JP2006339559A5 - - Google Patents

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Publication number
JP2006339559A5
JP2006339559A5 JP2005165112A JP2005165112A JP2006339559A5 JP 2006339559 A5 JP2006339559 A5 JP 2006339559A5 JP 2005165112 A JP2005165112 A JP 2005165112A JP 2005165112 A JP2005165112 A JP 2005165112A JP 2006339559 A5 JP2006339559 A5 JP 2006339559A5
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JP
Japan
Prior art keywords
led chip
heat sink
wiring board
hole
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005165112A
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Japanese (ja)
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JP2006339559A (en
JP4915058B2 (en
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Publication date
Application filed filed Critical
Priority to JP2005165112A priority Critical patent/JP4915058B2/en
Priority claimed from JP2005165112A external-priority patent/JP4915058B2/en
Priority to US11/579,770 priority patent/US20070200133A1/en
Priority to PCT/JP2006/306798 priority patent/WO2006106901A1/en
Publication of JP2006339559A publication Critical patent/JP2006339559A/en
Publication of JP2006339559A5 publication Critical patent/JP2006339559A5/ja
Application granted granted Critical
Publication of JP4915058B2 publication Critical patent/JP4915058B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (6)

放熱板と、この放熱板の上に実装されたＬＥＤチップと、バリスタ素子を内蔵した配線基板とからなるＬＥＤ部品であって、前記配線基板の中央部に貫通孔を設け、この貫通孔の内部に前記ＬＥＤチップを搭載した放熱板を結合し、前記ＬＥＤチップと配線基板に内蔵したバリスタ素子を並列に接続し、透明樹脂によってＬＥＤチップを埋設したＬＥＤ部品。 An LED component comprising a heat sink, an LED chip mounted on the heat sink, and a wiring board with a built-in varistor element, wherein a through hole is provided in the center of the wiring board, and the inside of the through hole An LED component in which a heat sink mounted with the LED chip is coupled, the LED chip and a varistor element built in a wiring board are connected in parallel, and the LED chip is embedded with a transparent resin. ＬＥＤチップとバリスタ素子を内蔵した配線基板をワイヤボンディングによって接続した請求項１に記載のＬＥＤ部品。 The LED component according to claim 1, wherein the wiring board incorporating the LED chip and the varistor element is connected by wire bonding. ＬＥＤチップとバリスタ素子を内蔵した配線基板をフリップチップによって接続した請求項１に記載のＬＥＤ部品。 The LED component according to claim 1, wherein the LED chip and the wiring board incorporating the varistor element are connected by a flip chip. 配線基板に貫通孔、配線パターンおよびバリスタ素子を形成する第一の工程と、前記貫通孔の内部に配置することができる放熱板を作製する第二の工程と、前記配線基板と貫通孔の内部に放熱板を圧入または接着剤により接合する第三の工程と、前記放熱板の一面にダイボンド用接着剤を用いてＬＥＤチップを接合する第四の工程と、前記ＬＥＤチップと配線基板に内蔵したバリスタ素子を並列に接続する第五の工程と、前記ＬＥＤチップを透明樹脂を用いて埋設する第六の工程を有したＬＥＤ部品の製造方法。 A first step of forming a through hole, a wiring pattern, and a varistor element in the wiring substrate; a second step of manufacturing a heat sink that can be disposed inside the through hole; and the interior of the wiring substrate and the through hole. A third step of press-fitting the heat sink to the heat sink, or a fourth step of bonding the LED chip to the one surface of the heat sink using a die bonding adhesive, and the LED chip and the wiring board. An LED component manufacturing method comprising a fifth step of connecting varistor elements in parallel and a sixth step of burying the LED chip using a transparent resin. 配線基板に貫通孔、配線パターンおよびバリスタ素子を作製する第一の工程と、前記配線基板の貫通孔の内部に熱伝導性フィラを含有した樹脂ペーストを用いて充填することにより放熱板を形成する第二の工程と、前記充填された樹脂ペーストを加熱硬化することにより配線基板と放熱板を接合する第三の工程と、前記放熱板の一面にダイボンド用接着剤を用いてＬＥＤチップを接合する第四の工程と、前記ＬＥＤチップと配線基板に内蔵したバリスタ素子を並列に接続する第五の工程と、前記ＬＥＤチップを透明樹脂を用いて埋設する第六の工程を有したＬＥＤ部品の製造方法。 A heat sink is formed by filling a through hole, a wiring pattern, and a varistor element on the wiring board, and filling the inside of the through hole of the wiring board with a resin paste containing a thermally conductive filler. The second step, the third step of bonding the wiring board and the heat sink by heat-curing the filled resin paste, and bonding the LED chip to one surface of the heat sink using a die bonding adhesive Manufacture of LED components having a fourth step, a fifth step of connecting the LED chip and the varistor element built in the wiring board in parallel, and a sixth step of embedding the LED chip using a transparent resin Method. 配線基板にバリスタ素子と貫通孔を形成する第一の工程と、前記配線基板の貫通孔の内部に熱伝導性フィラを主成分とし、低融点ガラスを無機バインダとする絶縁ペーストを充填する第二の工程と、前記充填された絶縁ペーストを焼成することにより放熱板の形成と配線基板との接合を行う第三の工程と、前記放熱板の一面にＬＥＤチップを実装するための電極パッドを有する配線パターンを形成する第四の工程と、この電極パッドの上にＬＥＤチップをバンプ接合することによって前記ＬＥＤチップと配線基板に内蔵したバリスタ素子を並列に接続する第五の工程と、前記ＬＥＤチップを透明樹脂を用いて埋設する第六の工程を有したＬＥＤ部品の製造方法。 A first step of forming a varistor element and a through-hole in the wiring substrate; and a second step of filling the inside of the through-hole of the wiring substrate with an insulating paste having a heat conductive filler as a main component and low-melting glass as an inorganic binder. A step of forming a heat sink and bonding the wiring board by firing the filled insulating paste, and an electrode pad for mounting an LED chip on one surface of the heat sink A fourth step of forming a wiring pattern; a fifth step of connecting the LED chip and the varistor element built in the wiring substrate in parallel by bump bonding the LED chip on the electrode pad; and the LED chip. The manufacturing method of the LED component which has the 6th process of embed | burying using transparent resin.
JP2005165112A 2005-04-01 2005-06-06 LED component and manufacturing method thereof Expired - Fee Related JP4915058B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005165112A JP4915058B2 (en) 2005-06-06 2005-06-06 LED component and manufacturing method thereof
US11/579,770 US20070200133A1 (en) 2005-04-01 2006-03-31 Led assembly and manufacturing method
PCT/JP2006/306798 WO2006106901A1 (en) 2005-04-01 2006-03-31 Led component and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005165112A JP4915058B2 (en) 2005-06-06 2005-06-06 LED component and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2006339559A JP2006339559A (en) 2006-12-14
JP2006339559A5 true JP2006339559A5 (en) 2008-07-10
JP4915058B2 JP4915058B2 (en) 2012-04-11

Family

ID=37559822

Family Applications (1)

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JP2005165112A Expired - Fee Related JP4915058B2 (en) 2005-04-01 2005-06-06 LED component and manufacturing method thereof

Country Status (1)

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JP (1) JP4915058B2 (en)

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JP4867511B2 (en) * 2006-07-19 2012-02-01 Ｔｄｋ株式会社 Varistor and light emitting device
JP4888225B2 (en) * 2007-03-30 2012-02-29 Ｔｄｋ株式会社 Varistor and light emitting device
WO2008129877A1 (en) * 2007-04-17 2008-10-30 Panasonic Corporation Led-mounting board
WO2008139981A1 (en) * 2007-05-09 2008-11-20 C.I. Kasei Company, Limited Light emitting device and package assembly for light emitting device
KR100999760B1 (en) * 2008-09-26 2010-12-08 엘지이노텍 주식회사 Lighting emitting device package and fabrication method thereof
DE112008004058T5 (en) * 2008-10-31 2013-02-28 Denki Kagaku Kogyo K.K. Substrate for light-emitting element package and light-emitting element package
KR101047801B1 (en) 2008-12-29 2011-07-07 엘지이노텍 주식회사 Light emitting device package and manufacturing method thereof
JP2012253048A (en) * 2010-02-26 2012-12-20 Sanyo Electric Co Ltd Electronic device
WO2011108227A1 (en) * 2010-03-01 2011-09-09 パナソニック株式会社 Substrate for light emitting element, method for manufacturing same, and light emitting device
JP5965158B2 (en) * 2012-02-20 2016-08-03 スタンレー電気株式会社 Light emitting device and manufacturing method thereof
DE102012104494A1 (en) 2012-05-24 2013-11-28 Epcos Ag light emitting diode device
JP5832956B2 (en) 2012-05-25 2015-12-16 株式会社東芝 Semiconductor light emitting device
EP2886933B1 (en) * 2012-07-23 2018-04-18 Guizhou Gzgps Co., Ltd Method for forming led bulb with high interchangeability and universality and integrated led bulb and lamp
DE102012113014A1 (en) * 2012-12-21 2014-06-26 Epcos Ag Component carrier and component carrier assembly
DE102014115375A1 (en) * 2014-08-08 2016-02-11 Epcos Ag Carrier for an LED
KR20160094755A (en) * 2015-02-02 2016-08-10 서울반도체 주식회사 Light emitting device
KR20180022714A (en) * 2015-06-29 2018-03-06 다츠다 덴센 가부시키가이샤 Composition for bonding a heat radiation material, a heat radiation material with an adhesive, an inlay substrate and a method for manufacturing the same
US20210359492A1 (en) * 2018-10-19 2021-11-18 Kyocera Corporation Optical element mounting package, electronic device, and electronic module

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JPH11186053A (en) * 1997-12-18 1999-07-09 Matsushita Electric Ind Co Ltd Composite component and its manufacture
JP3639428B2 (en) * 1998-03-17 2005-04-20 三洋電機株式会社 Light source device
JP2001015815A (en) * 1999-04-28 2001-01-19 Sanken Electric Co Ltd Semiconductor light-emitting device
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JP4211359B2 (en) * 2002-03-06 2009-01-21 日亜化学工業株式会社 Manufacturing method of semiconductor device
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