CN111132474A - High-frequency board and laminating method thereof - Google Patents
High-frequency board and laminating method thereof Download PDFInfo
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- CN111132474A CN111132474A CN201911373645.9A CN201911373645A CN111132474A CN 111132474 A CN111132474 A CN 111132474A CN 201911373645 A CN201911373645 A CN 201911373645A CN 111132474 A CN111132474 A CN 111132474A
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- layer
- plate
- frequency
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- laminating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a high-frequency board and a laminating method thereof, which comprises a core board, an insulating substrate PP and a copper foil, wherein the number of the core boards is two, and L1/L2 and L3/L4 are respectively one core board and are used for manufacturing L2 layers and L3 layers of circuits; the copper foil is a plate with copper foil, and two insulation substrates PP are used for bonding and pressing in the middle. On the basis of the existing high-frequency board, 2 core boards are adopted for pressing. The uniformity of each dielectric layer can be effectively ensured, the plate thickness tolerance can be controlled within the range of +/-5%, the copper foil is self-contained in the plate, the requirement of the binding force can be met after browning treatment before lamination, and the risk of lamination and plate explosion lamination can be avoided. The problem of the requirement on the thickness of the dielectric layer of the high-frequency plate is effectively solved, and the plate explosion layering risk is effectively controlled.
Description
Technical Field
The invention relates to the field of circuit board processing and manufacturing, in particular to a high-frequency board and a laminating method thereof.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. The PCB is electrically connected among all elements, and the printed circuit board consists of an insulating bottom plate, connecting wires and welding pads for assembling and welding electronic elements and has double functions of a conducting wire and the insulating bottom plate. However, in the prior art, a conventional 4-layer PCB is formed by laminating 1 core board + PP and copper foil, and the sequence of lamination and lamination is as follows: copper foil → PP → core → PP → copper foil. The process is as follows: cutting → inner layer wet film → inner layer etching → inner layer AOI → brown oxidation → pre-stack → press-fit → gong side → edging → transfer process. The conventional pressing mode has the advantages of mature process flow and low processing cost, but the conventional pressing mode is not enough for a high-frequency plate, and the main problems are that the high-frequency plate bears the function of signal rapid transmission, the requirement on the thickness uniformity of the plate in the laminating process is very high, the whole pressing uniformity can be controlled within +/-8 percent, but the dielectric layers have the condition of thick one side and thin one side; the copper foil of the high-frequency plate is RTF copper foil, the copper teeth are 3 mu m, specific copper foil and PP are needed for pressing, the pressing program and the press have specific requirements, the bonding force of pressing cannot be guaranteed, and the problems of plate explosion and delamination exist.
Disclosure of Invention
In order to solve the technical problems that the high-frequency plate is laminated by adopting the common laminating technology, the thickness uniformity of the laminated plate cannot meet the requirement, and the laminating binding force is poor, so that the plate is broken and laminated, the invention provides the high-frequency plate and the laminating method thereof.
A high-frequency board comprises two core boards, an insulating substrate PP and copper foil, wherein the two core boards are respectively L1/L2 and L3/L4 and are used for manufacturing L2 layers and L3 layers of circuits; the copper foil is a plate with copper foil, and two insulation substrates PP are used for bonding and pressing in the middle.
Further, the invention also provides a method for manufacturing the high-frequency plate, which comprises the following steps:
s1: preparing to synchronously manufacture an L1/L2 layer and an L3/L4 layer;
s2: respectively cutting the L1/L2 layer and the L3/L4 layer, covering a double-sided copper plate, and transferring to S3;
s3: exposing the whole surfaces of the inner layer wet film, the L1 layer and the L4 layer, making a circuit of an L2 layer and an L3 layer, and transferring to S4;
s4: etching the inner layer, making inner layer circuits of the L2 layer and the L3 layer, reserving copper surfaces of the L1 layer and the L4 layer, and turning into S5;
s5: and respectively carrying out inner layer AOI on the two core plates, and transferring to a laminating procedure.
Preferably, the lamination procedure comprises the steps of:
browning SS1, transferring into SS 2;
SS 2: pre-stacking, and transferring into SS 3;
SS 3: laminating, and transferring into SS 4;
SS 4: routing edges and switching to SS 5;
SS 6: turning to the next procedure.
Preferably, the roughness value of the copper surface is monitored after the browning, the surface roughness value Rz is 0.8-1.2 mu m, and the average dividing and board beating precision is +/-0.03 mm.
Preferably, an OEM press with a pressing accuracy of ± 0.05mm is used.
Preferably, steel plates with a uniformity of >98% are selected for pressing.
Preferably, the high-frequency board pressing method further comprises an alignment test module designed at four corners of the board edge and used for monitoring the alignment degree between the layers, wherein the layer deflection precision value is +/-0.05 mm-0.08 mm.
Preferably, the high-frequency board laminating method further includes an electrical performance testing module for testing the phase and amplitude of the high-frequency board.
Preferably, the phase is less than or equal to 5 degrees, the phase difference between the plates is less than or equal to 8 degrees, the amplitude deviation value is less than or equal to 0.6dB, and the amplitude between the plates is less than or equal to 08 dB.
The high-frequency board and the laminating method thereof provided by the invention are based on the conventional laminating of 1 core board of 4 layers of boards, two core boards are adopted for laminating instead, because the core boards are solidified, the uniformity of each dielectric layer can be effectively ensured, the board thickness tolerance can be controlled within the range of +/-5%, and because the copper foils are self-carrying copper foils of the board, the requirement of the binding force can be met after the browning treatment before the laminating, and the risk of laminating, cracking and layering of the board can be avoided. The requirements on the thickness of the dielectric layer of the high-frequency plate and the plate explosion layering risk are effectively met.
Drawings
Fig. 1 is a flowchart of a high-frequency board laminating method according to an embodiment of the invention.
Fig. 2 is a schematic diagram of the high-frequency board according to the embodiment of the invention.
Detailed Description
The core of the invention is to provide a high-frequency plate and a laminating method thereof, which are improved on the basis of the conventional high-frequency plate and the manufacture thereof, effectively ensure the uniformity of each dielectric layer and avoid the risk of lamination and plate explosion delamination. The requirements on the thickness of the dielectric layer of the high-frequency plate and the plate explosion layering risk are effectively met.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention designs a high-frequency plate which comprises two core plates, an insulating substrate PP and copper foils.
Because the high-frequency material uses special RTF copper foil, the tension of the copper foil laminated by the common 4-layer manufacturing method can not meet the requirement, and the problem of delamination can occur. Therefore, 2 pieces of high-frequency materials are selected as core plates, namely L1/L2 and L3/L4 are respectively one core plate, and after the L2 layer and L3 layer circuits are respectively manufactured, 2 pieces of high-frequency PP are used as bonding pressing in the middle.
The invention respectively adopts L1/L2 and L3/L4 as a core board for manufacturing circuits of an L2 layer and an L3 layer; the copper foil is a plate with copper foil, and two insulation substrates PP are used for bonding and pressing in the middle.
Further, the present invention also provides a method for manufacturing the high frequency board (as shown in fig. 1), which comprises the following steps:
s1: preparing to synchronously manufacture an L1/L2 layer and an L3/L4 layer;
s2: respectively cutting the L1/L2 layer and the L3/L4 layer, covering a double-sided copper plate, and transferring to S3;
s3: exposing the whole surfaces of the inner layer wet film, the L1 layer and the L4 layer, making a circuit of an L2 layer and an L3 layer, and transferring to S4;
s4: etching the inner layer, making inner layer circuits of the L2 layer and the L3 layer, reserving copper surfaces of the L1 layer and the L4 layer, and turning into S5;
s5: and respectively carrying out inner layer AOI on the two core plates, and transferring to a laminating procedure.
Wherein, only L2 layers of circuits are made in the L1/L2 layer, and L1 layers of copper foils are well protected.
Furthermore, only L3 layers of circuits are made in the L3/L4 layers, and L4 layers of copper foils are well protected.
Preferably, the lamination procedure comprises the steps of: browning, pre-stacking, laminating, routing edges and turning to the next process.
Because the influence of the line surface roughness on the lamination binding force is large, preferably, the copper surface roughness value is monitored after the browning, the surface roughness value Rz is obtained to be 0.8-1.2 mu m after a plurality of tests, and the average beating precision is +/-0.03 mm.
Preferably, an OEM press with a pressing accuracy of ± 0.05mm is used.
Preferably, steel plates with a uniformity of >98% are selected for pressing.
Preferably, the deviation of the interlayer alignment degree causes the deviation of the standing wave and the phase of the coupler, so that the management and control of the interlayer alignment degree must be strengthened in the production process of the printed board of the coupler, therefore, the high-frequency board laminating method further comprises a board edge four-corner design alignment test module for monitoring the interlayer alignment degree, and the layer deviation precision value is +/-0.05 mm-0.08 mm.
Preferably, the high-frequency board pressing method further comprises an electrical performance testing module, the performance of the high-frequency board is detected through a high-frequency measuring instrument, and the high-frequency board pressing method is mainly used for testing the phase and amplitude of the high-frequency board.
Preferably, the phase is less than or equal to 5 degrees, the phase difference between the plates is less than or equal to 8 degrees, the amplitude deviation value is less than or equal to 0.6dB, and the amplitude between the plates is less than or equal to 08 dB.
The invention provides a high-frequency board and a laminating method thereof, which changes the laminating mode of laminating a conventional 4-layer board by using one core board and adopts 2 core boards for laminating. The uniformity of each dielectric layer can be effectively ensured, the plate thickness tolerance can be controlled within the range of +/-5%, the copper foil is taken as a plate, the problems that the copper blocks are not flat and the matching degree of the copper blocks and the plate is not high due to the copper embedding process can be solved, in addition, the requirement of the binding force can be met after the browning treatment before the pressing, and the risk of the lamination and plate explosion layering caused by insufficient roughness of the core plate can be avoided. The requirements on the thickness of the dielectric layer of the high-frequency plate and the plate explosion layering risk are effectively met.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (9)
1. A high-frequency plate comprises a core plate, an insulating substrate PP and a copper foil, and is characterized in that the core plate comprises two core plates, wherein L1/L2 and L3/L4 are respectively one core plate and used for manufacturing a circuit with an L2 layer and an L3 layer, and the whole copper surface of the L1 layer and the L4 layer is reserved; the copper foil is a plate with copper foil, and two insulation substrates PP are used for bonding and pressing in the middle.
2. A method for manufacturing a high-frequency board press-fit according to claim 1, comprising the steps of:
s1: preparing to synchronously manufacture an L1/L2 layer and an L3/L4 layer;
s2: respectively cutting the L1/L2 layer and the L3/L4 layer, covering a double-sided copper plate, and transferring to S3;
s3: exposing the whole surfaces of the inner layer wet film, the L1 layer and the L4 layer, making a circuit of an L2 layer and an L3 layer, and transferring to S4;
s4: etching the inner layer, making inner layer circuits of the L2 layer and the L3 layer, reserving copper surfaces of the L1 layer and the L4 layer, and turning into S5;
s5: and respectively carrying out inner layer AOI on the two core plates, and transferring to a laminating procedure.
3. A high-frequency board laminating method according to claim 2, wherein said laminating process sequentially comprises the steps of: browning, pre-stacking, laminating, routing edges and turning to the next process.
4. A high-frequency board pressing method according to claim 3, characterized in that the roughness value of the copper surface is monitored after the browning, the surface roughness value Rz is 0.8 μm to 1.2 μm, and the average beating precision is ± 0.03 mm.
5. A high-frequency board press-bonding method according to claim 3, wherein the press-bonding is performed by an OEM press.
6. A method according to claim 5, characterized in that steel sheets with a homogeneity >98% are selected for pressing.
7. A pressing method for high-frequency boards according to claim 6, further comprising an alignment test module for designing four corners of the board for monitoring the alignment between the layers, wherein the layer deflection precision is ± (0.05 mm-0.08 mm).
8. A method for laminating a high-frequency board according to claim 7, further comprising an electrical performance testing module for testing the phase and amplitude of the high-frequency board.
9. A method for laminating a high-frequency board as claimed in claim 8, wherein said phase is not more than 5 °, said phase difference between boards is not more than 8 °, said amplitude deviation value is not more than 0.6dB, and said amplitude between boards is not more than 0.8 dB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911373645.9A CN111132474A (en) | 2019-12-27 | 2019-12-27 | High-frequency board and laminating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911373645.9A CN111132474A (en) | 2019-12-27 | 2019-12-27 | High-frequency board and laminating method thereof |
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| Publication Number | Publication Date |
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| CN111132474A true CN111132474A (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911373645.9A Pending CN111132474A (en) | 2019-12-27 | 2019-12-27 | High-frequency board and laminating method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117881112A (en) * | 2024-03-12 | 2024-04-12 | 四川英创力电子科技股份有限公司 | 28-layer 8-order Ultra HDI and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311627A (en) * | 2003-04-04 | 2004-11-04 | Denso Corp | Multilayer circuit board and its manufacturing method |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
| CN106888549A (en) * | 2017-04-12 | 2017-06-23 | 广东冠锋科技股份有限公司 | A kind of High Frequency Of Recombination circuit board and its production method |
| CN107278062A (en) * | 2017-07-20 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of different plate mixed pressures |
-
2019
- 2019-12-27 CN CN201911373645.9A patent/CN111132474A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311627A (en) * | 2003-04-04 | 2004-11-04 | Denso Corp | Multilayer circuit board and its manufacturing method |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
| CN106888549A (en) * | 2017-04-12 | 2017-06-23 | 广东冠锋科技股份有限公司 | A kind of High Frequency Of Recombination circuit board and its production method |
| CN107278062A (en) * | 2017-07-20 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | A kind of high frequency board manufacturing method of different plate mixed pressures |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117881112A (en) * | 2024-03-12 | 2024-04-12 | 四川英创力电子科技股份有限公司 | 28-layer 8-order Ultra HDI and manufacturing method thereof |
| CN117881112B (en) * | 2024-03-12 | 2024-05-07 | 四川英创力电子科技股份有限公司 | 28-Layer 8-order Ultra HDI and manufacturing method thereof |
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Application publication date: 20200508 |
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