CN201957334U - Aluminum-base circuit board - Google Patents
Aluminum-base circuit board Download PDFInfo
- Publication number
- CN201957334U CN201957334U CN2011200588123U CN201120058812U CN201957334U CN 201957334 U CN201957334 U CN 201957334U CN 2011200588123 U CN2011200588123 U CN 2011200588123U CN 201120058812 U CN201120058812 U CN 201120058812U CN 201957334 U CN201957334 U CN 201957334U
- Authority
- CN
- China
- Prior art keywords
- aluminum
- circuit board
- aluminium base
- base plate
- aluminum base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses an aluminum-base circuit board, which comprises an aluminum base plate, an insulating layer and a circuit layer. The circuit layer and the aluminum base plate are partitioned by the insulating layer, element pads and circuits are formed on the circuit layer, each ground pad of the element pads is provided with a communicating hole, the communicating hole is drilled from a pad surface to the aluminum base, penetrates through the insulating layer, extends into the aluminum base plate and is filled with a cooling material, and the ground pad is communicated with the aluminum base plate via the cooling material. Since the ground pads of the circuit layer are drilled with holes and the holes are filled with cooling materials communicated to the aluminum base plate to realize heat dissipation, heat dissipation effect of the circuit board in use is improved according to quick heat dissipation property of the aluminum base plate.
Description
Technical field
The utility model relates to a kind of metal base circuit board, especially a kind of aluminum-based circuit board.
Background technology
Existing wiring board, after it mounted components and parts, in actual use, its heat radiation realized that by natural heat dissipation and insulating barrier heat conduction radiating effect is not good.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of aluminum-based circuit board, utilizes the quick heat radiating characteristic of metal to strengthen radiating effect.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of aluminum-based circuit board, comprise aluminium base, insulating barrier and line layer, between line layer and the aluminium base by insulating barrier at interval, be formed with components and parts pad and circuit on this line layer, the self-brazing card is drilled with intercommunicating pore to aluminium base on the ground pad in the described components and parts pad, institute's intercommunicating pore of telling connects insulating barrier and stretches in the aluminium base, is filled with heat sink material in this intercommunicating pore, and this heat sink material is communicated with described ground pad to aluminium base.
As further improvement of the utility model, described heat sink material is a copper.
The beneficial effects of the utility model are: be communicated to aluminium base with heat radiation by punching on each ground pad of line layer and filling heat sink material, utilize the metal quick heat radiating characteristic of aluminium base itself, improve the radiating effect in the wiring board use.
Description of drawings
Fig. 1 is a cross-sectional view of the present utility model.
Embodiment
Embodiment: a kind of aluminum-based circuit board, comprise aluminium base 1, insulating barrier 2 and line layer 3, between line layer 3 and the aluminium base 1 by insulating barrier 2 at interval, be formed with components and parts pad and circuit on this line layer 3, the self-brazing card is drilled with intercommunicating pore to aluminium base 1 on the ground pad in the described components and parts pad, institute's intercommunicating pore of telling connects insulating barrier 2 and stretches in the aluminium base 1, is filled with heat sink material 4 in this intercommunicating pore, and this heat sink material 4 is communicated with described ground pad to aluminium base.
Described heat sink material 4 is a copper.
Claims (2)
1. aluminum-based circuit board, comprise aluminium base (1), insulating barrier (2) and line layer (3), between line layer (3) and the aluminium base (1) by insulating barrier (2) at interval, this line layer is formed with components and parts pad and circuit on (3), it is characterized in that: the self-brazing card is drilled with intercommunicating pore to aluminium base (1) on the ground pad in the described components and parts pad, institute's intercommunicating pore of telling connects insulating barrier (2) and stretches in the aluminium base (1), be filled with heat sink material (4) in this intercommunicating pore, this heat sink material (4) is communicated with described ground pad to aluminium base.
2. aluminum-based circuit board according to claim 1 is characterized in that: described heat sink material (4) is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200588123U CN201957334U (en) | 2011-03-08 | 2011-03-08 | Aluminum-base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200588123U CN201957334U (en) | 2011-03-08 | 2011-03-08 | Aluminum-base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201957334U true CN201957334U (en) | 2011-08-31 |
Family
ID=44501435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200588123U Expired - Fee Related CN201957334U (en) | 2011-03-08 | 2011-03-08 | Aluminum-base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201957334U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686008A (en) * | 2011-03-08 | 2012-09-19 | 昆山市华升电路板有限公司 | Aluminum-based circuit board |
-
2011
- 2011-03-08 CN CN2011200588123U patent/CN201957334U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686008A (en) * | 2011-03-08 | 2012-09-19 | 昆山市华升电路板有限公司 | Aluminum-based circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201878420U (en) | Radiating PCB (printed circuit board) structure | |
| CN207625867U (en) | A kind of good copper base of heat dissipation | |
| TWM507138U (en) | Heat dissipation circuit board | |
| US20160007440A1 (en) | Heat channeling and dispersing structure and manufacturing method thereof | |
| CN106876554A (en) | A kind of high-heat-dispersion LED surface-mounted integrated circuit | |
| CN102781164B (en) | Novel special circuit board for LED (light-emitting diode) lighting fixture | |
| CN201957334U (en) | Aluminum-base circuit board | |
| CN201774736U (en) | Flexible circuit board with heat dissipation structure | |
| US20130313606A1 (en) | Illuminating device | |
| CN102686008A (en) | Aluminum-based circuit board | |
| CN201733513U (en) | Device for heat dissipation of printed board | |
| CN201925886U (en) | Heat-dissipation structure based on thermoelectric separation LED (light-emitting diode) lamp | |
| CN204966543U (en) | Novel composite metal material base plate | |
| CN201947540U (en) | Aluminum base copper-clad laminate (CCL) | |
| CN204408745U (en) | Novel patch encapsulating structure | |
| CN202425193U (en) | Aluminium-based circuit board | |
| CN208028050U (en) | A kind of spliced uniform-temperature plate heat dissipating device | |
| CN206806361U (en) | A kind of high-heat-dispersion LED surface-mounted integrated circuit | |
| CN208353691U (en) | A kind of double-sided wiring board of perfect heat-dissipating | |
| CN201518324U (en) | Aluminum base plate without thermal resistance | |
| CN205912420U (en) | Heat dissipation device | |
| CN207926528U (en) | A kind of effective mounting structure of power amplification | |
| CN205755048U (en) | A kind of multilayer printed circuit board | |
| CN203560869U (en) | LED and PCB (printed circuit board) combined double-face conduction radiator | |
| CN202535645U (en) | High-power led circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160627 Address after: 215341 Suzhou city in Jiangsu province Kunshan City Qiandeng Fumin Industrial Development Zone Patentee after: Kunshan Huasheng circuit board research and development base Co Ltd Address before: Henderson Fumin Industrial Zone, Kunshan Road, Qiandeng Town Suzhou city Jiangsu province 215341 No. 198 Patentee before: Kunshan Huasheng Printed Circuit Board Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20180308 |