WO2006132794A3 - A light-emitting device module with flip-chip configuration on a heat-dissipating substrate - Google Patents

A light-emitting device module with flip-chip configuration on a heat-dissipating substrate Download PDF

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Publication number
WO2006132794A3
WO2006132794A3 PCT/US2006/019826 US2006019826W WO2006132794A3 WO 2006132794 A3 WO2006132794 A3 WO 2006132794A3 US 2006019826 W US2006019826 W US 2006019826W WO 2006132794 A3 WO2006132794 A3 WO 2006132794A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting device
substrate
heat
flip
Prior art date
Application number
PCT/US2006/019826
Other languages
French (fr)
Other versions
WO2006132794A2 (en
Inventor
Shen-Nan Tong
Original Assignee
Intex Recreation Corp
Shen-Nan Tong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intex Recreation Corp, Shen-Nan Tong filed Critical Intex Recreation Corp
Publication of WO2006132794A2 publication Critical patent/WO2006132794A2/en
Publication of WO2006132794A3 publication Critical patent/WO2006132794A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A light-emitting device module comprising a substrate, having a top metal surface and a bottom metal surface, a light-emitting device chip, a heat-dissipating unit, wherein the light-emitting device chip is flip-chip bonded onto the substrate through bonding bumps which serve as electrical and thermal conductors, the substrate has through-holes in its thickness, each through-hole being underneath a bonding bump and each hole being plated with metal on its inner wall or filled with a thermal-conductive medium, the heat-dissipating unit is joined onto the bottom metal surface of the substrate and the substrate has a cavity formed on the top surface to accommodate the light-emitting device chip and is filled with an encapsulating material for encapsulating the light-emitting device chip.
PCT/US2006/019826 2005-06-03 2006-05-22 A light-emitting device module with flip-chip configuration on a heat-dissipating substrate WO2006132794A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2005200839605U CN2814676Y (en) 2005-06-03 2005-06-03 Light-emitting diode packaging structure with groove substrate
CN200520083960.5 2005-06-03

Publications (2)

Publication Number Publication Date
WO2006132794A2 WO2006132794A2 (en) 2006-12-14
WO2006132794A3 true WO2006132794A3 (en) 2007-04-19

Family

ID=36949762

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/019826 WO2006132794A2 (en) 2005-06-03 2006-05-22 A light-emitting device module with flip-chip configuration on a heat-dissipating substrate

Country Status (2)

Country Link
CN (1) CN2814676Y (en)
WO (1) WO2006132794A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010110572A2 (en) * 2009-03-24 2010-09-30 Kim Kang Light-emitting diode package
CN102082220A (en) * 2009-11-27 2011-06-01 李学富 LED and manufacturing process thereof
CN101834175B (en) * 2010-05-13 2015-07-15 中节能晶和照明有限公司 LED lighting COB (Chip on Board) packaging structure and bubble sphere
CN101958390A (en) * 2010-08-13 2011-01-26 李刚 Light-emitting chip packaging structure
KR101144351B1 (en) * 2010-09-30 2012-05-11 서울옵토디바이스주식회사 wafer level LED package and fabrication method thereof
CN102447018A (en) * 2010-10-12 2012-05-09 柏腾科技股份有限公司 Improved combination structure and combining method of baseplate and heat dissipating structure
CN102376699A (en) * 2011-06-17 2012-03-14 杭州华普永明光电股份有限公司 LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof
CN102412246A (en) * 2011-06-17 2012-04-11 杭州华普永明光电股份有限公司 LED (Light-emitting diode) module based on metal matrix PCB (Printed Circuit Board) board and manufacture method thereof
CN102364684B (en) * 2011-06-17 2017-02-08 杭州华普永明光电股份有限公司 LED (Light-Emitting Diode) module and manufacturing process thereof
CN104124216A (en) * 2014-07-03 2014-10-29 天水华天科技股份有限公司 Substrate chip carrier CSP package and production method thereof
CN110391350B (en) * 2019-07-29 2022-08-05 云谷（固安）科技有限公司 Display panel and display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949772B2 (en) * 2001-08-09 2005-09-27 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949772B2 (en) * 2001-08-09 2005-09-27 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source

Also Published As

Publication number Publication date
WO2006132794A2 (en) 2006-12-14
CN2814676Y (en) 2006-09-06

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