen from the foregoing that in this embodiment, the antenna array module 11 can have higher design flexibility and lower manufacturing process difficulty, and can better meet future requirements.

Wherein, the antenna array module 11 is a composite material stack structure, so that the circuit layer 111 and the antenna dielectric layer 112 have different thermal conductivity, and the thermal conductivity of the antenna dielectric layer 112 is smaller than that of the circuit layer 111, and the antenna dielectric layer 112 has different thermal conductivity. The dielectric loss is less than 0.008@10GHz. The stacked structure design of this material can improve the heat dissipation effect of the antenna array module 11 and make the antenna array module have a good antenna gain.

In addition, the thermal conductivity of the antenna dielectric layer 112 is 0.2~1W/m.K (equivalent to the thermal conductivity of the second dielectric material D2 being 0.2~1W/m.K). The thermal conductivity of the first dielectric material D1 of the circuit layer 111 is 3~6W/mK. Since the circuit layer 111 includes a plurality of signal lines L and the ground layer G, the thermal conductivity of the circuit layer 111 can be increased to 4~8W/mK. mK.

In addition, the side heat dissipation electrodes 115 can not only be used for fixing the antenna array module 11 and transmitting signals, but also can directly and effectively discharge the heat generated by the chip 114.

Of course, the foregoing is only an example. The structure of the antenna array module 11, the thermal conductivity of the dielectric material, and the synergistic relationship between its components can be changed according to actual needs, and the present disclosure is not limited to this embodiment.

Please refer to FIG. 2, which is a flowchart of the manufacturing method of the antenna array module 11 of the first embodiment of the disclosure. The manufacturing method of the antenna array module 11 includes the following steps:

Step S21: Through a multi-layer stacking method, a multi-layer structure with a signal line L, a ground layer G with a coupling slot S and a first dielectric material D1 is stacked and combined to form a circuit layer 111, and a side heat dissipation electrode 115 is formed on the side. The signal line L, the ground layer G, and the coupling slot S can be made of patterned metal.

Step S22: forming a second dielectric material D2 on the circuit layer 111 as the antenna dielectric layer 112, and the thermal conductivity of the second dielectric material D2 is smaller than the thermal conductivity of the first dielectric material D1. The second medium D2 can be realized by coating.

Step S23: forming a metal sheet 113 on the antenna dielectric layer 112. The metal sheet 113 may be made of patterned metal, such as by evaporation or sputtering the metal layer, and then removing part of the metal layer through an etching process, or through a masking method Metal plated directly.

Step S24: Improve the solderability of the side heat dissipation electrode 115 through the chemical coating method.

Step S25: After connecting the chip 114 to the signal line L in the circuit layer 111, molding is completed.

Please refer to FIG. 3, which is a cross-sectional view of the antenna array module of the second embodiment of the disclosure. The antenna array module 21 includes a circuit layer 211, an antenna dielectric layer 212, a plurality of metal sheets 213, a chip 214, a plurality of side heat dissipation electrodes 215, and an antenna protection layer 216.

The circuit layer 211 includes a plurality of signal lines L, a plurality of ground layers G, a plurality of coupling slots S, and a first dielectric material D1. The bottom of the first dielectric material D1 includes a cavity R, and the chip 214 is disposed in the cavity R, and is connected to the signal lines L through solder balls B, and is fixed on the first dielectric material D1.

The antenna dielectric layer 212 is located on the circuit layer 211 and includes a second dielectric material D2; wherein the thermal conductivity of the second dielectric material D2 is smaller than that of the first dielectric material D1; in this embodiment, the first dielectric material D1 can Using Dupont 9K7, its thermal conductivity is 4.6W/mK; the second dielectric material D2 can use RO4003C material, its thermal conductivity is 0.71 W/mK, and its dielectric loss is 0.0027.

The metal sheets 213 are located on the antenna dielectric layer 212, and the millimeter wave signal is coupled to the metal sheet 213 by the signal line L through the coupling slot S.

The side heat dissipation electrodes 215 are arranged on the sides of the circuit layer 211 and connected to the ground layers G; similarly, the side heat dissipation electrodes 215 can fix the antenna array module 21 on the substrate and can also transfer the circuit layer High frequency signal of signal line L in 211.

The antenna array module 21 of the present disclosure may further include an antenna protection layer 216 which covers the metal sheets 213; in this embodiment, the antenna protection layer 216 includes the third dielectric material D3, and the antenna protection layer 216 is transparent In another embodiment, the thermal conductivity of the third dielectric material D3 is 0.2~0.5 W/mK; in another embodiment, the thermal conductivity of the third dielectric material D3 is 0.2~1 W/mK .

It can be seen from the above that the antenna array module 21 is a special composite material stack structure, so that the antenna protective layer 216, the circuit layer 211, and the antenna dielectric layer 212 have different thermal conductivity; among them, the thermal conductivity of the antenna protective layer 216 is 0.2~1 W/mK, the thermal conductivity of the antenna dielectric layer 212 is 0.2~1 W/mK, the dielectric loss of the antenna dielectric layer is less than 0.008@10GHz, and the thermal conductivity of the circuit layer 211 is 4~8 W/mK.

Of course, the foregoing is only an example. The structure of the antenna array module 11, the thermal conductivity of the dielectric material, and the synergistic relationship between its components can be changed according to actual needs, and the present disclosure is not limited to this embodiment.

Please refer to FIG. 4, which is a cross-sectional view of the antenna array module of the third embodiment of the disclosure. The antenna array module 31 includes a circuit layer 311, an antenna dielectric layer 312, a plurality of metal sheets 313, a chip 314, a plurality of side heat dissipation electrodes 315, and an antenna protection layer 316.

The circuit layer 311 includes a plurality of signal lines L, a plurality of ground layers G, a plurality of coupling slots S, and a first dielectric material D1. The bottom of the first dielectric material D1 includes a cavity R, and the chip 314 is disposed in the cavity R, and is connected to the signal lines L through solder balls B, and is fixed on the first dielectric material D1.

The antenna dielectric layer 312 is located on the circuit layer 111 and includes the second dielectric material D2.

The plurality of metal sheets 313 are located on the antenna dielectric layer 312, and the millimeter wave signal is coupled to the plurality of metal sheets 313 from the signal line L through the coupling slots S.

The antenna protection layer 316 covers the plurality of metal sheets 313 and includes the third dielectric material D3.

The side heat dissipation electrodes 315 are arranged on the sides of the circuit layer 311 and connected to the ground layers G.

The structure and connection relationship of the above-mentioned elements are similar to those in the above-mentioned embodiment, so we will not repeat them here. The difference from the above-mentioned embodiment is that the antenna dielectric layer 312 of the antenna array module 31 of this embodiment further includes a plurality of cavities E. The cavities E are located between the plurality of metal sheets 313 and the coupling slots S; this structural design can enhance the performance of the antenna array module 31 and make the antenna array module 31 more widely used.

Of course, the above is only an example. The structure of the antenna array module 31, the thermal conductivity of the dielectric material, and the synergistic relationship between its components can be changed according to actual requirements, and the present disclosure is not limited to this embodiment.

Please refer to FIG. 5, which is a flowchart of the manufacturing method of the antenna array module of the third embodiment of the disclosure. The manufacturing method of the antenna array module includes the following steps:

Step S51: Through a multi-layer stacking method, the multi-layer structure with the signal line L, the ground layer G, the coupling slot S and the first dielectric material D1 is stacked and combined to form the circuit layer 311, and at the same time, the side heat dissipation electrode 315 is formed on the side. The signal line L, the ground layer G, and the coupling slot S can be made of patterned metal.

Step S52: forming a second dielectric material D2 on the circuit layer 311, and forming a cavity E on the second dielectric material D2 as the antenna dielectric layer 312, and the thermal conductivity of the second dielectric material D2 is lower than that of the first dielectric material Thermal conductivity of D1. Among them, the cavity E can be made by laser perforation, punching or drilling.

Step S53: forming a plurality of metal sheets 313 on the antenna dielectric layer 312.

Step S54: forming an antenna protection layer 316 on the antenna dielectric layer 312 and covering a plurality of metal sheets 313.

Step S55: Improve the solderability of the side heat sink electrode 315 through the chemical coating method.

Step S56: Connect the chip 314 to the signal line L in the circuit layer 311 to complete the mold manufacturing.

According to the embodiment of the present disclosure, the first dielectric material D1 can be Dupont 9K7, which has a thermal conductivity of 4.6W/mK; the second dielectric material D2 can be RTduroid® 5880, which has a thermal conductivity of 0.2W/mK and a dielectric loss (loss tangent) is 0.0009@10GHz. The thermal conductivity of the circuit layer of the antenna array module 31 is 4-8W/m.K.

The experimental results show that the stacked structure formed by the first dielectric material D1 with the aforementioned thermal conductivity range and the second dielectric material D2 with the aforementioned thermal conductivity range and dielectric loss range can significantly increase the first dielectric material D1 and the second dielectric material D2 has the original heat conduction effect, so the heat dissipation effect of the antenna array module 31 can be improved, and the antenna array module has a good antenna gain.

Please refer to FIG. 6, which is a cross-sectional view of the antenna array module of the fourth embodiment of the disclosure. The antenna array module 41 includes a circuit layer 411, an antenna dielectric layer 412, a plurality of metal sheets 413, a plurality of chips 414, a side heat dissipation electrode 415, and an antenna protection layer 416.

The circuit layer 411 includes a plurality of signal lines L, a plurality of ground layers G, a plurality of coupling slots S, and a first dielectric material D1. The bottom of the first dielectric material D1 includes a plurality of cavities R, and the chips 414 are disposed in the cavities R, and are connected to the signal lines L through solder balls B, and are fixed on the first dielectric material D1.

The antenna dielectric layer 412 is located on the circuit layer 411 and includes the second dielectric material D2 and a plurality of cavities E; the cavities E are located between the plurality of metal sheets 413 and the coupling slots S.

The plurality of metal sheets 413 are located on the antenna dielectric layer 412, and the millimeter wave signal is coupled to the plurality of metal sheets 413 from the signal line L through the coupling slot S.

The antenna protection layer 416 covers the plurality of metal sheets 413 and includes the third dielectric material D3.

The side heat dissipation electrodes 415 are arranged on the sides of the circuit layer 411 and connected to the ground layers G.

The structure and connection relationship of the above-mentioned components are similar to those in the above-mentioned embodiment, so we will not repeat them here. Different from the above-mentioned embodiment, the antenna array module 41 of this embodiment includes a plurality of chips 414, so it can be applied to include more A large phased array antenna with a plurality of metal pieces 413. It can be seen from the above that the antenna array module 11 of the embodiment of the disclosure can indeed achieve higher design flexibility.

Similarly, the antenna array module 41 of this embodiment is also a composite material stack structure, so that the antenna protection layer 416, the circuit layer 411, and the antenna dielectric layer 412 have different thermal conductivity, and the thermal conductivity of the circuit layer 411 is greater than that of the antenna dielectric layer 412 , The heat dissipation effect of the antenna array module 41 can be greatly improved.

Of course, the foregoing is only an example. The structure of the antenna array module 41, the thermal conductivity of the dielectric material, and the synergistic relationship between its components can be changed according to actual requirements, and the present disclosure is not limited to this embodiment.

Please refer to FIG. 7, which is a cross-sectional view of the antenna array module of the fifth embodiment of the disclosure. The antenna array module 51 includes a circuit layer 511, an antenna dielectric layer 512, a plurality of metal sheets 513, a chip 514, a plurality of side heat dissipation electrodes 515, and an antenna protection layer 516.

The circuit layer 511 includes a plurality of signal lines L, a plurality of ground layers G, a plurality of coupling slots S, and a first dielectric material D1. The bottom of the first dielectric material D1 includes a plurality of cavities R, and the chips 514 are disposed in the cavities R and fixed to the first dielectric material D1 through solder balls B to be connected to the signal lines L; in addition, , Each coupling slot S is provided with a signal line L above and below.

The antenna dielectric layer 512 is located on the circuit layer 511 and includes the second dielectric material D2.

The metal sheets 513 are located on the antenna dielectric layer 512; similarly, the transmission process of the millimeter wave signal in this embodiment is the same as the previous embodiment, and the millimeter wave signal generated by the signal lines L under the coupling slot S passes through the millimeter wave signals. The coupling slot S is coupled to the metal sheets 513, and the millimeter wave signals generated by the signal lines L above the coupling slot S are also coupled to the metal sheets 513 through the coupling slots S.

The antenna protection layer 516 covers the metal sheets 513 and includes the third dielectric material D3.

The side heat dissipation electrodes 515 are arranged on the sides of the circuit layer 511 and connected to the ground layers G.

The structure and connection relationship of the above-mentioned elements are similar to those in the above-mentioned embodiment, so I will not repeat them here. Different from the above-mentioned embodiment, the antenna array module 51 of this embodiment can be provided with a signal line L above and below the ground layer G. , So the effect of biaxial polarization can be achieved. From the foregoing, it can be seen that the antenna array module 51 of the embodiment of the present disclosure can indeed achieve higher design flexibility.

Similarly, the antenna array module 51 of this embodiment is also a composite material stack structure, so that the antenna protective layer 516, the circuit layer 511, and the antenna dielectric layer 512 have different thermal conductivity, and the thermal conductivity of the circuit layer 511 is greater than that of the antenna dielectric layer 512 , The heat dissipation effect of the antenna array module 51 can be greatly improved.

Of course, the foregoing is only an example. The structure of the antenna array module 51, the thermal conductivity of the dielectric material, and the synergistic relationship between its components can be changed according to actual needs, and the present disclosure is not limited to this embodiment.

Please refer to FIG. 8, which is a schematic diagram of the antenna array module of the sixth embodiment of the disclosure. An antenna array module 61 with multiple antennas and multiple chips is disposed on the substrate T to form a phased array antenna 1.

It can be seen from the figure that the phased array antenna 1 includes two side heat dissipation electrodes 615a and 615b with different structures. Wherein, the side heat dissipating electrode 615a is an electrode plate arranged on one side of the phased array antenna 1, and the side heat dissipating electrode 615b is arranged in a strip-like metal wire arrangement and includes a plurality of electrode plates EC, and any two adjacent electrode plates There is an interval N between ECs.

It can be seen from the above that the side heat dissipation electrodes can also have different structures to meet different needs, so that it can achieve the desired effect.

Of course, the above is only an example, and the structure of the side heat dissipation electrodes 615a, 615b can be changed according to actual needs, and the present disclosure is not limited to this embodiment.

Please refer to FIGS. 9 and 10; FIG. 9 is a simulation result diagram of the antenna array module of the sixth embodiment of the disclosure, and FIG. 10 is a simulation result diagram of a conventional antenna array module.

Figure 9 shows a phased array antenna 1 formed by an antenna array module 11 using the thermal conductivity range and heat dissipation structure of the embodiment of the disclosure; wherein the thermal conductivity of the antenna dielectric layer 112 is 0.3 W/mK, and the circuit layer 111 The thermal conductivity is 5 W/mK. The highest temperature of the antenna array module 61 of the phased array antenna 1 in Fig. 9 is about 94.2 degrees.

Figure 10 shows a conventional phased array antenna 1'which does not use the thermal conductivity range and heat dissipation structure of the embodiment of the disclosure. The highest temperature of the antenna array module of the phased array antenna 1'in Fig. 10 is about 113 degrees. Therefore, the phased array antenna 1 in Fig. 9 does have a better heat dissipation effect.

In summary, according to the embodiment of the present disclosure, as shown in Figure 1, the antenna array module 11 is a special composite material stack structure, so that the circuit layer 111 and the antenna dielectric layer 112 have different thermal conductivity, and the antenna dielectric The layer 112 is a material with low thermal conductivity and low dielectric loss. Such a heat transfer structure design can improve the heat dissipation effect of the antenna array module 11 and enable the antenna array module to have a good antenna gain.

According to the embodiment of the disclosure, the thermal conductivity of the antenna dielectric layer 112 of the antenna array module 11 is 0.2~1W/mK, the dielectric loss is less than 0.008, and the thermal conductivity of the circuit layer 111 is 4~8W/mK, the thermal conductivity The range design can improve the heat dissipation effect of the antenna array module 11 and make the antenna array module have good antenna gain.

Furthermore, according to the embodiment of the present disclosure, the antenna array module 11 has a side heat dissipation electrode 115, which can not only be used to fix the antenna array module 11 and transmit signals, but also can directly and effectively discharge the heat generated by the chip 114. Therefore, The heat dissipation effect of the antenna array module 11 is further improved.

In addition, as shown in FIG. 3, according to the embodiment of the present disclosure, the antenna array module 21 has an antenna protective layer 216, and the thermal conductivity of the antenna protective layer 216 is 0.2-1 W/m.K.

In addition, as shown in FIG. 4, according to the embodiment of the present disclosure, the antenna dielectric layer 312 of the antenna array module 31 includes a cavity E. This structural design can further reduce the thermal conductivity of the antenna dielectric layer 312 and at the same time reduce the antenna dielectric The dielectric loss of the layer 312 enhances the performance of the antenna array module 31, which makes the antenna array module 31 more widely used.

It can be seen that this disclosure has indeed achieved the desired enhancement effect under the breakthrough of the previous technology, and it is not easy to think about by those familiar with the technology. Its progressiveness and practicality show that it has met the requirements of patent application. Yan has filed a patent application in accordance with the law, and I implore your office to approve this invention patent application to encourage creativity and make it easy.

The above description is only illustrative, and not restrictive. Any other equivalent modifications or changes that do not depart from the spirit and scope of this disclosure should be included in the scope of the attached patent application.

1‧‧‧Phase Array Antenna E‧‧‧cavity 1’‧‧‧Traditional phased array antenna R‧‧‧cavity 11, 21, 31, 41, 51, 61‧‧‧antenna array module T‧‧‧Substrate 111, 211, 311, 411, 511‧‧‧line layer B‧‧‧Solder ball 112, 212, 312, 412, 512‧‧‧antenna dielectric layer EC‧‧‧electrode sheet 113, 213, 313, 413, 513‧‧‧Metal sheet N‧‧‧ interval 114, 214, 314, 414, 514‧‧‧ chip D1‧‧‧The first medium material 115, 215, 315, 415, 515, 615a, 615b‧‧‧Side cooling electrode D2‧‧‧Second Medium Material 216, 316, 416, 516‧‧‧antenna protective layer D3‧‧‧The third medium material L‧‧‧ signal line S21~S25, S51~S56‧‧‧Step flow S‧‧‧Coupling slot

Figure 1 is a cross-sectional view of the antenna array module of the first embodiment of the disclosure.

Figure 2 is a flowchart of the manufacturing method of the antenna array module of the first embodiment of the disclosure.

Figure 3 is a cross-sectional view of the antenna array module of the second embodiment of the disclosure.

Figure 4 is a cross-sectional view of the antenna array module of the third embodiment of the disclosure.

FIG. 5 is a flowchart of the manufacturing method of the antenna array module of the third embodiment of the disclosure.

Figure 6 is a cross-sectional view of the antenna array module of the fourth embodiment of the disclosure.

Figure 7 is a cross-sectional view of the antenna array module of the fifth embodiment of the disclosure.

Figure 8 is a schematic diagram of the antenna array module of the sixth embodiment of the disclosure.

Fig. 9 is a simulation result diagram of the antenna array module of the sixth embodiment of the disclosure.

Figure 10 is the simulation result of the traditional antenna array module.

11‧‧‧Antenna array module

L‧‧‧ signal line

111‧‧‧Line layer

112‧‧‧Antenna dielectric layer

113‧‧‧Metal sheet

114‧‧‧chip

115‧‧‧Side cooling electrode

G‧‧‧Ground plane

S‧‧‧Coupling slot

D1‧‧‧The first medium material

D2‧‧‧Second Medium Material

Claims (18)

An antenna array module, which contains: A circuit layer includes a signal line, a ground layer and a first dielectric material, the signal line and the ground layer are located in the first dielectric material, and the ground layer includes a coupling slot; An antenna dielectric layer is located on the circuit layer and includes a second dielectric material, the thermal conductivity of the second dielectric material is less than the thermal conductivity of the first dielectric material; A metal sheet is located on the antenna dielectric layer, and the millimeter wave signal is coupled to the metal sheet by the signal line through the coupling slot; and A chip is connected to the signal line. For the antenna array module described in the first item of the scope of patent application, the thermal conductivity of the first dielectric material is 3~6W/m.K. For the antenna array module described in the first item of the scope of patent application, the thermal conductivity of the first dielectric material is 2-8W/m.K. For the antenna array module described in item 1 of the scope of patent application, the thermal conductivity of the circuit layer is 4~8W/m.K. For the antenna array module described in item 1 of the scope of patent application, the thermal conductivity of the second dielectric material is 0.1~1W/m.K, and the dielectric loss is less than 0.008. For the antenna array module described in item 1 of the scope of patent application, the thermal conductivity of the second dielectric material is 0.1~1W/m.K, and the dielectric loss range is 0.001~0.005. For the antenna array module described in item 1 of the scope of patent application, the thermal conductivity of the second dielectric material is 0.2~0.8W/m.K, and the dielectric loss range is 0.0005~0.004. The antenna array module described in item 1 of the scope of patent application further includes a heat dissipation electrode, which is arranged on one side of the circuit layer and connected to the ground layer. According to the antenna array module described in item 8 of the scope of patent application, the side heat dissipation electrode includes a plurality of electrode plates, and there is a gap between two adjacent electrode plates. In the antenna array module described in claim 1, wherein the antenna dielectric layer further includes a cavity located under the metal sheet. In the antenna array module described in claim 10, the cavity is located between the metal sheet and the coupling slot. The antenna array module described in item 1 of the scope of patent application further includes an antenna protection layer, which is located on the antenna dielectric layer and covers the metal sheet. The antenna array module described in item 12 of the scope of patent application, wherein the antenna protective layer includes a third dielectric material, and the thermal conductivity of the third dielectric material is 0.2~1W/m.K. For the antenna array module described in item 12 of the scope of patent application, the transmittance of the antenna protective layer is greater than 80%. According to the antenna array module described in claim 1, wherein the circuit layer includes a cavity, and the chip is located in the cavity. A manufacturing method of antenna array module includes: Through a multi-layer stacking method, a multi-layer structure with a signal line, a grounding layer with a coupling slot and a first dielectric material is stacked to form a circuit layer, and at the same time a side heat dissipation electrode is formed on the side; Forming a second dielectric material on the circuit layer as an antenna dielectric layer, and the thermal conductivity of the second dielectric material is less than the thermal conductivity of the first dielectric material; Forming a metal sheet on the antenna dielectric layer; and Connect the chip to the signal line. The manufacturing method of the antenna array module described in item 16 of the scope of patent application further includes: A cavity is formed on the second dielectric material. The manufacturing method of the antenna array module described in item 16 of the scope of patent application further includes: An antenna protection layer is formed on the antenna dielectric layer and covered with the metal sheet.

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