CN102686008A - Aluminum-based circuit board - Google Patents
Aluminum-based circuit board Download PDFInfo
- Publication number
- CN102686008A CN102686008A CN2011100549142A CN201110054914A CN102686008A CN 102686008 A CN102686008 A CN 102686008A CN 2011100549142 A CN2011100549142 A CN 2011100549142A CN 201110054914 A CN201110054914 A CN 201110054914A CN 102686008 A CN102686008 A CN 102686008A
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- CN
- China
- Prior art keywords
- aluminum
- aluminium base
- circuit board
- board
- based board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses an aluminum-based circuit board which comprises an aluminum-based board, an insulating layer and a circuit layer. The circuit layer and the aluminum-based board are parted through the insulating layer. Component pads and circuits are formed on the circuit layer. Communicating holes are drilled on ground pads of the component pads facing the aluminum-based board. The communicating holes penetrate through the insulating layer and extend to the aluminum-based board. Radiating materials are filled into the communicating holes. The ground pads are communicated with the aluminum-based board through the radiating materials. By drilling the communicating holes on the ground pads and filling the communicating holes with the radiating materials to communicate the ground pads with the aluminum-based board, fast radiating characteristic of the aluminum-based board is utilized to enhance radiating effect of the circuit board in use.
Description
Technical field
The present invention relates to a kind of metal base circuit board, especially a kind of aluminum-based circuit board.
Background technology
Existing wiring board, after it mounted components and parts, in actual use, its heat radiation leaned on natural heat dissipation and insulating barrier heat conduction to realize that radiating effect is not good.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of aluminum-based circuit board, utilize the quick heat radiating characteristic of metal to strengthen radiating effect.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of aluminum-based circuit board; Comprise aluminium base, insulating barrier and line layer, by insulating barrier at interval, be formed with components and parts pad and circuit on this line layer between line layer and the aluminium base; The self-brazing card is drilled with intercommunicating pore to aluminium base on the ground pad in the said components and parts pad; Institute's intercommunicating pore of telling connects insulating barrier and stretches in the aluminium base, is filled with heat sink material in this intercommunicating pore, and this heat sink material is communicated with said ground pad to aluminium base.
As further improvement of the present invention, said heat sink material is a copper.
The invention has the beneficial effects as follows: be communicated to aluminium base with heat radiation through punching on each ground pad of line layer and filling heat sink material, utilize the metal quick heat radiating characteristic of aluminium base itself, improve the radiating effect in the wiring board use.
Description of drawings
Fig. 1 is a cross-sectional view of the present invention.
Embodiment
Embodiment: a kind of aluminum-based circuit board; Comprise aluminium base 1, insulating barrier 2 and line layer 3, by insulating barrier 2 at interval, be formed with components and parts pad and circuit on this line layer 3 between line layer 3 and the aluminium base 1; The self-brazing card is drilled with intercommunicating pore to aluminium base 1 on the ground pad in the said components and parts pad; Institute's intercommunicating pore of telling connects insulating barrier 2 and stretches in the aluminium base 1, is filled with heat sink material 4 in this intercommunicating pore, and this heat sink material 4 is communicated with said ground pad to aluminium base.
Said heat sink material 4 is a copper.
Claims (2)
1. aluminum-based circuit board; Comprise aluminium base (1), insulating barrier (2) and line layer (3); Between line layer (3) and the aluminium base (1) by insulating barrier (2) at interval; This line layer is formed with components and parts pad and circuit on (3), it is characterized in that: the self-brazing card is drilled with intercommunicating pore to aluminium base (1) on the ground pad in the said components and parts pad, and institute's intercommunicating pore of telling connects insulating barrier (2) and stretches in the aluminium base (1); Be filled with heat sink material (4) in this intercommunicating pore, this heat sink material (4) is communicated with said ground pad to aluminium base.
2. aluminum-based circuit board according to claim 1 is characterized in that: said heat sink material (4) is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100549142A CN102686008A (en) | 2011-03-08 | 2011-03-08 | Aluminum-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100549142A CN102686008A (en) | 2011-03-08 | 2011-03-08 | Aluminum-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102686008A true CN102686008A (en) | 2012-09-19 |
Family
ID=46817174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100549142A Pending CN102686008A (en) | 2011-03-08 | 2011-03-08 | Aluminum-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102686008A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446361A (en) * | 2019-07-24 | 2019-11-12 | 广合科技（广州）有限公司 | A kind of matrix LED car light circuit board and production method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355846A (en) * | 2007-07-24 | 2009-01-28 | 千如电机工业股份有限公司 | Heat transmission and heat-dissipating structure for substrate |
| CN201479461U (en) * | 2009-09-08 | 2010-05-19 | 武汉正维电子技术有限公司 | Heat-radiation structure used for power amplifier |
| CN201681945U (en) * | 2010-05-04 | 2010-12-22 | 河北英沃泰电子科技有限公司 | Ceramic substrate for packaging focusing type solar receiver |
| CN201957334U (en) * | 2011-03-08 | 2011-08-31 | 昆山市华升电路板有限公司 | Aluminum-base circuit board |
-
2011
- 2011-03-08 CN CN2011100549142A patent/CN102686008A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101355846A (en) * | 2007-07-24 | 2009-01-28 | 千如电机工业股份有限公司 | Heat transmission and heat-dissipating structure for substrate |
| CN201479461U (en) * | 2009-09-08 | 2010-05-19 | 武汉正维电子技术有限公司 | Heat-radiation structure used for power amplifier |
| CN201681945U (en) * | 2010-05-04 | 2010-12-22 | 河北英沃泰电子科技有限公司 | Ceramic substrate for packaging focusing type solar receiver |
| CN201957334U (en) * | 2011-03-08 | 2011-08-31 | 昆山市华升电路板有限公司 | Aluminum-base circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446361A (en) * | 2019-07-24 | 2019-11-12 | 广合科技（广州）有限公司 | A kind of matrix LED car light circuit board and production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120919 |