CN101355846A - Heat transmission and heat-dissipating structure for substrate - Google Patents
Heat transmission and heat-dissipating structure for substrate Download PDFInfo
- Publication number
- CN101355846A CN101355846A CNA2007101284706A CN200710128470A CN101355846A CN 101355846 A CN101355846 A CN 101355846A CN A2007101284706 A CNA2007101284706 A CN A2007101284706A CN 200710128470 A CN200710128470 A CN 200710128470A CN 101355846 A CN101355846 A CN 101355846A
- Authority
- CN
- China
- Prior art keywords
- heat
- base material
- heater element
- radiator structure
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a heat transferring and radiating structure for a parent metal. The heat transferring and radiating structure is applied to transfer heat and radiate a heating element and comprises the parent metal, at least one heat conducting cylinder, a heat conducting insulated rubber layer and a conductive layer, wherein at least one hole is processed inside the parent metal, and the heat conducting cylinder is embedded into the hole. In the structure, the heat quantity of the heating element is transmitted heat and radiated through the conducting cylinder without needing the heat conducting insulated rubber layer, the heat transfer and the radiation of the heating element are realized by the design of the heat conducting cylinder so that the structure breaks through the heat transferring way of the prior parent metal plate. The heat transferring and radiating structure improves the heat conducting and radiating effects with high expansion and effectively solves the heat transfer and the radiation of the heating element.
Description
Technical field
The present invention relates to a kind of base material and conduct heat and radiator structure, be meant the heat energy that relies on heating column to conduct heat generating member especially, the base material that promotes high magnification heat conduction and radiating effect conducts heat and radiator structure.
Background technology
Between modern age short many decades, the paces that various electronic product is grown up but are with rapid changepl. never-ending changes and improvements, from the simple and bulky electronic product of function in the past, be developed to present electronic product and have compact volume and powerful characteristic, so, the heater element of electronic product inside also must be developed into present high-power by small-power in the past, but when the power of heater element constantly promoted, what research staff and dealer faced was thorny heat transfer of heater element and heat dissipation problem.
The electronic product major part is that the heater element combination is fixed on the substrate at present, and described base material is formed by copper foil layer and thermal conductive insulation glue pressing, and relies on the copper foil layer on the base material to provide the circuit of heater element to connect.Therefore, when producing heat energy, mainly be to rely on copper foil layer heat energy outwards to be conducted by the heat conductive insulating glue-line when the heater element running; But, therefore can't be effectively the heat energy of heater element be outwards transmitted because thermal conductive insulation glue is not to be a kind of good heat carrier.
In view of the heat transfer and the radiator structure of aforementioned heater element are not attained the desirable fact, this case inventor is based on being engaged in the experience that this already researchs and develops for many years, hope can provide a kind of heat transfer problem from basic solution heater element, and the base material that can reach industry applications really conducts heat and radiator structure, with service industry and society, satisfying through for a long time research and development has generation of the present invention.
Summary of the invention
Prior art shortcoming in view of the above, main purpose of the present invention provide a kind of base material and promote conduct heat structure with heat radiation of high magnification, make the heat transfer of heater element obtain effectively to solve with heat radiation.
For taking off purpose and other purposes on reaching, the invention provides a kind of base material and conduct heat and radiator structure, be heat transfer and the heat radiation that is applied to heater element, described structure includes:
One base material be to be provided with at least one hole, and base material simultaneously has a joint portion;
At least one heating column is to embed in the described hole, in order to the above-mentioned heater element of bearing;
One heat conductive insulating glue-line is the joint portion that is coated on above-mentioned base material; And
One conductive layer is that to be combined in thermal conductive insulation glue laminated.
Compared with prior art, the beneficial effect that the present invention has is: rely on above-mentioned technological means, the present invention can improve existing disappearance and have the powerful heat transfer of lifting and radiating effect, makes the heat transfer of heater element obtain effectively to solve with heat radiation.
Description of drawings
Shown in Figure 1 is the generalized section of preferred embodiment bearing heater element of the present invention;
Shown in Figure 2 is the STRUCTURE DECOMPOSITION figure of preferred embodiment of the present invention.
Description of reference numerals: 1-base material; The 11-hole; The 12-joint portion; The 2-heating column; The 21-placing part; 3-heat conductive insulating glue-line; The 4-conductive layer; The 9-heater element.
Embodiment
, in the detailed description of the following preferred embodiment that cooperates referenced in schematic, can clearly present relevant for aforementioned and other technology contents of the present invention, characteristics and effect.
Please cooperate and consult Fig. 1 and shown in Figure 2, the base material of preferred embodiment of the present invention conducts heat and radiator structure, is the heat transfer that is applied to heater element 9, includes:
One base material 1, be to establish to have a hole 11 at least, and base material 1 one side has a joint portion 12, and base material 1 can be selected from least a material in the material group that is made up of gold, silver, aluminium, copper, pottery, ceramal, superconductor, epoxy resin, pi, FR4 resin, FR5 resin and BT (Bismaleimide-triazine) resin in addition;
At least one heating column 2, be to embed in the hole 11, the one end is to have a placing part 21, described placing part 21 is in order to the above-mentioned heater element 9 of bearing, described heating column 2 is the materials that adopt a high conduction coefficient, is selected from any material in the material group that is made up of gold, silver, aluminium, copper, pottery, ceramal and superconductor;
One heat conductive insulating glue-line 3 is to be coated on the joint portion 12 of above-mentioned base material 1; And
One conductive layer 4 be to be combined in heat conductive insulating glue-line 3 one sides, and conductive layer 4 is Copper Foil, goldleaf and superconductor.
User mode relevant for above-mentioned member sees also shown in Figure 1, when the base material of preferred embodiment of the present invention conducts heat with the radiator structure use, be with the placing part 21 of heater element 9 bearings at heating column 2, the thermal energy conduction that is produced after relying on heating column 2 with heater element 9 runnings is to base material 1, pass out heat by base material 1 and heating column 2, because between heater element 9 and the heating column 2, be not to come transferring heat energy by heat conductive insulating glue-line 3, therefore can effectively obtain high efficiency heat-conducting effect, also therefore make the heat transfer of heater element obtain effectively to solve with heat radiation.
More than explanation is just illustrative for the purpose of the present invention, and it is nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited, can make many modifications, variation or equivalence, but but all will fall within the claim restricted portion of the present invention.
Claims (4)
1, a kind of base material heat conduction and radiator structure are heat transfer and the heat radiations that is applied to heater element, it is characterized in that, include:
One base material be to be provided with at least one hole, and base material simultaneously has a joint portion;
At least one heating column is to embed in the described hole, in order to the above-mentioned heater element of bearing;
One heat conductive insulating glue-line is the joint portion that is coated on above-mentioned base material; And
One conductive layer is that to be combined in thermal conductive insulation glue laminated.
2, base material according to claim 1 conducts heat and radiator structure, and it is characterized in that: base material is selected from least a material in the material group that is made up of gold, silver, aluminium, copper, pottery, epoxy resin, pi, FR4 resin, FR5 resin and BT resin.
3, base material according to claim 1 conducts heat and radiator structure, and it is characterized in that: heating column one end is to have a placing part, and described placing part is in order to the above-mentioned heater element of bearing.
4, base material according to claim 1 conducts heat and radiator structure, it is characterized in that: described heating column is any material that is selected from the material group that is formed by gold, silver, aluminium, copper, with pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101284706A CN101355846A (en) | 2007-07-24 | 2007-07-24 | Heat transmission and heat-dissipating structure for substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101284706A CN101355846A (en) | 2007-07-24 | 2007-07-24 | Heat transmission and heat-dissipating structure for substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101355846A true CN101355846A (en) | 2009-01-28 |
Family
ID=40308359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101284706A Pending CN101355846A (en) | 2007-07-24 | 2007-07-24 | Heat transmission and heat-dissipating structure for substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101355846A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686008A (en) * | 2011-03-08 | 2012-09-19 | 昆山市华升电路板有限公司 | Aluminum-based circuit board |
| CN103348138A (en) * | 2010-10-27 | 2013-10-09 | 三菱重工业株式会社 | Inverter-integrated electric compressor |
| CN103917043A (en) * | 2014-03-14 | 2014-07-09 | 苏州晶品光电科技有限公司 | Patterned multi-insulating-material circuit substrate |
| CN103939869A (en) * | 2014-04-02 | 2014-07-23 | 安徽金雨灯业有限公司 | Efficient heat dissipation LED aluminum substrate |
-
2007
- 2007-07-24 CN CNA2007101284706A patent/CN101355846A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103348138A (en) * | 2010-10-27 | 2013-10-09 | 三菱重工业株式会社 | Inverter-integrated electric compressor |
| CN103348138B (en) * | 2010-10-27 | 2016-01-06 | 三菱重工业株式会社 | Inverter-integrated type electric compressor |
| US9318935B2 (en) | 2010-10-27 | 2016-04-19 | Mitsubishi Heavy Industries, Ltd. | Inverter-integrated electric compressor |
| CN102686008A (en) * | 2011-03-08 | 2012-09-19 | 昆山市华升电路板有限公司 | Aluminum-based circuit board |
| CN103917043A (en) * | 2014-03-14 | 2014-07-09 | 苏州晶品光电科技有限公司 | Patterned multi-insulating-material circuit substrate |
| WO2015135249A1 (en) * | 2014-03-14 | 2015-09-17 | 苏州晶品光电科技有限公司 | Patterned multi-insulating material circuit substrate |
| CN103939869A (en) * | 2014-04-02 | 2014-07-23 | 安徽金雨灯业有限公司 | Efficient heat dissipation LED aluminum substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI302821B (en) | Flexible circuit board with heat sink | |
| CN101556941B (en) | Heat radiation structure of surface mounting high-power element | |
| CN107896421B (en) | PCB capable of fast radiating | |
| CN101841975B (en) | Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board | |
| TW201019431A (en) | Insulating and heat-dissipating structure of an electronic component | |
| CN107734837B (en) | PCB capable of fast radiating | |
| CN102692000A (en) | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate | |
| CN110494018A (en) | A kind of optical module | |
| CN101355846A (en) | Heat transmission and heat-dissipating structure for substrate | |
| CN209627793U (en) | A kind of cooling circuit board | |
| CN208850120U (en) | A kind of radiator | |
| CN2884809Y (en) | Radiator of power element | |
| CN201397814Y (en) | Radiating structure of chip type high-power element | |
| CN107734838B (en) | PCB capable of fast radiating | |
| CN201758491U (en) | High heat-conducting circuit board manufactured by oil printing method | |
| CN209659706U (en) | A kind of wiring board with heat conduction structure | |
| CN201475950U (en) | Heat dissipation substrate of LED lamp | |
| TW201212306A (en) | LED heat-conduction substrate and heat-dissipation module structure | |
| CN110600852A (en) | Novel communication antenna radiator | |
| CN213426557U (en) | Circuit board | |
| CN209994611U (en) | Grid heat conduction copper-clad plate | |
| CN201758485U (en) | High-thermal conductivity circuit board made by using hot-press method | |
| CN203521476U (en) | LED packaging structure with high heat conduction performance | |
| CN209882211U (en) | HDI high density lamination circuit board | |
| CN216795540U (en) | Heat dissipation device for packaging heat-conducting graphite flake-soaking motor controller |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090128 |