CN107278062B - A kind of high frequency board manufacturing method of difference plate mixed pressure - Google Patents
A kind of high frequency board manufacturing method of difference plate mixed pressure Download PDFInfo
- Publication number
- CN107278062B CN107278062B CN201710593847.9A CN201710593847A CN107278062B CN 107278062 B CN107278062 B CN 107278062B CN 201710593847 A CN201710593847 A CN 201710593847A CN 107278062 B CN107278062 B CN 107278062B
- Authority
- CN
- China
- Prior art keywords
- copper
- layers
- high frequency
- plate
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of high frequency board manufacturing methods of different plate mixed pressures, the high frequency plate and epoxy resin board for selecting double-sided copper-clad are made, pressing medium using not gummosis PP piece as high frequency plate and epoxy resin board, and the slot size of not gummosis PP on piece is specially designed, to solve the problems, such as slot excessive glue, to improve the processing quality of product；In addition, the present invention also specially devises the lamination process to drill to high frequency plate；Moreover, aiming at the problem that pressing has plate recess after slotting in high frequency plate technique, it has been specifically designed pressing stack, three-in-one cushion etc. is used to solve the problems, such as fluting side plate material recess, and hot pressing formula is devised according to its one step of pressing stack, while using the extension cold pressing time to further decrease because different plate harmomegathus coefficients are different to lead to plate benging the problem of；Due to there is the filler for not easily passing through chemical degumming mode and removing in high frequency plate, before being electroplated, first carries out plasma and remove glue, then use chemical degumming, sufficiently clean, to effectively improve electroplating quality.
Description
Technical field
The present invention relates to wiring board production field more particularly to a kind of high frequency board manufacturing methods of different plate mixed pressures.
Background technique
With mobile and data communication development, mobile communications network is gradually developed from 4G to 5G, with regard to equipment structure and
Speech, has gradually abandoned the design structure of traditional indoor all-in-one machine, and it is smaller and tear that shifting is easy to receive open to develop into existing volume
Split type structure of the sender in outdoor (ODU), modulation /demodulation and baseband interface (IDU) indoors.Especially marine vessel is logical
The needs of letter, the requirement for microwave telecommunication devices communication distance develop from short haul connection to long haul communication, drive microwave
The transmission capacity and interface mode of communication equipment also can with the development of network smooth upgrade, to reduce the investment of operator.
For the needs for reaching high-speed remote Distance Transmission signal, it is also required to as the PCB of the mother of electronic product using special type
High frequency, high-speed material production.But this special material still belongs to the external monopolization stage at present, and price is very expensive.To reach letter
Number transmission is complete, and the purpose of save the cost, it will usually using high frequency plate+common plate mixed pressure design scheme, for day
Position below line, it is also necessary to common plate discharge position be slotted, to reach complete signal transmission.Due to high frequency plate and commonly
Plate, harmomegathus characteristic is different, and plate song, the more difficult to govern control of harmomegathus, in addition the plate of this type needs first to slot and press again, but presses after slotting
Credit union have plate be recessed risk, and between high frequency plate and common plate PP pressing when, gummosis can more difficult to govern control, lead to slot
Surrounding has residue glue, influences the quality of product.
At present PCB producer using by way of constantly adjusting pressing formula it is expected to solve the above problems, and it is high
It is higher that resin properties in frequency plate require temperature rise when pressing, and solidification temperature is higher, heating rate 3.2-4.2 DEG C/
200 DEG C of min, solidification temperature > or more, thus press formula adjustment space it is limited and simple adjustment pressing formula produce effects very
It is micro-.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of high frequency board manufacturing method of different plate mixed pressures, this can be effectively improved
The processing quality of product, comprising the following steps:
A. the high frequency plate that a two sides is covered with L1 layers of copper, L2 layers of copper respectively is provided, a two sides is covered with L3 layers of copper, L4 copper respectively
The epoxy resin board of layer, a not gummosis PP piece；
B. sawing sheet, drilling are carried out to the high frequency plate, epoxy resin board, then to the L2 layers of copper and ring on high frequency plate
L3 layers of copper on oxygen resin plate carries out route production, the inspection of line；In the route production for carrying out L2 layers of copper, correspondence is designed at L1
The predeterminated position of antenna in layers of copper etches no copper region unit；After the route of L2 layers of copper completes, palm fibre is carried out to L2 layers of copper
Change；
With no copper region unit corresponding position groove milling hole on epoxy resin board, slot on epoxy resin board with it is corresponding
Geomery without copper region unit is consistent, and runs through L3 layers of copper, L4 layers of copper；Then brownification is carried out to L3 layers of copper；
Sawing sheet, drilling are carried out to the not gummosis PP piece；It is milled in not gummosis PP on piece position corresponding with no copper region unit
Slot, the slot of gummosis PP on piece is not big 0.1-0.3mm more unilateral than corresponding no copper region unit；
C. according to L1 layers of copper, high frequency plate, L2 layers of copper, not gummosis PP piece, L3 layers of copper, epoxy resin board, L4 layers of copper it is suitable
Sequence is stacked gradually from top to bottom and is pressed；In L2 layers of copper without copper region unit be set to not gummosis PP piece and epoxy resin
Corresponding slot on plate forms the control deep trouth from L4 layers of copper to L2 layers of copper；
D. after the completion of pressing, L1 layers of copper, L4 layers of copper is ground, drilled, are electroplated, then L1 layers of copper, L4 layers of copper are carried out
Route production, the inspection of line, the production of antenna is completed when carrying out route production to L1 layers of copper.
Preferably, in stepb, when drilling to high frequency plate, phenolic resin plate is laminated on high frequency plate two sides, and
It folds an aluminium flake again on the phenolic resin plate being laminated in above high frequency plate, then carries out drilling processing.
Preferably, it when carrying out step C, before pressing, below L4 layers of copper, from top to bottom stacks gradually three-in-one slow
Rush material, steel plate, brown paper；Above L1 layers of copper, aluminium flake, steel plate, brown paper are stacked gradually from the bottom to top, then pressed.
Further, the three-in-one fender is made by pressing from both sides a fender overlapping among two release films.
Further, in step C, when being pressed, hot pressing is first carried out, then be cold-pressed；The hot pressing includes 9 sections
Formula, the corresponding pressing pressure of every section of formula be followed successively by 70psi, 200psi, 350psi, 420psi, 420psi, 420psi,
420psi, 240psi, 140psi, the corresponding pressing-in temp of every section of formula are followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 220
DEG C, 220 DEG C, 220 DEG C, 180 DEG C, 140 DEG C, the corresponding pressing time of every section of formula be followed successively by 5min, 5min, 5min, 5min,
8min、50min、120min、15min、10min。
Further, it carries out first being vacuumized when hot pressing, pumpdown time 3min reaches 50mBar.
Further, the cold pressing is to be pressed at normal temperature, pressing time 1.5 hours.
Preferably, the high frequency plate is hydrocarbon tie-plate material or ceramic tie-plate material or hydrocarbon ceramic mixed stocker plate.
Preferably, in step D, before L1 layers of copper, L4 layers of copper being electroplated, a plasma is first carried out except glue, then into
Capable primary or secondary levels chemical degumming, to guarantee electroplating quality.
Preferably, further include step E, carried out after the completion of step D anti-welding, text, surface treatment, molding, test, FQC,
Packaging, is made high frequency panel products;Super roughening or sandblasting are carried out before anti-welding to handle copper face, guarantee anti-welding binding force.
The present invention provides a kind of high frequency board manufacturing method of different plate mixed pressures, select double-sided copper-clad high frequency plate and
Epoxy resin board is made, the pressing medium using not gummosis PP piece as high frequency plate and epoxy resin board, and design is special
Production process, and the slot size of not gummosis PP on piece is improved, to solve the problems, such as slot excessive glue, reduces product
Manufacture difficulty improves the processing quality of product；In addition, the present invention also specially devises the stacking work to drill to high frequency plate
Skill can effectively reduce drilling burr, improve borehole accuracy；Moreover, plate is had for pressing after slotting in high frequency plate technique
The problem of material recess, it is specifically designed pressing stack, has used three-in-one cushion etc. and be recessed with the side plate material that solves the problems, such as to slot,
And hot pressing formula is further devised according to the material processing characteristics of its pressing stack and high frequency plate, while being cold-pressed using extending
The method of time further avoids in temperature-fall period because different plate harmomegathus coefficients are different leads to plate benging the problem of；By
Exist in high frequency plate and not easily pass through the filler that chemical degumming mode removes, before being electroplated, first carries out plasma and remove glue,
Chemical degumming is used again, is sufficiently cleaned, to effectively improve electroplating quality.By the improvement of above-mentioned production method, mention on the whole
High yield quality.
Detailed description of the invention
Fig. 1 is the high frequency board manufacturing method embodiment pressing stack schematic diagram of different plate mixed pressures provided by the invention.
Specific embodiment
Technology contents of the invention are understood for convenience of those skilled in the art, with reference to the accompanying drawings and embodiments to this hair
It is bright to be described in further detail.
In the high frequency plate of different plate mixed pressures of the production for communicating, following steps are specifically used:
A. a high frequency plate and an epoxy resin board are selected, high frequency plate two sides is covered with L1 layers of copper, L2 layers of copper, epoxy respectively
Resin plate two sides is covered with L3 layers of copper, L4 layers of copper respectively；Hydrocarbon tie-plate material or ceramic tie-plate material or hydrocarbon pottery may be selected in high frequency plate
Porcelain mixed stocker plate；The preferred FR-4 plate of epoxy resin board.
B. sawing sheet, drilling are carried out to high frequency plate, epoxy resin board;It, need to be in height when carrying out drilling processing to high frequency plate
Phenolic resin plate is laminated in frequency plate two sides, and folds one layer of aluminium flake again on the phenolic resin plate of boring direction, then carries out drilling and add
Work improves drilling hole position accuracy to improve drilling burr.Special parameter need to be used according to bore diameter when drilling, such as following table institute
Show.
Then the L3 layers of copper to the L2 layers of copper on high frequency plate and on epoxy resin board carries out route production, the inspection of line；
In the route production for carrying out L2 layers of copper, the predeterminated position of the corresponding antenna being designed in L1 layers of copper etches no copper region unit；
After the route of L2 layers of copper completes, brownification is carried out to L2 layers of copper；
With no copper region unit corresponding position groove milling hole on epoxy resin board, slot on epoxy resin board with it is corresponding
Geomery without copper region unit is consistent, and runs through L3 layers of copper, L4 layers of copper；Then brownification is carried out to L3 layers of copper；
Sawing sheet, drilling are carried out to not gummosis PP piece；In not gummosis PP on piece and no copper region unit corresponding position groove milling hole,
The slot of gummosis PP on piece is not big 0.15mm more unilateral than corresponding no copper region unit, excessive glue when preventing pressing；
To high frequency plate, epoxy resin board, the working process of gummosis PP piece can not carry out independently, can also successively into
Row, preferably carries out the brownification of L2 layers of copper, L3 layers of copper, the binding force of subsequent pressing can be improved in brownification simultaneously.
C. according to L1 layers of copper 1, high frequency plate a, L2 layers of copper 2, not gummosis PP piece b, L3 layers of copper 3, epoxy resin board c, L4 copper
The sequence of layer 4, stacks gradually from top to bottom and is pressed；In L2 layers of copper without copper region unit 21 be set to not gummosis PP piece b
The control deep trouth d from L4 layers of copper 4 to L2 layers of copper 2 is formed with the corresponding slot on epoxy resin board c, control deep trouth d is corresponding to be located at L1
The lower section of antenna predeterminated position in layers of copper 1 reaches complete signal transmission in order to improve antenna performance.
Before pressing, below L4 layers of copper 4, three-in-one fender 6, steel plate 71, brown paper are from top to bottom stacked gradually
81；Above L1 layers of copper, aluminium flake 5, steel plate 72, brown paper 82 are stacked gradually from the bottom to top, are carried out again after completing this pressing stack
Pressing, pressing stack are as shown in Figure 1.Three-in-one fender is made by pressing from both sides a fender overlapping among two release films.
Wherein brown paper plays the role of compensator or trimmer pressure, uniformly transfer heat, can guarantee that pressing is smooth using steel plate, plate thickness is equal
It is even.It may make the thermally conductive quickening of the side using aluminium flake in high frequency plate side, so that high frequency plate and epoxy resin board is heated
Generate difference, so as to improve high frequency plate and epoxy resin board when carrying out hot pressing because caused by harmomegathus coefficient difference plate face it is curved
Qu Wenti；Using three-in-one fender, the heat transfer efficiency of epoxy resin board side is on the one hand reduced, another aspect release film plays
The effect of isolation production plate at high temperature, and fender plays effective filling effect.Three-in-one fender must be put when pressing
In the one side of fluting, pressing, fender be can be filled into support is formed in slot, to avoid depression problem, and three-in-one buffering
The release film on material surface is flat and smooth, and when pre- folded pressing stack is easy to install, is also easy to remove after the completion of pressing.
For the pressing stack, when being pressed, hot pressing is first carried out；The hot pressing includes 9 sections of formulas, according to high frequency plate
Heating rate required by resin properties in material is in 3.2-4.2 DEG C/min, and 200 DEG C of solidification temperature > or more, and combine pressing
The design of folded structure, the corresponding pressing pressure of every section of formula be followed successively by 70psi, 200psi, 350psi, 420psi, 420psi,
420psi, 420psi, 240psi, 140psi, the corresponding pressing-in temp of every section of formula are followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180
DEG C, 220 DEG C, 220 DEG C, 220 DEG C, 180 DEG C, 140 DEG C, the corresponding pressing time of every section of formula be followed successively by 5min, 5min, 5min,
5min,8min,50min,120min,15min,10min；It also needs to vacuumize before hot pressing, pumpdown time 3min reaches
50mBar。
It being cold-pressed after the completion of hot pressing, cold pressing is to be pressed at normal temperature, pressing time 1.5 hours, compared to generalIt is logicalRing
Wiring board made of oxygen resin plate, cold pressing time substantially extend, and improve high frequency plate and epoxy resin board after cooling because of harmomegathus
Plate face buckling problem caused by coefficient is different.
D. after the completion of pressing, L1 layers of copper, L4 layers of copper is ground, drilled, are electroplated, then L1 layers of copper, L4 layers of copper are carried out
Route production, the inspection of line, the production of antenna is completed when carrying out route production to L1 layers of copper.L1 layers of copper, L4 layers of copper are carried out
Before plating, first carries out a plasma and remove glue, it is sufficiently clear by the filler that chemical degumming mode removes is not easily passed through in high frequency plate
It is clean, then primary or secondary levels chemical degumming is carried out, to guarantee electroplating quality.
E. anti-welding, text, surface treatment, molding, test, FQC, packaging are carried out after the completion of step D, the production of high frequency plate is made
Product;Super roughening or sandblasting are carried out before anti-welding to handle copper face, guarantee anti-welding binding force.
The above are specific implementations of the invention, and the description thereof is more specific and detailed, but it cannot be understood as
Limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not departing from this hair
Under the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to of the invention
Protection scope.
Claims (8)
1. a kind of high frequency board manufacturing method of difference plate mixed pressure, comprising the following steps:
A. the high frequency plate that a two sides is covered with L1 layers of copper, L2 layers of copper respectively is provided, a two sides is covered with L3 layers of copper, L4 layers of copper respectively
Epoxy resin board, a not gummosis PP piece；
B. sawing sheet, drilling are carried out to the high frequency plate, epoxy resin board, then to the L2 layers of copper and asphalt mixtures modified by epoxy resin on high frequency plate
L3 layers of copper on rouge plate carries out route production, the inspection of line；In the route production for carrying out L2 layers of copper, correspondence is designed at L1 layers of copper
On the predeterminated position of antenna etch no copper region unit；After the route of L2 layers of copper completes, brownification is carried out to L2 layers of copper；?
With no copper region unit corresponding position groove milling hole on epoxy resin board, slot on epoxy resin board and corresponding no copper region unit
Geomery it is consistent, and run through L3 layers of copper, L4 layers of copper；Then brownification is carried out to L3 layers of copper；The not gummosis PP piece is carried out
Sawing sheet, drilling；In not gummosis PP on piece and no copper region unit corresponding position groove milling hole, the slot of gummosis PP on piece is not than corresponding to
Without the unilateral big 0.1-0.3mm of copper region unit；
C. according to L1 layers of copper, high frequency plate, L2 layers of copper, not gummosis PP piece, L3 layers of copper, epoxy resin board, L4 layers of copper sequence, from
It stacks gradually and is pressed under；In L2 layers of copper without copper region unit be set to not on gummosis PP piece and epoxy resin board
Corresponding slot forms the control deep trouth from L4 layers of copper to L2 layers of copper；When carrying out step C, before pressing, below L4 layers of copper, by
Three-in-one fender, steel plate, brown paper are stacked gradually under；Above L1 layers of copper, aluminium flake, steel are stacked gradually from the bottom to top
Plate, brown paper, then pressed；The three-in-one fender by pressing from both sides a fenders overlapping production among two release films and
At；
D. after the completion of pressing, L1 layers of copper, L4 layers of copper is ground, drilled, are electroplated, then route is carried out to L1 layers of copper, L4 layers of copper
The production of antenna is completed in production, the inspection of line when carrying out route production to L1 layers of copper.
2. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 1, it is characterised in that: in stepb, right
When high frequency plate is drilled, phenolic resin plate is laminated on high frequency plate two sides, and in the phenolic aldehyde being laminated in above high frequency plate
An aluminium flake is folded on resin plate again, then carries out drilling processing.
3. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 1, it is characterised in that: in step C, into
When row pressing, hot pressing is first carried out, then be cold-pressed；The hot pressing include 9 sections of formulas, the corresponding pressing pressure of every section of formula according to
Secondary is 70psi, 200psi, 350psi, 420psi, 420psi, 420psi, 420psi, 240psi, 140psi, every section of formula pair
The pressing-in temp answered is followed successively by 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 220 DEG C, 220 DEG C, 220 DEG C, 180 DEG C, 140 DEG C, every section
The corresponding pressing time of formula is followed successively by 5min, 5min, 5min, 5min, 8min, 50min, 120min, 15min, 10min.
4. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 3, it is characterised in that: carry out needing elder generation when hot pressing
It is vacuumized, pumpdown time 3min reaches 50mBar.
5. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 3, it is characterised in that: the cold pressing is normal
It is pressed under temperature, pressing time 1.5 hours.
6. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 1, it is characterised in that: the high frequency plate
For hydrocarbon tie-plate material or ceramic tie-plate material or hydrocarbon ceramic mixed stocker plate.
7. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 1, it is characterised in that: in step D, right
Before L1 layers of copper, L4 layers of copper are electroplated, first carry out a plasma and remove glue, then carry out primary or secondary levels chemical degumming, with
Guarantee electroplating quality.
8. the high frequency board manufacturing method according to difference plate mixed pressure described in claim 1, it is characterised in that: it further include step E,
Anti-welding, text, surface treatment, molding, test, FQC, packaging are carried out after the completion of step D, high frequency panel products are made；Anti-welding advance
Row surpasses roughening or sandblasting to handle copper face, guarantees anti-welding binding force.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593847.9A CN107278062B (en) | 2017-07-20 | 2017-07-20 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
| KR1020197010096A KR102175303B1 (en) | 2017-07-20 | 2017-07-26 | Method for manufacturing high frequency substrate in which different plate materials are mixed and compressed |
| PCT/CN2017/094434 WO2019014956A1 (en) | 2017-07-20 | 2017-07-26 | Method for manufacturing high-frequency board by mixing and pressing different board materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593847.9A CN107278062B (en) | 2017-07-20 | 2017-07-20 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107278062A CN107278062A (en) | 2017-10-20 |
| CN107278062B true CN107278062B (en) | 2019-07-02 |
Family
ID=60079344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710593847.9A Active CN107278062B (en) | 2017-07-20 | 2017-07-20 | A kind of high frequency board manufacturing method of difference plate mixed pressure |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102175303B1 (en) |
| CN (1) | CN107278062B (en) |
| WO (1) | WO2019014956A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107896426A (en) * | 2017-10-20 | 2018-04-10 | 泰州市博泰电子有限公司 | A kind of preparation method for high-frequency high-speed PVD composite mixed pressure wiring boards |
| CN108966530A (en) * | 2018-08-15 | 2018-12-07 | 恩达电路(深圳)有限公司 | Rigid Flex is laminated production method |
| CN109005645A (en) * | 2018-08-30 | 2018-12-14 | 广合科技（广州）有限公司 | A kind of production method of the double electric thick gold finger of PCB |
| CN110337201B (en) * | 2019-06-14 | 2021-11-16 | 珠海崇达电路技术有限公司 | Method for improving mixed pressing plate pressing cavity |
| CN111132474A (en) * | 2019-12-27 | 2020-05-08 | 广东科翔电子科技股份有限公司 | High-frequency board and laminating method thereof |
| CN110831355B (en) * | 2020-01-13 | 2020-04-10 | 智恩电子(大亚湾)有限公司 | Preparation method of printed circuit board of 5G base station coupler |
| CN111182732B (en) * | 2020-02-28 | 2023-01-10 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN111970858B (en) * | 2020-07-14 | 2022-04-15 | 深圳崇达多层线路板有限公司 | High-offset rigid-flex PCB and manufacturing method thereof |
| CN113950205B (en) * | 2020-07-16 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method, copper-clad plate processing method and circuit board |
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
| CN112218433B (en) * | 2020-09-30 | 2021-10-26 | 生益电子股份有限公司 | Mixed-compression PCB (printed circuit board) glue removing process |
| CN112261791B (en) * | 2020-11-02 | 2021-10-26 | 生益电子股份有限公司 | Glue removing method for mixed-compression PCB |
| CN113543472A (en) * | 2021-06-16 | 2021-10-22 | 昆山沪利微电有限公司 | Composite circuit board and manufacturing method thereof |
| CN114126215A (en) * | 2021-11-08 | 2022-03-01 | 昆山沪利微电有限公司 | 4D vehicle-mounted radar PCB and manufacturing method thereof |
| CN114286542A (en) * | 2021-12-06 | 2022-04-05 | 龙南骏亚柔性智能科技有限公司 | Laminating method of OLED circuit board |
| CN114340214A (en) * | 2021-12-14 | 2022-04-12 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN114585152A (en) * | 2022-03-30 | 2022-06-03 | 生益电子股份有限公司 | Printed circuit board and preparation method thereof |
| CN115038260A (en) * | 2022-07-06 | 2022-09-09 | 诚亿电子（嘉兴）有限公司 | Method for manufacturing high-frequency PCB with asymmetric stacking design |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
| CN102333415A (en) * | 2011-09-19 | 2012-01-25 | 华为技术有限公司 | PCB (printed circuit board) and base station communication equipment |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN103687347A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Manufacturing method of partial hybrid printed circuit board |
| CN105392306A (en) * | 2015-11-27 | 2016-03-09 | 北大方正集团有限公司 | High-frequency blind slot circuit board and processing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033419A (en) * | 2000-07-14 | 2002-01-31 | Sharp Corp | High-frequency module and manufacturing method therefor |
| CN105451450A (en) * | 2015-12-14 | 2016-03-30 | 深圳崇达多层线路板有限公司 | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow |
| CN205946357U (en) * | 2016-08-18 | 2017-02-08 | 东莞市五株电子科技有限公司 | Third -order on blind hole high frequency mixes clamp plate |
| CN205946336U (en) * | 2016-08-18 | 2017-02-08 | 东莞市五株电子科技有限公司 | High frequency mixes clamp plate |
-
2017
- 2017-07-20 CN CN201710593847.9A patent/CN107278062B/en active Active
- 2017-07-26 KR KR1020197010096A patent/KR102175303B1/en active IP Right Grant
- 2017-07-26 WO PCT/CN2017/094434 patent/WO2019014956A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
| CN102333415A (en) * | 2011-09-19 | 2012-01-25 | 华为技术有限公司 | PCB (printed circuit board) and base station communication equipment |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN103687347A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Manufacturing method of partial hybrid printed circuit board |
| CN105392306A (en) * | 2015-11-27 | 2016-03-09 | 北大方正集团有限公司 | High-frequency blind slot circuit board and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107278062A (en) | 2017-10-20 |
| KR20190049817A (en) | 2019-05-09 |
| WO2019014956A1 (en) | 2019-01-24 |
| KR102175303B1 (en) | 2020-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107278062B (en) | A kind of high frequency board manufacturing method of difference plate mixed pressure | |
| CN102395249B (en) | Manufacturing method of four-layer copper-based metal plate | |
| CN103722807A (en) | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof | |
| CN104780702B (en) | A kind of forming method of quick heat radiating high frequency mixed pressure wiring board | |
| CN106132081B (en) | A kind of high-frequency high-speed PCB and preparation method thereof | |
| CN105430941B (en) | A kind of technique for improving thick copper coin pressing white edge | |
| CN103260350B (en) | Blind buried via hole plate compression method | |
| CN102686029A (en) | Method for manufacturing blind slot of circuit board | |
| CN107613642B (en) | The production method of the burying capacitance circuit board containing stepped groove | |
| CN108811375A (en) | A kind of processing of multi-layer PCB blind slot gasket and fill method | |
| CN205255668U (en) | Low dielectricity glued membrane | |
| CN106488666A (en) | A kind of resistance gluing method for PCB blind slot | |
| CN107835590A (en) | A kind of preparation method of buried via hole circuit board | |
| CN205429174U (en) | Array antenna of low thermal resistance connectorless feed | |
| CN102638935A (en) | Production method of green environment-friendly flexible printed circuit (FPC) antenna | |
| CN101699930A (en) | Glue filling and laminating method of circuit board | |
| CN103025066B (en) | A kind of preparation method of metal base single-sided doubling plate | |
| CN107548244A (en) | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based | |
| CN105216400A (en) | High-thermal conductive metal base plate resin filler method, vacuum pressing-combining structure and metal substrate | |
| CN110418520A (en) | A kind of partial hybrid substrate of 5G high frequency circuit board and preparation method thereof | |
| CN111148361A (en) | Method for manufacturing copper-based sandwich board through glue filling | |
| CN106182989A (en) | Processing method, laminate and the pcb board of edges of boards gummosis uniform PCB layer pressing plate | |
| CN205946357U (en) | Third -order on blind hole high frequency mixes clamp plate | |
| US7504148B2 (en) | Printed circuit board structure and manufacturing method thereof | |
| CN113910738A (en) | Copper-clad plate processing technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |